CN103968972A - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN103968972A CN103968972A CN201410181410.0A CN201410181410A CN103968972A CN 103968972 A CN103968972 A CN 103968972A CN 201410181410 A CN201410181410 A CN 201410181410A CN 103968972 A CN103968972 A CN 103968972A
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- pressure sensor
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- pressure transducer
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- buffer part
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Abstract
The invention discloses a pressure sensor. The pressure sensor comprises an outer packaging structure, a pressure sensor chip, an integrated circuit chip and air holes, wherein the pressure sensor chip and the integrated circuit chip are arranged inside the outer packaging structure, and the air holes are communicated with the interior and the exterior of the pressure sensor. The pressure sensor further comprises a buffering part arranged inside the outer packaging structure. The pressure sensor chip is fixedly connected with a substrate through the buffering part which prevents the external stress from acting on the pressure sensor chip through the substrate. In the assembling and using process of the pressure sensor, the external stress is buffered and removed through the buffering part after being transmitted to the substrate, the external stress does not act on the pressure sensor chip, the sensor error caused by the effect of the external stress on the pressure sensor is avoided, the pressure sensor precision is improved, and the pressure sensor is stable in performance. The pressure sensor has the advantage of being superior in performance.
Description
Technical field
The present invention relates to sensor field, relate in particular to a kind of pressure transducer of function admirable.
Background technology
Along with the development of miniaturization of electronic products microminiaturization, electronic product is more and more higher to the requirement of its internal component miniaturization.Pressure transducer, as common sensor, is applied in multiple electronic product, therefore the Miniaturization Design of pressure transducer also becomes focal point.In order to guarantee the Miniaturization Design of pressure transducer, the pressure transducer based on MEMS (micro electro mechanical system) (Micro-Electro-MechanicalSystem, MEMS) is more and more subject to people and pays close attention to.
Pressure transducer based on MEMS technology, comprises substrate, is fixed on the shell of described substrate, and described substrate and described shell form described pressure transducer outer enclosure structure.In described outer enclosure structure, be fixedly installed pressure sensor chip and integrated circuit (IC) chip on described substrate, pressure sensor chip is electrically connected to the mode of integrated circuit (IC) chip by metal lead wire routing, on substrate, be provided with pad, substrate pads is electrically connected to pressure transducer inside chip with external electronic circuits, meanwhile, pressure transducer is fixed on outside mainboard by pad.The pressure transducer of traditional structure, pressure sensor chip is directly fixed on substrate, in pressure transducer assembling, use procedure, the stress that substrate is subject to can conduct on pressure sensor chip, pressure sensor chip is responded to this stress, make pressure transducer produce error, cause pressure transducer performance issue.
Therefore be necessary to propose a kind of improvement, to overcome traditional structure pressure transducer defect.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of pressure transducer of function admirable.
To achieve these goals, the present invention is by the following technical solutions:
A kind of pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure, integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, described outer enclosure structure comprises substrate, and: described pressure transducer also comprises buffer part, and described buffer part is arranged on the described substrate in described outer enclosure structure, and described pressure sensor chip is arranged at described buffer part away from described substrate one side.
As a kind of preferred technical scheme, described outer enclosure structure also comprises shell, and described shell and described substrate are fixedly installed, and described shell coordinates described pressure sensor chip and described integrated circuit (IC) chip and external isolation with described substrate.
As a kind of preferred technical scheme, described outer enclosure structure also comprises framework and top board, and described framework and described substrate are fixedly installed, and described top board is arranged at described framework away from described substrate one end; Described substrate, framework and top board coordinate described pressure sensor chip and described integrated circuit (IC) chip and external isolation.
As a kind of preferred technical scheme of above scheme, described integrated circuit (IC) chip is also arranged at described buffer part away from described substrate one side.
Based on above scheme, as further preferred technical scheme, the corresponding described buffer part of described substrate is provided with groove, and described buffer part is arranged in described substrate recess.
Pressure transducer of the present invention, in outer enclosure structure, be provided with buffer part, pressure sensor chip is arranged at buffer part away from substrate one side, in pressure transducer assembling, use procedure, external stress is delivered to after substrate, through buffer part buffering, lays down, do not act on pressure sensor chip, avoid external stress to exert an influence and cause sensor error pressure transducer, improve Pressure Sensor Precision, make pressure transducer stable performance.Therefore, pressure sensing appliance of the present invention has the advantage of function admirable.
Accompanying drawing explanation
Fig. 1 is pressure transducer the first embodiment cut-open view of the present invention;
Fig. 2 is the birds-eye perspective of pressure transducer inner structure shown in Fig. 1;
Fig. 3 is pressure transducer the second embodiment cut-open view of the present invention;
Fig. 4 is pressure transducer of the present invention the 3rd embodiment cut-open view.
Embodiment
Below in conjunction with accompanying drawing, describe pressure transducer concrete structure of the present invention in detail.
Embodiment mono-:
As depicted in figs. 1 and 2, the present embodiment pressure transducer, comprises substrate 1, and with the shell 2 that substrate 1 is fixedly installed, substrate 1 forms pressure transducer outer enclosure structure with shell 2.The integrated circuit (IC) chip 4 that be arranged in pressure transducer outer enclosure structure, the pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 arranges, between pressure sensor chip 3 and integrated circuit (IC) chip 4, by metal lead wire 5, the mode by routing is electrically connected to, on substrate 1, be provided with pad, pad is electrically connected to pressure transducer inside chip with external electronic circuits.In order to guarantee Multifunction Sensor, normally work, Multifunction Sensor is provided with the bleeder vent that is communicated with pressure transducer inside and outside, ambient pressure variation enters Multifunction Sensor inside by bleeder vent, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, and the signal that integrated circuit (IC) chip 4 gathers pressure sensor chip 3 carries out rough handling and is passed to external electronic circuits through described pad.
As depicted in figs. 1 and 2, the present embodiment pressure transducer also comprises buffer part 6, and buffer part 6 is arranged in encapsulating structure, substrate 1 is near shell 2 one sides, and pressure sensor chip 3 is fixed on buffer part 6 away from substrate 1 one sides.Pressure sensor chip 3 is fixed on substrate 1 by buffer part 6, in pressure transducer assembling, the course of work, external stress is passed to substrate 1, after by buffer part 6 buffering, laid down, do not act on pressure sensor chip 3, avoided external stress to exert an influence to pressure transducer 3 and cause pressure sensor data error, improve Pressure Sensor Precision, make pressure transducer stable performance, guarantee that pressure transducer of the present invention is functional.
As a kind of technical scheme of optimization, as shown in Figure 1, the corresponding buffer part 6 of substrate 1 is provided with the groove 7 that material forms, and buffer part 6 is arranged in groove 7, and pressure sensor chip 3 is arranged at buffer part 6 away from substrate 1 one sides.The design of groove 7 can make full use of pressure transducer inner space, and the pressure transducer inside chip height of avoiding the setting because of buffer part 6 to cause uprises, and is conducive to the Miniaturization Design of product.
Embodiment bis-:
Similar with embodiment mono-structure, as shown in Figure 3, the present embodiment pressure transducer, comprises substrate 1, and with the shell 2 that substrate 1 is fixedly installed, substrate 1 forms pressure transducer outer enclosure structure with shell 2.The integrated circuit (IC) chip 4 that be arranged in pressure transducer outer enclosure structure, the pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 arranges, between pressure sensor chip 3 and integrated circuit (IC) chip 4, by metal lead wire 5, the mode by routing is electrically connected to, on substrate 1, be provided with pad, pad is electrically connected to pressure transducer inside chip with external electronic circuits.In order to guarantee Multifunction Sensor, normally work, Multifunction Sensor is provided with the bleeder vent that is communicated with pressure transducer inside and outside, ambient pressure variation enters Multifunction Sensor inside by bleeder vent, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, and the signal that integrated circuit (IC) chip 4 gathers pressure sensor chip 3 carries out rough handling and is passed to external electronic circuits through described pad.
