CN202679614U - Electret capacitance-type microphone - Google Patents
Electret capacitance-type microphone Download PDFInfo
- Publication number
- CN202679614U CN202679614U CN 201220282853 CN201220282853U CN202679614U CN 202679614 U CN202679614 U CN 202679614U CN 201220282853 CN201220282853 CN 201220282853 CN 201220282853 U CN201220282853 U CN 201220282853U CN 202679614 U CN202679614 U CN 202679614U
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- CN
- China
- Prior art keywords
- housing
- shell
- wiring board
- pressure
- bottom portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 abstract 4
- 238000005242 forging Methods 0.000 abstract 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000005236 sound signal Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses an electret capacitance-type microphone. The electret capacitance-type microphone includes an encapsulation structure composed of a circuit board and a housing. A bottom portion of the housing is provided with sound holes for receiving sound signals; a parallel plate capacitor composed of a diaphragm, a gasket and a pole plate is arranged at the bottom portion of the housing inside the encapsulation structure; and the bottom portion of the housing inside the encapsulation structure is provided with a pressure-equalizing groove for equalizing the pressure inside the encapsulation structure with the pressure outside, wherein the pressure-equalizing groove is made through laser forging. According to the electret capacitance-type microphone, the pressure-equalizing groove arranged at the bottom portion of the housing is made through laser forging, and therefore, by adopting a laser forging mode, the requirement for the thickness of the bottom portion of the housing is low, and at the same time, the category of the material of the housing is not limited; and further, the pressure-equalizing groove forged by lasers is of favorable consistency, which enables a relatively flat frequency response curve of a manufactured product.
Description
Technical field
The utility model relates to a kind of acoustic-electric conversion equipment, relates in particular to a kind of electret capacitor microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, along with the electronic product volumes such as mobile phone, notebook computer constantly reduce, people are also more and more higher to the performance requirement of these portable electronic products, thereby require also with it that the volume of supporting electronic component constantly reduces, performance and consistency improve constantly.Under this background, also released a lot of novel products as the microphone products field of one of strength member of above-mentioned portable electronic products, wherein take electret capacitor microphone as representative.
Conventional electret capacitor microphone comprises the encapsulating structure that is comprised of wiring board and shell, the inner described outer casing bottom of described encapsulating structure is provided with by diaphragm, the plane-parallel capacitor that pad and pole plate form, the inner described outer casing bottom of described encapsulating structure is provided with the extraneous and inner balancing slit of realizing all pressing effect of encapsulating structure, generally balancing slit outside during casing forming the mode by mechanical compression be made, the balancing slit that adopts this kind mode to make requires higher to the shell bottom thickness, there are certain restriction and produced product frequency response curve rugged and rough to the material category of shell, need thus to design a kind of novel electret capacitor microphone.
The utility model content
In view of the above problems, the purpose of this utility model provides a kind of lower to the requirement of shell bottom thickness, to the material category of shell without limits and the comparatively smooth a kind of electret capacitor microphone of produced product frequency response curve.
For addressing the above problem, the utility model by the following technical solutions:
A kind of electret capacitor microphone, comprise: the encapsulating structure that is formed by wiring board and shell, described outer casing bottom is provided with the sound hole that receives voice signal, the inner described outer casing bottom of described encapsulating structure is provided with the plane-parallel capacitor that is comprised of diaphragm, pad and pole plate, the inner described outer casing bottom of described encapsulating structure is provided with the extraneous and inner balancing slit of realizing all pressing effect of encapsulating structure, wherein, described balancing slit is made by laser and is formed.
As a kind of preferred version, described shell is " U " shape shell, forms by fixing glue is bonding between described shell and the described wiring board.
As a kind of preferred version, described shell is assembled by wiring board base plate and circuit board frame, and described balancing slit is arranged on the described wiring board base plate.
As a kind of preferred version, form by fixing glue is bonding between described circuit board frame and described wiring board and the wiring board base plate.
As a kind of preferred version, described balancing slit be shaped as bar shaped.
Utilize above-mentioned according to electret capacitor microphone of the present utility model, because the described balancing slit of outer casing bottom is made by laser and is formed, adopt mode that laser makes to the shell bottom thickness require lower, simultaneously to the material category of shell without limits and because the balancing slit consistency that laser is made out is better, make produced product frequency response curve comparatively smooth.
Description of drawings
By the content of reference below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present utility model, other purpose of the present utility model and result will understand and easy to understand more.
Fig. 1 is the profile of the utility model embodiment one electret capacitor microphone.
Fig. 2 is the vertical view of the utility model embodiment one electret capacitor microphone shell.
Fig. 3 is the profile of the utility model embodiment two electret capacitor microphones.
