CN201042078Y - Silicon microphone with dustproof sound hole - Google Patents
Silicon microphone with dustproof sound hole Download PDFInfo
- Publication number
- CN201042078Y CN201042078Y CNU2007200225922U CN200720022592U CN201042078Y CN 201042078 Y CN201042078 Y CN 201042078Y CN U2007200225922 U CNU2007200225922 U CN U2007200225922U CN 200720022592 U CN200720022592 U CN 200720022592U CN 201042078 Y CN201042078 Y CN 201042078Y
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- China
- Prior art keywords
- wiring board
- hole
- sound hole
- silicon microphone
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a silicon microphone with dustproof sound holes. A circuit board comprises a first circuit board and a second circuit board both of which are overlapped together, wherein, a compartment layer which is used for separating the first circuit board and the second circuit board. A first sound hole is arranged on the first circuit board, while a MEMS acoustic chip is mounted on the surface of the first circuit board above the first sound hole. A second sound hole that is mutually staggered but is not overlapped with the first sound hole is arranged on the second circuit board, while a hollow cavity that is communicated with the first sound hole and the second hole respectively is arranged on the compartment layer. By setting roundabout tracks, when the silicon microphone is welded onto the circuit board of an electronic product, the impurities such as soldering tine dross can not be easily sent onto the MEMS acoustic chip through lathy tracks so as to prevent poor welding from occurring. After being welded, the lathy tracks also exert the dustproof function.
Description
Technical field
The utility model relates to a kind of silicon microphone, especially relates to a kind of silicon capacitor microphone structure that can reach dustproof effect easily.
Background technology
In recent years, along with electronic product volumes such as mobile phone, notebook computer constantly reduce, performance requirement is more and more higher, also require the volume of supporting electronic component constantly to reduce, performance and consistency improve.Under this background, also released a lot of novel products as the microphone products field of one of strength member, utilize the semiconductor fabrication process technology and the silicon microphone realized in batches is wherein representative products.In order to cooperate the installation needs of electronic product, the part product needed is offered hole in the circuit board in the silicon microphone, to reach on the electronic product wiring board requirement that realizes " zero elevation " (main body of silicon microphone is installed in below the electronic product wiring board, does not increase the above height of electronic product wiring board) when installing or to satisfy acoustical behavior such as directive property.Also occur a lot of the embodiment recently and offered the patent of hole technology on the silicon microphone wiring board, for example Chinese patent CN200610153865 discloses the silicon microphone encapsulation of a kind of by name " condenser microphone and method for packing thereof ", and Figure 10 has wherein represented to offer on a kind of wiring board the cutaway view of the silicon capacitor microphone encapsulating structure in hole.
Shown in Figure 10 as in this patent, silicon capacitor microphone comprises a lid 110, a wiring board 120 is arranged, lid and wiring board are combined into a cavity, install MEMS (MEMS (micro electro mechanical system)) acoustics chip and integrated circuit on the wiring board, MEMS chip and integrated circuit can be converted into voice signal the signal of telecommunication after the amplification jointly, the signal of telecommunication is by the pad conduction in the wiring board outside, in the corresponding position of MEMS chip a sound hole 120a is arranged on the wiring board, the pad on pad on the silicon microphone wiring board and the electronic product wiring board welds together.The advantage of this design do not need to be the space of electronic product wiring board top, can realize " zero elevation " installation.
Yet when this silicon microphone was welded on the electronic product wiring board, the scolding tin slag of generation, steam etc. were easy to enter the sound hole of silicon microphone, even caused problems such as obstruction sound hole, destruction MEMS acoustics chip; And, being welded in the use later on the electronic product at silicon microphone, extraneous steam, dust also are easy to enter silicon microphone by the sound hole, cause bad.So must increase other dust guard at place, sound hole, so just increased product cost and increased product size, and acoustic efficiency has also been had certain influence, this is not hoped.
The utility model content
Technical problem to be solved in the utility model provides a kind of special silicon microphone that other dust guard just can reach the dustproof sound of having of dustproof effect, the size that does not increase product and manufacturing cost hole easily that do not need to increase that has.
For solving the problems of the technologies described above, the technical solution of the utility model is: the silicon microphone with dustproof sound hole, comprise microphone case and wiring board, be arranged on the external pad on the described wiring board, described wiring board comprises first wiring board that is superimposed, second wiring board, wall with described first wiring board and the isolation of second wiring board, described first wiring board and described shell are combined together to form a sealed hollow, described first wiring board is provided with the hole first, on first PCB surface of top, described first hole MEMS acoustics chip is installed, described second wiring board is provided with described first hole and staggers mutually and nonoverlapping rising tone hole, and described wall is provided with the hollow out that is communicated with described first hole and rising tone hole.
As optimized technical scheme, be provided with between described first wiring board, second wiring board and the wall and make the three keep conducting electricity the number of metal through hole that connects, described external pad is positioned at the outer surface of described second wiring board.
As optimized technical scheme, the size of described wiring board is greater than the planar dimension of described shell, and described pad is arranged on described first wiring board and is positioned at the outer upper surface of described shell.
As optimized technical scheme, wall between described first wiring board and second wiring board is the conductive layer of metal material or conducting resinl material, described conductive layer has the conductiving point of some electrical connection first wiring boards and second wiring board, the other parts insulation of described conductiving point and described conductive layer.
As to further improvement in the technical proposal, described shell is cylindrical or cube, and described wiring board is corresponding with described shell circular or square.
As to further improvement in the technical proposal, the hollow out of described wall is an elongated strip shaped or circular or square.
As to further improvement in the technical proposal, be provided with the sound hole that makes silicon microphone reach the directive property function above the described shell.
As to further improvement in the technical proposal, described wiring board preferably uses resin material as base material.
Owing to adopted technique scheme, silicon microphone with dustproof sound hole, comprise microphone case and wiring board, be arranged on the external pad on the described wiring board, described wiring board comprises first wiring board that is superimposed, second wiring board, wall with described first wiring board and the isolation of second wiring board, described first wiring board and described shell are combined together to form a sealed hollow, described first wiring board is provided with the hole first, on first PCB surface of top, described first hole MEMS acoustics chip is installed, described second wiring board is provided with described first hole and staggers mutually and nonoverlapping rising tone hole, and described wall is provided with the hollow out that is communicated with described first hole and rising tone hole; By the setting of this circuitous sound channel, silicon microphone is on being welded to the electronic product wiring board time, and impurity such as the scolding tin slag of generation can not be easy to be communicated to above the MEMS acoustics chip by above-mentioned elongated sound channel, have prevented the generation of failure welding; Finish in the later use in welding, above-mentioned elongated sound channel can play dust reduction capability equally.
Description of drawings
Fig. 1 is the structure principle chart of the utility model case study on implementation one;
Fig. 2 is the first wiring board vertical view of the utility model case study on implementation one;
Fig. 3 is the second wiring board vertical view of the utility model case study on implementation one;
Fig. 4 is the vertical view of the wall of the utility model case study on implementation one;
Fig. 5 is the vertical view of the another kind of wall of the utility model case study on implementation one;
Fig. 6 is the structure principle chart of the utility model case study on implementation two;
Fig. 7 is the silicon microphone scheme of installation of the utility model case study on implementation two;
Fig. 8 is the structure principle chart of the utility model case study on implementation three;
Fig. 9 is the distribution schematic diagram of isolate conductive material between first wiring board of the utility model case study on implementation three and second wiring board.
Figure 10 is the schematic diagram of the utility model background technology.
Embodiment
Embodiment one: as shown in Figure 1, silicon microphone 100 comprises a square metal shell 101; The square wiring board 103 that size is consistent with the metal shell planar dimension; Square metal shell and wiring board are bonded together and form a square cavity, become the environmental protection device of silicon microphone; Wiring board 103 is formed by three layers, be respectively the first wiring board 103a, the second wiring board 103b and wall 103c, wall is placed between first wiring board and second wiring board, according to different sound effects and dustproof effect, the thickness of wall generally is set in several microns between the hundreds of micron, a sound hole 102a (as shown in Figure 2) is arranged on first wiring board, a sound hole 102b (as shown in Figure 3) is arranged on second wiring board, an elongated hollow out or circular hollow out 102c (as Fig. 4 or shown in Figure 5) are arranged on the wall, hollow out 102c can connect the elongated sound channel 102 that sound hole 102a harmony hole 102b forms a connection, thereby wiring board 103 is run through by elongated sound channel 102; The sound hole 102a top of the first wiring board 103a is equipped with MEMS acoustics chip 104; The integrated circuit 105 of amplified analog signal also is installed on the first wiring board 103a; Second wiring board outside is provided with and a plurality ofly can be installed in pad 106 on the electronic product with the output of the silicon microphone signal of telecommunication and with silicon microphone; First wiring board, second wiring board and wall are equipped with a plurality of plated-through holes 107, thereby guarantee between first wiring board and the wall and conduction connection between second wiring board and the wall, in view of the electric connection technology between the multilayer circuit board and mechanical pressing technology belong to known technology, and it doesn't matter with this novel design purport, do not repeat them here.
This novel silicon microphone is on being welded on the electronic product wiring board time, and the impurity such as scruff that pad 106 and electronic product pad produce need just might affact above the MEMS acoustics chip 104 through elongated sound channel 102; Equally, in the use of electronic product after the silicon microphone welding finishes, the material that dust, steam etc. may influence the silicon microphone performance also needs just might affact above the MEMS acoustics chip 104 through elongated sound channel 102, thereby has reduced the possibility of this bad generation greatly.
