CN203225886U - Mems microphone - Google Patents
Mems microphone Download PDFInfo
- Publication number
- CN203225886U CN203225886U CN 201320173450 CN201320173450U CN203225886U CN 203225886 U CN203225886 U CN 203225886U CN 201320173450 CN201320173450 CN 201320173450 CN 201320173450 U CN201320173450 U CN 201320173450U CN 203225886 U CN203225886 U CN 203225886U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- sound hole
- operatic tunes
- electric chip
- mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011148 porous material Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 20
- 230000001012 protector Effects 0.000 abstract 6
- 230000001755 vocal effect Effects 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 230000003139 buffering effect Effects 0.000 description 11
- 230000000295 complement effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008447 perception Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a MEMS microphone including a packaging structure formed by a circuit board and a housing. A MEMS acoustic-electric chip is disposed in the packaging structure and the circuit board is provided with a sound hole. The MEMS microphone is characterized in that the surface of the circuit board inside the package structure is provided with a protector covering the sound hole; the MEMS acoustic-electric chip is covered on the protector and disposed on the circuit board; the MEMS acoustic-electric chip, the circuit board and the protector form a first vocal cavity; communicating holes are disposed in the protector; and the sound hole and the first vocal cavity are communicated via the communicating hole. An outside air flow enters into the sound hole and is buffered first under the blocking effect of the protector. The buffered air flow enters into the first vocal cavity via the communication holes on the protector to achieve the effect of sound pressure balance via the first vocal cavity, and is then applied to the MEMS acoustic-electric chip to achieve a sound inlet effect, so that impact of the outside air flow on a membrane of the MEMS acoustic-electric chip is prevented and performance of the product is ensured.
Description
Technical field
The utility model relates to the acoustical-electrical transducer technical field, more specifically, relates to a kind of MEMS microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, electronic product such as mobile phone, notebook computer volume constantly reduces, people are also more and more higher to the performance requirement of these portable electronic products, thereby require also with it that the volume of supporting electronic component constantly reduces, performance and consistency improve constantly.MEMS(Micro-Electro-Mechanical-System, abbreviation MEMS) the integrated MEMS microphone of technology begins to be applied in batches in the electronic products such as mobile phone, notebook computer, its encapsulation volume is littler than traditional electret microphone, therefore is subjected to most of microphone manufacturer's favor.
The MEMS microphone is the encapsulating structure of being made up of metal shell and wiring board (Printed Circuit Board abbreviates PCB as).PCB surface in encapsulating structure inside is provided with MEMS acoustic-electric chip, the described wiring board position relative with described MEMS acoustic-electric chip is provided with the sound hole that receives voice signal, external sound is applied to by the sound hole and realizes sound effective value on the MEMS acoustic-electric chip, conventional design is because MEMS acoustic-electric chip is directly relative with the sound hole, when the air-flow that enters tone-entering hole inside is big, bigger air-flow can directly be applied on the MEMS acoustic-electric chip and the diaphragm of MEMS acoustic-electric chip is caused certain impact, can damage the diaphragm on the MEMS acoustic-electric chip when serious and influence the performance of MEMS acoustic-electric chip, thereby influence the general performance of MEMS microphone, need to design a kind of novel MEMS microphone thus.
The utility model content
In view of the above problems, the purpose of this utility model provides a kind of air-flow that can enter to external world and plays cushioning effect and make the comparatively a kind of MEMS microphone of stepless action to the MEMS acoustic-electric chip of air-flow.
For addressing the above problem the utility model by the following technical solutions: a kind of MEMS microphone, comprise by wiring board and shell and surround the encapsulating structure that forms, described encapsulating structure inside is provided with MEMS acoustic-electric chip, described wiring board is provided with the sound hole that receives voice signal, wherein, the inner described PCB surface of described encapsulating structure is provided with the guard member that can cover described sound hole; Described MEMS acoustic-electric chip covers described guard member and is arranged on the described wiring board; Described MEMS acoustic-electric chip, described wiring board and described guard member are surrounded and are formed first operatic tunes; Described guard member is provided with plural intercommunicating pore; Described intercommunicating pore aperture size is less than described sound hole aperture size; Described intercommunicating pore is communicated with described sound hole and described first operatic tunes.
