CN102075839B - MEMS microphone chip and MEMS microphone using same - Google Patents
MEMS microphone chip and MEMS microphone using same Download PDFInfo
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- CN102075839B CN102075839B CN200910223257.2A CN200910223257A CN102075839B CN 102075839 B CN102075839 B CN 102075839B CN 200910223257 A CN200910223257 A CN 200910223257A CN 102075839 B CN102075839 B CN 102075839B
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- 239000003990 capacitor Substances 0.000 claims abstract description 110
- 239000012528 membrane Substances 0.000 claims description 49
- 230000004888 barrier function Effects 0.000 claims description 19
- 238000009827 uniform distribution Methods 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000002210 silicon-based material Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The present invention discloses an MEMS microphone chip, comprising a substrate and a plurality of capacitors connected with each other in series and arranged on the substrate. The plurality of capacitors comprise one first capacitor and at least one second capacitor, wherein the first capacitor comprises a fixed first pole plate part (130) and a vibrating diaphragm (110), and the second capacitor comprises two electrodes remaining stationary. According to the above structure, the adoption of the MEMS microphone chip can easily realize voltage matching between the MEMS microphone chip and an IC chip by adjusting the capacitance of the second capacitor under the condition that the IC chip provides a constant driving voltage, thereby reducing the manufacturing cost for the MEMS microphone.
Description
Technical field
The present invention relates to a kind of MEMS microphone chip and adopt the MEMS microphone of this chip.
Background technology
In recent years, along with the electronic product such as mobile phone, notebook volume constantly reduces, performance is more and more higher, correspondingly require the volume of supporting electronic component constantly to reduce and performance and consistency raising.Under this background, the demand of the MEMS microphone that utilizes the production of MEMS (MEMS (micro electro mechanical system)) technology is increased fast.A core devices of MEMS microphone is exactly the MEMS microphone chip that utilizes MEMS technique to make, and this chip can complete sound-electric translation function.
A kind of structure of MEMS microphone chip is for example disclosed in prior art, this chip structure comprises a substrate, be arranged on the insulating barrier of this substrate top and be arranged on the capacitance component of this insulating barrier top, and this capacitance component comprises a vibrating membrane, a fixed polar plate and is arranged on the insulating barrier between the two.Particularly, Fig. 1 is the concise and to the point encapsulation schematic diagram that represents this MEMS microphone chip 1.As shown in Figure 1, the encapsulating structure of MEMS microphone comprises the metal side's groove form casing 2 and the square wiring board 3 that are provided with the sound hole 21 for receiving external sound signal, and, MEMS microphone chip 1 is installed on the surface of wiring board 3, two electrodes of the capacitor in this MEMS microphone chip are connected on wiring board 3 by metal wire (not shown) respectively, and are electrically communicated on signal processing chip (IC chip) 4 by the circuit on wiring board 3.
Fig. 2 is the schematic diagram of the circuit connecting relation of MEMS microphone chip 1 in presentation graphs 1, two utmost points of capacitor C0 in MEMS microphone chip 1 are electrically connected to IC chip 4, the signal of telecommunication of exporting from this capacitor C0 is after the processing of IC chip 4, output by IC chip is sent to external circuit, thereby realizes the function of MEMS microphone product.
But, in MEMS microphone chip as above, because two electrodes itself of capacitor of this MEMS microphone chip do not have electric charge, need to rely on IC chip that a driving voltage is provided, and require voltage and MEMS microphone chip required voltage that IC chip provides to mate.Therefore, in order to mate different MEMS microphone chips, need to design the multiple IC chip that different driving voltage can be provided, but the cost of this IC chip is very high, the holistic cost that this has just increased substantially MEMS microphone product, is unfavorable for the popularization of MEMS microphone product.On the other hand, spacing between pole plate and the vibrating membrane of MEMS microphone chip is very little, under some hygrothermal environments, easily between pole plate and vibrating membrane, there is leaky, even directly be pasted together, thereby the two is conducted, cause the undesired even damage of work of IC chip, so the performance of whole MEMS microphone product also can be affected, cause the reliability of product to reduce.
Summary of the invention
In order to solve above-mentioned problems of the prior art, the invention provides and a kind ofly can mate easily IC chip and the good MEMS microphone chip of reliability and adopt the MEMS microphone of this chip.
To achieve these goals, a kind of MEMS microphone chip provided by the invention, comprises basalis and the multiple capacitors that are arranged on basalis and are mutually connected in series, and described multiple capacitors comprise first capacitor and at least one second capacitor; Described the first capacitor comprises a fixing pole plate and a vibrating membrane, and described the second capacitor comprises that two keep fixing electrode.
In addition, preferred structure can be that described capacitor comprises pole plate layer, vibration rete and the separator between described pole plate layer and vibration rete; An electrode of the vibrating membrane of described the first capacitor and described the second capacitor is positioned at described vibration rete, and the fixing pole plate of described the first capacitor and another electrode of described the second capacitor are positioned at described pole plate layer.
In addition, preferred structure can be, by being positioned at described pole plate layer or a vibration electrode of described the first capacitor of rete and the physical connection of an electrode of described the second capacitor, to realize being connected in series of the first capacitor and the second capacitor.
In addition, preferred structure can be, described pole plate layer comprises the first blade portion as the fixed electrode of described the first capacitor, and around described the first blade portion, be uniform-distribution with multiple support portions across prescribed distance, possess the multiple dowels corresponding to described support portion as the described vibrating membrane of the movable electrode of described the first capacitor; Described multiple dowel is fixed on respectively the top of described multiple support portions, and the main part of described vibrating membrane is supported for to vacant state.
In addition, preferred structure can be that described dowel has strip or L shaped shape.
In addition, preferred structure can be, described vibrating membrane comprises the part of the movable electrode of the first capacitor described in the conduct linking into an integrated entity and the part as a fixed electrode of described the second capacitor.
In addition, the present invention also provides a kind of MEMS microphone chip that comprises said structure and the MEMS microphone that forms.
Owing to having adopted technique scheme, by adjusting the capacitance of the second capacitor, the driving voltage that provides at IC chip is constant, can easily realize the voltage matches of IC chip and MEMS microphone chip, also can in the situation that IC chip remains unchanged, adjust the sensitivity of MEMS microphone, reduce multiple IC chip design, produced the waste causing.In addition; owing to being provided with second capacitor with 2 fixed electrodes; avoid being subject to the impact of hygrothermal environment to cause the first blade portion and the vibrating membrane of the first capacitor of MEMS microphone chip to produce the situation of leaking electricity, being even sticked together; protect IC chip, thereby improved the global reliability of MEMS microphone product.
Brief description of the drawings
Fig. 1 is the concise and to the point encapsulation schematic diagram that represents existing MEMS microphone chip.
Fig. 2 is the schematic diagram that represents the circuit connecting relation of existing MEMS microphone chip.
Fig. 3 is the vertical view of the MEMS microphone chip that represents that the first embodiment of the present invention relates to.
Fig. 4 is the pole plate layer of the MEMS microphone chip that represents that the first embodiment of the present invention the relates to distribution schematic diagram on barrier layer.
Fig. 5 is the upward view of the MEMS microphone chip that represents that the first embodiment of the present invention relates to.
Fig. 6 be along a-a in Fig. 3 to profile.
Fig. 7 represents that MEMS microphone chip that the first embodiment of the present invention relates to is installed to the schematic diagram of the state on wiring board.
Fig. 8 is the schematic diagram of the circuit connecting relation of the MEMS microphone chip that represents that the first embodiment of the present invention relates to.
Fig. 9 is the vertical view of the MEMS microphone chip that represents that the second embodiment of the present invention relates to.
Figure 10 is the vertical view of the MEMS microphone chip that represents that the third embodiment of the present invention relates to.
