CN202334881U - Micro-electromechanical systems (MEMS) microphone - Google Patents
Micro-electromechanical systems (MEMS) microphone Download PDFInfo
- Publication number
- CN202334881U CN202334881U CN201120489899XU CN201120489899U CN202334881U CN 202334881 U CN202334881 U CN 202334881U CN 201120489899X U CN201120489899X U CN 201120489899XU CN 201120489899 U CN201120489899 U CN 201120489899U CN 202334881 U CN202334881 U CN 202334881U
- Authority
- CN
- China
- Prior art keywords
- screen
- mems
- shell
- microphone
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001746 injection moulding Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract 2
- 238000001914 filtration Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Images
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a micro-electromechanical systems (MEMS) microphone, which comprises an outer encapsulation structure formed by a plastic shell and a circuit board baseboard. A MEMS chip and an application specific integrated circuit (ASIC) chip are arranged on the surface of the circuit board baseboard inside the outer encapsulation structure, the inner wall of an outer shell is provided with a shielding layer electrically connected with an earth terminal of the circuit board baseboard, and a sound inletting hole is arranged on the shell, and the inner wall of the shielding layer is provided with a filtering net covering the sound inletting hole; and the shielding layer and the plastic shell are molded by integrated injection molding. The MEMS microphone simplifies the assembling process of products and lowers producing costs on the premise of guaranteeing waterproof and dustproof.
Description
Technical field
The utility model relates to a kind of microphone, especially relates to a kind of MEMS microphone.
Background technology
Along with development of wireless communication devices; The mobile phone user is more and more; The user also improves for the requirement of speech quality thereupon; Especially at present the development of mobile multimedia technology, mobile call quality show important especially, and possessing good water proof and dust proof microphone designed is a key factor that directly influences speech quality.
Be illustrated in figure 1 as a kind of MEMS microphone of prior art; It comprises: circuit board 1 ', be covered in the loam cake 20 ' of circuit board 1 ', the cavity 12 ' that formed jointly by circuit board 1 ' and loam cake 20 ', be contained in the cavity 12 ' and place respectively and changing device 5 ' with control circuit 6 ' be covered in the waterproof material 11 ' on the loam cake 20 ' on the circuit board 1 ', wherein loam cake 20 ' is provided with sound hole 21 '.
The MEMS microphone of correlation technique relies on waterproof material 11 ' to carry out waterproof, though the MEMS microphone of this design has possessed the water proof and dust proof effect, assembling is trouble.
Therefore, be necessary to provide a kind of new microphone to overcome above-mentioned defective.
The utility model content
The utility model technical problem to be solved provides a kind of water proof and dust proof microphone designed that possesses, and assembling is simple, can reduce the production cost of MEMS microphone.
To achieve these goals, the utility model adopts following technical scheme:
A kind of MEMS microphone; Comprise the outer enclosure structure that forms by plastic casing and wiring board base plate; On the wiring board backplate surface of said encapsulating structure inside MEMS chip and asic chip are installed; The inwall of said shell is provided with the screen that the electrical interconnection plate is held chassis ground, and on said shell, also is provided with sound hole, and: the inwall of said screen is provided with the filter screen that covers said sound hole; Said screen and said plastic casing integrated injection molding.
As a kind of optimized technical scheme, said filter screen covers the top and the sidewall of said screen.
As a kind of optimized technical scheme, said screen is the copper product screen.
Compared with prior art, the utlity model has following advantage: under the prerequisite that guarantees water proof and dust proof, simplified the packaging technology of product, reduced production cost.
Description of drawings
Fig. 1 is the cross-sectional schematic of correlation technique MEMS microphone;
Fig. 2 is the cross-sectional schematic of the utility model MEMS microphone.
Embodiment
Specify the concrete structure of the utility model below in conjunction with accompanying drawing.