A kind of preferred version, described MEMS acoustic-electric chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprises a rigid perforated back electrode and an elasticity vibrating diaphragm, described vibrating diaphragm end face links to each other with base terminal, back electrode is away from base terminal, and described MEMS acoustic-electric chip is realized and being connected of described wiring board by described substrate.
A kind of preferred version, described guard member are the lid that covers on the described sound hole, and described lid and described wiring board surround and form described second operatic tunes, and described MEMS acoustic-electric chip, described wiring board and described lid surround and form described first operatic tunes; The described position of cap relative with described sound hole is entity, and described intercommunicating pore is around being arranged on around the described entity, and realize and being communicated with of described first operatic tunes by second operatic tunes, intercommunicating pore in described sound hole.
Fixedly connected by fixing glue between a kind of preferred version, described lid and described wiring board, the described wiring board installed surface periphery that is connected with described lid is provided with the colloidal sol groove to lower recess.
A kind of preferred version, described guard member are the cover plate that is arranged on described PCB surface and covers described sound hole; Described MEMS acoustic-electric chip, described wiring board and described cover plate surround and form described first operatic tunes.
Fixedly connected by fixing glue between a kind of preferred version, described cover plate and described wiring board, the described wiring board installed surface periphery relative with described cover plate is local to be provided with the colloidal sol groove to lower recess.
A kind of preferred version, described guard member are the cover plate that covers on the described sound hole, are provided with strutting piece between described cover plate and the described wiring board; Described wiring board, described strutting piece and described cover plate surround and form described second operatic tunes, and described MEMS acoustic-electric chip, described wiring board, described strutting piece and described cover plate surround and form described first operatic tunes; The described cover plate position relative with described sound hole is entity, and described intercommunicating pore is around being arranged on around the described entity, and realize and being communicated with of described first operatic tunes by second operatic tunes, intercommunicating pore in described sound hole.
A kind of preferred version, the aperture size of described intercommunicating pore is between 0.01-0.1mm.
Preferred version further, the aperture size of described intercommunicating pore is between 0.03-0.05mm.
A kind of preferred version, the aperture size in the sound hole on the described wiring board is between 0.2-0.3mm.
Utilize above-mentioned according to MEMS microphone of the present utility model, because MEMS microphone of the present utility model, comprise by wiring board and shell and surround the encapsulating structure that forms, described encapsulating structure inside is provided with MEMS acoustic-electric chip, described wiring board is provided with the sound hole that receives voice signal, wherein, the inner described PCB surface of described encapsulating structure is provided with the guard member that can cover described sound hole; Described MEMS acoustic-electric chip covers described guard member and is arranged on the described wiring board; Described MEMS acoustic-electric chip, described wiring board and described guard member are surrounded and are formed first operatic tunes; Described guard member is provided with plural intercommunicating pore; Described intercommunicating pore aperture size is less than described sound hole aperture size; Described intercommunicating pore is communicated with described sound hole and described first operatic tunes.When extraneous air-flow advances tone-entering hole; at first under the stopping of guard member, air-flow is cushioned; air-flow after the buffering is realized shunting effect by the intercommunicating pore on the guard member and is entered in first operatic tunes; realize the effect of acoustic pressure balance by first operatic tunes; be applied to then and realize sound effective value on the MEMS acoustic-electric chip; prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip diaphragm, having guaranteed the performance of product.
Description of drawings
By the content of reference below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present utility model, other purpose of the present utility model and result will understand and easy to understand more.
Fig. 1 is that the utility model embodiment one realizes the into profile of the MEMS microphone of sound effective value by lid.
Fig. 2 is the structural representation of the utility model embodiment one lid.
Fig. 3 is the utility model embodiment one by the profile of the MEMS microphone that the colloidal sol groove is set in the circuit board forms.
Fig. 4 is that the utility model embodiment two is by establishing the profile of the MEMS microphone of covering plate structure in wiring board sound hole site.
Fig. 5 is the utility model embodiment two arranges the MEMS microphone of colloidal sol groove design in the circuit board on the basis of Fig. 4 profile.
Fig. 6 is the vertical view of wiring board among the utility model embodiment two.
Fig. 7 is the profile that the utility model embodiment three supports cover plate by strutting piece the MEMS microphone that forms the operatic tunes.
Fig. 8 is the vertical view of the utility model MEMS microphone cover plate.
Fig. 9 is the generalized section of MEMS acoustic-electric chip among the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with the drawings and specific embodiments the utility model is described in detail.Obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment one:
As Fig. 1, shown in Figure 2, a kind of MEMS microphone, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, the inner described wiring board of described encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3, as shown in Figure 9, this MEMS acoustic-electric chip 3 is by a substrate 31 and the capacitor that is arranged in the substrate 31, described capacitor comprises a rigid perforated back electrode 32 and an elasticity vibrating diaphragm 33, elasticity vibrating diaphragm 33 on the MEMS acoustic-electric chip 3 is the variation of the extraneous acoustic pressure of perception effectively, and be converted into changes in capacitance, wherein vibrating diaphragm 33 end faces link to each other with substrate 31 ends, and back electrode 32 is away from substrate 31 ends.Described MEMS acoustic-electric chip 3 realizes and the installation of described wiring board 1 that by substrate 31 described wiring board 1 is provided with the sound hole 11 that receives voice signal, and wherein, the inner described wiring board of described encapsulating structure 1 surface is provided with the guard member that can cover described sound hole 11; Described MEMS acoustic-electric chip 3 covers described guard member and is arranged on the described wiring board 1; Described MEMS acoustic-electric chip 3, described wiring board 1 and described guard member are surrounded and are formed first operatic tunes 20; Described guard member is provided with plural intercommunicating pore 40; Described intercommunicating pore 40 aperture sizes are less than described sound hole 11 aperture sizes; As realizing a kind of optimized technical scheme of the utility model, the quantity of described intercommunicating pore 40 is two, and described intercommunicating pore 40 is communicated with described sound hole 11 and described first operatic tunes 20.When extraneous air-flow advances tone-entering hole 11; at first under the stopping of guard member, air-flow is cushioned; air-flow after the buffering is shunted and is entered in first operatic tunes 20 by the intercommunicating pore 40 on the guard member; realize the effect of acoustic pressure balance by first operatic tunes 20; be applied to then and realize sound effective value on the MEMS acoustic-electric chip 3; prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip 3 upper diaphragms 33, having guaranteed the performance of product.
As realizing a kind of optimized technical scheme of the utility model, described guard member is the lid 4 that covers on the described sound hole 11, described lid 4 surrounds with described wiring board 1 and forms described second operatic tunes 10, and described MEMS acoustic-electric chip 3, described wiring board 1 and described lid 4 surround and form described first operatic tunes 20; The described position of cap relative with described sound hole is entity, and described intercommunicating pore is around being arranged on around the described entity, and realize and being communicated with of described first operatic tunes 20 by second operatic tunes 10, intercommunicating pore 40 in described sound hole 11.Extraneous air-flow at first enters second operatic tunes 10 by sound hole 11, under the effect of second operatic tunes 10, air-flow is played the effect of buffering, air-flow after the buffering is realized shunting by the intercommunicating pore 40 on the lid 4 and is entered in first operatic tunes 20, realize the effect of acoustic pressure balance by first operatic tunes 20, be applied to then and realize sound effective value on the MEMS acoustic-electric chip 3, prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip 3 diaphragms, having guaranteed the performance of product.