Figure 11 be along a-a in Figure 10 to profile.
Embodiment
With specific embodiment, the present invention is done to further detailed description by reference to the accompanying drawings below.
In order to solve the voltage pairing of MEMS microphone chip and IC chip and the easy problem of electric leakage, adhesion, MEMS microphone chip provided by the invention is two capacitors of mutually connecting by the capacitor design being arranged on basalis, and the following examples will be done more specific description to the specific structural features of MEMS microphone chip provided by the present invention.
(the first embodiment)
Fig. 3 is the vertical view of the MEMS microphone chip that represents that the first embodiment of the present invention relates to, Fig. 4 is the pole plate layer of the MEMS microphone chip that represents that the first embodiment of the present invention the relates to distribution schematic diagram on barrier layer, Fig. 5 is the upward view of the MEMS microphone chip that represents that the first embodiment of the present invention relates to, Fig. 6 be along a-a in Fig. 3 to profile.From these diagrams, square MEMS microphone chip 1 involving vibrations rete 11, separator 12, fixing pole plate layer 13, barrier layer 14 and basalis 15 successively from top to bottom.
Wherein, basalis 15 is made for single crystal silicon material, and on this basalis 15, having by hollow out is columniform through hole 151 (seeing Fig. 6), and its inner cavity forming can be used as the back cavity of MEMS microphone chip.
In addition, in order to ensure the accuracy of MEMS microphone processing, above the not openwork part of basalis 15, be provided with barrier layer 14, barrier layer 14 is silica material making.Moreover the shape on this barrier layer 14 is corresponding with the shape of basalis 15, and, on barrier layer 14, also offer the circular hole of and same shape corresponding with through hole 151.
Above barrier layer 14, be provided with fixing pole plate layer 13, pole plate layer 13 is polycrystalline silicon material making.Pole plate layer 13 comprises that the first blade portion 130, elongated connecting portion 133 and the second blade portion 132, the first blade portion 130 and the second blade portion 132 are connected together by this connecting portion 133.The first blade portion 130 is positioned at the top of the through hole 151 of basalis 15, and has corresponding with through hole 151 round-shapedly, and it becomes an electrode of the first capacitor C0 in the MEMS microphone chip the present invention relates to.And, be provided with multiple apertures 131 in the first blade portion 130, make the air conducting of the first blade portion 130 upper and lowers, thereby make through hole 151 parts of basalis 15 become the back cavity of MEMS microphone chip 1.And, owing to being provided with multiple apertures on pole plate 130, except realizing necessary acoustic efficiency, can also be convenient to discharge the insolated layer materials between pole plate and vibrating membrane.In addition, be arranged in the second blade portion 132 on part beyond the through hole 151 of basalis 15 and become an electrode of the second capacitor C1 of MEMS microphone chip.At this, about the first capacitor C0 in MEMS microphone chip and the structure of the second capacitor C1, will be described in detail in the back.
In addition, around the first blade portion 130, be provided with three support portions 134 across predetermined distance, these support portions 134 and the first blade portion 130 interval predetermined distances and highly identical.
In addition, be provided with the separator 12 of insulating effect on above-mentioned pole plate layer 13 and three support portions 134, separator 12 is silica material making.In the present embodiment, separator 12 comprises that several separate the spacer arranging and form, and these spacers lay respectively at the top of described support portion 134 and the second blade portion 132, and its shape is corresponding with the shape of support portion 134 and the second blade portion 132 respectively.
Above separator 12, be provided with the vibration rete 11 that polycrystalline silicon material is made, vibration rete 11 comprises the vibrating membrane 110 of the first blade portion 130 tops that are arranged at pole plate layer 13 and is arranged at the flat board 113 of the second blade portion 132 tops, and, described vibrating membrane 110 and dull and stereotyped 113 is the members that are separated, described vibrating membrane 110 and dull and stereotyped 113 and pole plate layer 13 between across described separator 12.Vibrating membrane 110 has the shape corresponding with the first blade portion 130, and arrange vis-a-vis with this first blade portion 130, in addition, extend outward three long and narrow dowels 111 for fixing this vibrating membrane 110 from the circular body portion of this vibrating membrane 110, the position of these three dowels 111 is corresponding three support portions 134 respectively.These three dowels 111 are fixed on respectively on separator 12, make the main part of vibrating membrane 110 be positioned at the first blade portion 130 tops of pole plate layer 13 with vacant state.Now, this vibrating membrane 110 becomes another electrode of the first capacitor C0 in MEMS microphone chip, thereby this vibrating membrane 110 and the first blade portion 130 form the first capacitor C0.At this, because vibrating membrane 110 is fixed on the top of separator 12 by three long and narrow dowels 111, the main part that makes vibrating membrane is unsettled and produce vibration, easily discharges stress simultaneously.In addition, the second blade portion 132 of the flat board 113 arranging vis-a-vis across described separator 12 and pole plate layer 13 forms the second capacitor C1 of MEMS microphone chip, and now, dull and stereotyped 113 become another electrode of this second capacitor C1.In addition, for two capacitor C0 are connected with external circuit with C1, on a dowel 111 of vibrating membrane 110 and dull and stereotyped 113, be also respectively arranged with metal electric connection point 112,114, connect for same external circuit.
At this, because vibrating membrane 110 and the first blade portion 130 form the first capacitor C0, flat board 113 and the second blade portion 132 form the second capacitor C1, and be connected by connecting portion 133 between the first blade portion 130 and the second blade portion 132, so form series relationship between the first capacitor C0 and the second capacitor C1.Wherein, in the time transmitting external voice, vibrating membrane 110 as an electrode of the first capacitor C0 can vibrate, this can cause the capacitance of this first capacitor C0 to change, and fix as the flat board 113 of an electrode of the second capacitor C1, therefore the capacitance of the second capacitor C1 immobilizes.
Fig. 7 represents that MEMS microphone chip that the first embodiment of the present invention relates to is installed to the schematic diagram of the state on wiring board.As shown in Figure 7, after the MEMS microphone chip of said structure is installed to wiring board 3, the electric connection point 112 of vibrating membrane 110 and dull and stereotyped 113 electric connection point 114 are connected on wiring board 3 by metal wire 5 respectively.Then, then the MEMS microphone chip and the IC chip 4 that are installed on wiring board 3 are linked together, just formed the operating circuit of the MEMS microphone shown in Fig. 8.
In the MEMS microphone chip with said structure, the IC chip 4 using at microphone does not change, can be by regulating the capacitance adjustment of the second capacitor C1 to be applied to the voltage on the first capacitor C0, thereby can make MEMS microphone chip match with IC chip 4, so just can reduce the design of a large amount of IC chips and produce burden, having saved significantly the holistic cost of MEMS microphone.And; owing to having increased by the second capacitor C1; therefore; even if the first capacitor C0 of MEMS microphone chip is subject to the impact of some hygrothermal environment; and cause its first blade portion 130 and vibrating membrane 110 to produce the situation that is even sticked together of leaking electricity; due to the protective effect of the second capacitor C1, IC chip can be not damaged yet, thereby improved the reliability of whole MEMS microphone product.
In addition, the first blade portion and the vibrating membrane of two electrodes respectively with the first capacitor C0 of the second capacitor C1 that the present embodiment relates to are positioned at same layer, and its structural design is simple, therefore, the first capacitor C0 and the second capacitor C1 can complete under same technique, do not need to increase extra operation, therefore save manufacturing cost.
Moreover, in the present embodiment, the second blade portion of the first blade portion of the first capacitor C0 and the second capacitor C1 interconnects, make the first capacitor and the second capacitor share a conductive layer, the effect of two capacitor's seriess of self-assembling formation, has therefore saved cost of manufacture.
(the second embodiment)
Fig. 9 is the vertical view of the MEMS microphone chip that represents that the second embodiment of the present invention relates to.As shown in the drawing, structure with the first embodiment is compared, the difference part of the MEMS microphone chip that this second embodiment relates to is, vibrating membrane 110 be shaped as squarish, the substantial middle portion on each limit of this vibrating membrane 110 extends outward four L-shaped dowels 111 certainly.And, with these four L shaped dowels accordingly, around the first blade portion 130 on barrier layer 12, be provided with four support portions 134 across predetermined distance.Adopt the vibrating membrane of this structure, its stress is less, can make MEMS microphone chip realize better acoustic efficiency.
(the 3rd embodiment)
Figure 10 is the vertical view of the MEMS microphone chip that represents that the third embodiment of the present invention relates to, Figure 11 be along a-a in Figure 10 to profile.As shown in Figure 10,11, compare with the first above-mentioned embodiment, the main distinction point of the MEMS microphone chip that this 3rd embodiment relates to is, vibration rete 11 is set above barrier layer 14, above vibration rete 11, sets gradually separator 12 and pole plate layer 13.
In the present embodiment, vibration rete 11 is made up of an overall vibrating membrane 110.The shape of the separator 12 arranging above vibrating membrane 110 is corresponding with barrier layer 14, all has annular shape.
In addition, be arranged at the pole plate layer 13 of separator 12 tops, comprise the first blade portion 130 of middle body and be positioned at second blade portion 136 in the outside of this first blade portion 130 around this first blade portion 130, between this first blade portion 130 and the second blade portion 136 across the interval of regulation.Wherein, the first blade portion 130 is general square shape, and offers multiple apertures 131, and these apertures 131 can make air-flow can run through the first blade portion 130, to realize the necessary acoustic efficiency of microphone, but also can discharge the insolated layer materials between the first blade portion 130 and vibrating membrane 110.At this, the corresponding part of this first blade portion 130 and vibrating membrane 110 forms the first capacitor of MEMS microphone chip, to realize the sound-electric translation function of microphone.In addition, the corresponding part of the second blade portion 136 and vibrating membrane 110 forms the second capacitor of MEMS microphone chip.
In this 3rd embodiment, vibration rete 11 and the setting position of pole plate layer 13 and the inverted configuration of the first embodiment, that vibration rete 11 is between barrier layer 14 and separator 12, on the separator 12 of pole plate layer 13 above being positioned at, and, the electrode of the first capacitor C0 and the electrode of the second capacitor C1 that are positioned at vibration rete are interconnected, thereby make the first capacitor and the second capacitor in series connection.
In addition, in the first blade portion 130 and the second blade portion 136, be respectively arranged with for MEMS microphone chip being connected to electric connection point 137 and the electric connection point 138 on wiring board 3, after this MEMS microphone chip is installed to the wiring board of MEMS microphone, can be connected on wiring board 3 by electric connection point 137 and electric connection point 138 and metal wire.
Compare with the first embodiment, in the structure of the MEMS microphone chip that the 3rd embodiment relates to, two electrodes of the second capacitor C1 are separately positioned on the peripheral part of the first blade portion 130 of vibration rete 11 and pole plate layer 13, can utilize more fully space, make size less, cost of manufacture is also cheaper.
And, in the MEMS microphone chip that the 3rd embodiment relates to, the the first capacitor C0 and changeless the second capacitor C1 of capacitance that exist equally capacitance to change with the vibration of vibrating membrane 110, and this first capacitor and the second capacitor are connected mutually, therefore, also can be by regulating the capacitance adjustment of the second capacitor C1 to be applied to the voltage on the first capacitor C0, thereby can make MEMS microphone chip match with IC chip 4, so just can reduce the design of a large amount of IC chips and produce burden, save significantly the holistic cost of MEMS microphone.And; owing to having increased by the second capacitor C1; therefore; even if the first capacitor C0 of MEMS microphone chip is subject to the impact of some hygrothermal environment; and cause its first blade portion 130 and vibrating membrane 110 to produce the situation that is even sticked together of leaking electricity; due to the protective effect of the second capacitor C1, IC chip can be not damaged yet, thereby improved the reliability of whole MEMS microphone product.
In the various embodiments described above, what for example understand the parts such as through hole, the first blade portion, the second blade portion, vibrating membrane, flat board is shaped as circle or squarish, but the present invention does not limit its concrete shape, also can adopt oval grade for other shapes according to the requirement of MEMS microphone.Such as, moreover what for example understand dowel 111 is shaped as strip or shape, but also can adopt other shapes, circular arc, spirality etc.
Moreover, in above-described embodiment, for example understand that basalis adopts single crystal silicon material, separator to adopt silica material, vibrating membrane and pole plate layer adopt polycrystalline silicon material, but the present invention is not limited to these materials, as long as can realize the function separately of each parts, they also can adopt other known material to make.
In addition, in above-mentioned first, second embodiment, illustrate on the extended dowel of self-excited oscillation film electric connection point has been set, but be not limited to this, also can, under the prerequisite of vibration performance that does not affect vibrating membrane, in the somewhere of vibrating membrane, this electric connection point be set.
In addition, variable capacitor and the structure that the constant capacitor of capacitance forms of a capacitance that comprises mutual series connection has been described in the various embodiments described above, but, also can adopt and comprise between capacitor that capacitance is variable and the constant capacitor of multiple capacitance and these capacitors all structures of series winding, this is mathematical.
On the other hand, the present invention also provides a kind of MEMS microphone, it comprises metal shell, wiring board, MEMS microphone chip and signal processing chip (IC chip) that sound hole is set, MEMS microphone chip and signal processing chip are realized electric connection by wiring board, the MEMS microphone chip that MEMS microphone chip wherein adopts above-described embodiment to record.Because the concrete encapsulating structure of microphone is that those skilled in the art know and know, so do not repeat them here.
In the respective embodiments described above of the present invention, to MEMS microphone chip and adopt shape, material and the architectural feature of the MEMS microphone of this chip to be all limited embodiment to show, the variation of some other shape, material and structure does not change purport of the present invention.Such as: IC chip can adopt numeral or analog amplifier chip, and this type of adjustment belongs to technology well known to those skilled in the art; Two electrodes of MEMS microphone chip can be connected on wiring board by for example gold thread of metal wire, also can be directly connected to and on IC chip, realize circuit and connect, or can two electrodes be connected to IC chip by plated-through hole being set in MEMS microphone chip inside, this type of is adjusted does not affect purport of the present invention yet.
Although for the concrete structure of MEMS microphone chip, the specific embodiment of the invention is described above,, under above-mentioned instruction of the present invention, those skilled in the art can carry out various improvement and distortion on the basis of above-mentioned execution mode.It will be understood by those skilled in the art that specific descriptions are above in order to explain object of the present invention, not for limiting the present invention.Protection scope of the present invention is limited by claim and equivalent thereof.
Claims (7)
1. a MEMS microphone chip, is characterized in that, comprising:
Basalis and the multiple capacitors that are arranged on basalis and are mutually connected in series, described multiple capacitors comprise first capacitor and at least one second capacitor; Wherein,
Above described basalis, be disposed with barrier layer, pole plate layer, separator and vibration rete; And,
On described basalis, be provided with through hole (151), on described barrier layer, offer the circular hole corresponding with described through hole (151);
Described pole plate layer comprises the first blade portion (130), the second blade portion (132) and connects described the first blade portion (130) and the connecting portion (133) of described the second blade portion (132), and described the second blade portion is positioned at beyond the through hole of described basalis on part;
Described vibration rete comprises the vibrating membrane (110) that is arranged on described the first blade portion (130) top and the flat board (113) that is arranged on described the second blade portion (132) top, and described vibrating membrane (110) and described flat board (113) are separated from each other;
Described the first blade portion (130) is the fixed electrode of described the first capacitor, described vibrating membrane (110) forms another electrode of described the first capacitor, and described the second blade portion (132) and described flat board (113) form two electrodes that maintenance is fixing of described the second capacitor.
2. MEMS microphone chip as claimed in claim 1, is characterized in that,
By being positioned at described pole plate layer or a vibration electrode of described the first capacitor of rete and the physical connection of an electrode of described the second capacitor, realize being connected in series of the first capacitor and the second capacitor.
3. MEMS microphone chip as claimed in claim 1, is characterized in that,
Described pole plate layer comprises the first blade portion (130) as the fixed electrode of described the first capacitor, and around described the first blade portion, be uniform-distribution with multiple support portions (134) across prescribed distance, possess the multiple dowels (111) corresponding to described support portion as the described vibrating membrane (110) of the movable electrode of described the first capacitor;
Described multiple dowel is fixed on respectively the top of described multiple support portion (134), and the main part of described vibrating membrane (110) is supported for to vacant state.
4. MEMS microphone chip as claimed in claim 3, is characterized in that,
Described dowel has strip or L shaped shape.
5. a MEMS microphone chip, is characterized in that, comprising:
Basalis and the multiple capacitors that are arranged on basalis and are mutually connected in series, described multiple capacitors comprise first capacitor and at least one second capacitor; Wherein,
Above described basalis, be disposed with barrier layer, vibration rete, separator and pole plate layer; And,
On described basalis, be provided with through hole (151), on described barrier layer, offer the circular hole corresponding with described through hole (151);
Described pole plate layer comprises the first blade portion (130) and the second blade portion (136);
Described vibration rete is made up of an overall vibrating membrane (110), and described vibration rete comprises the movable electrode part of the first capacitor described in the conduct linking into an integrated entity and the part as a fixed electrode of described the second capacitor;
The corresponding part of described the first blade portion (130) and described vibrating membrane (110) forms the first capacitor of described MEMS microphone chip, and the corresponding part of described the second blade portion and described vibrating membrane (110) forms the second capacitor of described MEMS microphone chip; And,
Described in the conduct of described pole plate layer, the second blade portion of the fixed electrode of the second capacitor is centered around as the first blade portion of the fixed electrode of described the first capacitor around across prescribed distance.
6. the MEMS microphone chip as described in claim 1 or 5, is characterized in that,
In described the first blade portion (130), be also provided with multiple apertures (131).
7. a MEMS microphone, is characterized in that:
Comprise as the MEMS microphone chip as described in arbitrary in claim 1～6.
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| CN103491490B (en) * | 2013-08-16 | 2019-03-19 | 上海集成电路研发中心有限公司 | A kind of MEMS microphone structure and its manufacturing method |
| US9439002B2 (en) * | 2014-11-13 | 2016-09-06 | Invensense, Inc. | Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same |
| CN104848982B (en) | 2015-05-29 | 2018-01-19 | 歌尔股份有限公司 | Quasi- differential capacitance type MEMS pressure sensor and its manufacture method |
| CN105047172A (en) * | 2015-09-15 | 2015-11-11 | 京东方科技集团股份有限公司 | Shift register, gate driving circuit, display screen and driving method of display screen |
| WO2019004933A1 (en) * | 2017-06-28 | 2019-01-03 | Agency For Science, Technology And Research | Acoustic device and method of forming the same |
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| CN201345731Y (en) * | 2009-01-10 | 2009-11-11 | 宁波鑫丰泰电器有限公司 | Electret capacitor microphone |
| CN201797597U (en) * | 2009-11-20 | 2011-04-13 | 歌尔声学股份有限公司 | MEMS microphone chip and MEMS microphone adopting same |
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| CN102075839A (en) | 2011-05-25 |
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