Fig. 4 is the vertical view of wiring board base plate in the utility model embodiment two shells.
Embodiment
Below with reference to accompanying drawing specific embodiment of the utility model is described in detail.
Embodiment one: as shown in Figure 1 and Figure 2, a kind of electret capacitor microphone, comprise: the encapsulating structure that is formed by wiring board 1 and shell 2, described shell 2 bottoms are provided with the sound hole 3 that receives voice signal, the inner described shell of described encapsulating structure 2 bottoms are provided with the plane-parallel capacitor that is comprised of diaphragm 5, pad 6 and pole plate 7, the inner described shell of described encapsulating structure 2 bottoms are provided with the extraneous and inner balancing slit 31 of realizing all pressing effect of encapsulating structure, wherein, described balancing slit 31 is made by laser and is formed.
Described shell 2 in the present embodiment is " U " shape shell, and is by fixing glue 4 bonding forming, simple to operate, be convenient to realize between described shell 2 and the described wiring board 1.
As realizing a kind of preferred technical scheme of the utility model, described balancing slit 31 be shaped as bar shaped, processing is simple, be convenient to realize.
Utilize above-mentioned according to electret capacitor microphone of the present utility model, because the described balancing slit of outer casing bottom is made by laser and is formed, adopt mode that laser makes to the shell bottom thickness require lower, simultaneously to the material category of shell without limits and because the balancing slit consistency that laser is made out is better, make produced product frequency response curve comparatively smooth.
Embodiment two: as shown in Figure 3, Figure 4, the difference of present embodiment and embodiment one is that described shell 2 is assembled by wiring board base plate 22 and circuit board frame 21, and described balancing slit 31 is arranged on the described wiring board base plate 22, makes simple, installation facility.
As realizing a kind of preferred technical scheme of the utility model, respectively by fixing glue 4 bonding forming, make simple, installation facility between described circuit board frame 21 and described wiring board 1 and the wiring board base plate 22.
Above embodiment, because the described balancing slit of outer casing bottom is made by laser and is formed, adopt mode that laser makes to the shell bottom thickness require lower, simultaneously to the material category of shell without limits and because the balancing slit consistency that laser is made out is better, make produced product frequency response curve comparatively smooth.
Only for explaining that the utility model is not restriction the utility model, under the prerequisite that does not break away from the utility model spirit and scope, the claimed scope of the utility model is defined by appending claims and equivalent thereof above-described embodiment.
Claims (5)
1. electret capacitor microphone, comprise: the encapsulating structure that is formed by wiring board and shell, described outer casing bottom is provided with the sound hole that receives voice signal, the inner described outer casing bottom of described encapsulating structure is provided with the plane-parallel capacitor that is comprised of diaphragm, pad and pole plate, the inner described outer casing bottom of described encapsulating structure is provided with the extraneous and inner balancing slit of realizing all pressing effect of encapsulating structure, and it is characterized in that: described balancing slit is made by laser and formed.
2. electret capacitor microphone as claimed in claim 1, it is characterized in that: described shell is " U " shape shell, forms by fixing glue is bonding between described shell and the described wiring board.
3. electret capacitor microphone as claimed in claim 1, it is characterized in that: described shell is assembled by wiring board base plate and circuit board frame, and described balancing slit is arranged on the described wiring board base plate.
4. electret capacitor microphone as claimed in claim 3 is characterized in that: form by fixing glue is bonding between described circuit board frame and described wiring board and the wiring board base plate.
5. electret capacitor microphone as claimed in claim 1 is characterized in that: described balancing slit be shaped as bar shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220282853 CN202679614U (en) | 2012-06-15 | 2012-06-15 | Electret capacitance-type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220282853 CN202679614U (en) | 2012-06-15 | 2012-06-15 | Electret capacitance-type microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202679614U true CN202679614U (en) | 2013-01-16 |
Family
ID=47500483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220282853 Expired - Lifetime CN202679614U (en) | 2012-06-15 | 2012-06-15 | Electret capacitance-type microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202679614U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379684A (en) * | 2018-10-09 | 2019-02-22 | 歌尔股份有限公司 | Microphone and electronic equipment |
| CN110798764A (en) * | 2019-11-14 | 2020-02-14 | 歌尔股份有限公司 | Sensor and electronic device |
-
2012
- 2012-06-15 CN CN 201220282853 patent/CN202679614U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379684A (en) * | 2018-10-09 | 2019-02-22 | 歌尔股份有限公司 | Microphone and electronic equipment |
| CN110798764A (en) * | 2019-11-14 | 2020-02-14 | 歌尔股份有限公司 | Sensor and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |