CN204518088U - A kind of encapsulating structure of MEMS microphone - Google Patents
A kind of encapsulating structure of MEMS microphone Download PDFInfo
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- CN204518088U CN204518088U CN201520240368.5U CN201520240368U CN204518088U CN 204518088 U CN204518088 U CN 204518088U CN 201520240368 U CN201520240368 U CN 201520240368U CN 204518088 U CN204518088 U CN 204518088U
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- Prior art keywords
- transducer
- circuit board
- encapsulating structure
- amplifier
- utility
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 6
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 241000218202 Coptis Species 0.000 description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a kind of encapsulating structure of MEMS microphone, comprise the transducer be arranged in enclosure space, amplifier, be provided with groove on circuit boards, transducer is connected in the groove of circuit board by planting tin ball bonding, and amplifier connects on circuit boards by planting tin ball bonding; Transducer, amplifier are electrically connected by the Butut in circuit board; Also sealing is provided with between transducer and circuit board; On circuit board, the position of corresponding transducer is provided with sound mouth.Encapsulating structure of the present utility model, transducer, amplifier all weld in the circuit board by the mode of planting tin ball, reduce the height of encapsulating structure, and what encapsulating structure can be done is thinner, to meet the lightening development of product; Transducer is seated in the groove of circuit board, reduce further the height of encapsulating structure, and uses the lower COB glue of circulation can realize good operatic tunes sealing effectiveness; The production technology of the utility model encapsulating structure is simple, and process efficiency is high, and production cost is low.
Description
Technical field
The utility model relates to a kind of microphone, belongs to acoustic-electric conversion art, more specifically, relates to a kind of encapsulating structure of MEMS microphone.
Background technology
MEMS (Micro Electro Mechanical System) microphone is the microphone manufactured based on MEMS technology, vibrating diaphragm wherein, back pole plate are the vitals in MEMS microphone, vibrating diaphragm, back pole plate constitute capacitor and on silicon integrated, realize the conversion of acoustic-electric.
In recent years, along with the development of science and technology, the volume of the electronic product such as mobile phone, notebook computer is in continuous reduction, and the performance requirement of people to these portable electronic products is also more and more higher, and this just requires that the volume of electronic component supporting with it also must along with reduction.
Existing MEMS microphone, comprise the encapsulating structure surrounded by circuit board, shell, and be arranged in MEMS chip, the asic chip of this encapsulating structure, wherein, MEMS chip and asic chip are all fixing on circuit boards, be electrically connected by gold thread between MEMS chip and asic chip, be electrically connected by gold thread between asic chip and circuit board.Such connected mode, not only adds production process, nor is beneficial to the miniaturization of MEMS microphone.
Utility model content
An object of the present utility model is to provide a kind of new solution of encapsulating structure of MEMS microphone.
According to first aspect of the present utility model, provide a kind of encapsulating structure of MEMS microphone, comprise circuit board, lid, and the enclosure space to be surrounded by circuit board and lid, also comprise the transducer be arranged in enclosure space, amplifier, described circuit board is provided with groove, and described transducer is connected in the groove of circuit board by planting tin ball bonding, and described amplifier connects on circuit boards by planting tin ball bonding; Described transducer, amplifier are electrically connected by the Butut in circuit board; Also sealing is provided with between described transducer and circuit board; On described circuit board, the position of corresponding transducer is provided with sound mouth.
Preferably, described sealing is arranged on the outer ledge of transducer.
Preferably, COB glue is sealed into described in.
Preferably, described transducer comprises support portion, and arranges backplane, the vibrating diaphragm of upper end, support portion, and the electrode of transducer is arranged on the upper end of support portion.
Preferably, described transducer is upside down welded in the groove of circuit board, and the pad of described transducer and circuit board is positioned at the electrode position of upper end, support portion.
Preferably, the inside of described support portion is provided with the plated-through hole of its lower end through and upper end electrode, and the pad of described transducer and circuit board is positioned at the lower end position of support portion plated-through hole.
Preferably, on described transducer, the side relative with tin ball position is provided with rubber cushion.
Encapsulating structure of the present utility model, transducer, amplifier all weld in the circuit board by the mode of planting tin ball, make transducer, amplifier is electrically connected by circuit board; Such syndeton, no longer need to adopt gold thread to connect, can reduce the height of whole encapsulating structure, what encapsulating structure can be done is thinner, to meet the lightening development of product; Transducer is seated in the groove of circuit board, reduce further the height of encapsulating structure, and uses the lower COB glue of circulation can realize good operatic tunes sealing effectiveness.Encapsulating structure of the present utility model, its production technology is simple, and process efficiency is high, and production cost is low.
Inventor of the present utility model finds, in the prior art, transducer, amplifier adopt the mode of gold thread to connect, and not only technique is comparatively complicated, but also have impact on the lightening development of whole encapsulating structure.Therefore, the technical assignment that the utility model will realize or technical problem to be solved are that those skilled in the art never expect or do not anticipate, therefore the utility model is a kind of new technical scheme.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
In the description combined and the accompanying drawing forming a part for specification shows embodiment of the present utility model, and illustrate that one is used from and explains principle of the present utility model together with it.
Fig. 1 is the profile of the utility model encapsulating structure.
Fig. 2 is the profile of the another kind of encapsulating structure of the utility model.
Fig. 3 is the structural representation of transducer in Fig. 2.
Fig. 4 is the upward view of transducer of the present invention.
Embodiment
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, described technology, method and apparatus should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
With reference to figure 1, the utility model discloses a kind of encapsulating structure of MEMS microphone, comprise circuit board 1, lid 2, and the enclosure space to be surrounded by circuit board 1 and lid 2, wherein, this lid 2 also can be in tabular, now, also needing to arrange side wall portion supports on the circuit card 1 by lid 2, the common outer enclosure forming microphone.
Encapsulating structure of the present utility model, also comprise the transducer 3 be arranged in enclosure space, amplifier 4, transducer 3 is transducer part voice signal being converted into the signal of telecommunication, and it can be MEMS chip, and this MEMS chip utilizes MEMS (MEMS (micro electro mechanical system)) technique to make.Amplifier 4 can be asic chip, and the signal of telecommunication be mainly used to transducer 3 exports amplifies, so that subsequent treatment.Wherein, the corresponding position of described circuit board 1 is provided with groove 8, and described transducer 3 is welded in this groove 8 by planting tin ball 5, and described amplifier 4 welds on the circuit card 1 by planting tin ball 5; That is, transducer 3, amplifier 4 respectively directly and circuit board 1 be electrically connected, by Butut on the circuit card 1, the Butut arrival amplifier 4 of the signal of telecommunication that transducer 3 is exported on circuit board 1.Certainly, encapsulating structure of the present utility model, on described circuit board 1, the position of corresponding transducer 3 is provided with sound mouth 10, for the inflow of sound.
Particularly, with reference to figure 3, described transducer 3 comprises support portion 31, and arranges the backplane, vibrating diaphragm 32 etc. of upper end, support portion 31, and support portion 31 can be silicon chip, and the electrode of described transducer 3 is arranged on the upper end of support portion 31.Said structure belongs to the common practise of those skilled in the art, no longer illustrates at this.
In the execution mode that the utility model one is concrete, because electrode is arranged on the upper end of support portion 31, so when welding, need transducer 3 to be inverted, the electrode making transducer 3 down, is welded in the groove 8 of circuit board 1.That is, the pad between described transducer 3 and circuit board 1 is positioned at the electrode position of upper end, support portion 31, with reference to figure 1.
In another execution mode of the utility model, the inside of described support portion 31 is provided with the plated-through hole 30 of its lower end through and upper end electrode, pad between described transducer 3 and circuit board 1 is positioned at the lower end position of support portion 31 plated-through hole 30, with reference to figure 2.After welding is good, the signal that transducer 3 exports is connected in circuit board 1 through plated-through hole 30, and is electrically connected with amplifier 4.
Wherein, in order to seal the operatic tunes, between described transducer 3 and circuit board 1, be also provided with sealing 7, in order to the convenience of technique, sealing 7 is arranged on the outer ledge of transducer 3.Such as adopt COB glue to seal, ensure that the hermetic seal of the operatic tunes.
In view of the design feature of transducer 3, amplifier 4, its electrode is often arranged on wherein side, with reference to figure 4, the position of the welding position on transducer 3 i.e. tin ball 5 is positioned at the side of transducer 3, in order to ensure the high balance of transducer 3 and/or amplifier 4 both sides, side relative with electrode or tin ball on described transducer 3, amplifier 4 is provided with rubber cushion 6.This rubber cushion 6 can be the top being bonded in transducer 3 in advance, also can be the upper end being bonded in circuit board 1 in advance.Described rubber cushion 6 can be strip, by padded for this side entirety of transducer 3, make transducer 3, amplifier 4 can and circuit board 1 between keep high balance, to prevent transducer 3, amplifier 4 run-off the straight; Meanwhile, this rubber cushion 6 can also cushion transducer 3, amplifier 4, causes damage when preventing from falling to transducer 3, amplifier 4.
Encapsulating structure of the present utility model, transducer, amplifier all weld in the circuit board by the mode of planting tin ball, make transducer, amplifier is electrically connected by circuit board; Such syndeton, no longer need to adopt gold thread to connect, can reduce the height of whole encapsulating structure, what encapsulating structure can be done is thinner, to meet the lightening development of product; Transducer is seated in the groove of circuit board, reduce further the height of encapsulating structure, and uses the lower COB glue of circulation can realize good operatic tunes sealing effectiveness.Encapsulating structure of the present utility model, its production technology is simple, and process efficiency is high, and production cost is low.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (7)
1. the encapsulating structure of a MEMS microphone, it is characterized in that: comprise circuit board (1), lid (2), and the enclosure space to be surrounded by circuit board (1) and lid (2), also comprise the transducer (3) be arranged in enclosure space, amplifier (4), described circuit board (1) is provided with groove (8), described transducer (3) is welded in the groove (8) of circuit board (1) by planting tin ball (5), and described amplifier (4) is welded on circuit board (1) by planting tin ball (5); Described transducer (3), amplifier (4) are electrically connected by the Butut in circuit board (1); Also be provided with between described transducer (3) and circuit board (1) and seal (7); The position of the upper corresponding transducer (3) of described circuit board (1) is provided with sound mouth (10).
2. encapsulating structure according to claim 1, is characterized in that: described sealing (7) is arranged on the outer ledge of transducer (3).
3. encapsulating structure according to claim 1 and 2, is characterized in that: described sealing (7) is COB glue.
4. encapsulating structure according to claim 1, it is characterized in that: described transducer (3) comprises support portion (31), and backplane, the vibrating diaphragm (32) of support portion (31) upper end are set, the electrode of transducer (3) is arranged on the upper end of support portion (31).
5. encapsulating structure according to claim 4, it is characterized in that: described transducer (3) is upside down welded in the groove (8) of circuit board (1), described transducer (3) is positioned at the electrode position of support portion (31) upper end with the pad of circuit board (1).
6. encapsulating structure according to claim 4, it is characterized in that: the inside of described support portion (31) is provided with the plated-through hole (30) of its lower end through and upper end electrode, described transducer (3) is positioned at the lower end position of support portion (31) plated-through hole (30) with the pad of circuit board (1).
7. encapsulating structure according to claim 1, is characterized in that: the upper side relative with tin ball (5) position of described transducer (3) is provided with rubber cushion (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520240368.5U CN204518088U (en) | 2015-04-20 | 2015-04-20 | A kind of encapsulating structure of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520240368.5U CN204518088U (en) | 2015-04-20 | 2015-04-20 | A kind of encapsulating structure of MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204518088U true CN204518088U (en) | 2015-07-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520240368.5U Active CN204518088U (en) | 2015-04-20 | 2015-04-20 | A kind of encapsulating structure of MEMS microphone |
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| Country | Link |
|---|---|
| CN (1) | CN204518088U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611720A (en) * | 2016-03-14 | 2016-05-25 | 江苏普诺威电子股份有限公司 | PCB acoustic cavity structure and processing method thereof |
| CN112333618A (en) * | 2020-10-27 | 2021-02-05 | 歌尔微电子有限公司 | Bone voiceprint sensor module and electronic equipment |
-
2015
- 2015-04-20 CN CN201520240368.5U patent/CN204518088U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611720A (en) * | 2016-03-14 | 2016-05-25 | 江苏普诺威电子股份有限公司 | PCB acoustic cavity structure and processing method thereof |
| CN112333618A (en) * | 2020-10-27 | 2021-02-05 | 歌尔微电子有限公司 | Bone voiceprint sensor module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |