CN112366187A - Millimeter wave chip cavity packaging structure and packaging method - Google Patents
Millimeter wave chip cavity packaging structure and packaging method Download PDFInfo
- Publication number
- CN112366187A CN112366187A CN202011300389.3A CN202011300389A CN112366187A CN 112366187 A CN112366187 A CN 112366187A CN 202011300389 A CN202011300389 A CN 202011300389A CN 112366187 A CN112366187 A CN 112366187A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012858 packaging process Methods 0.000 description 7
- 229920006335 epoxy glue Polymers 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention relates to the technical field of chip packaging, in particular to a millimeter wave chip cavity packaging structure and a millimeter wave chip cavity packaging method. The packaging structure can effectively reduce the product loss, improve the efficiency and show better product performance; the product packaging is completed through the prefabricated adhesive, the whole process only needs one-time packaging, the process is simplified, and the manufacturing cost is reduced.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a millimeter wave chip cavity packaging structure and a millimeter wave chip cavity packaging method.
Background
In the current semiconductor industry chain, chip packaging is a critical ring. With the application and development of various electromagnetic wave frequency bands, the millimeter wave frequency band is more and more commonly used, for example, the development of the automatic driving technology of automobiles cannot be supported by millimeter wave radars. For the packaging of high-frequency chip products, in order to ensure that product indexes are not affected by packaging, a metal ceramic packaging structure is mostly adopted, but the metal ceramic packaging structure has the defects of high cost and complex process.
Therefore, the chip packaging process in the prior art has certain defects, and it is necessary to develop a packaging structure with low cost and simple process, and a more reasonable technical scheme needs to be provided to solve the technical problems in the prior art.
Disclosure of Invention
In order to overcome the defects in the prior art mentioned in the above, the invention provides a millimeter wave chip cavity packaging structure and a packaging method, aiming at realizing the rapid packaging of a millimeter wave chip by improving the packaging structure and the packaging process of a product, simplifying the packaging process and reducing the packaging cost at the same time.
In order to achieve the purpose, the invention specifically adopts the technical scheme that:
a millimeter wave chip cavity packaging structure comprises a substrate, wherein a mounting platform is arranged on the substrate, a chip is fixedly arranged on the mounting platform, and the chip is electrically connected with the substrate; the base plate is provided with a shell, the shell covers the mounting platform, and the connecting surface of the shell and the base plate is provided with a bonding agent.
According to the packaging structure disclosed by the invention, the mounting platform is arranged on the substrate, and the mounting platform is used for connecting and fixing the chip in a structure suitable for the chip; meanwhile, the chip is covered by the shell for protection, the shell and the substrate are very convenient to connect through the adhesive, and the efficiency of the packaging process is greatly improved.
Further, the structure of the mounting platform is not uniquely determined, and various structures may be provided to achieve connection and fixation of the chip, which includes the following possible ways: the mounting platform on be provided with the chip groove, chip fixed connection is in the chip inslot, and passes through connecting material fastening connection between chip and the chip groove.
Further, the structure of the chip slot is optimized to be more suitable for the installation of the chip: the chip groove depth be 100 ~ 200um, the distance between the interior edge in chip groove and the chip keeps 100 ~ 500 um.
Furthermore, in order to enhance the bonding strength between the housing and the substrate, the connection surface is optimized, and the following specific feasible schemes are provided: at least one connecting surface between the shell and the substrate is provided with a connecting groove. Therefore, the housing and/or the substrate may be provided with a coupling groove for receiving and shaping the adhesive, which may increase the adhesive strength.
Still further, the structure of the connecting groove is not uniquely determined, and the structure of the connecting groove is optimized here, which includes the following specific feasible schemes: the connecting groove is a closed groove connected end to end.
Furthermore, when the connecting groove is arranged, the width of the connecting groove can be limited, so that the connecting groove has a better connecting effect, and a specific feasible scheme is given out: the width of the connecting groove is 1/2-2/3 of the thickness of the shell.
