CN202679629U - MEMS (Micro-electromechanical System) microphone - Google Patents
MEMS (Micro-electromechanical System) microphone Download PDFInfo
- Publication number
- CN202679629U CN202679629U CN 201220301155 CN201220301155U CN202679629U CN 202679629 U CN202679629 U CN 202679629U CN 201220301155 CN201220301155 CN 201220301155 CN 201220301155 U CN201220301155 U CN 201220301155U CN 202679629 U CN202679629 U CN 202679629U
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- wiring board
- mems
- passage
- chip
- microphone
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- 239000004020 conductor Substances 0.000 claims abstract description 8
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses an MEMS (Micro-electromechanical System) microphone, comprising an encapsulation structure composed of a housing with an opening on one end and a circuit board. A surface of the circuit board inside the encapsulation structure is provided with an MEMS acoustoelectric chip and an ASIC chip, the MEMS acoustoelectric chip, the ASIC chip and the circuit board are electrically connected through conductor wires, an inner part of the circuit board is provided with a channel connecting the MEMS acoustoelectric chip and a side end face of the circuit board, since an opening at one end of the channel is arranged on the side end face of the circuit board, an effect of side sound entering can be achieved, and since the other end of the channel is communicated with the MEMS acoustoelectric chip, an effect can be achieved that the sound enters from a side face and acts on the MEMS acoustoelectric chip through the circuit board.
Description
Technical field
The utility model relates to a kind of acoustic-electric conversion equipment, relates in particular to a kind of MEMS microphone.
Background technology
Utilizing in recent years the MEMS(MEMS (micro electro mechanical system)) the integrated MEMS microphone of technique begins to be applied in batches in the electronic products such as mobile phone, notebook computer, and its encapsulation volume is less than traditional electret microphone.Therefore be subject to most of microphone manufacturer's favor.
Conventional MEMS microphone, comprise: the encapsulating structure that is formed by shell and the wiring board of an end opening, the inner described PCB surface of described encapsulating structure is provided with MEMS acoustic-electric chip and asic chip, described MEMS acoustic-electric chip, be electrically connected by conductor wire between described asic chip and the wiring board, in order to prevent into the impact of process to the diaphragm on the MEMS acoustic-electric chip, usually the sound hole is arranged on the side of shell, be used for realizing sound effective value, the MEMS microphone external sound of this structure can only be by the sonoporation on the shell to MEMS acoustic-electric chip, can't realize being applied to effect on the MEMS acoustic-electric chip by wiring board, need thus to design a kind of novel MEMS microphone.
The utility model content
In view of the above problems, the purpose of this utility model provides a kind of side of not only can having realized and advances sound but also can be applied to a kind of MEMS microphone on the MEMS acoustic-electric chip by wiring board.
For addressing the above problem, the utility model is by the following technical solutions: a kind of MEMS microphone, comprise: the encapsulating structure that is formed by shell and the wiring board of an end opening, the inner described PCB surface of described encapsulating structure is provided with MEMS acoustic-electric chip and asic chip, described MEMS acoustic-electric chip, be electrically connected by conductor wire between described asic chip and the wiring board, wherein, described wiring board inside is provided with the passage that is communicated with described MEMS acoustic-electric chip and wiring board side end face, external sound is applied to the aperture position of wiring board side end face passage, by the passage realization of wiring board inside and being communicated with of MEMS acoustic-electric chip.
A kind of preferred technical scheme, it is inner that described passage is arranged on described wiring board by etched mode.
A kind of preferred technical scheme, described passage is arranged on described wiring board inside by the mode of machining.
A kind of preferred technical scheme, described conductor wire are gold thread.
A kind of preferred technical scheme, the aperture position of the described passage in described wiring board side end face and described PCB surface are respectively equipped with Air Filter with the aperture position of the passage that described MEMS acoustic-electric chip is communicated with.
A kind of preferred technical scheme, the aperture position of the described passage in described wiring board side end face or described PCB surface are provided with Air Filter with the aperture position of the passage that described MEMS acoustic-electric chip is communicated with.
Utilize above-mentioned according to MEMS microphone of the present utility model, owing to being provided with the passage that is communicated with described MEMS acoustic-electric chip and wiring board side end face in described wiring board inside, the opening of passage one end is owing to arranging on the side end face of wiring board, can realize the side advance sound effect, simultaneously because the passage other end is communicated with described MEMS acoustic-electric chip, realized not only can realizing that the side advances sound but also can be applied to effect on the MEMS acoustic-electric chip by wiring board.
Description of drawings
By the content of reference below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present utility model, other purpose of the present utility model and result will understand and easy to understand more.
Fig. 1 is the profile of the utility model embodiment MEMS microphone.
Fig. 2 is the structural representation after the utility model embodiment MEMS microphone is removed Air Filter.
Embodiment
Below with reference to accompanying drawing specific embodiment of the utility model is described in detail.
Embodiment: such as Fig. 1, shown in Figure 2, a kind of MEMS microphone, comprise: the encapsulating structure that is formed by shell 1 and the wiring board 2 of an end opening, the inner described wiring board of described encapsulating structure 2 surfaces are provided with MEMS acoustic-electric chip 3 and asic chip 4, described MEMS acoustic-electric chip 3, be electrically connected by conductor wire 5 between described asic chip 4 and the wiring board 2, wherein, described wiring board 2 inside are provided with the passage 22 that is communicated with described MEMS acoustic-electric chip 3 and wiring board 2 side end faces, external sound is applied to the aperture position of the passage 22 of wiring board 2 side end faces, realizes and realizes being communicated with of MEMS acoustic-electric chip 3 into the effect of sound by the passage 22 of wiring board 2 inside.
As realizing a kind of preferred technical scheme of the utility model, described passage 22 is arranged on described wiring board 2 inside by etched mode; Certainly, described passage 22 also can be arranged on by the mode of machining described wiring board 2 inside.
Described conductor wire 5 in the present embodiment is gold thread, and its ductility and electric conductivity are better.
As realizing a kind of preferred technical scheme of the utility model, the aperture position of the passage 22 that the aperture position of the described passage 22 in described wiring board 2 side end faces and described wiring board 2 surfaces are communicated with described MEMS acoustic-electric chip 3 is respectively equipped with Air Filter 6, can prevent effectively that extraneous dust from entering the MEMS microphone by passage 22 inner; Certainly Air Filter 6 also can be arranged on separately described passage 22 aperture positions in described wiring board 2 side end faces or described wiring board 2 surperficial passage 22 aperture positions that are communicated with described MEMS acoustic-electric chip 3.
Utilize above-mentioned according to MEMS microphone of the present utility model, owing to being provided with the passage that is communicated with described MEMS acoustic-electric chip and wiring board side end face in described wiring board inside, the opening of passage one end is owing to arranging on the side end face of wiring board, can realize the side advance sound effect, simultaneously because the passage other end is communicated with described MEMS acoustic-electric chip, realized not only can realizing that the side advances sound but also can be applied to effect on the MEMS acoustic-electric chip by wiring board.
Above demonstration and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. MEMS microphone, comprise: the encapsulating structure that is formed by shell and the wiring board of an end opening, the inner described PCB surface of described encapsulating structure is provided with MEMS acoustic-electric chip and asic chip, be electrically connected by conductor wire between described MEMS acoustic-electric chip, described asic chip and the wiring board, it is characterized in that: described wiring board inside is provided with the passage that is communicated with described MEMS acoustic-electric chip and wiring board side end face.
2. MEMS microphone as claimed in claim 1 is characterized in that: it is inner that described passage is arranged on described wiring board by etched mode.
3. MEMS microphone as claimed in claim 1 is characterized in that: it is inner that the mode of described passage by machining is arranged on described wiring board.
4. MEMS microphone as claimed in claim 1, it is characterized in that: described conductor wire is gold thread.
5. MEMS microphone as claimed in claim 1, it is characterized in that: the aperture position of the described passage in described wiring board side end face and described PCB surface are respectively equipped with Air Filter with the aperture position of the passage that described MEMS acoustic-electric chip is communicated with.
6. MEMS microphone as claimed in claim 1, it is characterized in that: the aperture position of the described passage in described wiring board side end face or described PCB surface are provided with Air Filter with the aperture position of the passage that described MEMS acoustic-electric chip is communicated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220301155 CN202679629U (en) | 2012-06-26 | 2012-06-26 | MEMS (Micro-electromechanical System) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220301155 CN202679629U (en) | 2012-06-26 | 2012-06-26 | MEMS (Micro-electromechanical System) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202679629U true CN202679629U (en) | 2013-01-16 |
Family
ID=47500498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220301155 Expired - Lifetime CN202679629U (en) | 2012-06-26 | 2012-06-26 | MEMS (Micro-electromechanical System) microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202679629U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9369788B1 (en) | 2014-12-05 | 2016-06-14 | Industrial Technology Research Institute | MEMS microphone package |
| US10125012B2 (en) | 2013-08-27 | 2018-11-13 | Infineon Technologies Ag | MEMS device |
| CN112995867A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | MEMS microphone and electronic device |
| CN112995868A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | MEMS microphone and electronic device |
-
2012
- 2012-06-26 CN CN 201220301155 patent/CN202679629U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10125012B2 (en) | 2013-08-27 | 2018-11-13 | Infineon Technologies Ag | MEMS device |
| US9369788B1 (en) | 2014-12-05 | 2016-06-14 | Industrial Technology Research Institute | MEMS microphone package |
| CN105792083A (en) * | 2014-12-05 | 2016-07-20 | 财团法人工业技术研究院 | Micro-electromechanical microphone package |
| CN105792083B (en) * | 2014-12-05 | 2019-01-18 | 财团法人工业技术研究院 | Micro-electromechanical microphone package |
| CN112995867A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | MEMS microphone and electronic device |
| CN112995868A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | MEMS microphone and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |
|
| CX01 | Expiry of patent term |