CN116614097A - Acoustic surface filter packaging structure and packaging method - Google Patents
Acoustic surface filter packaging structure and packaging method Download PDFInfo
- Publication number
- CN116614097A CN116614097A CN202310325417.4A CN202310325417A CN116614097A CN 116614097 A CN116614097 A CN 116614097A CN 202310325417 A CN202310325417 A CN 202310325417A CN 116614097 A CN116614097 A CN 116614097A
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- Prior art keywords
- substrate
- filter chip
- filter
- blocking block
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 230000000903 blocking effect Effects 0.000 claims abstract description 60
- 239000003292 glue Substances 0.000 claims abstract description 55
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 238000001746 injection moulding Methods 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 20
- 238000003466 welding Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention discloses a sound surface filter packaging structure, which comprises: the filter comprises a substrate, a filter chip, thick glue, an inner baffle plate, an outer baffle plate and a plastic sealing layer, wherein the thick glue is arranged between the side wall of the filter chip and the substrate in a surrounding manner so as to form a sealing cavity between the filter chip and the substrate; a groove is formed between the inner blocking block and the outer blocking block, and the bottom of the thick glue is positioned in the groove; and the plastic layer is arranged on the outer sides of the thick glue and the filter chip. The packaging method is characterized in that an inner blocking block and an outer blocking block are arranged on a substrate, grooves are formed on the substrate, a filter chip is welded on the substrate, thick glue is coated on the filter chip, and finally plastic packaging is performed. The problem that the injection molding layer is easy to infiltrate between the chip and the substrate at present is solved. The thick adhesive is ensured not to pollute the surface of the IDT, so that the packaging is ensured not to influence the performance of the filter chip, and the packaging yield is greatly improved.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a sound surface filter packaging structure and a sound surface filter packaging method.
Background
The acoustic surface wave filter (SAW) converts an input signal of an electric wave into mechanical energy by using the piezoelectric characteristics of a piezoelectric material, and converts the mechanical energy into an electric signal after processing, thereby filtering clutter outside a frequency band. In SAW packaging, it is necessary to ensure that the IDT has a cavity on its surface to ensure signal quality. In most packaging schemes in the current industry, a bare chip of the SAW is connected with a substrate by adopting a solder ball, after reflow soldering, the edge of the SAW is lapped with a solder resist, a sealing cavity is formed on the lower surface of the SAW, the solder resist layer and the upper surface of the substrate, and finally, the packaging is finished by injection molding. After the reflow soldering is performed at high temperature, the height of the solder ball is slightly reduced, so that the lower surface of the SAW is overlapped with the solder mask layer, but the reduced height of the solder ball and the flatness of the overlapped surface are not easy to control, and the sealing of the cavity is not ideal. And the injection molding is performed by pressing, so that the injection molding layer is filled under the non-filter chip. Under pressure, the injection molding layer can infiltrate into the cavity with poor sealing, pollute the surface of the IDT, and cause poor product performance, such as deterioration of insertion loss, increase of return loss and the like, and even failure of chip functions in severe cases. There are also blocking blocks arranged between the lower surface of the acoustic wave filter and the substrate, and thin film covers are arranged on the acoustic wave filter, but the thin film is easy to penetrate through in the scheme, the protection effect is lost, the height of the blocking block below the filter chip is required to be matched with the height of the connecting block on the chip, and the requirements on the blocking block and the flatness of the bottom surface of the chip are high.
Disclosure of Invention
The invention aims to provide a sound surface filter packaging structure and a sound surface filter packaging method, which can effectively solve the problem that the cavity between a chip and a substrate of the traditional sound surface filter is poor in sealing after welding is finished, and an injection molding layer can infiltrate into the cavity to influence the performance of a product.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a sound surface filter package structure comprising:
a substrate, on which a bonding pad is arranged;
the filter chip is provided with a connecting block welded with the bonding pad;
the thick glue is arranged between the side wall of the filter chip and the substrate in a surrounding mode, so that a sealing cavity is formed between the filter chip and the substrate;
the internal blocking plate is arranged on the substrate and used for blocking the thick glue from entering the lower part of the filter chip;
the outer blocking block is arranged on the substrate and positioned at the outer side of the inner blocking block, a groove is formed between the inner blocking block and the outer blocking block, and the bottom of the thick glue is positioned in the groove;
and the plastic layer is arranged on the outer sides of the thick glue and the filter chip.
Preferably, the internal blocking plate is located in the projection of the filter chip on the substrate. The thick glue is enabled to be close to the side wall of the filter chip as much as possible, and the effect of thick glue blocking is better exerted.