Furthermore, after the shell is bonded with the substrate, the adhesive overflows on the connecting surface, and the mounting platform and the shell are separated by a certain distance, so that the mounting platform is prevented from contacting with the adhesive, and the connection between the chip and the substrate is protected; specifically, the following possible schemes may be adopted: the distance from the inner edge of the connecting surface of the shell and the substrate to the outer edge of the mounting platform is 100-200 um.
Further, the housing and the substrate may be made of various materials, specifically: the shell is made of ceramic materials or plastics, and the substrate is made of ceramics or resin.
Still further, when the cavity structure is formed, the limitation to the housing caused by the overlarge integral structure of the housing and the substrate is avoided, and the following feasible scheme can be specifically adopted: the height of the shell is less than or equal to 3.5 mm.
The above disclosure describes the package structure provided by the present invention, and the present invention also discloses a packaging method, so that the above package structure is formed after the chip is mounted.
Specifically, the millimeter wave chip cavity packaging method is used for forming the above packaging structure, and includes:
mounting the chip into the chip groove, and electrically connecting the chip with the substrate through a connecting wire;
and prefabricating an adhesive on the connecting surface of the shell and the substrate, and connecting and fixing the shell to the substrate to form a cavity structure between the shell and the substrate.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses a millimeter wave chip cavity packaging structure and a packaging method; the packaging structure is characterized in that a circle of groove is formed in the periphery of a packaging substrate and the bonding surface of a shell, a bonding agent is prefabricated in a connecting groove, the shell is covered after chip mounting and bonding, and product sealing caps are completed by heating the prefabricated bonding agent to form cavity packaging. The packaging structure does not need to be filled with a plastic packaging material, and meanwhile, as the dielectric constant of air is 1 and is smaller than that of the plastic packaging material (the dielectric constant of a common plastic packaging material is 4), for millimeter wave chip packaging, the product loss can be effectively reduced, the efficiency is improved, and better product performance is shown; the product packaging is completed through the prefabricated adhesive, the whole process only needs one-time packaging, the process is simplified, and the manufacturing cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a package structure.
Fig. 2 is a schematic structural view of a chip disposed on a substrate.
Fig. 3 is a schematic structural view of the housing.
Fig. 4 is a process diagram of the packaging method.
The reference numbers in the above figures represent the meanings: 1. a substrate; 2. mounting a platform; 3. a housing; 4. a chip slot; 5. a chip; 6. connecting materials; 7. a binder; 8. and a connecting groove.
Detailed Description
The invention is further explained below with reference to the drawings and the specific embodiments.
It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Specific structural and functional details disclosed herein are merely illustrative of example embodiments of the invention. This invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.
Example 1
Aiming at the problems of complex millimeter wave chip packaging process and high packaging cost in the prior art, the embodiment provides an improved packaging structure which can be realized under a simpler process, and the packaging cost is greatly reduced. Specifically, the package structure disclosed in this embodiment is as follows:
as shown in fig. 1, 2 and 3, a millimeter wave chip cavity package structure includes a substrate 1, a mounting platform 2 is disposed on the substrate 1, a chip 5 is fixedly disposed on the mounting platform 2, and the chip 5 is electrically connected to the substrate 1; the substrate 1 is provided with a shell 3, the shell 3 covers the mounting platform 2, and the connecting surface of the shell 3 and the substrate 1 is provided with a binder 7.
Preferably, in the present embodiment, the chip 5 is electrically connected to the substrate 1 by a bonding wire, one end of the bonding wire is connected to the chip 5, and the other end of the bonding wire is connected to the contact of the substrate 1, and the contact is disposed on the upper surface of the mounting platform 2.
In the packaging structure disclosed above, the mounting platform 2 is arranged on the substrate 1, the mounting platform 2 and the substrate 1 are integrally formed, and the mounting platform 2 is used for connecting and fixing the chip 5 in a structure suitable for the chip 5; meanwhile, the chip 5 is covered by the shell 3 for protection, the shell 3 and the substrate 1 are very convenient to connect through the adhesive, and the efficiency of the packaging process is greatly improved.
Preferably, epoxy glue is used as the adhesive 7 in this embodiment.
The structure of the mounting platform 2 is not uniquely determined, and various structures can be arranged to realize the connection and fixation of the chip 5, and the following feasible modes are given in this embodiment: the mounting platform 2 is provided with a chip groove 4, the chip 5 is fixedly connected in the chip groove 4, and the chip 5 and the chip groove 4 are fixedly connected through a connecting material 6.
Preferably, the chip slot 4 is a square slot, so that the chip 5 can be integrally arranged in the slot. The connecting material 6 can adopt connecting solder or epoxy glue.
The structure of the chip slot 4 is optimized to be more suitable for the installation of the chip 5: chip groove 4 degree of depth be 100 ~ 200um, the distance between the interior edge of chip groove 4 and chip 5 keeps 100 ~ 500 um.
In order to enhance the bonding strength between the housing 3 and the substrate 1, the connection surface is optimized, and the following specific possible schemes are provided: at least one connecting surface between the shell 3 and the substrate 1 is provided with a connecting groove 8. Therefore, the housing 3 and/or the substrate 1 may be provided with the coupling groove 8, and the coupling groove 8 is used for receiving and shaping the adhesive 7, thereby increasing the adhesive strength.
Preferably, in this embodiment, the connection surface of the housing 3 and the substrate 1 is provided with a connection groove 8, and the connection groove 8 is an arc-shaped groove, and when the housing 3 is attached to the substrate 1, the arc-shaped groove forms an oval channel.
The structure of the connecting groove 8 is not uniquely determined, and the structure of the connecting groove 8 is optimized in the present embodiment, and the following specific feasible schemes are adopted: the connecting groove 8 is an annular closed groove.
While the connecting groove 8 is provided, the width of the connecting groove 8 can be limited, so that the connecting groove 8 has a better connecting effect, and a specific possible scheme is as follows: the width of the connecting groove 8 is 1/2-2/3 of the thickness of the shell 3.
After the shell 3 is bonded with the substrate 1, the adhesive 7 overflows on the connecting surface, and the mounting platform 2 and the shell 3 are separated by a certain distance, so that the mounting platform 2 is prevented from contacting the adhesive 7, and the connection between the chip 5 and the substrate 1 is protected; specifically, the following possible schemes may be adopted: the distance from the inner edge of the connecting surface of the shell 3 and the substrate 1 to the outer edge of the mounting platform 2 is 100-200 um.
Preferably, an overflow groove is arranged on the connecting surface of the shell 3 and the substrate 1, and drains the adhesive 7 to the outer edge of the substrate 1, so that the adhesive 7 is prevented from influencing the electrical connection of the chip 5.
The housing 3 and the substrate 1 may be made of a plurality of materials, specifically, in this embodiment, the housing 3 is made of a ceramic material or a plastic, and the substrate 1 is made of a ceramic material or a resin.
When a cavity structure is formed, the limitation on the housing 3 caused by the oversize of the integral structure of the housing 3 and the substrate 1 is avoided, and the following feasible schemes can be specifically adopted: the height of the shell 3 is less than or equal to 3.5 mm.
Preferably, the thickness of the substrate 1 is 100-500 um.
Example 2
The content disclosure of the above embodiment 1 describes a package structure, and this embodiment discloses a packaging method, so that the package structure is formed after a chip is mounted.
Specifically, as shown in fig. 4, the millimeter wave chip cavity packaging method is used for forming the above package structure, and includes:
s01: the chip 5 is mounted in the chip pocket 4, and the chip 5 is electrically connected to the substrate 1 by a connection wire.
S02: an adhesive 7 is prefabricated on the connecting surface of the shell 3 and the substrate 1, and the shell 3 is fixedly connected to the substrate 1, so that a cavity structure is formed between the shell 3 and the substrate 1.
Preferably, the adhesive 7 is prefabricated in the connecting groove 8 of the shell 3, and when the adhesive 7 is epoxy glue, the epoxy glue is melted by heating to realize adhesion.
According to the packaging method disclosed by the embodiment, on the basis of prefabricating the epoxy glue on the shell 3, after the chip 5 is pasted and bonded, the packaging can be completed only by heating once in the whole process, the packaging process is simplified, the production efficiency is improved, and the manufacturing cost is reduced.
The present invention is not limited to the above-described alternative embodiments, and various other embodiments can be obtained by those skilled in the art from the above-described embodiments in any combination, and any other embodiments can be obtained in various forms while still being within the spirit of the present invention. The above detailed description should not be taken as limiting the scope of the invention, which is defined in the claims, and which the description is intended to be interpreted accordingly.
Claims (10)
1. The utility model provides a millimeter wave chip cavity packaging structure which characterized in that: the LED packaging structure comprises a substrate (1), wherein an installation platform (2) is arranged on the substrate (1), a chip (5) is fixedly arranged on the installation platform (2), and the chip (5) is electrically connected with the substrate (1); the mounting structure is characterized in that a shell (3) is arranged on the substrate (1), the mounting platform (2) is covered by the shell (3), and a bonding agent (7) is arranged on the connecting surface of the shell (3) and the substrate (1).
2. The millimeter wave chip cavity package structure of claim 1, wherein: the mounting platform (2) is provided with a chip groove (4), the chip (5) is fixedly connected in the chip groove (4), and the chip (5) and the chip groove (4) are fixedly connected through a connecting material (6).
3. The millimeter wave chip cavity package structure of claim 2, wherein: the chip groove (4) is 100-200 um deep, and the distance between the inner edge of the chip groove (4) and the chip (5) is kept 100-500 um.
4. The millimeter wave chip cavity package structure of claim 1 or 2, wherein: at least one connecting surface between the shell (3) and the substrate (1) is provided with a connecting groove (8).
5. The millimeter-wave chip cavity package structure of claim 4, wherein: the connecting groove (8) is a closed groove connected end to end.
6. The millimeter-wave chip cavity package structure of claim 4, wherein: the width of the connecting groove (8) is 1/2-2/3 of the thickness of the shell (3).
7. The millimeter wave chip cavity package structure of claim 1, wherein: the distance from the inner edge of the connecting surface of the shell (3) and the substrate (1) to the outer edge of the mounting platform (2) is 100-200 um.
8. The millimeter wave chip cavity package structure of claim 1, wherein: the shell (3) is made of ceramic materials or plastics, and the substrate (1) is made of ceramics or resin.
9. The millimeter wave chip cavity package structure of claim 1 or 8, wherein: the height of the shell (3) is less than or equal to 3.5 mm.
10. The millimeter wave chip cavity packaging method is used for forming the packaging structure of any one of claims 1 to 9, and is characterized by comprising the following steps:
mounting the chip (5) into the chip groove (4), and electrically connecting the chip (5) with the substrate (1) through a connecting wire;
an adhesive (7) is prefabricated on the connecting surface of the shell (3) and the substrate (1), and the shell (3) is fixedly connected to the substrate (1), so that a cavity structure is formed between the shell (3) and the substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011300389.3A CN112366187A (en) | 2020-11-19 | 2020-11-19 | Millimeter wave chip cavity packaging structure and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011300389.3A CN112366187A (en) | 2020-11-19 | 2020-11-19 | Millimeter wave chip cavity packaging structure and packaging method |
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| Publication Number | Publication Date |
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| CN112366187A true CN112366187A (en) | 2021-02-12 |
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| CN202011300389.3A Pending CN112366187A (en) | 2020-11-19 | 2020-11-19 | Millimeter wave chip cavity packaging structure and packaging method |
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Application publication date: 20210212 |