As shown in Figure 3, as realizing a kind of optimized technical scheme of the utility model, fixedly connected by fixing glue between described lid 4 and the described wiring board 1, the described wiring board installed surface periphery that is connected with described lid 4 is provided with the colloidal sol groove 5 of an annular to lower recess.Prevent that fixing glue is excessive and influence the product acoustical behavior.
As realizing a kind of optimized technical scheme of the utility model, the aperture size of described intercommunicating pore 40 is convenient to be complementary with other size of product between 0.03-0.05mm.
As realizing a kind of optimized technical scheme of the utility model, the aperture size in the sound hole 11 on the described wiring board 1 is between 0.2-0.3mm.
When extraneous air-flow advances tone-entering hole; at first under the stopping of guard member, air-flow is cushioned; air-flow after the buffering is realized shunting effect by the intercommunicating pore on the guard member and is entered in first operatic tunes; realize the effect of acoustic pressure balance by first operatic tunes; be applied to then and realize sound effective value on the MEMS acoustic-electric chip; prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip diaphragm, having guaranteed the performance of product.
Embodiment two:
As shown in Figure 4, a kind of MEMS microphone, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, the inner described wiring board of described encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3, as shown in Figure 9, this MEMS acoustic-electric chip 3 is by a substrate 31 and the capacitor that is arranged in the substrate 31, described capacitor comprises a rigid perforated back electrode 32 and an elasticity vibrating diaphragm 33, elasticity vibrating diaphragm 33 on the MEMS acoustic-electric chip 3 is the variation of the extraneous acoustic pressure of perception effectively, and be converted into changes in capacitance, wherein vibrating diaphragm 33 end faces link to each other with substrate 31 ends, and back electrode 32 is away from substrate 31 ends.Described MEMS acoustic-electric chip 3 realizes and the installation of described wiring board that by substrate 31 described wiring board 1 is provided with the sound hole 11 that receives voice signal, and wherein, the inner described wiring board of described encapsulating structure 1 surface is provided with the guard member that can cover described sound hole 11; Described MEMS acoustic-electric chip 3 covers described guard member and is arranged on the described wiring board 1; Described MEMS acoustic-electric chip 3, described wiring board 1 and described guard member are surrounded and are formed first operatic tunes 20; Described guard member is provided with plural intercommunicating pore 40; Described intercommunicating pore 40 aperture sizes are less than described sound hole 11 aperture sizes; Described intercommunicating pore 40 is communicated with described sound hole 11 and described first operatic tunes 20.When extraneous air-flow advances tone-entering hole 11; at first under the stopping of guard member, air-flow is cushioned; air-flow after the buffering is shunted and is entered in first operatic tunes 20 by the intercommunicating pore 40 on the guard member; realize the effect of acoustic pressure balance by first operatic tunes 20; be applied to then and realize sound effective value on the MEMS acoustic-electric chip 3; prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip 3 upper diaphragms 33, having guaranteed the performance of product.
As realizing a kind of optimized technical scheme of the utility model, described guard member is the cover plate 41 that is arranged on described wiring board 1 surface and covers described sound hole 11; Described MEMS acoustic-electric chip 3, described wiring board 1 and described cover plate 41 surround and form described first operatic tunes 20.
As Fig. 5, shown in Figure 6, as realizing a kind of optimized technical scheme of the utility model, fixedly connected by fixing glue between described cover plate 41 and the described wiring board 1, the described wiring board installed surface periphery relative with described cover plate 41 is local to be provided with an annular colloidal sol groove 5 to lower recess.Prevent that fixing glue is excessive and influence the product acoustical behavior.
As realizing a kind of optimized technical scheme of the utility model, the aperture size of described intercommunicating pore 40 is convenient to be complementary with other size of product between 0.03-0.05mm.
As realizing a kind of optimized technical scheme of the utility model, the aperture size in the sound hole 11 on the described wiring board 1 is between 0.2-0.3mm.
