CN201138865Y - Microphone with silicon capacitor - Google Patents
Microphone with silicon capacitor Download PDFInfo
- Publication number
- CN201138865Y CN201138865Y CNU2007200264166U CN200720026416U CN201138865Y CN 201138865 Y CN201138865 Y CN 201138865Y CN U2007200264166 U CNU2007200264166 U CN U2007200264166U CN 200720026416 U CN200720026416 U CN 200720026416U CN 201138865 Y CN201138865 Y CN 201138865Y
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- CN
- China
- Prior art keywords
- wiring board
- hollow out
- shell
- operatic tunes
- mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
- H04R1/086—Protective screens, e.g. all weather or wind screens
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a silicon capacitive microphone that comprises a first shell and a circuit board. The first shell is provided with sound holes for the sound to pass through; and the circuit board and the first shell are combined to form a first acoustic cavity. The silicon capacitive microphone is characterized by comprising a second shell and an MEMS acoustic chip; the second shell is arranged in the first acoustic cavity and is combined with the circuit board to form a second acoustic cavity. The MEMS acoustic chip is used for transforming sound signals into electric signals, and is arranged on the circuit board that is arranged in the second acoustic cavity; the circuit board is provided with sound channels that are communicated with the MEMS acoustic chip and the first acoustic cavity; the space of the MEMS acoustic chip in the second acoustic cavity is changed into a back cavity of the MEMS acoustic chip, so that the expansion of the rear cavity of the MEMS acoustic chip is not limited by the circuit board, and the acoustic properties of the MEMS acoustic chip can be greatly improved. Moreover, the design does not increase the thickness of the circuit board and reduces the production costs.
Description
Technical field
The present invention relates to a kind of microphone, especially relate to a kind of silicon capacitor microphone with novel package structure.
Background technology
In recent years, along with electronic product volumes such as mobile phone, notebook constantly reduce, performance is more and more higher, also require the volume of supporting electronic component constantly to reduce, performance and consistency improve.Under this background, also released a lot of novel products as the microphone products field of one of strength member, utilize the semiconductor fabrication process technology and the silicon capacitor microphone realized in batches is wherein representative products.And the key Design content in the silicon capacitor microphone is an encapsulation technology, and it is higher to encapsulate shared cost ratio, so, also occurred a lot of patents about the silicon capacitor microphone encapsulation technology recently, for example U.S. Patent No. US20020102004 discloses the microphone package of a kind of " small-sized silicon capacitor microphone and manufacture method thereof (miniature siliconcondenser microphone and method for producing same) " by name.Accompanying drawing 6 has been represented the cutaway view of disclosed silicon capacitor microphone encapsulating structure among the patent No.US20020102004.
As shown in Figure 6, silicon capacitor microphone comprises a shell 11, the sound hole 12 that can see through sound is arranged on the shell 11, a wiring board 13 is arranged, shell 11 and wiring board 13 are combined into a cavity, install MEMS (MEMS (micro electro mechanical system)) acoustics chip 14 and integrated circuit 15 on the wiring board 13, MEMS acoustics chip 14 and integrated circuit 15 can be converted into the signal of telecommunication with voice signal jointly.The key point of this design is, the position below MEMS acoustics chip 14, and wiring board is made certain depression 16 by technologies such as corrosion.The air space that the advantage of this design has been to increase MEMS acoustics chip 14 belows (is referred to as " back cavity " usually in the industry, refer to that sound wave runs into after the MEMS acoustics chip, the space at MEMS acoustics chip rear), can make the sensitivity of silicon capacitor microphone higher, frequency response curve is better.
Yet the wiring board depression 16 of passing through MEMS acoustics chip 14 belows of this simplicity of design increases back cavity, and is very limited to the contribution that back cavity increases, also very little to the contribution that performance improves; And this design will make the thickness of wiring board increase greatly, too much increase the height of product, and cause cost to increase.