Embodiment two: with respect to case study on implementation one, as shown in Figure 6, the difference of the implementation case is that the size of silicon microphone wiring board 103 is slightly larger than the planar dimension of shell 101, shell is installed in the middle part of wiring board, pad 106 is arranged on the first wiring board 103a, silicon microphone needs the main circuit board of electronic product that a space that can hold shell 101 is set on being installed to electronic product the time, and silicon microphone is welded on the electronic product by pad 106 then.Adopt the advantage of this structure to be, it is that the logical wiring board in two-sided Electricity Federation gets final product that the employed three layers of wiring board of silicon microphone only need the first wiring board 103a, second wiring board and wall do not need to possess the logical effect in Electricity Federation, only need to use nonconducting board substrate, cooperate the elongated sound channel 102 of formation to get final product.The silicon microphone that Fig. 7 has expressed the implementation case is installed in the mounting means on the electronic product wiring board.With respect to " zero elevation " mounting means in the case study on implementation one, after installing, the silicon microphone of the implementation case increased electronic product wiring board top certain height.
Case study on implementation three: with respect to case study on implementation one, the difference of the implementation case is the composition difference of silicon microphone wiring board 103, as shown in Figure 8, adopted layer of metal conductive layer or conducting resinl 103c to connect, separate between the first wiring board 103a and the second wiring board 103b.As shown in Figure 9,103c comprises two parts, part 103c1 is the marginal position of annular spread between the first wiring board 103a and the second wiring board 103b, and another part 103c2 is interrupted the position that does not contact 103c1 that is distributed between the first wiring board 103a and the second wiring board 103b.103c1 and 103c2 can set in advance on first wiring board or second wiring board, and the 103c1 and first wiring board, second wiring board form elongated sound channel 102, and play electric action; 103c2 can play electric action, and making has a plurality of signalling channels signal can be communicated on the pad 106 between silicon microphone first wiring board and second wiring board.Compare case study on implementation 1, the easier making of silicon microphone wiring board of the implementation case, thickness is also thinner.
In three cited case study on implementation, all adopted square shell and wiring board, shell is the metal groove form casing of one, wiring board adopts two-layer or three layers of wiring board are formed.In fact, shell and wiring board also can be other shapes, and shell also can adopt wiring board material, plastic material etc. to make, and shell also can be that a framework and a cover combination form; Wiring board also can be made up of the wiring board of more multi-layered number; Hole also can be set on the shell reach functions such as directive property; Each connecting portion in this patent can use materials such as scolding tin, conducting resinl as required; Wiring board in this patent can the preferred resin material as base material.In a word, in the various choice of technology modes under this novel silicon microphone is provided with elongated sound channel by multilayer circuit board the prerequisite of design purport do not violated all within the protection at this patent.In view of the suitable adjustment of MEMS acoustics chip to not influence of purport of the present invention, the MEMS acoustics chip in the pattern only adopts simple pattern to represent.
Claims (8)
1. the silicon microphone that has dustproof sound hole, comprise microphone case and wiring board, be arranged on the external pad on the described wiring board, it is characterized in that: described wiring board comprises first wiring board that is superimposed, second wiring board, wall with described first wiring board and the isolation of second wiring board, described first wiring board and described shell are combined together to form a sealed hollow, described first wiring board is provided with the hole first, on first PCB surface of top, described first hole MEMS acoustics chip is installed, described second wiring board is provided with described first hole and staggers mutually and nonoverlapping rising tone hole, and described wall is provided with the hollow out that is communicated with described first hole and rising tone hole.
2. the silicon microphone with dustproof sound hole as claimed in claim 1, it is characterized in that: be provided with between described first wiring board, second wiring board and the wall and make the three keep conducting electricity the number of metal through hole that connects, described external pad is positioned at the outer surface of described second wiring board.
3. the silicon microphone with dustproof sound hole as claimed in claim 1 is characterized in that: the size of described wiring board is greater than the planar dimension of described shell, and described pad is arranged on described first wiring board and is positioned at the outer upper surface of described shell.
4. the silicon microphone with dustproof sound hole as claimed in claim 1, it is characterized in that: the wall between described first wiring board and second wiring board is the conductive layer of metal material or conducting resinl material, described conductive layer has the conductiving point of some electrical connection first wiring boards and second wiring board, the other parts insulation of described conductiving point and described conductive layer.
5. as claim 1,2,3 or 4 described silicon microphones with dustproof sound hole, it is characterized in that: described shell is cylindrical or cube, and described wiring board is corresponding with described shell circular or square.
6. as claim 1,2,3 or 4 described silicon microphones with dustproof sound hole, it is characterized in that: the hollow out of described wall is an elongated strip shaped or circular or square.
7. as claim 1,2,3 or 4 described silicon microphones, it is characterized in that: be provided with the sound hole that makes silicon microphone reach the directive property function above the described shell with dustproof sound hole.
8. the silicon microphone with dustproof sound hole as claimed in claim 1, it is characterized in that: described wiring board is the resin material wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200225922U CN201042078Y (en) | 2007-05-26 | 2007-05-26 | Silicon microphone with dustproof sound hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200225922U CN201042078Y (en) | 2007-05-26 | 2007-05-26 | Silicon microphone with dustproof sound hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201042078Y true CN201042078Y (en) | 2008-03-26 |
Family
ID=39253791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200225922U Expired - Lifetime CN201042078Y (en) | 2007-05-26 | 2007-05-26 | Silicon microphone with dustproof sound hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201042078Y (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316393A (en) * | 2010-06-17 | 2012-01-11 | 宝星电子株式会社 | Microphone |
| CN102395093A (en) * | 2011-10-31 | 2012-03-28 | 歌尔声学股份有限公司 | Silicic miniature microphone |
| CN102665154A (en) * | 2012-05-19 | 2012-09-12 | 歌尔声学股份有限公司 | Pickup hole structure for microphone (MIC) |
| WO2013045749A1 (en) * | 2011-09-29 | 2013-04-04 | Nokia Corporation | Dust protection of sound transducer |
| CN103841747A (en) * | 2012-11-21 | 2014-06-04 | 昆山华扬电子有限公司 | Internally-embedded cavity-based multi-layer printed board structure |
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| GB2559838A (en) * | 2017-02-15 | 2018-08-22 | Wildlife Acoustics Inc | Ultrasonic microphone enclosure |
| CN111277938A (en) * | 2020-03-09 | 2020-06-12 | 无锡韦尔半导体有限公司 | Packaging structure of microphone |
| US10911854B2 (en) | 2017-02-15 | 2021-02-02 | Wildlife Acoustics, Inc. | Ultrasonic microphone enclosure |
-
2007
- 2007-05-26 CN CNU2007200225922U patent/CN201042078Y/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316393A (en) * | 2010-06-17 | 2012-01-11 | 宝星电子株式会社 | Microphone |
| US9473838B2 (en) | 2011-09-29 | 2016-10-18 | Nokia Technologies Oy | Dust protection of sound transducer |
| WO2013045749A1 (en) * | 2011-09-29 | 2013-04-04 | Nokia Corporation | Dust protection of sound transducer |
| US8644530B2 (en) | 2011-09-29 | 2014-02-04 | Nokia Corporation | Dust protection of sound transducer |
| CN103931210B (en) * | 2011-09-29 | 2017-05-17 | 诺基亚技术有限公司 | Dust protection of sound transducer |
| CN103931210A (en) * | 2011-09-29 | 2014-07-16 | 诺基亚公司 | Dust protection of sound transducer |
| CN102395093A (en) * | 2011-10-31 | 2012-03-28 | 歌尔声学股份有限公司 | Silicic miniature microphone |
| CN102665154B (en) * | 2012-05-19 | 2015-04-22 | 歌尔声学股份有限公司 | Pickup hole structure for microphone (MIC) |
| CN102665154A (en) * | 2012-05-19 | 2012-09-12 | 歌尔声学股份有限公司 | Pickup hole structure for microphone (MIC) |
| CN103841747A (en) * | 2012-11-21 | 2014-06-04 | 昆山华扬电子有限公司 | Internally-embedded cavity-based multi-layer printed board structure |
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| GB2559838A (en) * | 2017-02-15 | 2018-08-22 | Wildlife Acoustics Inc | Ultrasonic microphone enclosure |
| GB2559839A (en) * | 2017-02-15 | 2018-08-22 | Wildlife Acoustics Inc | Ultrasonic microphone enclosure |
| US10612967B2 (en) | 2017-02-15 | 2020-04-07 | Wildlife Acoustics, Inc. | Ultrasonic microphone enclosure |
| US10911854B2 (en) | 2017-02-15 | 2021-02-02 | Wildlife Acoustics, Inc. | Ultrasonic microphone enclosure |
| GB2559838B (en) * | 2017-02-15 | 2021-11-03 | Wildlife Acoustics Inc | Ultrasonic microphone enclosure |
| GB2559839B (en) * | 2017-02-15 | 2021-12-29 | Wildlife Acoustics Inc | Ultrasonic microphone enclosure |
| CN111277938A (en) * | 2020-03-09 | 2020-06-12 | 无锡韦尔半导体有限公司 | Packaging structure of microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080326 |