When extraneous air-flow advances tone-entering hole; at first under the stopping of guard member, air-flow is cushioned; air-flow after the buffering is realized shunting effect by the intercommunicating pore on the guard member and is entered in first operatic tunes; realize the effect of acoustic pressure balance by first operatic tunes; be applied to then and realize sound effective value on the MEMS acoustic-electric chip; prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip diaphragm, having guaranteed the performance of product.
Embodiment three:
As shown in Figure 7, a kind of MEMS microphone, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, the inner described wiring board of described encapsulating structure 1 surface is provided with MEMS acoustic-electric chip 3, as shown in Figure 9, this MEMS acoustic-electric chip 3 is by a substrate 31 and the capacitor that is arranged in the substrate 31, described capacitor comprises a rigid perforated back electrode 32 and an elasticity vibrating diaphragm 33, elasticity vibrating diaphragm 33 on the MEMS acoustic-electric chip 3 is the variation of the extraneous acoustic pressure of perception effectively, and be converted into changes in capacitance, wherein vibrating diaphragm 33 end faces link to each other with substrate 31 ends, and back electrode 32 is away from substrate 31 ends.Described MEMS acoustic-electric chip 3 realizes and the installation of described wiring board that by substrate 31 described wiring board 1 is provided with the sound hole 11 that receives voice signal, and wherein, the inner described wiring board of described encapsulating structure 1 surface is provided with the guard member that can cover described sound hole 11; Described MEMS acoustic-electric chip 3 covers described guard member and is arranged on the described wiring board 1; Described MEMS acoustic-electric chip 3, described wiring board 1 and described guard member are surrounded and are formed first operatic tunes 20; Described guard member is provided with plural intercommunicating pore 40; Described intercommunicating pore 40 aperture sizes are less than described sound hole 11 aperture sizes; Described intercommunicating pore 40 is communicated with described sound hole 11 and described first operatic tunes 20.
As realizing a kind of optimized technical scheme of the utility model, described guard member is the cover plate 41 that covers on the described sound hole 11, is provided with strutting piece 6 between described cover plate 41 and the described wiring board 1; Described wiring board 1, described strutting piece 6 and described cover plate 41 surround and form described second operatic tunes 10, and described MEMS acoustic-electric chip 3, described wiring board 1, described strutting piece 6 and described cover plate 41 surround and form described first operatic tunes 20; Described cover plate 41 positions relative with described sound hole 11 are entity, and described intercommunicating pore 40 is around being arranged on around the described entity, and realize and being communicated with of described first operatic tunes 20 by second operatic tunes 10, intercommunicating pore 40 in described sound hole 11.Extraneous air-flow at first enters second operatic tunes 10 by sound hole 11, under the effect of second operatic tunes 10, air-flow is played the effect of buffering, air-flow after the buffering is realized shunting by the intercommunicating pore 40 on the cover plate 41 and is entered in first operatic tunes 20, realize the effect of acoustic pressure balance by first operatic tunes 20, be applied to then and realize sound effective value on the MEMS acoustic-electric chip 3, prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip 3 diaphragms, having guaranteed the performance of product.
As realizing a kind of optimized technical scheme of the utility model, the aperture size of described intercommunicating pore 40 is convenient to be complementary with other size of product between 0.03-0.05mm.
As realizing a kind of optimized technical scheme of the utility model, the aperture size in the sound hole 11 on the described wiring board 1 is between 0.2-0.3mm.
Extraneous air-flow at first enters second operatic tunes 10 by sound hole 11, under the effect of second operatic tunes 10, air-flow is played the effect of buffering, air-flow after the buffering is realized shunting by the intercommunicating pore 40 on the cover plate 41 and is entered in first operatic tunes 20, realize the effect of acoustic pressure balance by first operatic tunes 20, be applied to then and realize sound effective value on the MEMS acoustic-electric chip 3, prevented that extraneous air-flow to the impact of MEMS acoustic-electric chip 3 diaphragms, having guaranteed the performance of product.
More than three embodiment show and described basic principle of the present utility model and principal character.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications; these changes and improvements all fall in claimed the utility model scope, and protection range of the present utility model should be determined by the content of appending claims.
