CN102256198A - Silicon microphone - Google Patents
Silicon microphone Download PDFInfo
- Publication number
- CN102256198A CN102256198A CN2011101396233A CN201110139623A CN102256198A CN 102256198 A CN102256198 A CN 102256198A CN 2011101396233 A CN2011101396233 A CN 2011101396233A CN 201110139623 A CN201110139623 A CN 201110139623A CN 102256198 A CN102256198 A CN 102256198A
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- China
- Prior art keywords
- pad
- air channel
- wiring board
- silicon microphone
- mems chip
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
The invention discloses a silicon microphone, which comprises a protective structure consisting of a circuit board and a shell. The surface of the circuit board in the protective structure is provided with a micro electromechanical system (MEMS) chip used for acousto-electric conversion. A sound hole for receiving an external sound signal is formed on the circuit board of the protective structure. The MEMS chip is arranged corresponding to the sound hole. A gasket surrounding the sound hole is arranged between the MEMS chip and the circuit board. A venting channel is formed on the gasket, and is communicated with the sound hole and a vocal cavity formed by the protective structure and the MEMS chip. The low-frequency curve of the silicon microphone can be regulated by the venting channel to avoid the influence of low-frequency noises such as wind noises and the like.
Description
Technical field
The present invention relates to the acoustical-electrical transducer technical field, more specifically, relate to a kind of silicon microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, along with electronic product volumes such as mobile phone, notebook computer constantly reduce, people are also more and more higher to the performance requirement of these portable electronic products, thereby also require the volume of supporting with it electronic component constantly to reduce, performance and consistency improve constantly.Under this background, also released a lot of novel products as the microphone products field of one of strength member of portable electronic products, wherein the silicon microphone of realizing in batches to utilize the semiconductor fabrication process technology is a representative products.
Common product need all be pressed design, makes the midget microphone inner space that the connection of a small space can be arranged with the external world.Flute profile metal material of for example original application is as product casing and protection constructed products, general by at elongated groove of outer casing bottom punching press by regulating the low frequency curve, can avoid wind low-frequency noise such as make an uproar.
Operation principle for this silicon microphone product; be a kind of silicon microphone product profile of routine as shown in Figure 4; the outer protection structure that comprises a square metal shell 1 and square wiring board 2 formation silicon microphones; wiring board 2 is provided with the sound hole 21 that is used to receive the external sound signal; externally protect on the wiring board 2 of inside configuration MEMS chip 3 is installed; wherein MEMS chip 3 is for utilizing the MEMS(MEMS (micro electro mechanical system)) the technology making; the outside sound signal transition can be become the signal of telecommunication, this silicon microphone structure but can't be avoided the wind influence of low-frequency noise to product such as make an uproar.
So, need to solve the influence of low-frequency noise to properties of product such as make an uproar of this silicon microphone structure wind-engaging.
Summary of the invention
In view of the above problems, it is simple to the purpose of this invention is to provide a kind of manufacture craft, can avoid a kind of silicon microphone of low-frequency noise to the product influence.
For solving the problems of the technologies described above, the present invention is by the following technical solutions: a kind of silicon microphone, comprise the protection structure that wiring board and shell are formed, PCB surface in described protection inside configuration is equipped with the MEMS chip that is used for the conversion of sound-electricity, the wiring board of described protection structure is provided with the sound hole that is used to receive the external sound signal, the corresponding described sound of described MEMS chip hole is provided with, wherein, between described MEMS chip and described wiring board, be provided with around the pad in described sound hole, on described pad, be provided with air channel; Described air channel is communicated with the operatic tunes that described sound hole and described protection structure and described MEMS chip form.
In addition, optimized technical scheme is that described pad is a metallic gasket.
In addition, optimized technical scheme is, described pad is provided with the boss that supports described wiring board and described pad around described sound hole, and described boss, described wiring board and pad are in conjunction with the described air channel of formation.
In addition, optimized technical scheme is to be provided with fixing glue between the described pad of described boss periphery and the described wiring board.