As shown in Figure 3, the present embodiment pressure transducer also comprises buffer part 6, and buffer part 6 is arranged in encapsulating structure, substrate 1 is near shell 2 one sides, and pressure sensor chip 3 and integrated circuit (IC) chip 4 are fixed on buffer part 6 away from substrate 1 one sides.Pressure sensor chip 3 is fixed on substrate 1 by buffer part 6, in pressure transducer assembling, the course of work, external stress is passed to substrate 1, after by buffer part 6 buffering, laid down, do not act on pressure sensor chip 3, avoided external stress to exert an influence to pressure transducer 3 and cause pressure sensor data error, improve Pressure Sensor Precision, make pressure transducer stable performance, guarantee that pressure transducer of the present invention is functional.
As a kind of preferred technical scheme, as shown in Figure 3, the corresponding buffer part 6 of substrate 1 is provided with the groove 7 that material forms, and buffer part 6 is arranged in groove 7, and pressure sensor chip 3 and integrated circuit (IC) chip 4 are arranged at buffer part 6 away from substrate 1 one sides.The design of groove 7 can make full use of pressure transducer inner space, and the pressure transducer inside chip height of avoiding the setting because of buffer part 6 to cause uprises, and is conducive to the Miniaturization Design of product.
Embodiment tri-:
Mentality of designing based on identical, pressure transducer of the present invention can adopt another kind of outer enclosure structure:
As shown in Figure 4, the present embodiment pressure transducer comprises substrate 1, with the fixing framework 2a of substrate 1, is fixed on framework 2a away from the top board 2b of substrate 1 one end, and substrate 1, framework 2a and top board 2b form the present embodiment pressure transducer outer enclosure structure.The integrated circuit (IC) chip 4 that be arranged in pressure transducer outer enclosure structure, the pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 arranges, between pressure sensor chip 3 and integrated circuit (IC) chip 4, by metal lead wire 5, the mode by routing is electrically connected to, on substrate 1, be provided with pad, pad is electrically connected to pressure transducer inside chip with external electronic circuits.In order to guarantee Multifunction Sensor, normally work, Multifunction Sensor is provided with the bleeder vent that is communicated with pressure transducer inside and outside, ambient pressure variation enters Multifunction Sensor inside by bleeder vent, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, and the signal that integrated circuit (IC) chip 4 gathers pressure sensor chip 3 carries out rough handling and is passed to external electronic circuits through described pad.
As shown in Figure 4, the present embodiment pressure transducer also comprises buffer part 6, and buffer part 6 is arranged in encapsulating structure, substrate 1 is near shell 2 one sides, and pressure sensor chip 3 is fixed on buffer part 6 away from substrate 1 one sides.Pressure sensor chip 3 is fixed on substrate 1 by buffer part 6, in pressure transducer assembling, the course of work, external stress is passed to substrate 1, after by buffer part 6 buffering, laid down, do not act on pressure sensor chip 3, avoided external stress to exert an influence to pressure transducer 3 and cause pressure sensor data error, improve Pressure Sensor Precision, make pressure transducer stable performance, guarantee that pressure transducer of the present invention is functional.
As a kind of technical scheme of optimization, as shown in Figure 4, the corresponding buffer part 6 of substrate 1 is provided with the groove 7 that material forms, and buffer part 6 is arranged in groove 7, and pressure sensor chip 3 is arranged at buffer part 6 away from substrate 1 one sides.The design of groove 7 can make full use of pressure transducer inner space, and the pressure transducer inside chip height of avoiding the setting because of buffer part 6 to cause uprises, and is conducive to the Miniaturization Design of product.
Certainly, similar with embodiment bis-, three, in the pressure transducer of the outer enclosure structure of the present embodiment, integrated circuit (IC) chip 4 can be arranged in buffer part 6 jointly with pressure sensor chip 3; Integrated circuit (IC) chip 4 also can be wholely set with buffer part 6, all can embody pressure sensor design thinking of the present invention, realizes pressure transducer advantage of the present invention.
Pressure transducer of the present invention, externally in encapsulating structure, buffer part is set, pressure sensor chip is fixed by buffer part and substrate, the setting of buffer part avoids external stress to act on pressure sensor chip by substrate, in pressure transducer assembling, use procedure, external stress is delivered to after substrate, through buffer part buffering, lay down, do not act on pressure sensor chip, avoid external stress to exert an influence and cause sensor error pressure transducer, improve Pressure Sensor Precision, guarantee that pressure transducer of the present invention is functional.
These are only the invention process case, be not limited to the present invention, as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection domain of recording in claims.
Claims (6)
1. a pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure, integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, described outer enclosure structure comprises substrate, it is characterized in that: described pressure transducer also comprises buffer part, described buffer part is arranged on the described substrate in described outer enclosure structure, and described pressure sensor chip is arranged at described buffer part away from described substrate one side.
2. pressure transducer according to claim 1, it is characterized in that: described outer enclosure structure also comprises shell, described shell and described substrate are fixedly installed, and described shell coordinates described pressure sensor chip and described integrated circuit (IC) chip and external isolation with described substrate.
3. pressure transducer according to claim 1, is characterized in that: described outer enclosure structure also comprises framework and top board, and described framework and described substrate are fixedly installed, and described top board is arranged at described framework away from described substrate one end; Described substrate, framework and top board coordinate described pressure sensor chip and described integrated circuit (IC) chip and external isolation.
4. according to the pressure transducer described in the arbitrary claim of claims 1 to 3, it is characterized in that: described integrated circuit (IC) chip is also arranged at described buffer part away from described substrate one side.
5. according to the pressure transducer described in the arbitrary claim of claims 1 to 3, it is characterized in that: the corresponding described buffer part of described substrate is provided with groove, and described buffer part is arranged in described substrate recess.
6. pressure transducer according to claim 4, is characterized in that: the corresponding described buffer part of described substrate is provided with groove, and described buffer part is arranged in described substrate recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410181410.0A CN103968972A (en) | 2014-04-30 | 2014-04-30 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410181410.0A CN103968972A (en) | 2014-04-30 | 2014-04-30 | Pressure sensor |
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|---|---|
| CN103968972A true CN103968972A (en) | 2014-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410181410.0A Pending CN103968972A (en) | 2014-04-30 | 2014-04-30 | Pressure sensor |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104688307A (en) * | 2015-03-13 | 2015-06-10 | 王国栋 | Compulsive shaping device of bone joint |
| CN104729984A (en) * | 2015-03-24 | 2015-06-24 | 国网电力科学研究院武汉南瑞有限责任公司 | Composite monitoring sensor for monitoring grounding grid corrosion |
| CN104900599A (en) * | 2015-04-16 | 2015-09-09 | 歌尔声学股份有限公司 | Packaging structure and method of integrated sensor |
| CN106802199A (en) * | 2016-12-27 | 2017-06-06 | 吴中区穹窿山德毅新材料技术研究所 | Novel sensor |
| CN108847442A (en) * | 2018-06-30 | 2018-11-20 | 山东昊润自动化技术有限公司 | A kind of pressure chip packaging method |
| CN109171102A (en) * | 2018-10-29 | 2019-01-11 | 深圳市科迈爱康科技有限公司 | Intelligent shoe and its middle bed die group |
| CN110793689A (en) * | 2019-11-30 | 2020-02-14 | 南通远辰测控设备有限公司 | High-efficient electric dynamometer machine |
| CN113218568A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor with air hole for measuring air pressure height and liquid level depth |
| WO2022061721A1 (en) * | 2020-09-25 | 2022-03-31 | 华为技术有限公司 | Chip and manufacturing method therefor, and electronic equipment |
| CN115057407A (en) * | 2022-04-29 | 2022-09-16 | 潍坊歌尔微电子有限公司 | MEMS product and electronic equipment |
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| JPS6388867A (en) * | 1986-10-01 | 1988-04-19 | Mitsubishi Electric Corp | Htbrid integrated circuit device for semiconductor pressure sensor |
| JP2001208626A (en) * | 2000-01-24 | 2001-08-03 | Mitsubishi Electric Corp | Semiconductor pressure sensor |
| CN101253411A (en) * | 2005-08-18 | 2008-08-27 | C&N株式会社 | Acceleration sensor device and sensor device |
| CN101271029A (en) * | 2008-05-13 | 2008-09-24 | 上海芯敏微系统技术有限公司 | Silicon piezoresistance type pressure transducer encapsulation structure based on substrates |
| CN103674399A (en) * | 2013-12-25 | 2014-03-26 | 北京必创科技有限公司 | Stress dispersion MEMS (Micro-Electro-Mechanical Systems) plastic package pressure sensor and preparation method thereof |
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2014
- 2014-04-30 CN CN201410181410.0A patent/CN103968972A/en active Pending
Patent Citations (5)
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| JPS6388867A (en) * | 1986-10-01 | 1988-04-19 | Mitsubishi Electric Corp | Htbrid integrated circuit device for semiconductor pressure sensor |
| JP2001208626A (en) * | 2000-01-24 | 2001-08-03 | Mitsubishi Electric Corp | Semiconductor pressure sensor |
| CN101253411A (en) * | 2005-08-18 | 2008-08-27 | C&N株式会社 | Acceleration sensor device and sensor device |
| CN101271029A (en) * | 2008-05-13 | 2008-09-24 | 上海芯敏微系统技术有限公司 | Silicon piezoresistance type pressure transducer encapsulation structure based on substrates |
| CN103674399A (en) * | 2013-12-25 | 2014-03-26 | 北京必创科技有限公司 | Stress dispersion MEMS (Micro-Electro-Mechanical Systems) plastic package pressure sensor and preparation method thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104688307A (en) * | 2015-03-13 | 2015-06-10 | 王国栋 | Compulsive shaping device of bone joint |
| CN104729984A (en) * | 2015-03-24 | 2015-06-24 | 国网电力科学研究院武汉南瑞有限责任公司 | Composite monitoring sensor for monitoring grounding grid corrosion |
| CN104900599A (en) * | 2015-04-16 | 2015-09-09 | 歌尔声学股份有限公司 | Packaging structure and method of integrated sensor |
| CN106802199A (en) * | 2016-12-27 | 2017-06-06 | 吴中区穹窿山德毅新材料技术研究所 | Novel sensor |
| CN108847442A (en) * | 2018-06-30 | 2018-11-20 | 山东昊润自动化技术有限公司 | A kind of pressure chip packaging method |
| CN109171102A (en) * | 2018-10-29 | 2019-01-11 | 深圳市科迈爱康科技有限公司 | Intelligent shoe and its middle bed die group |
| CN110793689A (en) * | 2019-11-30 | 2020-02-14 | 南通远辰测控设备有限公司 | High-efficient electric dynamometer machine |
| WO2022061721A1 (en) * | 2020-09-25 | 2022-03-31 | 华为技术有限公司 | Chip and manufacturing method therefor, and electronic equipment |
| CN113218568A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor with air hole for measuring air pressure height and liquid level depth |
| CN115057407A (en) * | 2022-04-29 | 2022-09-16 | 潍坊歌尔微电子有限公司 | MEMS product and electronic equipment |
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Application publication date: 20140806 |