Claims (10)
1. a MEMS microphone comprises by wiring board and shell and surrounds the encapsulating structure that forms, and described encapsulating structure inside is provided with MEMS acoustic-electric chip, and described wiring board is provided with the sound hole that receives voice signal, it is characterized in that:
The inner described PCB surface of described encapsulating structure is provided with the guard member that can cover described sound hole;
Described MEMS acoustic-electric chip covers described guard member and is arranged on the described wiring board;
Described MEMS acoustic-electric chip, described wiring board and described guard member are surrounded and are formed first operatic tunes;
Described guard member is provided with plural intercommunicating pore;
Described intercommunicating pore aperture size is less than described sound hole aperture size;
Described intercommunicating pore is communicated with described sound hole and described first operatic tunes.
2. MEMS microphone as claimed in claim 1 is characterized in that:
Described MEMS acoustic-electric chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprises a rigid perforated back electrode and an elasticity vibrating diaphragm, described vibrating diaphragm end face links to each other with base terminal, back electrode is away from base terminal, and described MEMS acoustic-electric chip is realized and being connected of described wiring board by described substrate.
3. MEMS microphone as claimed in claim 1 or 2 is characterized in that:
Described guard member is the lid that covers on the described sound hole, and described lid and described wiring board surround and form described second operatic tunes, and described MEMS acoustic-electric chip, described wiring board and described lid surround and form described first operatic tunes; The described position of cap relative with described sound hole is entity, and described intercommunicating pore is around being arranged on around the described entity, and realize and being communicated with of described first operatic tunes by second operatic tunes, intercommunicating pore in described sound hole.
4. MEMS microphone as claimed in claim 3 is characterized in that:
Fixedly connected by fixing glue between described lid and the described wiring board, the described wiring board installed surface periphery that is connected with described lid is provided with the colloidal sol groove to lower recess.
5. MEMS microphone as claimed in claim 1 or 2 is characterized in that:
Described guard member is the cover plate that is arranged on described PCB surface and covers described sound hole;
Described MEMS acoustic-electric chip, described wiring board and described cover plate surround and form described first operatic tunes.
6. MEMS microphone as claimed in claim 5 is characterized in that:
Fixedly connected by fixing glue between described cover plate and the described wiring board, the described wiring board installed surface periphery relative with described cover plate is local to be provided with the colloidal sol groove to lower recess.
7. MEMS microphone as claimed in claim 1 or 2 is characterized in that:
Described guard member is the cover plate that covers on the described sound hole, is provided with strutting piece between described cover plate and the described wiring board;
Described wiring board, described strutting piece and described cover plate surround and form described second operatic tunes, and described MEMS acoustic-electric chip, described wiring board, described strutting piece and described cover plate surround and form described first operatic tunes;
The described cover plate position relative with described sound hole is entity, and described intercommunicating pore is around being arranged on around the described entity, and realize and being communicated with of described first operatic tunes by second operatic tunes, intercommunicating pore in described sound hole.
8. MEMS microphone as claimed in claim 1, it is characterized in that: the aperture size of described intercommunicating pore is between 0.01-0.1mm.
9. MEMS microphone as claimed in claim 1, it is characterized in that: the aperture size of described intercommunicating pore is between 0.03-0.05mm.
10. MEMS microphone as claimed in claim 1 is characterized in that: the aperture size in the sound hole on the described wiring board is between 0.2-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320173450 CN203225886U (en) | 2013-04-09 | 2013-04-09 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320173450 CN203225886U (en) | 2013-04-09 | 2013-04-09 | Mems microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203225886U true CN203225886U (en) | 2013-10-02 |
Family
ID=49252875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320173450 Expired - Lifetime CN203225886U (en) | 2013-04-09 | 2013-04-09 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203225886U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107200300A (en) * | 2017-04-26 | 2017-09-26 | 歌尔股份有限公司 | MEMS and encapsulating structure preparation method |
| CN109451384A (en) * | 2019-01-02 | 2019-03-08 | 歌尔股份有限公司 | MEMS microphone and electronic equipment |
| CN110545512A (en) * | 2019-09-05 | 2019-12-06 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone and anti structure of blowing thereof |
| CN110574395A (en) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | MEMS microphone |
| CN113415781A (en) * | 2021-06-17 | 2021-09-21 | 甬矽电子(宁波)股份有限公司 | double-MEMS chip packaging structure and double-MEMS chip packaging method |
-
2013
- 2013-04-09 CN CN 201320173450 patent/CN203225886U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107200300A (en) * | 2017-04-26 | 2017-09-26 | 歌尔股份有限公司 | MEMS and encapsulating structure preparation method |
| CN107200300B (en) * | 2017-04-26 | 2023-07-21 | 潍坊歌尔微电子有限公司 | MEMS device and packaging structure manufacturing method |
| CN110574395A (en) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | MEMS microphone |
| CN110574395B (en) * | 2017-05-05 | 2020-11-13 | 潍坊歌尔微电子有限公司 | MEMS microphone |
| US11109162B2 (en) | 2017-05-05 | 2021-08-31 | Goertek Inc. | MEMS microphone |
| CN109451384A (en) * | 2019-01-02 | 2019-03-08 | 歌尔股份有限公司 | MEMS microphone and electronic equipment |
| WO2020140880A1 (en) * | 2019-01-02 | 2020-07-09 | 歌尔股份有限公司 | Mems microphone and electronic device |
| CN109451384B (en) * | 2019-01-02 | 2024-01-23 | 潍坊歌尔微电子有限公司 | MEMS microphone and electronic device |
| CN110545512A (en) * | 2019-09-05 | 2019-12-06 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone and anti structure of blowing thereof |
| CN113415781A (en) * | 2021-06-17 | 2021-09-21 | 甬矽电子(宁波)股份有限公司 | double-MEMS chip packaging structure and double-MEMS chip packaging method |
| CN113415781B (en) * | 2021-06-17 | 2023-05-23 | 甬矽电子(宁波)股份有限公司 | Double MEMS chip packaging structure and double MEMS chip packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203225886U (en) | Mems microphone | |
| CN206100450U (en) | Packaging structure of MEMS microphone | |
| CN203225885U (en) | Mems microphone | |
| US9073747B2 (en) | MEMS microphone and electronic equipment having the MEMS microphone | |
| CN207070324U (en) | Loudspeaker module and electronic equipment | |
| CN204761710U (en) | MEMS microphone | |
| CN102742301A (en) | Microelectromechanical transducer and corresponding assembly process | |
| CN207072807U (en) | Mems chip and mems microphone | |
| CN202799144U (en) | Micro-electromechanical systems (MEMS) microphone | |
| US8983107B2 (en) | Silicon based capacitive microphone | |
| CN103401966A (en) | Earphone interface compatible with microphone function | |
| CN107105378A (en) | MEMS chip, microphone and preparation method and method for packing | |
| CN202663538U (en) | Mems microphone | |
| CN206413130U (en) | A kind of integrating device of microphone and environmental sensor | |
| CN209526835U (en) | A kind of encapsulating structure of microphone and environmental sensor | |
| CN104780490A (en) | MEMS microphone packaging structure and manufacturing method thereof | |
| CN203225887U (en) | Mems microphone | |
| CN202663539U (en) | MEMS (micro-electro-mechanical system) microphone | |
| CN204887448U (en) | Loudspeaker | |
| CN204550046U (en) | A kind of MEMS microphone chip and encapsulating structure thereof | |
| CN102131140B (en) | Micro-electro-mechanical systems (MEMS) microphone | |
| CN206350046U (en) | The receiver and mobile phone of electronic product | |
| CN204681598U (en) | A kind of encapsulating structure of MEMS microphone | |
| CN206821014U (en) | Mems chip and mems microphone | |
| CN202085303U (en) | Silicon microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131002 |
|
| CX01 | Expiry of patent term |