The utility model content
Technical problem to be solved in the utility model provides a kind of size that increases wiring board of exceeding, and but can significantly increase the silicon capacitor microphone of MEMS acoustics chip back cavity volume.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: silicon capacitor microphone, comprise first shell, and described first shell is provided with the sound hole that can see through sound; Wiring board, described first shell and described wiring board are combined into first operatic tunes, it is characterized in that: it also comprises second shell, described second shell is arranged in described first operatic tunes, and is combined into second operatic tunes with described wiring board; The MEMS acoustics chip that voice signal can be converted to the signal of telecommunication, described MEMS acoustics chip is installed on the interior described wiring board of described second operatic tunes, described wiring board is provided with sound channel, and described sound channel is communicated with the described MEMS acoustics chip and described first operatic tunes.
The improvement of the technical program is: described wiring board is the multilayer circuit board be combined into, wherein install on the wiring board of MEMS acoustics chip and be positioned at described MEMS acoustics chip below and be provided with hollow out, also be provided with hollow out in described first operatic tunes and on the top layer wiring board outside described second operatic tunes, described multilayer circuit board is provided with the sound channel that is communicated with two hollow outs.
A kind of further improvement of the technical program is: described wiring board is the wiring board be combined into of three layers of consistent size, first wiring board that described MEMS acoustics chip and described second shell wherein are installed is provided with two hollow outs, first hollow out is in MEMS acoustics chip position in the described hollow out, second hollow out is in the position beyond described second shell, the second middle wiring board is provided with one the 3rd hollow out and can be communicated with described first hollow out and described second hollow out, and described first hollow out, second hollow out and the 3rd hollow out form described sound channel.
Another kind of further improvement of the technical program is: described wiring board is to harden to close and form in three layer line roads, first wiring board that described MEMS acoustics chip and described second shell wherein are installed is provided with first hollow out, described hollow out is in MEMS acoustics chip position, the second middle wiring board is provided with large-area second hollow out, the described first wiring board size is less than second wiring board and tertiary circuit plate, and described first wiring board partly covers described second hollow out, the gap that described first wiring board and described second hollow out form, described second hollow out and described first hollow out can be communicated with the described sound channel of formation.
The another kind of the technical program further improves and is: be bonded with a rubber cushion that has hole between described first wiring board and the described MEMS acoustics chip, described second housing parts is bonded on the described rubber cushion, part is bonded on described first wiring board, and described first operatic tunes and described second operatic tunes are interconnected by described sound channel.
The another kind of the technical program improves and is: be bonded with a thin type sheet metal that has hole between described wiring board and the described MEMS acoustics chip, described second housing parts is bonded on the described thin type sheet metal, part is bonded on the described wiring board, the solder resist and the coat of metal that are bonded with on the described wiring board on the one side of described thin type sheet metal and described second shell have the part hollow out, described hollow out has formed described sound channel, and described first operatic tunes and described second operatic tunes are interconnected by described sound channel.
The improvement of the technical program is: described first shell and second shell are the groove form casing of metal material or plastic material or ceramic material.
The improvement of the technical program is: described wiring board is that resin material or ceramic material are the wiring board of base material.
The improvement of the technical program is: on the wiring board in described second operatic tunes integrated circuit is installed also.
The improvement of the technical program is: described first shell, second shell and described MEMS acoustics chip all are to be bonded on the described wiring board by high-temp glue.
Owing to adopted technique scheme, silicon capacitor microphone comprises first shell, and described first shell is provided with the sound hole that can see through sound; Wiring board, described first shell and described wiring board are combined into first operatic tunes, it is characterized in that: it also comprises second shell, described second shell is arranged in described first operatic tunes, and is combined into second operatic tunes with described wiring board; The MEMS acoustics chip that voice signal can be converted to the signal of telecommunication, described MEMS acoustics chip is installed on the interior described wiring board of described second operatic tunes, described wiring board is provided with sound channel, and described sound channel is communicated with the described MEMS acoustics chip and described first operatic tunes; The above space of MEMS acoustics chip becomes the back cavity of MEMS acoustics chip in described second operatic tunes, makes the increase of MEMS acoustics chip back cavity no longer be subjected to the restriction of wiring board, can improve the acoustical behavior of MEMS acoustics chip greatly; And this design can not increase the thickness of wiring board, and has reduced production cost.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
Fig. 3 is the vertical view of second shell and wiring board combination among the utility model embodiment two;
Fig. 4 is a kind of structural representation of the utility model embodiment three;
Fig. 5 is a kind of structural representation of the utility model embodiment four;
Fig. 6 is the structural representation of background technology.
Embodiment
Embodiment one: as shown in Figure 1, silicon microphone 100 comprises the square groove shape shell 101 of a metal, the last planar portions of shell 101 has the sound hole 102 that can see through sound, the lower edge of shell 101 is pasted with wiring board 103, shell 101 and wiring board 103 utilize the high-temperature electric conduction glue bond to be combined into a cube first operatic tunes 108, in first operatic tunes, 108 inside, also bond on the wiring board 103 the square groove shape shell 106 of a genus is installed, shell 106 and wiring board 103 are combined into a cube second operatic tunes 107, and MEMS (MEMS (micro electro mechanical system)) the acoustics chip 105 that voice signal can be converted to the signal of telecommunication is installed on the wiring board of second operatic tunes, 107 inside.
MEMS (MEMS (micro electro mechanical system)) acoustics chip 105 is installed in the top of the last hollow out 104a of the first pcb layer 103a of second operatic tunes inboard, be included in second operatic tunes 107 of second shell 106 and first pcb layer 103a formation, the first pcb layer 103a goes up hollow out 104c and is located at beyond second operatic tunes 107, in first operatic tunes 108.
When sound wave after hole 102 enters silicon microphone from the sound of shell 101, at first enter first operatic tunes 108, pass sound channel 104 then, enter into the below of MEMS (MEMS (micro electro mechanical system)) acoustics chip 105, thereby second operatic tunes 107 just becomes the back cavity of silicon microphone 100 with the space around interior MEMS (MEMS (micro electro mechanical system)) the acoustics chip 105.
In the present embodiment, metal operatic tunes cap, metal shell, integrated circuit, MEMS acoustics chip can be connected on the wiring board 103 by conducting resinl.
Technical scheme by the implementation case, the size that does not need too much increase wiring board, and, make the silicon microphone back cavity increase to become and be more prone to, and can adjust easily by adding the effect that a shell 106 realizes increasing the silicon microphone back cavity in addition.
Embodiment two: as shown in Figure 2, the difference of the implementation case and case study on implementation one is, the implementation difference of sound channel.The first wiring board 103a size is less than the second wiring board 103b in the implementation case, the first wiring board 103a is provided with a hollow out 104c, the second wiring board 103b is provided with a large tracts of land hollow out 104b, the undersize of the first wiring board 103a is with whole covering hollow out 104b, so formed one or more slit 104a between the first wiring board 103a and the second wiring board 103b.The vertical view of having represented second shell and wiring board combination in the present embodiment as Fig. 3.
Technical scheme by the implementation case, when sound wave after hole 102 enters silicon microphone from the sound of shell 101, at first enter first operatic tunes 108, pass the sound channel of forming by slit 104a, hollow out 104b and hollow out 104c 104 then, enter into the below of MEMS (MEMS (micro electro mechanical system)) acoustics chip 105, thereby second operatic tunes 107 just becomes the back cavity of silicon microphone 100 with the space around interior MEMS (MEMS (micro electro mechanical system)) the acoustics chip 105.
Embodiment three: as shown in Figure 4, the difference of the implementation case and case study on implementation two is, between MEMS (MEMS (micro electro mechanical system)) acoustics chip 105 and the wiring board 103a rubber cushion 109 is installed, makes that the installation of MEMS (MEMS (micro electro mechanical system)) acoustics chip 105 is more easy.Rubber cushion 109 is provided with hole 104d, and sound hole 104d, slit 104a, hollow out 104b and hollow out 104c have formed sound channel 104 jointly.Because the thickness of rubber cushion 109 can be very little, and possess certain elasticity, second shell 106 can select part to be bonded on the rubber cushion 109, and can not cause gas leakage etc. bad.
Embodiment four: as shown in Figure 5, the difference of the implementation case and case study on implementation three is that the wiring board in the implementation case adopts the individual layer double sided board.Wiring board comprises base material 103c, the Copper Foil 103b of base material both sides, the solder resist 103a of Copper Foil both sides.In this figure, the purport that the Copper Foil of base material below and solder resist do not influence this patent, not shown herein.The hollow out that the Copper Foil of base material top and solder resist have a strip, the deep gouge 104b of a level of formation.Above deep gouge 104b, a thin type sheet metal 109 that has hole 104c is arranged, sheet metal 109 parts cover deep gouge 104b, the top of sound 104c position, hole on the sheet metal 109, be bonded with a MEMS (MEMS (micro electro mechanical system)) acoustics chip 105, around the acoustics chip 105, there is the metal shell 106 of a square groove shape to be bonded in formation second operatic tunes 107 on the sheet metal 109.
In the implementation case, when sound wave after hole 102 enters silicon microphone from the sound of shell 101, at first enter first operatic tunes 108, pass then deep gouge 104b not by sheet metal 109 cover the slit 104a that forms of part, pass deep gouge 104b harmony hole 104c then, enter into the below of MEMS (MEMS (micro electro mechanical system)) acoustics chip 105, thereby second operatic tunes 107 becomes the back cavity of acoustics chip 105.
In the implementation case, each parts adopts the conducting resinl isocolloid to connect, and can guarantee the needed air-tightness requirement of acoustic product.And this kind structure helps reducing the height of product.
Claims (10)
1. silicon capacitor microphone comprises first shell, and described first shell is provided with the sound hole that can see through sound; Wiring board, described first shell and described wiring board are combined into first operatic tunes, it is characterized in that: it also comprises second shell, described second shell is arranged in described first operatic tunes, and is combined into second operatic tunes with described wiring board; The MEMS acoustics chip that voice signal can be converted to the signal of telecommunication, described MEMS acoustics chip is installed on the interior described wiring board of described second operatic tunes, described wiring board is provided with sound channel, and described sound channel is communicated with the described MEMS acoustics chip and described first operatic tunes.
2. silicon capacitor microphone as claimed in claim 1, it is characterized in that: described wiring board is the multilayer circuit board be combined into, wherein install on the wiring board of MEMS acoustics chip and be positioned at described MEMS acoustics chip below and be provided with hollow out, also be provided with hollow out in described first operatic tunes and on the top layer wiring board outside described second operatic tunes, described multilayer circuit board is provided with the sound channel that is communicated with two hollow outs.
3. silicon capacitor microphone as claimed in claim 2, it is characterized in that: described wiring board is the wiring board be combined into of three layers of consistent size, first wiring board that described MEMS acoustics chip and described second shell wherein are installed is provided with two hollow outs, first hollow out is in MEMS acoustics chip position in the described hollow out, second hollow out is in the position beyond described second shell, the second middle wiring board is provided with one the 3rd hollow out and can be communicated with described first hollow out and described second hollow out, and described first hollow out, second hollow out and the 3rd hollow out form described sound channel.
