CN205177827U - Packaging structure for chip - Google Patents
Packaging structure for chip Download PDFInfo
- Publication number
- CN205177827U CN205177827U CN201520978312.XU CN201520978312U CN205177827U CN 205177827 U CN205177827 U CN 205177827U CN 201520978312 U CN201520978312 U CN 201520978312U CN 205177827 U CN205177827 U CN 205177827U
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- CN
- China
- Prior art keywords
- chip
- circuit board
- shielding conductor
- housing
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 claims description 65
- 238000005452 bending Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a packaging structure for chip, including the circuit board that has the earthing terminal, still include the casing that becomes outside encapsulation with the circuit hoarding be provided with two at least core assembly pieces in the inner chamber of outside encapsulation, still be equipped with the one row at least shielded wire that is located between the two adjacent core assembly pieces in the inner chamber of outside encapsulation, the shielded wire is connected with the earthing terminal electricity of circuit board to formation is used for shielding electromagnetic interference's between the two adjacent core assembly pieces shielding portion. The utility model discloses a packaging structure is provided with one row at least shielded wire of being connected with circuit plate earthing end electricity between two adjacent core assembly pieces, this shielded wire lies in between the two adjacent core assembly pieces, that is to say, severs two adjacent core assembly piece branches on the space, can block the electromagnetic interference of this two core assembly piece transmission each other in the inner chamber from this for each the core assembly piece that is arranged in the inner chamber can normally be worked.
Description
Technical field
The utility model relates to the encapsulation field of chip, more specifically, relates to a kind of encapsulating structure integrating multiple chip.
Background technology
In recent years, along with the development of science and technology, the volume of the electronic product such as mobile phone, notebook computer is in continuous reduction, and the performance requirement of people to these portable electronic products is also more and more higher, and this just requires that the volume of electronic component supporting with it also must reduce thereupon.
In order to meet the demand of development in science and technology, usually by multiple integrated chip in same encapsulating structure, such as MEMS pressure sensor, humidity sensor or temperature sensor and MEMS microphone are integrated in same encapsulation; Certainly, also exist the structure of two MEMS microphone sensor integration in same encapsulation in prior art.Fig. 1 shows a kind of encapsulating structure of chip, and it comprises circuit board 1a and surrounds the metal shell 2a of outer enclosure structure with circuit board 1a, and is provided with acoustic aperture 7a on metal shell 2a; The first microphone chip 3a and the first asic chip 4a for the treatment of its output signal is provided with in this outer enclosure structure, second microphone chip 6a and the second asic chip 5a for the treatment of its output signal is also provided with in this outer enclosure structure, wherein the earth terminal of the first asic chip 4a, the second asic chip 5a is connected on the shared grounding end GND of circuit board 1a, with reference to figure 1, Fig. 2.
Above-mentioned four integrated chips in same outer enclosure structure, thus can reduce the size of element, meet the miniaturization of modern electronic product.But electromagnetic interference can occur between said chip, this electromagnetic interference is transmitted in the inner chamber of outer enclosure or on the earth terminal of circuit board, thus affects the work of each chip, even makes the disabler of chip time serious.
Utility model content
An object of the present utility model is to provide a kind of new solution of encapsulating structure of chip.
According to first aspect of the present utility model, provide a kind of encapsulating structure of chip, comprise the circuit board with earth terminal, also comprise the housing surrounding outer enclosure with circuit board, in the inner chamber of described outer enclosure, be provided with at least two groups of chip; In the inner chamber of described outer enclosure, be also provided with at least one row's shielding conductor between two adjacent groups chip, described shielding conductor is electrically connected with the earth terminal of circuit board, to form the shielding part for shielding electromagnetic interference between two adjacent groups chip.
Preferably, one end of described shielding conductor connects the position of drawing earth terminal on circuit boards, and the other end extends towards the direction of housing.
Preferably, between the termination of the contiguous housing side of described shielding conductor and housing, there is gap or link together.
Preferably, described shielding conductor is in the arch bending towards housing, and two terminations of described shielding conductor all connect on circuit boards.
Preferably, between the vault of described shielding conductor and housing, there is gap or link together.
Preferably, described housing is metal material, and the position of the lower end of described housing and circuit board being drawn earth terminal links together.
Preferably, described shielding conductor one end is connected on housing, and to make the earth terminal of shielding conductor and circuit board be electrically connected, the other end extends towards the direction of circuit board.
Preferably, described shielding conductor is in the U-shaped structure bending towards circuit board, and two terminations of described shielding conductor are all connected on housing.
Preferably, described often row shielding conductor vertically or obliquely extends to the opposite end of inner chamber from one end of inner chamber.
Preferably, in described often row shielding conductor, between adjacent two shielding conductors, there is gap, or adjacent two shielding conductors closely.
Encapsulating structure of the present utility model, the shielding conductor that at least one row is electrically connected with circuit board ground end is provided with between two adjacent groups chip, this shielding conductor is between two adjacent groups chip, that is, spatially two adjacent groups chip separation is opened, the electromagnetic interference that this two groups of chip transmits in the lumen mutually can be blocked thus, each core assembly sheet being arranged in inner chamber can normally be worked; Encapsulating structure of the present utility model, can be inner at same encapsulating structure by multiple integrated chip, can not electromagnetic interference be produced between each chip under the effect of shielding conductor, the size of whole element can be reduced thus, meet the lightening development of modern electronic product.
Inventor of the present utility model finds, in the prior art, during by multiple integrated chip in same encapsulating structure, the electromagnetic wave that wherein certain or some chips radiate can be propagated in the inner chamber of encapsulating structure, thus disturbs the normal work of other chip.Therefore, the technical assignment that the utility model will realize or technical problem to be solved are that those skilled in the art never expect or do not anticipate, therefore the utility model is a kind of new technical scheme.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
In the description combined and the accompanying drawing forming a part for specification shows embodiment of the present utility model, and illustrate that one is used from and explains principle of the present utility model together with it.
Fig. 1 is the schematic diagram of conventional package.
Fig. 2 is the circuit connection diagram of conventional package.
Fig. 3 is the schematic diagram of the utility model encapsulating structure.
Fig. 4 is the structural representation of the utility model encapsulating structure the second execution mode.
Fig. 5 is the structural representation of the third execution mode of the utility model encapsulating structure.
Fig. 6 is the circuit connection diagram of the utility model encapsulating structure.
Embodiment
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, described technology, method and apparatus should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
With reference to figure 3, the utility model provides a kind of encapsulating structure of chip, and it comprises the circuit board 1 with earth terminal 9, also comprises the housing 2 surrounding outer enclosure with circuit board 1, after described housing 2 is fixed together with circuit board 1, define the outer enclosure with inner chamber 8.Wherein, described housing 2 can be the tubular in one end open, and one end of its opening is fixing on the circuit card 1, and be encapsulated by the openend of circuit board 1 by housing 2, the two defines the outer enclosure with inner chamber 8.In another execution mode of the utility model, housing 2 can be also tabular, and now also need to arrange side wall portion, by this sidewall portion, housing 2 is supported and fixed on the top of circuit board 1, three defines the outer enclosure with inner chamber 8 jointly.
Encapsulating structure of the present utility model, in the inner chamber 8 of described outer enclosure, be provided with at least two groups of chip, this two groups of chip can work alone, to realize respective function; Certainly, this two groups of chip also can interact.Chip of the present utility model can be the chip structures well-known to those skilled in the art such as microphone chip, asic chip, accelerometer chip, gyroscope chip, pressure sensor chip, temperature sensor chip or humidity sensor chip.
For a person skilled in the art, encapsulating structure of the present utility model can be the encapsulating structure of any chip portfolio, for convenience of description the technical solution of the utility model, is now described for microphone chip, asic chip.Microphone chip is the energy transducer for voice signal being converted to the signal of telecommunication, and it can utilize MEMS (MEMS (micro electro mechanical system)) technique to make.The signal of telecommunication that asic chip is mainly used in microphone chip exports processes.The structure of microphone chip, asic chip and the principle of work and power all belong to the common practise of those skilled in the art, no longer illustrate at this.
In the execution mode that the utility model one is concrete, wherein a core assembly sheet is the first microphone chip 3, first asic chip 4, and another core assembly sheet is second microphone chip 6, second asic chip 5.This two groups of chip is fixed on the circuit card 1 in a manner familiar to those skilled in the art.Described circuit board 1 can adopt the stacked mode of multi-layer sheet to be formed, be formed with at least three metal levels in the inside of this circuit board 1, these three metal levels respectively as circuit board 1 earth terminal 9, for export the first microphone chip 3 signal the first output 10, for exporting the second output 11 of second microphone chip 6 signal.These three metal levels are formed with link in the inner side of circuit board 1, and outside it, be formed with the pad for being connected with exterior terminal, this belongs to the common practise of those skilled in the art, no longer illustrates at this.
First microphone chip 3, first asic chip 4, second microphone chip 6, second asic chip 5 are fixing on the circuit card 1, and carry out circuit connection by routing mode well-known to those skilled in the art.Fig. 6 shows each microphone chip, circuit connection diagram between asic chip and circuit board.First asic chip 4, second asic chip 5 includes bias voltage end Bias, input Vin, earth terminal GND, output end vo ut, power end Vdd.Wherein, two electrodes of described first microphone chip 3 are connected on bias voltage end Bias, the input Vin of the first asic chip 4, and two electrodes of described second microphone chip 6 are connected on bias voltage end Bias, the input Vin of the second asic chip 5.Power end Vdd, the output end vo ut of described first asic chip 4 are connected on the first feeder ear Vdd1, the first output end vo ut1 of circuit board 1, power end Vdd, the output end vo ut of described second asic chip 5 are connected on the second feeder ear Vdd2, the second output end vo ut2 of circuit board 1, wherein, the earth terminal GND of described first asic chip 4, second asic chip 5 is connected on the same earth terminal GND of circuit board 1.
Encapsulating structure of the present utility model, at least one row's shielding conductor 12 between two adjacent groups chip is also provided with in the inner chamber 8 of described outer enclosure, wherein, described shielding conductor 12 is electrically connected with the earth terminal 9 of circuit board 1, to form the shielding part for shielding electromagnetic interference between two adjacent groups chip.Often arrange shielding conductor 12 to be formed by many shielding conductors 12 arrangement, these many shielding conductors 12 are arranged on the direction of inner chamber 8 opposite end.Wherein, shielding conductor 12 vertically can extend to inner chamber opposite end from one end of inner chamber is often arranged; Also can be often arrange shielding conductor 12 extends to inner chamber obliquely opposite end from one end of inner chamber, with reference to figure 5.Often arrange in shielding conductor 12, adjacent two shielding conductors 12 can equidistantly be arranged, and make to have certain gap between adjacent two shielding conductors 12, and the size in this gap can be selected according to electromagnetic wavelength.Such as when electromagnetic wavelength is longer, larger gap can be selected; When electromagnetic wavelength is shorter, needs to select less gap, can not pass through from the gap between adjacent two shielding conductors 12 to make this electromagnetic wave.For a person skilled in the art, adjacent two shielding conductors 12 also can be closely.
Shielding conductor 12 can be electrically connected by the earth terminal 9 of connected mode well-known to those skilled in the art and circuit board 1.In the execution mode that the utility model one is concrete, one end of described shielding conductor 12 connects on the circuit card 1, specifically, one end of this shielding conductor 12 connects the position of exposing earth terminal 9 on the circuit card 1, thus achieves between shielding conductor 12 with circuit board 1 earth terminal 9 and be electrically connected; The other end of shielding conductor 12 extends towards the direction of housing 2, thus spatially the two groups of chip being arranged in inner chamber 8 is separated, another core assembly sheet that the core assembly sheet that the first microphone chip 3, first asic chip 4 is formed and second microphone chip 6, second asic chip 5 are formed lays respectively at the both sides of shielding conductor 12.
In the execution mode that the utility model one is concrete, every root shielding conductor can be arranged in inner chamber 8 vertically, and termination of its contiguous housing 2 side can link together with housing 2, also can and housing 2 between there is certain gap.
In another concrete execution mode of the utility model, described shielding conductor 12 in the U-shaped structure of the arch or handstand that bend towards housing 2, with reference to figure 3.Two free terminations of described shielding conductor 12 all connect on the circuit card 1, and specifically, the two ends of this shielding conductor 12 connect the position of exposing earth terminal 9 on the circuit card 1, thus achieve between shielding conductor 12 with circuit board 1 earth terminal 9 and be electrically connected.This arch has the vault 121 that bends towards housing 2, and wherein, this vault 121 can link together with housing 2, with reference to figure 4; Also can and housing 2 between there is certain gap, with reference to figure 3.
Encapsulating structure of the present utility model, the shielding conductor that at least one row is electrically connected with circuit board ground end is provided with between two adjacent groups chip, this shielding conductor is between two adjacent groups chip, that is, spatially two adjacent groups chip separation is opened, the electromagnetic interference that this two groups of chip transmits in the lumen mutually can be blocked thus, each core assembly sheet being arranged in inner chamber can normally be worked; Encapsulating structure of the present utility model, can be inner at same encapsulating structure by multiple integrated chip, can not electromagnetic interference be produced between each chip under the effect of shielding conductor, the size of whole element can be reduced thus, meet the lightening development of modern electronic product.
In another concrete execution mode of the utility model, described housing 2 is the housing of metal material, and the lower end of described housing 2 contacts with the earth terminal 9 on circuit board 1 and links together, and this housing 2 itself also can be used as the earth terminal of circuit board.One end of described shielding conductor 12 is connected on housing 2, thus shielding conductor 12 is electrically connected by the earth terminal of housing 2 with circuit board, the other end of shielding conductor 12 extends towards the direction of circuit board 1, to form the shielding part for shielding electromagnetic interference between two adjacent groups chip.Wherein, every root shielding conductor 12 can be arranged in inner chamber 8 vertically, and the termination of its proximate circuitry plate 1 side can link together with circuit board 1, also can and circuit board 1 between there is certain gap.The utility model one preferred embodiment in, described shielding conductor 12 is in the U-shaped structure bending towards circuit board 1.Two free terminations of described shielding conductor 12 are all connected on housing 2, and this U-shaped structure has the bottom that bends towards circuit board 1, and wherein, the bottom of this U-shaped structure can link together with circuit board 1, also can and circuit board 1 between there is certain gap.
Encapsulating structure of the present utility model, because two groups of chip all includes microphone chip, therefore, described outer enclosure also needs arrange through hole 7, this through hole 7 is as the acoustic aperture of microphone, sound can be flowed into the inner chamber 8 of outer enclosure from this through hole 7, and act on microphone chip.When including the environmental sensor chips such as temperature sensor chip, pressure sensor, humidity sensor in two groups of chip, this through hole 7 can be communicated with chip with extraneous, make these environmental sensors can respond to extraneous environmental change, thus externally can the signal of telecommunication of output detections.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (10)
1. the encapsulating structure of a chip, it is characterized in that: comprise the circuit board (1) with earth terminal (9), also comprise the housing (2) surrounding outer enclosure with circuit board (1), in the inner chamber (8) of described outer enclosure, be provided with at least two groups of chip; At least one row's shielding conductor (12) between two adjacent groups chip is also provided with in the inner chamber (8) of described outer enclosure, described shielding conductor (12) is electrically connected with the earth terminal (9) of circuit board (1), to form the shielding part for shielding electromagnetic interference between two adjacent groups chip.
2. encapsulating structure according to claim 1, it is characterized in that: one end of described shielding conductor (12) is connected to the position of circuit board (1) being drawn earth terminal (9), the other end extends towards the direction of housing (2).
3. encapsulating structure according to claim 2, is characterized in that: have gap between the termination of contiguous housing (2) side of described shielding conductor (12) and housing (2) or link together.
4. encapsulating structure according to claim 1, is characterized in that: described shielding conductor (12) is in the arch bending towards housing (2), and two terminations of described shielding conductor (12) are all connected on circuit board (1).
5. encapsulating structure according to claim 4, is characterized in that: have gap between the vault (121) of described shielding conductor (12) and housing (2) or link together.
6. encapsulating structure according to claim 1, it is characterized in that: described housing (2) is metal material, the position of the lower end of described housing (2) and circuit board (1) being drawn earth terminal (9) links together.
7. encapsulating structure according to claim 6, it is characterized in that: described shielding conductor (12) one end is connected on housing (2), to make shielding conductor (12) be electrically connected with the earth terminal (9) of circuit board (1), the other end extends towards the direction of circuit board (1).
8. encapsulating structure according to claim 6, it is characterized in that: described shielding conductor (12) is in the U-shaped structure bending towards circuit board (1), and two terminations of described shielding conductor (12) are all connected on housing (2).
9. encapsulating structure according to claim 1, is characterized in that: describedly often arrange shielding conductor (12) vertically or obliquely extends to inner chamber (8) opposite end from one end of inner chamber (8).
10. encapsulating structure according to claim 1, is characterized in that: describedly often arrange in shielding conductor (12), have gap, or adjacent two shielding conductors (12) closely between adjacent two shielding conductors (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520978312.XU CN205177827U (en) | 2015-11-30 | 2015-11-30 | Packaging structure for chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520978312.XU CN205177827U (en) | 2015-11-30 | 2015-11-30 | Packaging structure for chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205177827U true CN205177827U (en) | 2016-04-20 |
Family
ID=55741777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520978312.XU Active CN205177827U (en) | 2015-11-30 | 2015-11-30 | Packaging structure for chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205177827U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312692A (en) * | 2018-12-11 | 2020-06-19 | 创意电子股份有限公司 | Integrated circuit packaging element and carrier plate thereof |
| CN111477611A (en) * | 2020-06-28 | 2020-07-31 | 甬矽电子(宁波)股份有限公司 | Electromagnetic shielding structure and manufacturing method thereof |
| CN111490034A (en) * | 2019-01-25 | 2020-08-04 | 苏州远创达科技有限公司 | Multi-chip module with high isolation |
| CN114300446A (en) * | 2022-03-09 | 2022-04-08 | 甬矽电子(宁波)股份有限公司 | Chip stacking shielding structure and manufacturing method thereof |
-
2015
- 2015-11-30 CN CN201520978312.XU patent/CN205177827U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312692A (en) * | 2018-12-11 | 2020-06-19 | 创意电子股份有限公司 | Integrated circuit packaging element and carrier plate thereof |
| CN111490034A (en) * | 2019-01-25 | 2020-08-04 | 苏州远创达科技有限公司 | Multi-chip module with high isolation |
| CN111477611A (en) * | 2020-06-28 | 2020-07-31 | 甬矽电子(宁波)股份有限公司 | Electromagnetic shielding structure and manufacturing method thereof |
| CN114300446A (en) * | 2022-03-09 | 2022-04-08 | 甬矽电子(宁波)股份有限公司 | Chip stacking shielding structure and manufacturing method thereof |
| CN114300446B (en) * | 2022-03-09 | 2022-07-08 | 甬矽电子(宁波)股份有限公司 | Chip stacking shielding structure and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191113 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Gore Co., Ltd. |