See also Fig. 2; The utility model MEMS microphone; Comprise that wiring board base plate 1 and plastic casing 2 form the outer enclosure structure, shell 2 is provided with sound hole 21, and MEMS chip 5 and asic chip 6 are installed on the surface of the inner wiring board base plate 1 of encapsulating structure; Set inside at shell 2 has screen 3; Screen 3 is electrically connected on the earth terminal of wiring board base plate 1, and the madial wall of screen 3 is provided with the filter screen 4 that covers sound hole 21, wherein screen 3 and plastic casing 2 integrated injection moldings.
This design in this implementation process through screen 3 is set, and is provided with filter screen 4 on the madial wall of screen 3 on plastic casing 2; And screen 3 is an integrated injection molding with plastic casing 2, when design, and can be in advance that filter screen 4 is fixing with screen 3; With screen 3 and plastic casing 2 integrated injection moldings, make product possess waterproof and dustproof design, then simultaneously because filter screen is arranged on the product by the way; Simplify the assembling of product, reduced production cost.
As a kind of optimized technical scheme, the screen of filter screen covering shell and sidewall.The top and the sidewall setting that filter screen are covered screen can be so that production technology be further simplified in the fixedly assembling of filter screen and screen.
As a kind of optimized technical scheme, screen is the copper product screen.Its effectiveness of the screen of copper product is better, better guarantees performance of products.
More than be merely the utility model case study on implementation, be not limited to the utility model,, all should include in the protection range of putting down in writing in claims as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed.
Claims (3)
1. MEMS microphone; Comprise the outer enclosure structure that forms by plastic casing and wiring board base plate; On the wiring board backplate surface of said encapsulating structure inside MEMS chip and asic chip are installed; The inwall of said shell is provided with the screen that the electrical interconnection plate is held chassis ground, and on said shell, also is provided with sound hole, it is characterized in that: the inwall of said screen is provided with the filter screen that covers said sound hole; Said screen and said plastic casing integrated injection molding.
2. MEMS microphone according to claim 1 is characterized in that:
Said filter screen covers the top and the sidewall of said screen.
3. MEMS microphone according to claim 1 is characterized in that:
Said screen is the copper product screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120489899XU CN202334881U (en) | 2011-11-30 | 2011-11-30 | Micro-electromechanical systems (MEMS) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120489899XU CN202334881U (en) | 2011-11-30 | 2011-11-30 | Micro-electromechanical systems (MEMS) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202334881U true CN202334881U (en) | 2012-07-11 |
Family
ID=46446843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120489899XU Expired - Lifetime CN202334881U (en) | 2011-11-30 | 2011-11-30 | Micro-electromechanical systems (MEMS) microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202334881U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103269462A (en) * | 2013-05-10 | 2013-08-28 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN103281665A (en) * | 2013-05-10 | 2013-09-04 | 歌尔声学股份有限公司 | Method for assembling non-metallic flexible net at sound holes of acoustic device |
| CN104113793A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Microphone encapsulation method |
| CN104113818A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Silicon substrate microphone encapsulation method |
| WO2014180140A1 (en) * | 2013-05-10 | 2014-11-13 | 歌尔声学股份有限公司 | Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module |
| CN107172549A (en) * | 2017-06-06 | 2017-09-15 | 广东欧珀移动通信有限公司 | Electroacoustic component and electronic equipment |
| US20170325012A1 (en) * | 2016-05-06 | 2017-11-09 | Infineon Technologies Ag | Device for detecting acoustic waves |
| CN109302652A (en) * | 2017-07-24 | 2019-02-01 | 法雷奥汽车内部控制（深圳）有限公司 | The microphone assembly with function of shielding for motor vehicles |
| CN111031460A (en) * | 2019-12-27 | 2020-04-17 | 歌尔微电子有限公司 | MEMS chip, preparation method and MEMS microphone comprising MEMS chip |
-
2011
- 2011-11-30 CN CN201120489899XU patent/CN202334881U/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103269462A (en) * | 2013-05-10 | 2013-08-28 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN103281665A (en) * | 2013-05-10 | 2013-09-04 | 歌尔声学股份有限公司 | Method for assembling non-metallic flexible net at sound holes of acoustic device |
| WO2014180140A1 (en) * | 2013-05-10 | 2014-11-13 | 歌尔声学股份有限公司 | Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module |
| CN103281665B (en) * | 2013-05-10 | 2016-01-06 | 歌尔声学股份有限公司 | The assembly method of acoustical device acoustic aperture place nonmetal flexible net |
| US10873802B2 (en) | 2013-05-10 | 2020-12-22 | Goertek Inc. | Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module |
| US9872099B2 (en) | 2013-05-10 | 2018-01-16 | Goertek Inc. | Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module |
| CN104113793A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Microphone encapsulation method |
| CN104113818A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Silicon substrate microphone encapsulation method |
| US20170325013A1 (en) * | 2016-05-06 | 2017-11-09 | Infineon Technologies Ag | Device for detecting acoustic waves |
| US20170325012A1 (en) * | 2016-05-06 | 2017-11-09 | Infineon Technologies Ag | Device for detecting acoustic waves |
| US10194226B2 (en) * | 2016-05-06 | 2019-01-29 | Infineon Technologies Ag | Device for detecting acoustic waves |
| US20190132661A1 (en) * | 2016-05-06 | 2019-05-02 | Infineon Technologies Ag | Device for detecting acoustic waves |
| US10880629B2 (en) * | 2016-05-06 | 2020-12-29 | Infineon Technologies Ag | Device for detecting acoustic waves |
| CN107172549A (en) * | 2017-06-06 | 2017-09-15 | 广东欧珀移动通信有限公司 | Electroacoustic component and electronic equipment |
| CN109302652A (en) * | 2017-07-24 | 2019-02-01 | 法雷奥汽车内部控制（深圳）有限公司 | The microphone assembly with function of shielding for motor vehicles |
| CN109302652B (en) * | 2017-07-24 | 2022-07-05 | 法雷奥汽车内部控制（深圳）有限公司 | Microphone assembly with shielding function for motor vehicle |
| US11582544B2 (en) | 2017-07-24 | 2023-02-14 | Valeo Comfort And Driving Assistance | Microphone assembly having shielding function for motor vehicle |
| CN111031460A (en) * | 2019-12-27 | 2020-04-17 | 歌尔微电子有限公司 | MEMS chip, preparation method and MEMS microphone comprising MEMS chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202334881U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN206100450U (en) | Packaging structure of MEMS microphone | |
| CN204425606U (en) | Loud speaker and mobile communication terminal | |
| CN203181149U (en) | Mobile terminal increasing size of sound cavity of loudspeaker | |
| CN202663538U (en) | Mems microphone | |
| CN201403200Y (en) | Silicon capacitance microphone | |
| CN101466060A (en) | Electret condenser microphone | |
| CN204559678U (en) | Compound 3D stereo mobile telephone speaker net and mobile phone | |
| CN204376891U (en) | Water proof type sound radio frequency module and electronic apparatus | |
| CN202059570U (en) | Silicon microphone | |
| CN206341409U (en) | Sounding monomer | |
| CN202103718U (en) | Mobile communication device | |
| CN201118978Y (en) | Electret microphone | |
| CN203590432U (en) | Loudspeaker module | |
| CN201054789Y (en) | Electrete microphone | |
| CN201781615U (en) | Electret microphone | |
| CN204559879U (en) | A kind of electret capacitor microphone | |
| CN201345731Y (en) | Electret capacitor microphone | |
| CN202059572U (en) | An electret capacitor microphone | |
| CN203039893U (en) | Loudspeaker | |
| CN202334883U (en) | MEMS (Micro-electromechanical System) microphone | |
| CN206302526U (en) | A kind of microphone module | |
| CN204697291U (en) | A kind of MEMS microphone | |
| CN204578775U (en) | A kind of MEMS microphone monomer | |
| CN201290163Y (en) | Integration system of minitype sound generator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200609 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120711 |
|
| CX01 | Expiry of patent term |