CN204578775U - A kind of MEMS microphone monomer - Google Patents
A kind of MEMS microphone monomer Download PDFInfo
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- CN204578775U CN204578775U CN201520146014.4U CN201520146014U CN204578775U CN 204578775 U CN204578775 U CN 204578775U CN 201520146014 U CN201520146014 U CN 201520146014U CN 204578775 U CN204578775 U CN 204578775U
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Abstract
The utility model relates to a kind of microphone package technical field, particularly relates to a kind of MEMS (Micro-Electro-Mechanical System MEMS (micro electro mechanical system)) microphone monomer.Wherein, comprise the enclosing cover that has acoustics through hole, the inner side of enclosing cover is connected with a plurality of hard contact by a seal; One substrate and enclosing cover form acoustics cavity, wherein, comprise a MEMS transducer in acoustics cavity, an ASIC sheet.The utility model has the advantages that: ASIC sheet, MEMS transducer are fixedly installed in the acoustics cavity that substrate and enclosing cover form respectively by the hard contact be arranged on seal, the seal cavity that MEMS transducer is formed in acoustics cavity forms acoustical back chamber, and then the acoustical back chamber of MEMS transducer does not limit by the cavity of MEMS transducer, considerably increase the back of the body chamber of MEMS transducer, improve the signal to noise ratio that microphone gathers.
Description
Technical field
The utility model relates to a kind of microphone package technical field, particularly relates to a kind of MEMS (Micro-Electro-Mechanical System MEMS (micro electro mechanical system)) microphone monomer.
Background technology
Along with the progress of society and the development of technology, in recent years, along with the electronic product such as mobile phone, notebook computer volume constantly reduces, the performance requirement of people to these portable electronic products is also more and more higher, thus also require that the volume of electronic component supporting with it constantly reduces, performance and consistency improve constantly.Under this background, microphone products field as one of the strength member of above-mentioned portable electronic products is also proposed a lot of novel products, and the MEMS microphone (also referred to as silicon microphone) that wherein batch realizes to utilize semiconductor fabrication process technology is for representative products.
Existing common MEMS microphone generally includes following parts: the acoustics through hole on terminal block, shell, shell, MEMS transducer, ASIC (ApplicationSpecificIntegratedCircuits, application-specific integrated circuit (ASIC)) sheet.MEMS transducer is bonded on terminal block, form the back of the body chamber of MEMS, ASIC is bonded on terminal block, ASIC sheet is connected with terminal block by gold thread, shell is bonded on PCB (PrintedCircuitBoard, printed circuit board (PCB)), makes enclosure form annular seal space.
Because the back of the body chamber of MEMS is formed by MEMS transducer, and the shape of MEMS transducer, size are by MIC limitation in height, so the cavity size of MEMS is restricted.Thus reduce the signal to noise ratio of microphone image data and reduce the integrated level of mobile terminal.
Utility model content
Utility model people of the present utility model finds to have problems in above-mentioned prior art, and therefore proposes a kind of new technical scheme at least one problem in described problem.
An object of the present utility model is to provide a kind of technical scheme of carrying on the back chamber for increasing microphone MEMS.
A kind of MEMS microphone monomer, wherein, comprises
One enclosing cover with acoustics through hole, the inner side of described enclosing cover is connected with a plurality of hard contact by a seal;
One substrate and described enclosing cover form acoustics cavity, wherein, comprise in described acoustics cavity
One MEMS transducer, is arranged at the inner side of described acoustics through hole;
One ASIC sheet, is arranged at the inner side of described enclosing cover, is connected by bonding wire with described MEMS transducer, and the signal output part of described ASIC sheet connects described hard contact, and is electrically connected with the external pads of described microphone monomer by described hard contact extraction.
Above-mentioned MEMS microphone monomer, wherein, the vibrating membrane of described MEMS transducer aims at described acoustics through hole, and the seal cavity that described vibrating membrane is formed in described acoustics cavity forms described acoustical back chamber.
Above-mentioned MEMS microphone monomer, wherein, described hard contact is that notch cuttype is arranged on described seal.
Above-mentioned MEMS microphone monomer, wherein, described enclosing cover is made up of copper product.
Above-mentioned MEMS microphone monomer, wherein, described seal is formed in the medial surface Shooting Technique of described enclosing cover, and described hard contact is formed on described seal.
Above-mentioned MEMS microphone monomer, wherein, described hard contact is formed by metal clips.
Above-mentioned MEMS microphone monomer, wherein, a plurality of described hard contact mates the output of described MEMS transducer, described ASIC sheet.
Compared with prior art, the utility model has the advantages that:
(1) ASIC sheet, MEMS transducer are fixedly installed in the acoustics cavity that substrate and enclosing cover form respectively by the hard contact be arranged on seal, the seal cavity that described MEMS transducer is formed in described acoustics cavity forms described acoustical back chamber, and then the acoustical back chamber of MEMS transducer does not limit by the cavity of MEMS transducer, considerably increase the back of the body chamber of MEMS transducer, improve the signal to noise ratio that microphone gathers.
(2) vibrating membrane of MEMS transducer aims at described acoustics through hole, greatly increases the sound collection ability of MEMS microphone.
Accompanying drawing explanation
Fig. 1 is the structural upright schematic diagram of enclosing cover in MEMS monomer of the present utility model;
Fig. 2 is the vertical view of enclosing cover in MEMS monomer of the present utility model;
Fig. 3 is the profile of MEMS microphone structure of the present utility model; Wherein 1-acoustics through hole, 2-enclosing cover, 3-seal, 4-hard contact, 5-substrate, 6-ASIC sheet, 7-MEMS transducer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as restriction of the present utility model.
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of the utility model protection.
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as restriction of the present utility model.
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of MEMS microphone monomer, wherein, comprising:
One enclosing cover 2 with acoustics through hole, the inner side of described enclosing cover 2 is connected with a plurality of hard contact 4 by a seal 3;
One substrate 5 forms acoustics cavity with described enclosing cover 2, wherein, comprises in described acoustics cavity
One MEMS transducer 7, is arranged at the inner side of described acoustics through hole 1;
One ASIC sheet 6, be arranged at the inner side of described enclosing cover 2, be connected by bonding wire with described MEMS transducer 7, the signal output part of described ASIC sheet 6 connects described hard contact 4, and is electrically connected with the external pads of described microphone monomer by described hard contact 4 extraction.
The operation principle of above-described embodiment is: to be fixedly installed in acoustics cavity that substrate 5 and enclosing cover 2 form by ASIC sheet 6, MEMS transducer 7 with the hard contact 4 on seal 3 respectively by arranging, the seal cavity that described MEMS transducer 7 is formed in described acoustics cavity forms described acoustical back chamber, and then the acoustical back chamber of MEMS transducer 7 does not limit by the cavity of MEMS transducer 7, considerably increase the back of the body chamber of MEMS transducer 7, improve the signal to noise ratio that microphone gathers.
As further preferred embodiment, above-mentioned MEMS microphone monomer, wherein, the vibrating membrane of described MEMS transducer 7 aims at described acoustics through hole, and the seal cavity that described vibrating membrane is formed in described acoustics cavity forms described acoustical back chamber.The vibrating membrane of described MEMS transducer 7 aims at described acoustics through hole 1, adds the sensitivity of MIC, substantially increases the sound collection ability of MEMS microphone.
As further preferred embodiment, above-mentioned MEMS microphone monomer, wherein, described hard contact 4 is arranged on described seal 3 in notch cuttype.The hard contact 4 of arranged in step shape connects described ASIC sheet 6, MEMS transducer 7 and substrate 5 respectively, is convenient to installation and the sealing of microphone monomer.
As further preferred embodiment, above-mentioned MEMS microphone monomer, wherein, described enclosing cover 2 is made up of copper product.
As further preferred embodiment, above-mentioned MEMS microphone monomer, wherein, described seal 3 is formed in the medial surface Shooting Technique of described enclosing cover 2, and described hard contact is formed on described seal 3.Shooting Technique described in the application can be conventional Shooting Technique, and conventional Shooting Technique can realize the technical purpose of the application, and the claimed technical scheme of the application is microphone monomer body, therefore repeats no more Shooting Technique the application.
As further preferred embodiment, above-mentioned MEMS microphone monomer, wherein, described hard contact 4 is formed by metal clips.
As further preferred embodiment, above-mentioned MEMS microphone monomer, a plurality of described hard contact 4 mates the output of described MEMS transducer 7, described ASIC sheet 6.
The foregoing is only the utility model preferred embodiment; not thereby execution mode of the present utility model and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilization the utility model specifications and diagramatic content and apparent change obtain in protection range of the present utility model.
Claims (7)
1. a MEMS microphone monomer, is characterized in that, comprises
One enclosing cover with acoustics through hole, the inner side of described enclosing cover is connected with a plurality of hard contact by a seal;
One substrate and described enclosing cover form acoustics cavity, wherein, comprise in described acoustics cavity
One MEMS transducer, is arranged at the inner side of described acoustics through hole;
One ASIC sheet, be arranged at the inner side of described enclosing cover, be connected by described hard contact bonding wire with described MEMS transducer, the signal output part of described ASIC sheet connects described hard contact, and is electrically connected with the external pads of described microphone monomer after being drawn by described hard contact.
2. MEMS microphone monomer according to claim 1, is characterized in that, the vibrating membrane of described MEMS transducer aims at described acoustics through hole, and the seal cavity that described vibrating membrane is formed in described acoustics cavity forms described acoustical back chamber.
3. MEMS microphone monomer according to claim 1, is characterized in that, described hard contact is that notch cuttype is arranged on described seal.
4. MEMS microphone monomer according to claim 1, is characterized in that, described enclosing cover is made up of copper product.
5. MEMS microphone monomer according to claim 1, is characterized in that, described seal is formed in the medial surface Shooting Technique of described enclosing cover, and described hard contact is formed on described seal.
6. MEMS microphone monomer according to claim 1, is characterized in that, described hard contact is formed by metal clips.
7. microphone monomer according to claim 1, is characterized in that, a plurality of described hard contact mates the output of described MEMS transducer, described ASIC sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520146014.4U CN204578775U (en) | 2015-03-13 | 2015-03-13 | A kind of MEMS microphone monomer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520146014.4U CN204578775U (en) | 2015-03-13 | 2015-03-13 | A kind of MEMS microphone monomer |
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| Publication Number | Publication Date |
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| CN204578775U true CN204578775U (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520146014.4U Active CN204578775U (en) | 2015-03-13 | 2015-03-13 | A kind of MEMS microphone monomer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754481A (en) * | 2015-03-13 | 2015-07-01 | 钰太芯微电子科技（上海）有限公司 | MEMS (Micro-Electro-Mechanical system) microphone monomer |
-
2015
- 2015-03-13 CN CN201520146014.4U patent/CN204578775U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754481A (en) * | 2015-03-13 | 2015-07-01 | 钰太芯微电子科技（上海）有限公司 | MEMS (Micro-Electro-Mechanical system) microphone monomer |
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