CN203848956U - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
- Publication number
- CN203848956U CN203848956U CN201420220491.6U CN201420220491U CN203848956U CN 203848956 U CN203848956 U CN 203848956U CN 201420220491 U CN201420220491 U CN 201420220491U CN 203848956 U CN203848956 U CN 203848956U
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- China
- Prior art keywords
- pressure transducer
- substrate
- pressure sensor
- chip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000004891 communication Methods 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 11
- 238000005538 encapsulation Methods 0.000 abstract 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000006355 external stress Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Abstract
The utility model discloses a pressure sensor. The pressure sensor comprises an external encapsulation structure as well as a pressure sensor chip and an integrated circuit chip which are arranged in the external encapsulation structure, wherein the encapsulation structure comprises a substrate; and an air vent which is communicated with the interior and exterior of the pressure sensor is formed in the substrate so that normal operation of the pressure sensor can be ensured. In the assembly and use processes of the pressure sensor, according to a terminal product, a cavity is not required to be formed at the top of the pressure sensor, and therefore, the thickness of the terminal product can be decreased, and use flexibility of the pressure sensor can be enhanced, and at the same time, the air vent which is formed in the substrate can prevent external airflow or light from directly acting on the pressure sensor chip, and therefore, errors of the pressure sensor which are caused by the above situation can be avoided, and the performance of the pressure sensor can be improved. Therefore, the pressure sensor of the utility model has the advantages of excellent performance and benefits to miniaturization design.
Description
Technical field
The utility model relates to sensor field, relates in particular to a kind of Miniaturization Design that is conducive to, the pressure transducer that performance is good.
Background technology
Along with the development of miniaturization of electronic products microminiaturization, electronic product is more and more higher to the requirement of its internal component miniaturization.Pressure transducer, as common sensor, is applied in multiple electronic product, therefore the Miniaturization Design of pressure transducer also becomes focal point.In order to guarantee the Miniaturization Design of pressure transducer, the pressure transducer based on MEMS (micro electro mechanical system) (Micro-Electro-Mechanical System, MEMS) is more and more subject to people and pays close attention to.
Pressure transducer based on MEMS technology, as shown in Figure 1, comprises substrate 1, is fixed on the shell 2 of described substrate, and described substrate 1 forms described pressure transducer outer enclosure structure with described shell 2.In described outer enclosure structure, be fixedly installed pressure sensor chip 3 and integrated circuit (IC) chip 5 on described substrate, pressure sensor chip 3 is electrically connected to the mode of integrated circuit (IC) chip 5 by metal lead wire 4 routings, on substrate 1, be provided with pad 7, pad 7 is electrically connected to pressure transducer inside chip with external electronic circuits, meanwhile, pressure transducer is fixed on outside mainboard by pad 7.In order to guarantee that pressure transducer normally works, pressure transducer is provided with the bleeder vent 6 that is communicated with pressure transducer inside and outside, as shown in Figure 1, the pressure transducer of traditional structure, bleeder vent 6 is arranged on shell 2 end face parallel with substrate 1.Bleeder vent 6 is arranged at the end face of shell 2, in order to guarantee that pressure transducer normally works, requires pressure transducer top to need to have a fixed gap, has increased end product thickness; Bleeder vent 6 is above shell 2 simultaneously, and when production and application, extraneous air-flow directly acts on pressure sensor chip 3, make pressure sensor chip 3 produce error, and extraneous light also easily acts on pressure sensor chip 3, make pressure sensor chip 3 produce error, affect properties of product.
Therefore, be necessary to propose a kind of improvement, to overcome traditional structure pressure transducer defect.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of Miniaturization Design that is conducive to, the pressure transducer that performance is good.
To achieve these goals, the utility model is by the following technical solutions:
A kind of pressure transducer, comprise outer enclosure structure, be arranged at pressure sensor chip and integrated circuit (IC) chip in described outer enclosure structure, and bleeder vent, described outer enclosure structure comprises substrate, described substrate is provided with pad away from described pressure transducer and integrated circuit (IC) chip one side, described pressure transducer is combined with external circuit by described substrate pads, described bleeder vent is communicated with described encapsulating structure inside and outside, and: described bleeder vent is arranged on the substrate of described pressure transducer.
As a kind of preferred technical scheme, described outer enclosure structure also comprises shell, and described shell and described substrate are fixedly installed, and described shell coordinates described pressure sensor chip and described integrated circuit (IC) chip and external isolation with described substrate.
As a kind of preferred technical scheme, described outer enclosure structure also comprises framework and top board, and described framework and described substrate are fixedly installed, and described top board is arranged at described framework away from described substrate one end; Described substrate, framework and top board coordinate described pressure sensor chip and described integrated circuit (IC) chip and external isolation.
As a kind of preferred technical scheme, described bleeder vent longitudinally connects described substrate.
As a kind of preferred technical scheme, on described substrate, be provided with the first hole, the second hole and interconnection, described the first hole is communicated with by described interconnection with described the second hole; Described the first hole is in communication with the outside, described the second hole and described pressure transducer internal communication, and described the first hole, described the second hole and described interconnection form described bleeder vent.
As a kind of preferred technical scheme, described interconnection is positioned at described pressure transducer below.
The utility model pressure transducer, bleeder vent is arranged on the substrate of pressure transducer.In pressure transducer assembling use procedure, end product needn't be at pressure transducer top design cavity, reduce end product thickness, increase pressure transducer and use flexibility ratio, meanwhile, in assembling use procedure, the bleeder vent being arranged on substrate can avoid extraneous air-flow or light to directly act on pressure sensor chip, therefore avoid and the pressure transducer errors producing improves pressure transducer performance.Therefore, the utility model pressure sensing appliance has performance good, is conducive to the advantage of Miniaturization Design.
Accompanying drawing explanation
Fig. 1 is traditional structure pressure transducer cut-open view;
Fig. 2 is the utility model pressure transducer the first embodiment cut-open view;
Fig. 3 is the utility model pressure transducer the second embodiment cut-open view;
Fig. 4 is the utility model pressure transducer the 3rd embodiment cut-open view;
Embodiment
Below in conjunction with accompanying drawing, describe the utility model pressure transducer concrete structure in detail.
Embodiment mono-:
As shown in Figure 2, the present embodiment pressure transducer, comprises substrate 1, and with the shell 2 that substrate 1 is fixedly installed, substrate 1 forms pressure transducer outer enclosure structure with shell 2.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 arrange, between pressure sensor chip 3 and integrated circuit (IC) chip 5, by metal lead wire 4, the mode by routing is electrically connected to, on substrate 1, be provided with pad 7, pad 7 is electrically connected to pressure transducer inside chip with external electronic circuits, when pressure transducer is worked, pressure sensor chip 3 gathers external pressures to be changed and is converted into electric signal, the signal that integrated circuit (IC) chip 5 gathers pressure sensor chip 3 carries out rough handling and is passed to external electronic circuits through described pad 7.
In order to guarantee that pressure transducer normally works, the present embodiment pressure transducer, substrate 1 is provided with bleeder vent 6.Bleeder vent 6 longitudinally connects substrate 1, is communicated with pressure transducer inside and outside.In the assembling of the present embodiment pressure transducer, use procedure, exterior terminal needn't arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, meanwhile, in assembling use procedure, the bleeder vent being arranged on substrate can avoid extraneous air-flow or light to directly act on pressure sensor chip, therefore avoid and the pressure transducer errors producing improves pressure transducer performance.
Embodiment bis-:
Similar with embodiment mono-, the present embodiment pressure transducer, as shown in Figure 3, comprises substrate 1, and with the shell 2 that substrate 1 is fixedly installed, substrate 1 forms pressure transducer outer enclosure structure with shell 2.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 arrange, between pressure sensor chip 3 and integrated circuit (IC) chip 5, by metal lead wire 4, the mode by routing is electrically connected to, on substrate 1, be provided with pad 7, pad 7 is electrically connected to pressure transducer inside chip with external electronic circuits, when pressure transducer is worked, pressure sensor chip 3 gathers external pressures to be changed and is converted into electric signal, the signal that integrated circuit (IC) chip 5 gathers pressure sensor chip 3 carries out rough handling and is passed to external electronic circuits through described pad.
In order to guarantee that pressure transducer normally works, the present embodiment pressure transducer, is provided with the first hole 61, the second hole 62 and interconnection 63, the first holes 61 and is communicated with by interconnection 63 with the second hole 62 on substrate 1.Interconnection 63 is positioned at pressure sensor chip 3 belows, and the first hole 61 is in communication with the outside, the second hole 62 and pressure transducer internal communication, and the first hole 61, the second hole 62 form bleeder vent 6 with interconnection 63, are communicated with pressure transducer inside and outside.In the assembling of the present embodiment pressure transducer, use procedure, exterior terminal needn't arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, meanwhile, in assembling use procedure, the bleeder vent being arranged on substrate can avoid extraneous air-flow or light to directly act on pressure sensor chip, therefore avoid and the pressure transducer errors producing improves pressure transducer performance.In addition, interconnection 63 be positioned at pressure sensor chip 3 belows externally stress be delivered to after substrate, interconnection can play buffer action, do not act on pressure sensor chip, avoid external stress to exert an influence and cause sensor error pressure transducer, improve Pressure Sensor Precision, make pressure transducer stable performance.
Embodiment tri-:
Design concept based on identical, the utility model pressure transducer can adopt another kind of outer enclosure structure:
As shown in Figure 4, the present embodiment pressure transducer comprises substrate 1, with the fixing framework 2a of substrate 1, is fixed on framework 2a away from the top board 2b of substrate 1 one end, and substrate 1, framework 2a and top board 2b form the present embodiment pressure transducer outer enclosure structure.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 arrange, between pressure sensor chip 3 and integrated circuit (IC) chip 5, by metal lead wire 4, the mode by routing is electrically connected to, on substrate 1, be provided with pad 7, pad 7 is electrically connected to pressure transducer inside chip with external electronic circuits, when pressure transducer is worked, pressure sensor chip 3 gathers external pressures to be changed and is converted into electric signal, the signal that integrated circuit (IC) chip 5 gathers pressure sensor chip 3 carries out rough handling and is passed to external electronic circuits through described pad 7.
In order to guarantee that pressure transducer normally works, pressure transducer is provided with the bleeder vent that is communicated with pressure transducer inside and outside.As shown in Figure 4, bleeder vent 6 is arranged on substrate 1, bleeder vent 6 be communicated with substrates 1 near pressure sensor chip 5 one sides and substrate 1 opposite side away from pressure sensor chip 5.Bleeder vent 6 longitudinally connects substrate 1, is communicated with pressure transducer inside and outside.In the assembling of the present embodiment pressure transducer, use procedure, exterior terminal needn't arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, meanwhile, in assembling use procedure, the bleeder vent being arranged on substrate can avoid extraneous air-flow or light to directly act on pressure sensor chip, therefore avoid and the pressure transducer errors producing improves pressure transducer performance.
Equally, the bleeder vent 6 of this encapsulating structure also can be the same with ventilative 6 structures on substrate 1 in embodiment bis-, on substrate, be provided with the first hole, the second hole and interconnection, the first hole is communicated with by interconnection with the second hole, and interconnection is positioned at pressure transducer below.The first hole is in communication with the outside, the second hole and pressure transducer internal communication, and the first hole, the second hole and interconnection form bleeder vent 6, are communicated with pressure transducer inside and outside.The bleeder vent of this design is positioned in pressure sensor substrate, bleeder vent be communicated with substrate near pressure sensor chip one side and substrate the opposite side away from pressure sensor chip.The pressure transducer of this structure is also the imbody of the utility model pressure sensor design thinking, can realize the utility model pressure transducer advantage, belongs to the utility model pressure transducer claim protection domain.Simultaneously as embodiment bis-, interconnection can play buffer action, and external stress is not acted on pressure sensor chip, avoids external stress to exert an influence and cause sensor error pressure transducer, improve Pressure Sensor Precision, make pressure transducer stable performance.
The utility model pressure transducer, bleeder vent is arranged on the substrate of pressure transducer.In pressure transducer assembling use procedure, end product needn't be at pressure transducer top design cavity, reduce end product thickness, increase pressure transducer and use flexibility ratio, meanwhile, in assembling use procedure, the bleeder vent being arranged on substrate can avoid extraneous air-flow or light to directly act on pressure sensor chip, therefore avoid and the pressure transducer errors producing improves pressure transducer performance.Therefore, the utility model pressure sensing appliance has performance good, is conducive to the advantage of Miniaturization Design.
These are only the utility model case study on implementation, be not limited to the utility model, as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection domain of recording in claims.
Claims (6)
1. a pressure transducer, comprise outer enclosure structure, be arranged at pressure sensor chip and integrated circuit (IC) chip in described outer enclosure structure, and bleeder vent, described outer enclosure structure comprises substrate, described substrate is provided with pad away from described pressure transducer and integrated circuit (IC) chip one side, described pressure transducer is combined with external circuit by described substrate pads, described bleeder vent is communicated with described encapsulating structure inside and outside, it is characterized in that: described bleeder vent is arranged on the substrate of described pressure transducer.
2. pressure transducer according to claim 1, it is characterized in that: described outer enclosure structure also comprises shell, described shell and described substrate are fixedly installed, and described shell coordinates described pressure sensor chip and described integrated circuit (IC) chip and external isolation with described substrate.
3. pressure transducer according to claim 1, is characterized in that: described outer enclosure structure also comprises framework and top board, and described framework and described substrate are fixedly installed, and described top board is arranged at described framework away from described substrate one end; Described substrate, framework and top board coordinate described pressure sensor chip and described integrated circuit (IC) chip and external isolation.
4. according to the pressure transducer described in the arbitrary claim of claims 1 to 3, it is characterized in that: described bleeder vent longitudinally connects described substrate.
5. according to the pressure transducer described in the arbitrary claim of claims 1 to 3, it is characterized in that: on described substrate, be provided with the first hole, the second hole and interconnection, described the first hole is communicated with by described interconnection with described the second hole; Described the first hole is in communication with the outside, described the second hole and described pressure transducer internal communication, and described the first hole, described the second hole and described interconnection form described bleeder vent.
6. pressure transducer according to claim 5, is characterized in that: described interconnection is positioned at described pressure transducer below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220491.6U CN203848956U (en) | 2014-04-30 | 2014-04-30 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220491.6U CN203848956U (en) | 2014-04-30 | 2014-04-30 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203848956U true CN203848956U (en) | 2014-09-24 |
Family
ID=51561959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420220491.6U Expired - Lifetime CN203848956U (en) | 2014-04-30 | 2014-04-30 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203848956U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110954262A (en) * | 2019-12-04 | 2020-04-03 | 上海矽睿科技有限公司 | Water-resistant and oil-proof packaged differential pressure sensor |
| WO2021031497A1 (en) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | Vibration sensing device |
-
2014
- 2014-04-30 CN CN201420220491.6U patent/CN203848956U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021031497A1 (en) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | Vibration sensing device |
| CN110954262A (en) * | 2019-12-04 | 2020-04-03 | 上海矽睿科技有限公司 | Water-resistant and oil-proof packaged differential pressure sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |