CN202425037U - MEMS (Micro Electronic Mechanical System) microphone - Google Patents
MEMS (Micro Electronic Mechanical System) microphone Download PDFInfo
- Publication number
- CN202425037U CN202425037U CN2012200141970U CN201220014197U CN202425037U CN 202425037 U CN202425037 U CN 202425037U CN 2012200141970 U CN2012200141970 U CN 2012200141970U CN 201220014197 U CN201220014197 U CN 201220014197U CN 202425037 U CN202425037 U CN 202425037U
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- chip
- wiring board
- mems
- encapsulating structure
- asic chip
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- Expired - Lifetime
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- 238000004377 microelectronic Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 abstract 4
- 230000005236 sound signal Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses an MEMS (Micro Electronic Mechanical System) microphone. The MEMS microphone comprises an encapsulation structure which consists of a circuit board and a shell; an MEMS acoustic-electric chip and an ASIC (Application Specific Integrated Circuit) chip are arranged on the surface of the circuit board inside the encapsulation structure; the MEMS acoustic-electric chip, the ASIC chip and the circuit board are in electrical connection with one another through metal wires; and the encapsulation structure is provided with sound holes which are used for receiving sound signals. Supporting parts are arranged between the ASIC chip and the circuit board; the supporting parts are provided with channels; the sound holes are formed in a position on the circuit board and opposite to the ASIC chip; and the inside and the outside of the encapsulation structure are communicated by the sound holes through the channels. With the adoption of the design, the effects that a diaphragm on the MEMS acoustic-electric chip is prevented from being impacted by airflow, and meanwhile, the probability of the increase of poor efficiency caused by that dust falls onto the diaphragm of the MEMS acoustic-electric chip is simultaneously prevented can be realized.
Description
Technical field
The utility model relates to a kind of acoustic-electric conversion equipment, relates in particular to a kind of MEMS microphone.
Background technology
Utilize the integrated MEMS microphone of MEMS (MEMS) technology to begin to be applied in the electronic products such as mobile phone, notebook computer in batches in recent years; The high-temperature resistant result of this MEMS microphone is better; Can withstand the high temperature test of SMT, therefore receive most of microphone manufacturer's favor.
As shown in Figure 1; Conventional MEMS microphone comprises the encapsulating structure of being made up of wiring board 1 and shell 2, and the inner said wiring board of said encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3 and asic chip 4, between said MEMS acoustic-electric chip 3, said asic chip 4 and the wiring board 1 through metal wire 5 electrical connections; Said encapsulating structure is provided with the sound hole 11 that receives voice signal; The position in sound hole 11 can be arranged on the shell 2, also can be arranged on the wiring board 1, usually for the height that reduces complete machine with 11 designs of sound hole in wiring board 1 position relative with MEMS acoustic-electric chip 3; Be convenient to directly corresponding setting with the terminated line plate; But the MEMS microphone of this form owing to receive the impact of air-flow that the diaphragm on the MEMS acoustic-electric chip is sustained damage, simultaneously since extraneous dust can drop on the diaphragm of MEMS acoustic-electric chip during through the sound hole; Increase causes bad probability because of dust gets into, and need design a kind of novel MEMS microphone thus.
The utility model content
In view of the above problems, the purpose of the utility model provides a kind of impact that can avoid diaphragm on the MEMS acoustic-electric chip to receive air-flow, can prevent that extraneous dust from falling on the diaphragm and influence a kind of MEMS microphone of properties of product simultaneously.
For addressing the above problem, the utility model adopts following technical scheme:
First kind of technical scheme as realization the utility model: a kind of MEMS microphone; Comprise: by the encapsulating structure that wiring board and shell are formed, the inner said PCB surface of said encapsulating structure is provided with MEMS acoustic-electric chip and asic chip, is electrically connected through metal wire between said MEMS acoustic-electric chip, said asic chip and the wiring board; Said encapsulating structure is provided with the sound hole that receives voice signal; Wherein, be provided with the support portion between said asic chip and the said wiring board, said support portion is provided with passage; Said sound hole is arranged on the wiring board position relative with said asic chip, and said sound hole is through inside and outside the said encapsulating structure of said channel connection.
As a kind of optimized technical scheme, said support portion is that the also brace table of fixed support asic chip is set at interval, and said passage is the space, interval between said each brace table.
As a kind of optimized technical scheme, said brace table is a scolding tin, and the quantity of said brace table is four, and said four brace tables evenly are provided with at interval.
As a kind of optimized technical scheme, said support portion is a support chip, and said support chip is provided with through hole, and said through hole is said passage, and said sound hole is communicated with inside and outside the said encapsulating structure through said through hole.
As a kind of optimized technical scheme, the protuberance that is provided with protruding upward in the middle of the said support chip, said asic chip is arranged on the said protuberance, and said through hole is arranged on the sidewall of said protuberance.
