CN202334883U - MEMS (Micro-electromechanical System) microphone - Google Patents
MEMS (Micro-electromechanical System) microphone Download PDFInfo
- Publication number
- CN202334883U CN202334883U CN2011204899761U CN201120489976U CN202334883U CN 202334883 U CN202334883 U CN 202334883U CN 2011204899761 U CN2011204899761 U CN 2011204899761U CN 201120489976 U CN201120489976 U CN 201120489976U CN 202334883 U CN202334883 U CN 202334883U
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- 239000000428 dust Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 230000000994 depressogenic effect Effects 0.000 claims description 23
- 230000000630 rising effect Effects 0.000 claims description 8
- 235000019994 cava Nutrition 0.000 claims description 5
- 230000005236 sound signal Effects 0.000 claims description 4
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Abstract
The utility model discloses an MEMS (Micro-electromechanical System) microphone, which comprises an outer packaging structure composed of a circuit board and a shell, wherein an MEMS acoustoelectric chip and an ASIC (Application Specific Integrated Circuit) chip are arranged on the circuit board inside the packaging structure, the MEMS acoustoelectric chip, the ASIC chip and the circuit board are mutually and electrically connected through metal wires, a first acoustic hole for receiving external acoustical signals is formed the bottom of the shell, the bottom of the shell partially sinks inwards to form a sunk part, the first acoustical hole is formed in the sunk part, a dustproof plate is arranged at the bottom of the shell, a cavity is formed between the dustproof plate and the sunk part, the part, arranged corresponding to the sunk part, on the dustproof plate is provided with a second acoustical hole, the first acoustical hole and the second acoustical hole are arranged in a staggering manner, and the design in such a way is favorable for effectively preventing external dust from entering the interior of the microphone so as to play a dustproof role.
Description
Technical field
The utility model relates to a kind of acoustic-electric conversion equipment, relates in particular to a kind of MEMS microphone.
Background technology
Utilize the integrated MEMS microphone of MEMS (MEMS) technology to begin to be applied in the electronic products such as mobile phone, notebook computer in batches in recent years; The high-temperature resistant result of this MEMS microphone is better; Can withstand the high temperature test of SMT, therefore receive most of microphone manufacturer's favor.
MEMS microphone commonly used is normally formed an outer enclosure structure by a wiring board and shell; Externally on the PCB surface of encapsulating structure inside MEMS acoustic-electric chip and asic chip are installed; The bottom surface of shell is generally a plane; And being provided with the sound hole that receives the external sound signal in the bottom of shell, the MEMS microphone of this structure is because outer casing bottom is a planar design; It is inner to make extraneous molecule dust be easy to get into the MEMS microphone through the sound hole on the outer casing bottom plane, influences the properties of product of MEMS microphone.This just requires to design a kind of novel MEMS microphone.
The utility model content
In view of the above problems, the purpose of the utility model provides a kind of a kind of dustproof MEMS microphone that can prevent extraneous dust entering product inside.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of MEMS microphone comprises: by the outer enclosure structure that wiring board and shell are formed, on the inner said wiring board of said encapsulating structure MEMS acoustic-electric chip and asic chip are installed; Be electrically connected through metal wire between said MEMS acoustic-electric chip, asic chip and the wiring board; Said outer casing bottom is provided with first hole that receives the external sound signal, and wherein, said outer casing bottom part caves inward and is provided with depressed part; Said first hole is arranged on the said depressed part; Said outer casing bottom is provided with a dust excluding plate, forms a cavity between said dust excluding plate and the said depressed part, and the corresponding said dust excluding plate part that is provided with said depressed part is provided with rising tone hole.
As a kind of optimized technical scheme, said first hole on the said depressed part and the said rising tone hole on the said dust excluding plate are crisscross arranged.
As a kind of optimized technical scheme, the said metal wire that connects between said MEMS acoustic-electric chip, said asic chip and the said wiring board is a gold thread.
As a kind of optimized technical scheme, said MEMS microphone is square microphone.
As a kind of optimized technical scheme, said shell is a metal shell.
Utilize above-mentioned MEMS microphone according to the utility model; Because the outer casing bottom part caves inward and is provided with depressed part, first hole is arranged on the said depressed part, be provided with a dust excluding plate at outer casing bottom simultaneously; Make and form a cavity between dust excluding plate and the said depressed part; And on the corresponding said dust excluding plate part that is provided with, be provided with rising tone hole with said depressed part, it is inner to prevent effectively that extraneous dust from getting into microphone, plays the dustproof effect.
Description of drawings
Through with reference to below in conjunction with the explanation of accompanying drawing and the content of claims, and along with the more complete understanding to the utility model, other purpose of the utility model and result will understand more and reach easy to understand.In the accompanying drawings:
Fig. 1 is the profile of the utility model embodiment microphone.
Embodiment
Below will combine accompanying drawing that the specific embodiment of the utility model is described in detail.
Embodiment
Fig. 1 is the profile of the utility model embodiment microphone, and is as shown in Figure 1, a kind of MEMS microphone; Comprise: by the outer enclosure structure that wiring board 1 and shell 2 are formed, on the inner said wiring board 1 of said encapsulating structure MEMS acoustic-electric chip 3 and asic chip 4 are installed, between said MEMS acoustic-electric chip 3, asic chip 4 and the wiring board 1 through metal wire 5 electrical connections; Said shell 2 bottoms are provided with first hole 21 that receives the external sound signal; Wherein, part, said shell 2 bottom caves inward and is provided with depressed part 6, and said first hole 21 is arranged on the said depressed part 6; The bottom of position and shell that makes first hole 21 is not on same plane; Simultaneously be provided with a dust excluding plate 7, form a cavity between said dust excluding plate 7 and the said depressed part 6, be provided with rising tone hole 71 with the said depressed part 6 corresponding said dust excluding plate parts that are provided with in shell 2 bottoms; Make extraneous dust directly not get into MEMS microphone inside, play the dustproof effect through first hole 21.
As a kind of optimized technical scheme that realizes the utility model, said first hole 21 on the said depressed part 6 is crisscross arranged with the said rising tone hole 71 on the said dust excluding plate 7, and it is inner to prevent effectively that extraneous dust from getting into the MEMS microphone.
As a kind of optimized technical scheme that realizes the utility model, the said metal wire 5 that connects between said MEMS acoustic-electric chip 3, said asic chip 4 and the said wiring board 1 is gold thread, ductility and pliability better effects if.
As a kind of optimized technical scheme that realizes the utility model, said shell 2 is a metal shell, and the enclosure designs of metal structure is simple, can realize the batch process of automation.
Utilize above-mentioned MEMS microphone according to the utility model; Because the outer casing bottom part caves inward and is provided with depressed part; First hole is arranged on the said depressed part, makes first hole and outer casing bottom not at grade, be provided with a dust excluding plate at outer casing bottom simultaneously; Make and form a cavity between dust excluding plate and the said depressed part; And on the corresponding said dust excluding plate part that is provided with, being provided with the rising tone hole that is crisscross arranged with said first hole with said depressed part, it is inner that this design can prevent effectively that extraneous dust from getting into microphone, plays the dustproof effect.
In the above-described embodiments; Seeing that the suitable adjustment of MEMS acoustic-electric chip and asic chip is to the not influence of purport of the utility model; MEMS acoustic-electric chip in the pattern and asic chip only adopt simple pattern to represent; Above embodiment in order to explain the utility model, is not to be used to limit the utility model only, and said those skilled in the art should be understood that; Any modification of being made within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included in the protection range of the utility model.
Claims (5)
1. MEMS microphone; Comprise: the outer enclosure structure of forming by wiring board and shell; On the inner said wiring board of said encapsulating structure MEMS acoustic-electric chip and asic chip are installed; Be electrically connected through metal wire between said MEMS acoustic-electric chip, asic chip and the wiring board, said outer casing bottom is provided with first hole that receives the external sound signal, and it is characterized in that: said outer casing bottom part caves inward and is provided with depressed part; Said first hole is arranged on the said depressed part; Said outer casing bottom is provided with a dust excluding plate, forms a cavity between said dust excluding plate and the said depressed part, and the corresponding said dust excluding plate part that is provided with said depressed part is provided with rising tone hole.
2. MEMS microphone as claimed in claim 1 is characterized in that: said first hole on the said depressed part and the said rising tone hole on the said dust excluding plate are crisscross arranged.
3. MEMS microphone as claimed in claim 1 is characterized in that: the said metal wire that connects between said MEMS acoustic-electric chip, said asic chip and the said wiring board is a gold thread.
4. MEMS microphone as claimed in claim 1 is characterized in that: said MEMS microphone is square microphone.
5. MEMS microphone as claimed in claim 1 is characterized in that: said shell is a metal shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204899761U CN202334883U (en) | 2011-11-30 | 2011-11-30 | MEMS (Micro-electromechanical System) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204899761U CN202334883U (en) | 2011-11-30 | 2011-11-30 | MEMS (Micro-electromechanical System) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202334883U true CN202334883U (en) | 2012-07-11 |
Family
ID=46446845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204899761U Expired - Lifetime CN202334883U (en) | 2011-11-30 | 2011-11-30 | MEMS (Micro-electromechanical System) microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202334883U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790940A (en) * | 2012-07-25 | 2012-11-21 | 中山市天键电声有限公司 | Wind-proof microphone |
| CN106612485A (en) * | 2015-10-23 | 2017-05-03 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone and sound receiving device |
-
2011
- 2011-11-30 CN CN2011204899761U patent/CN202334883U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790940A (en) * | 2012-07-25 | 2012-11-21 | 中山市天键电声有限公司 | Wind-proof microphone |
| CN106612485A (en) * | 2015-10-23 | 2017-05-03 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone and sound receiving device |
| CN106612485B (en) * | 2015-10-23 | 2024-03-29 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone and radio device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120711 |