4. silicon capacitor microphone as claimed in claim 2, it is characterized in that: described wiring board is to harden to close and form in three layer line roads, first wiring board that described MEMS acoustics chip and described second shell wherein are installed is provided with first hollow out, described hollow out is in MEMS acoustics chip position, the second middle wiring board is provided with large-area second hollow out, the described first wiring board size is less than second wiring board and tertiary circuit plate, and described first wiring board partly covers described second hollow out, the gap that described first wiring board and described second hollow out form, described second hollow out and described first hollow out can be communicated with the described sound channel of formation.
5. silicon capacitor microphone as claimed in claim 4, it is characterized in that: be bonded with a rubber cushion that has hole between described first wiring board and the described MEMS acoustics chip, described second housing parts is bonded on the described rubber cushion, part is bonded on described first wiring board, and described first operatic tunes and described second operatic tunes are interconnected by described sound channel.
6. silicon capacitor microphone as claimed in claim 1, it is characterized in that: be bonded with a thin type sheet metal that has hole between described wiring board and the described MEMS acoustics chip, described second housing parts is bonded on the described thin type sheet metal, part is bonded on the described wiring board, the solder resist and the coat of metal that are bonded with on the described wiring board on the one side of described thin type sheet metal and described second shell have the part hollow out, described hollow out has formed described sound channel, and described first operatic tunes and described second operatic tunes are interconnected by described sound channel.
7. silicon capacitor microphone as claimed in claim 1 is characterized in that: described first shell and second shell are the groove form casing of metal material or plastic material or ceramic material.
8. silicon capacitor microphone as claimed in claim 1 is characterized in that: described wiring board is that resin material or ceramic material are the wiring board of base material.
9. silicon capacitor microphone as claimed in claim 1 is characterized in that: on the wiring board in described second operatic tunes integrated circuit is installed also.
10. silicon capacitor microphone as claimed in claim 1 is characterized in that: described first shell, second shell and described MEMS acoustics chip all are to be bonded on the described wiring board by high-temp glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200264166U CN201138865Y (en) | 2007-08-10 | 2007-08-10 | Microphone with silicon capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200264166U CN201138865Y (en) | 2007-08-10 | 2007-08-10 | Microphone with silicon capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201138865Y true CN201138865Y (en) | 2008-10-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200264166U Expired - Fee Related CN201138865Y (en) | 2007-08-10 | 2007-08-10 | Microphone with silicon capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201138865Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008053327A1 (en) * | 2008-10-27 | 2010-04-29 | Epcos Ag | Microphone arrangement for use in communication technology, has cased microphone, and acoustic channel connecting sound entry opening and environment above interconnect device on side of interconnect device |
| ITTO20130595A1 (en) * | 2013-07-15 | 2015-01-16 | St Microelectronics Rousset | ASSEMBLY OF A MEMS ENVIRONMENTAL SENSOR DEVICE WITH IMPROVED RESISTANCE AND ITS MANUFACTURING PROCEDURE |
| CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
| CN113949978A (en) * | 2020-07-17 | 2022-01-18 | 通用微(深圳)科技有限公司 | Sound collection device, sound processing device and method, device and storage medium |
-
2007
- 2007-08-10 CN CNU2007200264166U patent/CN201138865Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008053327A1 (en) * | 2008-10-27 | 2010-04-29 | Epcos Ag | Microphone arrangement for use in communication technology, has cased microphone, and acoustic channel connecting sound entry opening and environment above interconnect device on side of interconnect device |
| US8553920B2 (en) | 2008-10-27 | 2013-10-08 | Epcos Ag | Arrangement comprising a microphone |
| ITTO20130595A1 (en) * | 2013-07-15 | 2015-01-16 | St Microelectronics Rousset | ASSEMBLY OF A MEMS ENVIRONMENTAL SENSOR DEVICE WITH IMPROVED RESISTANCE AND ITS MANUFACTURING PROCEDURE |
| CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
| CN113949978A (en) * | 2020-07-17 | 2022-01-18 | 通用微(深圳)科技有限公司 | Sound collection device, sound processing device and method, device and storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081022 Termination date: 20160810 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |