CN201345731Y - Electret capacitor microphone - Google Patents
Electret capacitor microphone Download PDFInfo
- Publication number
- CN201345731Y CN201345731Y CNU2009201125511U CN200920112551U CN201345731Y CN 201345731 Y CN201345731 Y CN 201345731Y CN U2009201125511 U CNU2009201125511 U CN U2009201125511U CN 200920112551 U CN200920112551 U CN 200920112551U CN 201345731 Y CN201345731 Y CN 201345731Y
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- Prior art keywords
- electrically connected
- capacitor
- metal shell
- last plane
- circuit board
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Abstract
The utility model discloses an electret capacitor microphone, which comprises a metal housing, a vibrating diaphragm, a metal ring, an insulating washer, a back polar plate, a metal mesh, a copper packing, a fixing plastic ring I, a metal ring I, a capacitor I, a capacitor II, a printed circuit board, a fixing plastic ring II, a metal ring II, a high-gain low-noise chip and an insulating washer, wherein, the high-gain low-noise chip is electrically connected with a power supply terminal, a signal terminal, a signal ground terminal and the back polar plate; the vibrating diaphragm is electrically connected with the signal terminal; the capacitor I is electrically connected with the power supply terminal and the signal ground terminal; the capacitor II is electrically connected with the signal terminal and the signal ground terminal; and a shielding ground terminal is electrically connected with the metal housing. The utility model can reduce the power frequency interference and the external electromagnetic wave interference effectively.
Description
Technical field
The utility model relates to the microphone that digital products such as mobile phone, cordless telephone, desktop computer, notebook computer are used, and specifically is a kind of electret capacitor microphone.
Background technology
At present, the electret capacitor microphone that is used for digital products such as mobile phone, cordless telephone, desktop computer, notebook computer is the two ends outputs, comprise feeder ear and earth terminal, and the shared earth terminal of the signal ground of described electret capacitor microphone and shielding ground, at present, the AC-powered of described digital product much is two lines with plug, particularly European countries substantially all are two lines, so just lacked the ground connection connecting line, therefore caused power ground floatingly described electret capacitor microphone to be produced power frequency and disturb.Electret capacitor microphone for existing two terminated lines, because the FET (field-effect transistor) in load resistance of feeder ear series connection and electret capacitor microphone inside constitutes drain electrode output, come the filter out power ripple so can not increase jumbo electric capacity in electret capacitor microphone inside, otherwise all audio signals together can be filtered, in these cases, described electret capacitor microphone can produce extremely strong power frequency and disturb under the detecting action of inner FET, therefore cause great background noise and influence electret capacitor microphone to the normal transmission in effective sound ground.
The utility model content
The technical problems to be solved in the utility model is that a kind of electret capacitor microphone that can effectively reduce power frequency interference and external electromagnetic wave interference is provided.
The technical solution of the utility model is, a kind of electret capacitor microphone with following structure is provided, it comprises metal shell and places the interior vibrating diaphragm of described metal shell, becket, insulating washer, back pole plate, wire netting, copper packing, fixedly moulding of back pole plate encircles I, be tight with at the becket I that fixedly moulds in the ring I, be pasted with the high-gain low-noise chip, the printed circuit board (PCB) of capacitor I and capacitor I I, the bottom surface of described vibrating diaphragm is bonded in the last plane of becket, the bottom surface of insulating washer is close on the last plane of described vibrating diaphragm, the last plane of described insulating washer is close to back pole plate and is fixedly moulded the bottom surface of ring I, the bottom surface of wire netting is close on the last plane of described back pole plate, the last plane of described wire netting is adjacent to the bottom surface of copper packing, the bottom surface of becket I is close on the last plane of described copper packing, the bottom surface of printed circuit board (PCB) is close on the last plane of described becket I, the last plane of printed circuit board (PCB) is pushed down in the upper end of described metal shell, and what it also comprised the vibrating diaphragm that places in the described metal shell fixedly moulds ring II, be tight with at the becket II that fixedly moulds in the ring II, insulating washer; Described insulating washer places on the inner bottom surface of metal shell; The last plane of described insulating washer is close to becket and is fixedly moulded the bottom surface of ring II; The bottom surface of becket II is close on the last plane of described vibrating diaphragm, and the bottom surface of printed circuit board (PCB) is close on the last plane of described becket II; Described high-gain low-noise chip attachment is on printed circuit board (PCB); The plane is provided with four binding posts on the described printed circuit board (PCB), is respectively supply terminals, signal terminal, signal ground terminals and shielding ground terminals; Described high-gain low-noise chip is electrically connected with supply terminals, signal terminal, signal ground terminals, back pole plate respectively; Described vibrating diaphragm is electrically connected with the signal ground terminals; One end of described capacitor I is electrically connected with supply terminals, and the other end of described capacitor I is electrically connected with the signal ground terminals; The end of described capacitor I I is electrically connected with signal terminal, and the other end of described capacitor I is electrically connected with the signal ground terminals; Described shielding ground terminals are electrically connected with metal shell.
After adopting said structure, the utility model compared with prior art, have the following advantages: because the utility model electret capacitor microphone is provided with four binding posts, the signal ground terminals are arranged with shielding ground terminals branch, and adopted the high-gain low-noise chip, disturb so can effectively reduce power frequency; Because be provided with shielding ground terminals, so can effectively shield of the interference of external electromagnetic ripple to the inside components and parts of the utility model electret capacitor microphone.
As improvement, the last plane of described printed circuit board (PCB) is coated with Copper Foil, and this Copper Foil is electrically connected with metal shell, shielding ground terminals respectively; Described shielding ground terminals are electrically connected with metal shell and are meant that described shielding ground terminals are electrically connected with metal shell by Copper Foil, like this, the performance of the utility model shielding external electromagnetic ripple are further improved.
As further improvement, described high-gain low-noise chip is a LMV1031 high-gain low-noise chip, and this LMV1031 high-gain low-noise chip performance is reliable, low in energy consumption, and performance of the present utility model is further improved.
As further improvement, the span of the capacitance value of described capacitor I is 100nF～10uF; The span of the capacitance value of described capacitor I I is 5pF～1nF; Like this, adopt capacitor I and capacitor I I in the above-mentioned scope can make utility model be operated in optimum state.
As further improvement, it also comprises the water proof and dust proof net, and this water proof and dust proof net is bonded on the bottom surface of outside of metal shell, like this, just can prevent effectively that sealing or dust enter described electret capacitor microphone inside, and then improve reliability of the present utility model and useful life.
As further improvement, the center of described copper packing is provided with a through hole; Described printed circuit board (PCB) is provided with along equally distributed six through holes of the circumference of printed circuit board (PCB); Described back pole plate is provided with along equally distributed four through holes of the circumference of back pole plate, and like this, the utility model just becomes a single electret capacitor microphone that points to, and the performance of the effective sound of the utility model collection is further improved.
As further improvement, described metal shell is that the material of aluminium or copper or iron is made, and like this, the material that adopts aluminium or copper or iron is as electro-magnetic shielding cover of the present utility model, can well shield the interference of external electromagnetic ripple, be particularly suitable for being applied to digital products such as mobile phone, computer.
Description of drawings
Fig. 1 is the cross-sectional view of the utility model electret capacitor microphone.
Fig. 2 is the vertical view of the utility model electret capacitor microphone.
Fig. 3 is the circuit connection diagram of the utility model electret capacitor microphone.
Shown in the figure, 1, vibrating diaphragm, 2, becket, 3, insulating washer, 4, back pole plate, 5, wire netting, 6, copper packing, 7, fixedly mould ring II, 8, becket II, 9, fixedly mould ring I, 10, becket I, 11, the high-gain low-noise chip, 12, capacitor I, 13, capacitor I I, 14, printed circuit board (PCB), 15, insulating washer, 16, metal shell, 17, supply terminals, 18, signal terminal, 19, signal ground terminals, 20, shielding ground terminals, 21, the water proof and dust proof net.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.Shown in Fig. 1 or 2 or 3:
The utility model electret capacitor microphone, it comprises metal shell 16 and places vibrating diaphragm 1 in the described metal shell 16, becket 2, insulating washer 3, back pole plate 4, wire netting 5, copper packing 6, fixedly moulding of back pole plate 4 encircles I9, be tight with at the becket I10 that fixedly moulds in the ring I9, be pasted with high-gain low-noise chip 11, the printed circuit board (PCB) 14 of capacitor I 12 and capacitor I I13, the bottom surface of described vibrating diaphragm 1 is bonded in the last plane of becket 2, the bottom surface of insulating washer 3 is close on the last plane of described vibrating diaphragm 1, the bottom surface that the last plane of described insulating washer 3 is close to back pole plate 4 and is fixedly moulded ring I9, the bottom surface of wire netting 5 is close on the last plane of described back pole plate 4, the last plane of described wire netting 5 is adjacent to the bottom surface of copper packing 6, the bottom surface of becket I10 is close on the last plane of described copper packing 6, the bottom surface of printed circuit board (PCB) 14 is close on the last plane of described becket I10, the last plane of printed circuit board (PCB) 14 is pushed down in the upper end of described metal shell 16, and what it also comprised the vibrating diaphragm 1 that places in the described metal shell 16 fixedly moulds ring II7, be tight with at becket II8 and the insulating washer 15 fixedly moulded in the ring II7; Described insulating washer 15 places on the inner bottom surface of metal shell 16; The bottom surface that the last plane of described insulating washer 15 is close to becket 2 and is fixedly moulded ring II7; The bottom surface of becket II8 is close on the last plane of described vibrating diaphragm 1, and the bottom surface of printed circuit board (PCB) 14 is close on the last plane of described becket II8; Described high-gain low-noise chip 11 is mounted on the printed circuit board (PCB) 14; The last plane of described printed circuit board (PCB) 14 is provided with four binding posts, is respectively supply terminals 17, signal terminal 18, signal ground terminals 19 and shielding ground terminals 20; Described high-gain low-noise chip 11 is electrically connected with supply terminals 17, signal terminal 18, signal ground terminals 19, back pole plate 4 respectively; Described vibrating diaphragm 1 is electrically connected with signal ground terminals 19; One end of described capacitor I 12 is electrically connected with supply terminals 17, and the other end of described capacitor I 12 is electrically connected with signal ground terminals 19; The end of described capacitor I I13 is electrically connected with signal terminal 18, and the other end of described capacitor I I13 is electrically connected with signal ground terminals 19; Described shielding ground terminals 20 are electrically connected with metal shell 16.
Described wire netting 5 can adopt stainless steel, also can adopt copper or nickel.
Described back pole plate 4 is the electret through the corona polarizing electret.
Described back pole plate 4 is secured in by the outer wall of back pole plate 4 and the close-fitting of fixedly moulding the inwall that encircles I9 and fixedly moulds in the ring I9, and described vibrating diaphragm 1 is secured in the inwall close-fitting of fixedly moulding ring II7 by the outer wall of vibrating diaphragm 1 and fixedly moulds in the ring II7.
It also comprises water proof and dust proof net 21, and this water proof and dust proof net 21 is bonded on the bottom surface of outside of metal shell 16.
The last plane of described printed circuit board (PCB) 14 is coated with Copper Foil, and this Copper Foil is electrically connected with metal shell 16, shielding ground terminals 20 respectively; Described shielding ground terminals 20 are electrically connected with metal shell 16 and are meant that described shielding ground terminals 20 are electrically connected with metal shell 16 by Copper Foil.
The center of described copper packing 6 is provided with a through hole; Described printed circuit board (PCB) 14 is provided with along equally distributed six through holes of the circumference of printed circuit board (PCB) 14; Described back pole plate 4 is provided with along equally distributed four through holes of the circumference of back pole plate 4.
Described high-gain low-noise chip 11 is a LMV1031 high-gain low-noise chip, described high-gain low-noise chip 11 respectively with supply terminals 17, signal terminal 18, signal ground terminals 19, back pole plate 4 is electrically connected and is meant, the Vcc end of described LMV1031 high-gain low-noise chip is electrically connected with supply terminals 17, the Vout end of described LMV1031 high-gain low-noise chip is electrically connected with signal terminal 18, the GND end of described LMV1031 high-gain low-noise chip is electrically connected with signal ground terminals 19, and the Vin end of described LMV1031 high-gain low-noise chip is electrically connected with back pole plate 4.
The span of the capacitance value of described capacitor I 12 is 100nF～10uF, adopts the electric capacity of 100nF in this example; The span of the capacitance value of described capacitor I I13 is 5pF～1nF, adopts the electric capacity of 33pF in this example.
Described metal shell 16 is made for the material of aluminium or copper or iron, is the metal shell 16 of irony in this example.
The operation principle of the utility model electret capacitor microphone is as follows:
Below only be described, but can not be interpreted as it is restriction claim with regard to the utility model preferred embodiment.Structure of the present utility model can have other variations, is not limited to said structure, such as: described back pole plate 4 can evenly be provided with two through holes along the circumference of back pole plate (4).In a word, all various variations of being done in the protection range of the utility model product independent claims are all in protection range of the present utility model.
Claims (7)
1, a kind of electret capacitor microphone, it comprises metal shell (16) and places the interior vibrating diaphragm (1) of described metal shell (16), becket (2), insulating washer (3), back pole plate (4), wire netting (5), copper packing (6), fixedly moulding of back pole plate (4) encircles I (9), be tight with at the becket I (10) that fixedly moulds in the ring I (9), be pasted with the printed circuit board (PCB) (14) of capacitor I (12) and capacitor I I (13), the bottom surface of described vibrating diaphragm (1) is bonded in the last plane of becket (2), the bottom surface of insulating washer (3) is close on the last plane of described vibrating diaphragm (1), the last plane of described insulating washer (3) is close to back pole plate (4) and is fixedly moulded the bottom surface of ring I (9), wire netting (5) bottom surface is close on the last plane of described back pole plate (4), described wire netting (5) is gone up the bottom surface that copper packing (6) are close on the plane, the bottom surface of becket I (10) is close on the last plane of described copper packing (6), the bottom surface of printed circuit board (PCB) (14) is close on the last plane of described becket I (10), the last plane of printed circuit board (PCB) (14) is pushed down in the upper end of described metal shell (16), it is characterized in that: what it also comprised the vibrating diaphragm (1) that places in the described metal shell (16) fixedly moulds ring II (7), be tight with at the becket II (8) that fixedly moulds in the ring II (7), high-gain low-noise chip (11) and insulating washer (15); Described insulating washer (15) places on the inner bottom surface of metal shell (16); The last plane of described insulating washer (15) is close to becket (2) and is fixedly moulded the bottom surface of ring II (7); The bottom surface of becket II (8) is close on the last plane of described vibrating diaphragm (1), and the bottom surface of printed circuit board (PCB) (14) is close on the last plane of described becket II (8); Described high-gain low-noise chip (11) is mounted on the printed circuit board (PCB) (14); The last plane of described printed circuit board (PCB) (14) is provided with four binding posts, is respectively supply terminals (17), signal terminal (18), signal ground terminals (19) and shielding ground terminals (20); Described high-gain low-noise chip (11) is electrically connected with supply terminals (17), signal terminal (18), signal ground terminals (19), back pole plate (4) respectively; Described vibrating diaphragm (1) is electrically connected with signal ground terminals (19); One end of described capacitor I (12) is electrically connected with supply terminals (17), and the other end of described capacitor I (12) is electrically connected with signal ground terminals (19); The end of described capacitor I I (13) is electrically connected with signal terminal (18), and the other end of described capacitor I I (13) is electrically connected with signal ground terminals (19); Described shielding ground terminals (20) are electrically connected with metal shell (16).
2, electret capacitor microphone according to claim 1 is characterized in that: the last plane of described printed circuit board (PCB) (14) is coated with Copper Foil, and this Copper Foil is electrically connected with metal shell (16), shielding ground terminals (20) respectively; Described shielding ground terminals (20) are electrically connected with metal shell (16) and are meant that described shielding ground terminals (20) are electrically connected with metal shell (16) by Copper Foil.
3, electret capacitor microphone according to claim 1 is characterized in that: described high-gain low-noise chip (11) is a LMV1031 high-gain low-noise chip.
4, electret capacitor microphone according to claim 1 is characterized in that: the span of the capacitance value of described capacitor I (12) is 100nF～10uF; The span of the capacitance value of described capacitor I I (13) is 5pF～15nF.
5, electret capacitor microphone according to claim 1 is characterized in that: it also comprises water proof and dust proof net (21), and this water proof and dust proof net (21) is bonded on the bottom surface of outside of metal shell (16).
6, electret capacitor microphone according to claim 1 is characterized in that: the center of described copper packing (6) is provided with a through hole; Described printed circuit board (PCB) (14) is provided with along equally distributed six through holes of the circumference of printed circuit board (PCB) (14); Described back pole plate (4) is provided with along equally distributed four through holes of the circumference of back pole plate (4).
7, electret capacitor microphone according to claim 1 is characterized in that: described metal shell (16) is made for the material of aluminium or copper or iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201125511U CN201345731Y (en) | 2009-01-10 | 2009-01-10 | Electret capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201125511U CN201345731Y (en) | 2009-01-10 | 2009-01-10 | Electret capacitor microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201345731Y true CN201345731Y (en) | 2009-11-11 |
Family
ID=41277315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201125511U Expired - Lifetime CN201345731Y (en) | 2009-01-10 | 2009-01-10 | Electret capacitor microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201345731Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102075839A (en) * | 2009-11-20 | 2011-05-25 | 歌尔声学股份有限公司 | MEMS microphone chip and MEMS microphone using same |
| CN101466060B (en) * | 2009-01-10 | 2012-06-27 | 宁波鑫丰泰电器有限公司 | Electret condenser microphone |
-
2009
- 2009-01-10 CN CNU2009201125511U patent/CN201345731Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101466060B (en) * | 2009-01-10 | 2012-06-27 | 宁波鑫丰泰电器有限公司 | Electret condenser microphone |
| CN102075839A (en) * | 2009-11-20 | 2011-05-25 | 歌尔声学股份有限公司 | MEMS microphone chip and MEMS microphone using same |
| CN102075839B (en) * | 2009-11-20 | 2014-09-03 | 歌尔声学股份有限公司 | MEMS microphone chip and MEMS microphone using same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20091111 Effective date of abandoning: 20090110 |