As a kind of optimized technical scheme, said support chip is a Copper Foil.
Second kind of technical scheme as realization the utility model: a kind of MEMS microphone; Comprise: the encapsulating structure of forming by wiring board and shell; The inner said PCB surface of said encapsulating structure is provided with MEMS acoustic-electric chip and asic chip; Be electrically connected through metal wire between said MEMS acoustic-electric chip, said asic chip and the wiring board; Said encapsulating structure is provided with the sound hole that receives voice signal, wherein, said sound hole be arranged on said MEMS acoustic-electric chip relative with asic chip wiring board part wiring board position in addition.
As a kind of optimized technical scheme, said sound hole is arranged on the said wiring board position near said shell edge.
The third technical scheme as realization the utility model: a kind of MEMS microphone; Comprise: the encapsulating structure of forming by wiring board and shell; The inner said PCB surface of said encapsulating structure is provided with MEMS acoustic-electric chip and asic chip; Be electrically connected through metal wire between said MEMS acoustic-electric chip, said asic chip and the wiring board, said encapsulating structure is provided with the sound hole that receives voice signal, wherein; Said sound hole is arranged on the wiring board position relative with said asic chip; Wiring board part local dent around the inner said sound of the said encapsulating structure hole is provided with groove, the said groove of the local covering of said asic chip, and said sound hole is communicated with inside and outside the said encapsulating structure through said groove.
As a kind of optimized technical scheme, said groove and said asic chip vertical direction are provided with.
Utilize above-mentioned MEMS microphone according to the utility model; Since will receive the sound hole of voice signal direct with the corresponding setting of MEMS acoustic-electric chip; On the basis that guarantees acoustic efficiency; Prevented to sustain damage because of the impact that receives air-flow causes the diaphragm on the MEMS acoustic-electric chip, having prevented simultaneously that extraneous dust from dropping on through the sound hole on the diaphragm of MEMS acoustic-electric chip increases bad probability.
Description of drawings
Through with reference to below in conjunction with the explanation of accompanying drawing and the content of claims, and along with the more complete understanding to the utility model, other purpose of the utility model and result will understand more and reach easy to understand.In the accompanying drawings:
Fig. 1 is the profile of MEMS microphone in the utility model background technology;
Fig. 2 is the profile of the utility model embodiment one MEMS microphone;
Fig. 3 is the branch layout situation of the utility model embodiment one brace table;
Fig. 4 is the profile of the MEMS microphone of the utility model embodiment one another kind of form;
Fig. 5 is the structural representation of strutting piece among Fig. 4;
Fig. 6 is the profile of the utility model embodiment two MEMS microphones;
Fig. 7 is the profile of the utility model embodiment three MEMS microphones;
Fig. 8 is asic chip and a groove sketch map in the circuit board among Fig. 7.
Identical label is indicated similar or corresponding feature or function in institute's drawings attached.
Embodiment
Below will combine accompanying drawing that the specific embodiment of the utility model is described in detail.
Embodiment one
Like Fig. 2, shown in Figure 3, a kind of MEMS microphone comprises: the encapsulating structure of being made up of wiring board 1 and shell 2; The inner said wiring board of said encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3 and asic chip 4; Be electrically connected through metal wire 5 between said MEMS acoustic-electric chip 3, said asic chip 4 and the wiring board 1, said encapsulating structure is provided with the sound hole 11 that receives voice signal, wherein; Be provided with the support portion between said asic chip 4 and the said wiring board 1; Said support portion is provided with passage, and said sound hole 11 is arranged on wiring board 1 position relative with said asic chip 4, and said sound hole 11 is through inside and outside the said encapsulating structure of said channel connection; Can prevent effectively that the diaphragm on the MEMS acoustic-electric chip 3 from receiving the impact of air-flow, prevent that simultaneously dust from falling on the diaphragm of MEMS acoustic-electric chip 3 and increase bad probability.
As realizing a kind of optimized technical scheme of the utility model, said support portion is that the also brace table 6 of fixed support asic chip 4 is set at interval, and said passage is the space, interval between said each brace table 6.
As realizing a kind of optimized technical scheme of the utility model, said brace table 6 is a scolding tin, and the quantity of said brace table 6 is four, and said four brace tables evenly are provided with at interval, and simplicity of design is convenient to realize.
Present embodiment is only in order to explain the utility model; Be not to be used to limit the utility model; Like Fig. 4, shown in Figure 5, said support portion also can be a support chip 7, and said support chip 7 is provided with through hole 71; Said through hole 71 is said passage; Said sound hole is communicated with inside and outside the said encapsulating structure through said through hole 71, adopts this kind design can realize also preventing that the diaphragm on the MEMS acoustic-electric chip from receiving the impact of air-flow, prevents that simultaneously dust from falling on the diaphragm of MEMS acoustic-electric chip and increase the effect of bad probability.
As realizing a kind of optimized technical scheme of the utility model; The protuberance 72 that is provided with protruding upward in the middle of the said support chip 7, said asic chip 4 is arranged on the said protuberance 72, and said through hole 71 is arranged on the sidewall of said protuberance 72; Simplicity of design is convenient to realize.
As realizing a kind of optimized technical scheme of the utility model, said support chip 7 is a Copper Foil.
Utilize above-mentioned MEMS microphone according to the utility model; Owing between said asic chip and said wiring board, be provided with the support portion; Said support portion is provided with passage, and said sound hole is arranged on the wiring board position relative with said asic chip, and said sound hole is through inside and outside the said encapsulating structure of said channel connection; Can prevent effectively that the diaphragm on the MEMS acoustic-electric chip from receiving the impact of air-flow, prevent that simultaneously dust from falling on the diaphragm of MEMS acoustic-electric chip and increase bad probability.
Embodiment two
As shown in Figure 6; A kind of MEMS microphone; Comprise: the encapsulating structure of forming by wiring board 1 and shell 2; The inner said wiring board of said encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3 and asic chip 4, is electrically connected through metal wire 5 between said MEMS acoustic-electric chip 3, said asic chip 4 and the wiring board 1, and said encapsulating structure is provided with the sound hole 11 that receives voice signal; Wherein, Said sound hole 11 be arranged on said MEMS acoustic-electric chip 3 and asic chip 4 relative the wiring board part beyond wiring board 1 position, can prevent effectively that the diaphragm on the MEMS acoustic-electric chip 3 from receiving the impact of air-flow, prevent that simultaneously dust from falling on the diaphragm of MEMS acoustic-electric chip 3 and increase bad probability.
As realizing a kind of optimized technical scheme of the utility model, said sound hole 11 is arranged on said wiring board 1 position near said shell 2 edges, and simplicity of design is convenient to realize.
Utilize above-mentioned MEMS microphone according to the utility model; Since with the sound hole be arranged on said MEMS acoustic-electric chip relative with asic chip wiring board part wiring board position in addition; On the basis that guarantees acoustic efficiency; Prevented to sustain damage because of the impact that receives air-flow causes the diaphragm on the MEMS acoustic-electric chip, having prevented simultaneously that extraneous dust from dropping on through the sound hole on the diaphragm of MEMS acoustic-electric chip increases bad probability.
Embodiment three
Like Fig. 7, shown in Figure 8; A kind of MEMS microphone comprises: by the encapsulating structure that wiring board 1 and shell 2 are formed, the inner said wiring board of said encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3 and asic chip 4; Be electrically connected through metal wire 5 between said MEMS acoustic-electric chip 3, said asic chip 4 and the wiring board 1; Said encapsulating structure is provided with the sound hole 11 that receives voice signal, and wherein, said sound hole 11 is arranged on wiring board 1 position relative with said asic chip 4; Wiring board part local dent around the inner said sound of the said encapsulating structure hole 11 is provided with groove 12; The said groove 12 of said asic chip 4 local coverings, said sound hole 11 is communicated with inside and outside the said encapsulating structure through said groove 12, has prevented to sustain damage because of the impact that receives air-flow causes the diaphragm on the MEMS acoustic-electric chip.
As a kind of optimized technical scheme of realization the utility model, said groove 12 and said asic chip 4 vertical direction settings, simplicity of design is convenient to realize.
Utilize above-mentioned MEMS microphone according to the utility model; Because the sound hole is arranged on the wiring board position relative with said asic chip; And the wiring board part local dent around the inner said sound of encapsulating structure hole is provided with groove; The said groove of the local covering of said asic chip, said sound hole is communicated with inside and outside the said encapsulating structure through said groove, has prevented to sustain damage because of the impact that receives air-flow causes the diaphragm on the MEMS acoustic-electric chip.
Above embodiment; Since will receive the sound hole of voice signal direct with the corresponding setting of MEMS acoustic-electric chip; On the basis that guarantees acoustic efficiency; Prevented to sustain damage because of the impact that receives air-flow causes the diaphragm on the MEMS acoustic-electric chip, having prevented simultaneously that extraneous dust from dropping on through the sound hole on the diaphragm of MEMS acoustic-electric chip increases bad probability.
The foregoing description does not influence in view of the suitable adjustment of MEMS acoustic-electric chip and the asic chip purport to the utility model; MEMS acoustic-electric chip in the pattern and asic chip only adopt simple pattern to represent; Above embodiment is only in order to explain the utility model; Be not to be used to limit the utility model; Said those skilled in the art should be understood that any modification of being made within all spirit and principles at the utility model, are equal to replacement and improvement etc., all should be included in the protection range of the utility model.
Claims (10)
1. MEMS microphone; Comprise: the encapsulating structure of forming by wiring board and shell; The inner said PCB surface of said encapsulating structure is provided with MEMS acoustic-electric chip and asic chip, is electrically connected through metal wire between said MEMS acoustic-electric chip, said asic chip and the wiring board, and said encapsulating structure is provided with the sound hole that receives voice signal; It is characterized in that: be provided with the support portion between said asic chip and the said wiring board; Said support portion is provided with passage, and said sound hole is arranged on the wiring board position relative with said asic chip, and said sound hole is through inside and outside the said encapsulating structure of said channel connection.
2. MEMS microphone as claimed in claim 1 is characterized in that: said support portion is for be provided with the also brace table of fixed support asic chip at interval, and said passage is the space, interval between said each brace table.
3. MEMS microphone as claimed in claim 2 is characterized in that: said brace table is a scolding tin, and the quantity of said brace table is four, and said four brace tables evenly are provided with at interval.
4. MEMS microphone as claimed in claim 1 is characterized in that: said support portion is a support chip, and said support chip is provided with through hole, and said through hole is said passage, and said sound hole is communicated with inside and outside the said encapsulating structure through said through hole.
5. MEMS microphone as claimed in claim 4 is characterized in that: the protuberance that is provided with protruding upward in the middle of the said support chip, and said asic chip is arranged on the said protuberance, and said through hole is arranged on the sidewall of said protuberance.
6. MEMS microphone as claimed in claim 5 is characterized in that: said support chip is a Copper Foil.
7. MEMS microphone; Comprise: the encapsulating structure of forming by wiring board and shell; The inner said PCB surface of said encapsulating structure is provided with MEMS acoustic-electric chip and asic chip; Be electrically connected through metal wire between said MEMS acoustic-electric chip, said asic chip and the wiring board, said encapsulating structure is provided with the sound hole that receives voice signal, it is characterized in that: said sound hole be arranged on said MEMS acoustic-electric chip relative with asic chip wiring board part wiring board position in addition.
8. MEMS microphone as claimed in claim 7 is characterized in that: said sound hole is arranged on the said wiring board position near said shell edge.
9. MEMS microphone; Comprise: the encapsulating structure of forming by wiring board and shell; The inner said PCB surface of said encapsulating structure is provided with MEMS acoustic-electric chip and asic chip, is electrically connected through metal wire between said MEMS acoustic-electric chip, said asic chip and the wiring board, and said encapsulating structure is provided with the sound hole that receives voice signal; It is characterized in that: said sound hole is arranged on the wiring board position relative with said asic chip; Wiring board part local dent around the inner said sound of the said encapsulating structure hole is provided with groove, the said groove of the local covering of said asic chip, and said sound hole is communicated with inside and outside the said encapsulating structure through said groove.
10. MEMS microphone as claimed in claim 9 is characterized in that: said groove and said asic chip vertical direction are provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200141970U CN202425037U (en) | 2012-01-13 | 2012-01-13 | MEMS (Micro Electronic Mechanical System) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200141970U CN202425037U (en) | 2012-01-13 | 2012-01-13 | MEMS (Micro Electronic Mechanical System) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425037U true CN202425037U (en) | 2012-09-05 |
Family
ID=46749756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200141970U Expired - Lifetime CN202425037U (en) | 2012-01-13 | 2012-01-13 | MEMS (Micro Electronic Mechanical System) microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425037U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104760924A (en) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | MEMS microphone chip and package structure and manufacture method thereof |
| CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
| CN108946652A (en) * | 2017-05-18 | 2018-12-07 | 日月光半导体制造股份有限公司 | Semiconductor packages and the method for manufacturing it |
| CN110574395A (en) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | MEMS microphone |
-
2012
- 2012-01-13 CN CN2012200141970U patent/CN202425037U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104760924A (en) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | MEMS microphone chip and package structure and manufacture method thereof |
| CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
| CN104760924B (en) * | 2015-04-20 | 2017-06-06 | 歌尔股份有限公司 | A kind of MEMS microphone chip and its encapsulating structure |
| CN110574395A (en) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | MEMS microphone |
| CN110574395B (en) * | 2017-05-05 | 2020-11-13 | 潍坊歌尔微电子有限公司 | MEMS microphone |
| US11109162B2 (en) | 2017-05-05 | 2021-08-31 | Goertek Inc. | MEMS microphone |
| CN108946652A (en) * | 2017-05-18 | 2018-12-07 | 日月光半导体制造股份有限公司 | Semiconductor packages and the method for manufacturing it |
| CN108946652B (en) * | 2017-05-18 | 2023-12-15 | 日月光半导体制造股份有限公司 | Semiconductor device package and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
| CX01 | Expiry of patent term |