Preferably, the outer blocking block is located outside the projection of the filter chip on the substrate. The opening of the groove is opened as much as possible, so that thick glue can enter the groove to be positioned conveniently.
Preferably, the height of the connection block is greater than the height of the internal blocking piece. The internal blocking plate is prevented from being abutted to the filter chip before welding, so that the filter chip is prevented from being in cold joint, and a certain margin is reserved for reducing the height of the filter chip and the substrate after welding.
Preferably, the internal barrier is a continuous annular bump. The internal blocking plate forms a continuous ring shape to form a complete blocking in the circumferential direction, so that thick glue is prevented from entering the lower part of the filter chip from the circumferential direction,
preferably, the internal barrier covers the substrate below the filter chip, and the internal barrier avoids the bonding pad. In another arrangement form of the inner blocking plate, the space below the filter chip is covered as much as possible, and thick glue is prevented from entering the space below the filter chip.
Preferably, the inner barrier and the outer barrier are each formed of green oil coated on a substrate. The green oil has good insulativity, can protect the substrate, is easy to form, and forms a blocking block to block thick glue.
Preferably, a non-filtering chip is further arranged on the bonding pad of the substrate, and the plastic sealing layer covers the non-filtering chip. And the plastic layer encapsulates other non-filter chips on the substrate together, and protects the non-filter chips.
Preferably, the plastic sealing layer penetrates between the non-filter chip and the substrate. The plastic layer permeates between the non-filter chip and the substrate, so that the fixation of the non-filter chip is further improved.
The packaging method adopting the sound surface filter packaging structure comprises the following steps:
s1, arranging an inner blocking block and an outer blocking block on the periphery of a bonding pad on a substrate, and forming a groove between the inner blocking block and the outer blocking block;
s2, placing the filter chip on a substrate, and welding the filter chip on the substrate through ultrasonic waves or reflow soldering;
s3, coating thick glue on the side wall of the filter chip, wherein the bottom of the thick glue is positioned in a groove formed by the inner blocking block and the outer blocking block;
and S4, carrying out injection molding packaging on the outer sides of the filter chip and the thick glue to form a plastic layer.
Compared with the prior art, the invention has the advantages that:
by arranging thick glue between the side wall of the filter chip and the substrate, a sealed cavity is formed between the filter chip and the substrate, and the problem that the injection molding layer is easy to infiltrate between the chip and the substrate at present is solved. Through setting up thick glue between filter chip's lateral wall and base plate, seal filter chip's periphery through thick glue high consistency, the poor characteristics of mobility to thick glue is difficult to be pierced, has good protectiveness. And still set up internal baffle piece and outer baffle piece on the base plate, form the recess between two baffle pieces, carry out spacingly to the bottom of thick glue through the recess to can prevent that thick glue from entering into filter chip below through the internal baffle piece, ensure that thick glue can not pollute the IDT surface, also just because thick glue mobility poor characteristic, the precision requirement to internal baffle piece direction of height reduces, even have the gap slightly between internal baffle piece and the filter chip, thick glue can not cross the internal baffle piece and flow into filter chip below yet, thereby ensure that the encapsulation can not influence filter chip's performance, improve encapsulation yields greatly.
Drawings
FIG. 1 is a schematic diagram of a package structure of a sound surface filter before welding a filter chip and a substrate;
FIG. 2 is a schematic diagram of the package structure of the acoustic surface filter after the filter chip and the substrate are soldered;
FIG. 3 is a schematic diagram of a structure of an acoustic surface filter package according to the present invention in which a thick glue is added after a filter chip and a substrate are soldered;
FIG. 4 is a schematic diagram of a package structure of an acoustic surface filter according to the present invention, in which a plastic layer is added after a filter chip and a substrate are soldered;
FIG. 5 is a cross-sectional view of a first construction form of an internal baffle of a saw filter package structure of the present invention;
FIG. 6 is a cross-sectional view of a second construction form of an internal baffle of a saw filter package structure of the present invention;
fig. 7 is a schematic structural diagram of a package structure of an acoustic surface filter according to the present invention after a non-filtering chip is soldered on a substrate.
The reference numerals are:
the filter comprises a substrate 1, a filter chip 2, a connecting block 3, an inner blocking piece 4, an outer blocking piece 5, thick glue 6, a plastic sealing layer 7, a non-filter chip 8, a groove 9 and a sealing cavity 10.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1 to 7, an embodiment of a sound surface filter package structure according to the present invention includes:
a substrate 1, wherein a bonding pad is arranged on the substrate 1;
the filter chip 2 is provided with a connecting block 3 welded with the bonding pad;
the thick glue 6 is arranged between the side wall of the filter chip 2 and the substrate 1 in a surrounding manner, so that a sealed cavity 10 is formed between the filter chip 2 and the substrate 1;
the internal blocking plate 4 is arranged on the substrate 1 and used for blocking the thick glue 6 from entering the lower part of the filter chip 2;
the outer baffle block 5 is arranged on the substrate 1 and positioned on the outer side of the inner baffle block 4, namely, on the side of the inner baffle block 4 away from the center of the filter chip 2, a groove 9 is formed between the inner baffle block 4 and the outer baffle block 5, and the bottom of the thick glue 6 is positioned in the groove 9;
and the plastic sealing layer 7 is arranged on the outer sides of the thick glue 6 and the filter chip 2.
Both the inner barrier 4 and the outer barrier 5 are formed of green oil coated on the substrate 1, and the green oil not only has good insulation but also protects the substrate 1. In order to make the internal blocking plate 4 exert the maximum blocking effect, the internal blocking plate 4 is located in the vertical projection of the filter chip 2 on the substrate 1, that is, the internal blocking plate 4 is located right below the filter chip 2, and the outer side edge of the internal blocking plate 4 may be flush with the edge of the filter chip 2 or may be retracted into the vertical projection of the filter chip 2, so that a larger size allowance is provided when the internal blocking plate 4 is manufactured, which is beneficial to improving the production efficiency.
Preferably, the height of the internal blocking plate 4 is lower than the height of the connecting block 3, that is, a gap is left between the internal blocking plate 4 and the bottom surface of the filter chip 2 before welding, because the height of the filter chip 2 is reduced due to melting of the connecting block 3 during welding, as shown in fig. 1 and 2, and the gap between the internal blocking plate 4 and the filter chip 2 is left for reducing the welding height of the filter chip 2, so as to prevent the internal blocking plate 4 from preventing the filter chip 2 from being reduced in height and causing cold joint. Although the inner barrier 4 leaves a gap with the bottom surface of the filter chip 2, the gap is very small in height, and the thick glue 6 does not penetrate into the sealed cavity 10 from the gap.
The internal blocking structure is not particularly limited, and includes, but is not limited to, the structures listed below:
first, as shown in fig. 5, the inner barrier 4 is formed into a continuous ring-shaped protrusion, that is, the inner barrier 4 is formed into a ring shape and protrudes from the upper surface of the substrate 1, so as to be disposed into a continuous ring shape, thereby forming a complete barrier in the circumferential direction, preventing the thick paste 6 from entering into the sealing cavity 10 from the circumferential direction. The specific continuous loop may be a circular loop or a rectangular loop, and may be determined according to the shape of the filter chip 2.
Second, as shown in fig. 6, the inner barrier 4 fills the sealed cavity 10, thereby preventing the thick glue 6 from entering the sealed cavity 10, but the inner barrier 4 is not covered with the bonding pad, so as to ensure that the filter chip 2 can be welded with the substrate 1. This way, the inner barrier 4 fills the sealed cavity 10, preventing the thick glue 6 from entering the sealed cavity 10, thereby ensuring that the thick glue 6 does not contaminate the IDT surface.
The height of the outer barrier 5 is not particularly limited, and the outer barrier 5 may be as high as the inner barrier 4 or may be higher than the inner barrier 4. The outer blocking block 5 is located outside the vertical projection of the filter chip 2 on the substrate 1, so that the opening of the groove 9 can be reduced or prevented from being blocked by the filter chip 2, and the thick glue 6 can more conveniently enter the groove 9 when the thick glue 6 is smeared.
As shown in fig. 7, a non-filter chip 8 such as a switch, a low noise amplifier, a power amplifier, etc. is soldered on the substrate 1 in addition to the filter chip 2. These non-filter chips 8 are directly welded on the substrate 1 and covered by the plastic sealing layer 7, the non-filter chips 8 are also protected by the plastic sealing layer 7, and the plastic sealing layer 7 penetrates between the non-filter chips 8 and the substrate 1, thereby further improving the fixation of the non-filter chips 8.
The packaging method for realizing the sound surface filter packaging structure comprises the following steps:
s1, as shown in FIG. 1, a bonding pad is arranged on a substrate 1, an inner baffle plate 4 and an outer baffle plate 5 are arranged on the substrate 1, a groove 9 is formed between the inner baffle plate 4 and the outer baffle plate 5, and a connecting block 3 is arranged at the bottom of a filter chip 2;
s2, as shown in FIG. 2, placing the filter chip 2 on the substrate 1, and welding the filter chip 2 on the substrate 1 by ultrasonic or reflow soldering;
s3, as shown in FIG. 3, coating the thick glue 6 on the outer side wall of the filter chip 2, wherein the bottom of the thick glue 6 is positioned in the groove 9 so as to prevent the thick glue 6 from diffusing outwards;
s4, as shown in FIG. 4, the outer sides of the filter chip 2 and the thick glue 6 are subjected to injection molding and encapsulation to form a plastic layer 7.
Through setting up thick glue 6 between the lateral wall of filter chip 2 and base plate 1, seal filter chip 2 all around through the characteristics that thick glue 6 viscosity is high, mobility is poor, and still set up internal baffle 4 and outer baffle 5 on base plate 1, form recess 9 between two baffles, it is spacing to the bottom of thick glue 6 through recess 9, and can prevent through internal baffle 4 that thick glue 6 from entering into filter chip 2 below, ensure thick glue 6 can not pollute the IDT surface, thereby ensure that the encapsulation can not influence filter chip 2's performance, improve the encapsulation yields greatly.
The above embodiments are merely illustrative embodiments of the present invention, but the technical features of the present invention are not limited thereto, and any changes or modifications made by those skilled in the art within the scope of the present invention are included in the scope of the present invention.
Claims (10)
1. The utility model provides a sound table wave filter packaging structure which characterized in that: comprising the following steps:
a substrate, on which a bonding pad is arranged;
the filter chip is provided with a connecting block welded with the bonding pad;
the thick glue is arranged between the side wall of the filter chip and the substrate in a surrounding mode, so that a sealing cavity is formed between the filter chip and the substrate;
the internal blocking plate is arranged on the substrate and used for blocking the thick glue from entering the lower part of the filter chip;
the outer blocking block is arranged on the substrate and positioned at the outer side of the inner blocking block, a groove is formed between the inner blocking block and the outer blocking block, and the bottom of the thick glue is positioned in the groove;
and the plastic layer is arranged on the outer sides of the thick glue and the filter chip.
2. The acoustic surface filter package structure of claim 1, wherein: the internal blocking piece is positioned in the projection of the filter chip on the substrate.
3. The acoustic surface filter package structure of claim 1, wherein: the height of the connecting block is greater than the height of the inner blocking block.
4. The acoustic surface filter package structure of claim 1, wherein: the internal blocking piece is a continuous annular protruding block.
5. The acoustic surface filter package structure of claim 1, wherein: the internal baffle plate covers the substrate below the filter chip, and the internal baffle plate avoids the bonding pad.
6. The acoustic surface filter package structure of claim 1, wherein: the outer blocking block is located outside the projection of the filter chip on the substrate.
7. The acoustic surface filter package structure of claim 1, wherein: the inner barrier and the outer barrier are each formed of green oil coated on a substrate.
8. The acoustic surface filter package structure of claim 1, wherein: and a non-filter chip is further arranged on the bonding pad of the substrate, and the plastic sealing layer covers the non-filter chip.
9. The acoustic surface filter package structure of claim 8, wherein: the plastic layer penetrates between the non-filter chip and the substrate.
10. A packaging method employing the acoustic surface filter packaging structure according to any one of claims 1 to 9, characterized by comprising the steps of:
s1, arranging an inner blocking block and an outer blocking block on the periphery of a bonding pad on a substrate, and forming a groove between the inner blocking block and the outer blocking block;
s2, placing the filter chip on a substrate, and welding the filter chip on the substrate through ultrasonic waves or reflow soldering;
s3, coating thick glue on the side wall of the filter chip, wherein the bottom of the thick glue is positioned in a groove formed by the inner blocking block and the outer blocking block;
and S4, carrying out injection molding packaging on the outer sides of the filter chip and the thick glue to form a plastic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325417.4A CN116614097A (en) | 2023-03-29 | 2023-03-29 | Acoustic surface filter packaging structure and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325417.4A CN116614097A (en) | 2023-03-29 | 2023-03-29 | Acoustic surface filter packaging structure and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116614097A true CN116614097A (en) | 2023-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310325417.4A Pending CN116614097A (en) | 2023-03-29 | 2023-03-29 | Acoustic surface filter packaging structure and packaging method |
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| Country | Link |
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| CN (1) | CN116614097A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117792321A (en) * | 2024-02-26 | 2024-03-29 | 甬矽电子(宁波)股份有限公司 | Chip packaging technology and chip packaging structure |
-
2023
- 2023-03-29 CN CN202310325417.4A patent/CN116614097A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117792321A (en) * | 2024-02-26 | 2024-03-29 | 甬矽电子(宁波)股份有限公司 | Chip packaging technology and chip packaging structure |
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