In addition, optimized technical scheme is that described air channel is a straight line air channel.
In addition, optimized technical scheme is that described air channel is a tortuous air channel.
Utilize above-mentioned according to silicon microphone of the present invention; by between described MEMS chip and described wiring board, being provided with around the pad in sound hole; the air channel of the operatic tunes that the company's of being provided with sound hole and protection structure and MEMS chip form on pad; regulate silicon microphone low frequency curve by air channel, avoided the wind influence of low-frequency noise such as make an uproar.
Description of drawings
Fig. 1 is the generalized section of the embodiment of the invention.
Fig. 2 is the local enlarged diagram of Fig. 1.
Fig. 3 is the vertical view at the pad back side.
Fig. 4 is the generalized section of background technology of the present invention.
Wherein, the front and the back side of pad are defined as: with the contacted pad face of MEMS chip for positive, with the contacted pad face of wiring board be the back side.
Identical label is indicated similar or corresponding feature or function in institute's drawings attached.
Embodiment
Below with reference to accompanying drawing specific embodiments of the invention are described in detail.
As Fig. 1, Fig. 2, shown in Figure 3, a kind of silicon microphone that present embodiment provides, comprise the protection structure that wiring board 2 and shell 1 are formed, be useful on the MEMS chip 3 of sound-electricity conversion in wiring board 2 mounted on surface of described protection inside configuration, the wiring board 2 of described protection structure is provided with the sound hole 21 that is used to receive the external sound signal, described MEMS chip 3 corresponding described sound holes 21 are provided with, wherein, between described MEMS chip 3 and described wiring board 2, be provided with around the pad 4 in described sound hole 21, on described pad 4, be provided with air channel 6; Described air channel 6 is communicated with the operatic tunes that described sound hole 21 and described protection structure and described MEMS chip 3 form.Regulate silicon microphone low frequency curve by the air channel on the pad 46, avoided the wind influence of low-frequency noise such as make an uproar.
As optimized technical scheme, described pad 4 is a metallic gasket.Adopt the pad of metal structure the MEMS chip can well be fixed on the pad, and good product consistency.
As optimized technical scheme, described pad 4 is provided with the boss 5 that supports described wiring board 2 and described pad 4 around described sound hole 21, and described boss 5, described wiring board 2 and pad 4 are in conjunction with forming described air channel 6.Form air channel by boss, fixedly the time, can prevent to stop up the maintenance consistency of product by modes such as some glue at pad and wiring board.
As optimized technical scheme, be provided with fixing glue 7 between the described pad 4 of described boss 5 peripheries and the described wiring board 2.Realize assembling between wiring board and the pad by fixing glue, technology is more simple.
As optimized technical scheme, described air channel 6 is a straight line air channel.The air channel of linear structure, in the production and processing of reality, technology is more simple.
As optimized technical scheme, described air channel 6 also can be a tortuous air channel.The acoustic resistance size that the design of this curved structure can be regulated air channel satisfies the acoustical behavior needs of different product.
In above cited embodiment, all adopted square shell and wiring board, shell is the metal groove form casing of one.In fact, shell and wiring board also can be other shapes, and shell also can adopt wiring board material, plastic material etc. to make, and shell also can be that a framework and a cover combination form; Wiring board in this patent can the preferred resin material as base material.In a word, in the various choice of technology modes under the prerequisite of not violating this novel silicon microphone design purport all within the protection at this patent.In addition, need to prove, in view of the suitable adjustment of MEMS chip to not influence of purport of the present invention, the MEMS chip in the pattern only adopts simple pattern to represent.
Claims (6)
1. silicon microphone, comprise the protection structure that wiring board and shell are formed, PCB surface in described protection inside configuration is equipped with the MEMS chip that is used for the conversion of sound-electricity, the wiring board of described protection structure is provided with the sound hole that is used to receive the external sound signal, the corresponding described sound of described MEMS chip hole is provided with, it is characterized in that: between described MEMS chip and described wiring board, be provided with around the pad in described sound hole, on described pad, be provided with air channel; Described air channel is communicated with the operatic tunes that described sound hole and described protection structure and described MEMS chip form.
2. silicon microphone as claimed in claim 1 is characterized in that: described pad is a metallic gasket.
3. silicon microphone as claimed in claim 1 is characterized in that: described pad is provided with the boss that supports described wiring board and described pad around described sound hole, and described boss, described wiring board and pad are in conjunction with forming described air channel.
4. silicon microphone as claimed in claim 3 is characterized in that: be provided with fixing glue between the described pad of described boss periphery and the described wiring board.
5. as the described silicon microphone of the arbitrary claim of claim 1-4, it is characterized in that: described air channel is a straight line air channel.
6. as the described silicon microphone of the arbitrary claim of claim 1-4, it is characterized in that: described air channel is a tortuous air channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101396233A CN102256198A (en) | 2011-05-27 | 2011-05-27 | Silicon microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101396233A CN102256198A (en) | 2011-05-27 | 2011-05-27 | Silicon microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102256198A true CN102256198A (en) | 2011-11-23 |
Family
ID=44983131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101396233A Pending CN102256198A (en) | 2011-05-27 | 2011-05-27 | Silicon microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102256198A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102932722A (en) * | 2012-11-08 | 2013-02-13 | 山东共达电声股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN103281660A (en) * | 2013-05-06 | 2013-09-04 | 山东共达电声股份有限公司 | Double-bottom gasket and MEMS (Micro Electro Mechanical System) microphone |
| CN104254047A (en) * | 2013-06-26 | 2014-12-31 | 英飞凌科技股份有限公司 | Electronic device with large back volume for electromechanical transducer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080123876A1 (en) * | 2006-10-16 | 2008-05-29 | Yamaha Corporation | Electrostatic pressure transducer and manufacturing method therefor |
| CN201210744Y (en) * | 2008-03-27 | 2009-03-18 | 歌尔声学股份有限公司 | Miniature capacitor type microphone |
| CN101426166A (en) * | 2008-11-07 | 2009-05-06 | 歌尔声学股份有限公司 | Silicon microphone |
| CN201533390U (en) * | 2009-10-26 | 2010-07-21 | 歌尔声学股份有限公司 | Minitype microphone |
| CN202085303U (en) * | 2011-05-27 | 2011-12-21 | 歌尔声学股份有限公司 | Silicon microphone |
-
2011
- 2011-05-27 CN CN2011101396233A patent/CN102256198A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080123876A1 (en) * | 2006-10-16 | 2008-05-29 | Yamaha Corporation | Electrostatic pressure transducer and manufacturing method therefor |
| CN201210744Y (en) * | 2008-03-27 | 2009-03-18 | 歌尔声学股份有限公司 | Miniature capacitor type microphone |
| CN101426166A (en) * | 2008-11-07 | 2009-05-06 | 歌尔声学股份有限公司 | Silicon microphone |
| CN201533390U (en) * | 2009-10-26 | 2010-07-21 | 歌尔声学股份有限公司 | Minitype microphone |
| CN202085303U (en) * | 2011-05-27 | 2011-12-21 | 歌尔声学股份有限公司 | Silicon microphone |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102932722A (en) * | 2012-11-08 | 2013-02-13 | 山东共达电声股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN103281660A (en) * | 2013-05-06 | 2013-09-04 | 山东共达电声股份有限公司 | Double-bottom gasket and MEMS (Micro Electro Mechanical System) microphone |
| CN103281660B (en) * | 2013-05-06 | 2015-11-18 | 山东共达电声股份有限公司 | A kind of Double bottom pad and a kind of MEMS microphone |
| CN104254047A (en) * | 2013-06-26 | 2014-12-31 | 英飞凌科技股份有限公司 | Electronic device with large back volume for electromechanical transducer |
| CN104254047B (en) * | 2013-06-26 | 2018-03-27 | 英飞凌科技股份有限公司 | Electronic equipment with the big back side volume for electromechanical transducer |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111123 |