CN202019450U - Micro-electromechanical system (MEMS) microphone - Google Patents
Micro-electromechanical system (MEMS) microphone Download PDFInfo
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- CN202019450U CN202019450U CN2011201023642U CN201120102364U CN202019450U CN 202019450 U CN202019450 U CN 202019450U CN 2011201023642 U CN2011201023642 U CN 2011201023642U CN 201120102364 U CN201120102364 U CN 201120102364U CN 202019450 U CN202019450 U CN 202019450U
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- shell
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- mems
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- 238000004806 packaging method and process Methods 0.000 claims description 16
- 230000000630 rising effect Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000005236 sound signal Effects 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
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Abstract
The utility model provides a micro-electromechanical system (MEMS) microphone, which comprises a first package and a second package, wherein the first package consists of a first circuit board and a first shell which is fixedly connected with the first circuit board; the first circuit board is provided with a first sound hole through which sound waves pass; the surface of the first circuit board in the first package is provided with an MEMS acoustic chip; the MEMS acoustic chip covers the first sound hole; a plurality of independently distributed bonding pads are arranged on the other side of the first circuit board opposite to the MEMS acoustic chip; the second package consists of a second circuit board and a second shell which is fixedly connected with the second circuit board; the second shell is provided with a second sound hole through which the sound waves pass; the first package is arranged in the second package; a first air gap is formed between the first shell and the second shell; the first circuit board is arranged on the second circuit board through the bonding pads and is provided with a second air gap; and a sound signal can enter from the second sound hole, enters the first sound hole through the first air gap and the second air gap in sequence and finally reaches the MEMS acoustic chip. Through the MEMS microphone with two packages, sound enters from the external package and can enter from the space below the MEMS acoustic chip through the gap between the two packages; and the MEMS microphone has a simple structure and is low in manufacturing cost and high reliability.
Description
Technical field
The utility model relates to a kind of microphone, relates in particular to a kind of MEMS microphone.
Background technology
In recent years, utilizing the MEMS(MEMS (micro electro mechanical system)) the integrated MEMS microphone of technology begins to be applied in batches in the electronic products such as mobile phone, notebook, and the high-temperature resistant result of this microphone is good, can withstand the high temperature test of SMT technology.The general structure of this product is exactly to utilize a wiring board and shell to constitute a cavity and the encapsulation that becomes the MEMS microphone, on the outer surface of wiring board, pad can be set, be used for fixing the MEMS microphone and be electrically connected to external circuit, MEMS acoustics chip is installed in the inside of cavity, and the encapsulation of microphone is provided with the permeate chamber inside and outside and is used to receive the sound hole of external sound signal.In order to adapt to different design of electronic products needs, need design and a kind of MEMS acoustics chip is installed on the wiring board, and the sound hole is arranged at the MEMS microphone of the another side relative with wiring board, but there is the defective of acoustical behavior aspect sometimes in this design, in order to improve acoustical behavior, application number is that the Chinese patent of CN200820227226.5 discloses a kind of product design.The scheme of this patent disclosure is by the sound channel of a complexity being set in MEMS microphone package inside, finally reaching from the design of MEMS acoustics chip below entering tone.
But this design is comparatively complicated, and Material Cost is very high, make installation, manufacturing process complexity and the corresponding production cost that increased, and also usually there is defective in product reliability.
Given this, need a kind of MEMS microphone simple in structure, well behaved.
Summary of the invention
The utility model proposes in order to address the above problem.
The utility model provides a kind of MEMS microphone, comprise by first wiring board and formed first packaging body of first shell of fixedlying connected with described first wiring board, described first wiring board is provided with first hole passing through for sound wave, MEMS acoustics chip is installed on first PCB surface of described first package interior, described MEMS acoustics chip covers described first hole and is provided with, and the opposite side that described first wiring board is relative with described MEMS acoustics chip is provided with the pad of a plurality of independent distribution; Comprise also that by second wiring board and formed second packaging body of second shell of fixedlying connected described second shell is provided with the rising tone hole of passing through for sound wave with described second wiring board; Described first packaging body is installed in described second packaging body, form first air gap between described first shell and described second shell, described first wiring board is installed on described second wiring board by a plurality of pads and forms second air gap, voice signal can enter from described rising tone hole, enter described first hole by described first air gap and described second air gap successively, finally arrive described MEMS acoustics chip.
In addition, preferably, described first shell and described second shell are metal shell.
In addition, preferably, the side that described second wiring board is relative with described first wiring board is provided with a plurality of pads.
According to the aforesaid MEMS microphone that has two packaging bodies, sound enters from the outer enclosure body, by the gap between two packaging bodies, can be from the below entering tone of MEMS acoustics chip, and its construction is simple, and is cheap for manufacturing cost, and reliability is good.
Description of drawings
By below in conjunction with accompanying drawing embodiment being described, above-mentioned feature of the present utility model and technological merit will become apparent and understand easily.
Fig. 1 is the schematic diagram of the concrete structure of the MEMS microphone that relates to of expression the utility model case study on implementation.
Fig. 2 is the upward view of first wiring board that relates to of expression the utility model case study on implementation.
Fig. 3 is the upward view of second wiring board that relates to of expression the utility model case study on implementation.
Embodiment
Below, specific embodiment of the utility model is done describing in further detail in conjunction with the accompanying drawings.
Fig. 1 is the schematic diagram of the concrete structure of the MEMS microphone that relates to of expression the utility model case study on implementation.
Fig. 2 is the upward view of first wiring board that relates to of expression the utility model case study on implementation.
Fig. 3 is the upward view of second wiring board that relates to of expression the utility model case study on implementation.
The MEMS microphone, comprise by first wiring board 12 and first shell, 11 formed first packaging bodies of fixedlying connected with first wiring board 12, first wiring board 12 is provided with first hole 13 passing through for sound wave, on first wiring board, 12 surfaces of first package interior, MEMS acoustics chip 4 is installed, MEMS acoustics chip 4 covers first hole 13 and is provided with, and first wiring board 12 and MEMS acoustics chip 4 relative opposite sides are provided with the pad 14 of a plurality of independent distribution; Comprise also that by second wiring board 22 and second shell, 21 formed second packaging bodies of fixedlying connected second shell 21 is provided with the rising tone hole of passing through for sound wave 23 with second wiring board 22; First packaging body is installed in second packaging body, form first air gap 31 between first shell 11 and second shell 21, first wiring board 12 is installed on second wiring board 22 by a plurality of pads 14 and forms second air gap 32, voice signal can enter from rising tone hole 23, enter hole 13 first by first air gap 31 and second air gap 32 successively, finally arrive MEMS acoustics chip 4.
According to the aforesaid MEMS microphone that has two packaging bodies, sound enters from the outer enclosure body, by the gap between two packaging bodies, can be from the below entering tone of MEMS acoustics chip, and its construction is simple, and is cheap for manufacturing cost, and reliability is good.
In addition, first shell 11 and second shell 21 are metal shell, and the shell of this structure is easy to make, and can thickness less, exceed the increase product size.
In addition, the side that second wiring board 22 is relative with first wiring board 12 is provided with a plurality of pads 24, and pad 24 can be fixedly installed in the MEMS microphone electronic product and finish the connection of the signal of telecommunication.
Though described embodiment of the present utility model at the concrete structure of MEMS microphone above; but; in the above teachings; those skilled in the art can carry out various improvement and distortion on the basis of above-mentioned execution mode; and these improvement and distortion; all should drop in the protection range of the present utility model; those skilled in the art should be understood that; above-mentioned specific descriptions are just in order better to explain the purpose of this utility model; be not to restriction of the present utility model, protection range of the present utility model is limited by claim and equivalent thereof.
Claims (3)
1. MEMS microphone, it is characterized in that, comprise by first wiring board and formed first packaging body of first shell of fixedlying connected with described first wiring board, described first wiring board is provided with first hole passing through for sound wave, MEMS acoustics chip is installed on first PCB surface of described first package interior, described MEMS acoustics chip covers described first hole and is provided with, and the opposite side that described first wiring board is relative with described MEMS acoustics chip is provided with the pad of a plurality of independent distribution; Comprise also that by second wiring board and formed second packaging body of second shell of fixedlying connected described second shell is provided with the rising tone hole of passing through for sound wave with described second wiring board; Described first packaging body is installed in described second packaging body, form first air gap between described first shell and described second shell, described first wiring board is installed on described second wiring board by a plurality of pads and forms second air gap, voice signal can enter from described rising tone hole, enter described first hole by described first air gap and described second air gap successively, finally arrive described MEMS acoustics chip.
2. MEMS microphone as claimed in claim 1 is characterized in that:
Described first shell and described second shell are metal shell.
3. MEMS microphone as claimed in claim 2 is characterized in that:
The side that described second wiring board is relative with described first wiring board is provided with a plurality of pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201023642U CN202019450U (en) | 2011-04-11 | 2011-04-11 | Micro-electromechanical system (MEMS) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201023642U CN202019450U (en) | 2011-04-11 | 2011-04-11 | Micro-electromechanical system (MEMS) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202019450U true CN202019450U (en) | 2011-10-26 |
Family
ID=44813115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201023642U Expired - Lifetime CN202019450U (en) | 2011-04-11 | 2011-04-11 | Micro-electromechanical system (MEMS) microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202019450U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833659A (en) * | 2012-08-25 | 2012-12-19 | 歌尔声学股份有限公司 | MEMS (micro electro mechanical systems) microphone and manufacturing method thereof |
| CN103313160A (en) * | 2012-03-16 | 2013-09-18 | 美律电子(深圳)有限公司 | Thinned micro-electromechanical microphone module |
| CN107948781A (en) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技（上海）有限公司 | A kind of Novel microphone structure and flip-type electronic equipment |
| CN114885534A (en) * | 2021-02-05 | 2022-08-09 | 深圳富泰宏精密工业有限公司 | Electronic device |
-
2011
- 2011-04-11 CN CN2011201023642U patent/CN202019450U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313160A (en) * | 2012-03-16 | 2013-09-18 | 美律电子(深圳)有限公司 | Thinned micro-electromechanical microphone module |
| CN103313160B (en) * | 2012-03-16 | 2017-11-21 | 美律电子(深圳)有限公司 | Thin type electric microphone module for microcomputer |
| CN102833659A (en) * | 2012-08-25 | 2012-12-19 | 歌尔声学股份有限公司 | MEMS (micro electro mechanical systems) microphone and manufacturing method thereof |
| CN107948781A (en) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技（上海）有限公司 | A kind of Novel microphone structure and flip-type electronic equipment |
| CN114885534A (en) * | 2021-02-05 | 2022-08-09 | 深圳富泰宏精密工业有限公司 | Electronic device |
| CN114885534B (en) * | 2021-02-05 | 2024-05-28 | 深圳富泰宏精密工业有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111026 |