CN103281660B - A kind of Double bottom pad and a kind of MEMS microphone - Google Patents
A kind of Double bottom pad and a kind of MEMS microphone Download PDFInfo
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- CN103281660B CN103281660B CN201310162352.2A CN201310162352A CN103281660B CN 103281660 B CN103281660 B CN 103281660B CN 201310162352 A CN201310162352 A CN 201310162352A CN 103281660 B CN103281660 B CN 103281660B
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Abstract
This application discloses a kind of Double bottom pad, this Double bottom pad comprises: the first pad and the second pad, the first pad has the first hole track, the second pad has the second hole track; The varying in size of first hole track and the second hole track, mutually not interlock; The medial surface of the first pad and the second pad has groove, first pad and the second pad are when pasting, and groove keeps different directions, and the edge fluid sealant of the first pad and the second pad or tin cream are pasted together, first pad is fixedly connected with the second pad, and forms the cavity of surrounding sealing.By this double-deck pad; when there is greater impact in the external world; arrive in MEMS sheet cavity again after first passing through the cavity of the first pad and the formation of the second pad; cavity has the effect of buffer gas flow, filtration and damping; after dust enters; can be filtered by cavity, reach the object of available protecting MEMS sheet, overall MEMS curve can be improved by the size of adjusting hole and track simultaneously.The invention also discloses a kind of MEMS microphone, this MEMS microphone has described Double bottom pad, effectively avoids MEMS sheet to be subject to greater impact, strengthens the reliability of MEMS microphone.
Description
Technical field
The present invention relates to mike technique field, in particular, relate to a kind of Double bottom pad and a kind of MEMS microphone.
Background technology
Microphone also claims microphone, microphone or microphone, and MIC write a Chinese character in simplified form in English, and it is a kind of electro-acoustic element sound wave being changed into the signal of telecommunication, plays a crucial role in public address or recording and broadcast system.Microphone comprises ECM (ElectretCondensorMicrophone, electric capacitor microphone) microphone and MEMS (MicroElectroMechanicalsystems, microelectromechanical systems) microphone, now generally use MEMS microphone, referring to accompanying drawing 1 is common MEMS microphone structural representation, specifically comprise following parts: terminal block 1, MEMS sheet 2, MEMS sheet packaging plastic 3, MEMS diaphragm 4, gold thread 5, ASIC (ApplicationSpecificIntegratedCircuit, application-specific integrated circuit (ASIC)) plate 6, ASIC plate fixing glue 7, ASIC plate packaging plastic 8, shell 9, fluid sealant or tin cream 10, the annular seal space 11 that shell 9 and terminal block 1 are formed and sound hole 12, wherein: MEMS sheet 2 bonds on terminal block 1 by MEMS sheet packaging plastic 3, ASIC plate 6 bonds on terminal block 1 by ASIC fixing glue 7, ASIC plate 6 is fixedly encapsulated on terminal block 1 by ASIC plate packaging plastic 8, MEMS sheet 2 and ASIC plate 6 link together by gold thread 5, and ASIC plate 6 is connected with terminal block 1 by another root gold thread 5, signal to be delivered on terminal block 1 and to export.
As shown in Figure 1, acoustic pressure directly enters into MEMS sheet 2 inside cavity by sound hole 12, and the MEMS diaphragm 4 on MEMS sheet 2 is vibrated, realize acoustic-electric to transform, but be directly delivered to when if acoustic pressure is higher on MEMS sheet 2, the vibration on MEMS diaphragm 4 is strengthened, is easy to the damage causing MEMS diaphragm 4.
Therefore, providing a kind of Double bottom pad and a kind of MEMS microphone, reach available protecting MEMS diaphragm, avoid the damage of MEMS diaphragm, is those skilled in the art's technical problems urgently to be resolved hurrily.
Summary of the invention
In view of this, the invention provides a kind of Double bottom pad and a kind of MEMS microphone, to overcome due to when acoustic pressure is higher in prior art, acoustic pressure is directly delivered on MEMS sheet by sound hole, vibration on MEMS diaphragm is strengthened, causes the problem that MEMS diaphragm damages.
For achieving the above object, the invention provides following technical scheme:
A kind of Double bottom pad, comprising: the first pad 13 and the second pad 14, described first pad 13 has the first hole track, described second pad has the second hole track 16; The varying in size of described first hole track 17 and described second hole track 16, mutually not interlock; The medial surface of described first pad 13 and described second pad 14 has groove 18; Described first pad 13 and described second pad 14 are when pasting, described groove 18 keeps different directions, edge fluid sealant or the tin cream 15 of described first pad 13 and described second pad 14 are pasted together, described first pad 13 is fixedly connected with described second pad 14, and forms the cavity of surrounding sealing.
Wherein, the described groove 18 described first pad 13 and described second pad 14 arranged is the groove of any angle.
Wherein, the size of the described hole track 16 and 17 described first pad 13 and described second pad 14 arranged and track adjustable.
Wherein, described first pad 13 and described second pad 14 are metallic gasket or alloy pad or stainless steel gasket or non-metallic gasket or semi-metallic gasket.
Wherein, the center of described first pad 13 and described second pad 14 can arrange porose.
Wherein, the adjustable interval between described first pad 13 and described second pad 14.
The present invention is on the basis of above-mentioned disclosed a kind of Double bottom pad, also disclose a kind of MEMS microphone, comprise: the annular seal space 11 that terminal block 1, MEMS sheet 2, MEMS sheet packaging plastic 3, MEMS diaphragm 4, gold thread 5, ASIC plate 6, ASIC plate fixing glue 7, ASIC plate packaging plastic 8, shell 9, fluid sealant or tin cream 10, shell 9 and terminal block 1 are formed and sound hole 12, also comprise Double bottom pad described above, described Double bottom pad comprises: the first pad 13 and the second pad 14, wherein
Described first pad 13 is pasted onto on described terminal block 1 by packaging plastic 19, and described second pad 14 is pasted with described MEMS sheet 2 is fixing by described MEMS sheet packaging plastic 3.
Known via above-mentioned technical scheme, compared with prior art, the invention discloses a kind of Double bottom pad and a kind of MEMS microphone, this Double bottom pad comprises: the first pad and the second pad, first pad and the second pad are provided with the hole track of groove and different size, first pad and the second pad are when pasting, groove keeps different directions, the edge fluid sealant of the first pad and the second pad or tin cream are pasted together, first pad is fixedly connected with the second pad, and forms the cavity of surrounding sealing.By this double-deck pad; when there is greater impact in the external world; arrive in MEMS sheet cavity again after first passing through the cavity of the first pad and the formation of the second pad; cavity has the effect of buffer gas flow, filtration and damping; after dust enters; can be filtered by cavity, reach the object of available protecting MEMS sheet, overall MEMS curve can be improved by the size of adjusting hole and track simultaneously.The invention also discloses a kind of MEMS microphone, this MEMS microphone has described Double bottom pad, effectively avoids MEMS sheet to be subject to greater impact, strengthens the reliability of MEMS microphone.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Fig. 1 is the structural representation of common MEMS microphone;
The structural representation of Fig. 2 a kind of Double bottom pad disclosed in the embodiment of the present invention;
The front schematic view of Fig. 3 first pad disclosed in the embodiment of the present invention;
The side schematic view of Fig. 4 first pad disclosed in the embodiment of the present invention;
The front schematic view of Fig. 5 second pad disclosed in the embodiment of the present invention;
The side schematic view of Fig. 6 second pad disclosed in the embodiment of the present invention;
Fig. 7 perspective view that the first pad and the second pad are pasted together disclosed in the embodiment of the present invention;
The another kind of scheme schematic diagram of Fig. 8 the first pad and second pad disclosed in the embodiment of the present invention;
The airflow directional diagram of Fig. 9 disclosed in the embodiment of the present invention between the first pad and the second pad;
The birds-eye perspective in the airflow direction of Figure 10 disclosed in the embodiment of the present invention between the first pad and the second pad;
The structural representation of Figure 11 a kind of MEMS microphone disclosed in the embodiment of the present invention.
The annular seal space 11 that terminal block 1, MEMS sheet 2, MEMS sheet packaging plastic 3, MEMS diaphragm 4, gold thread 5, ASIC plate 6, ASIC plate fixing glue 7, ASIC plate packaging plastic 8, shell 9, fluid sealant or tin cream 10, shell 9 are formed with terminal block 1, sound hole 12, first pad 13, second pad 14, fluid sealant or tin cream 15, hole track 16 and 17, groove 18, packaging plastic 19.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The invention discloses a kind of Double bottom pad, this Double bottom pad comprises: the first pad and the second pad, first pad and the second pad are provided with the hole track of groove and different size, first pad and the second pad are when pasting, groove keeps different directions, the edge fluid sealant of the first pad and the second pad or tin cream are pasted together, and the first pad is fixedly connected with the second pad, and form the cavity of surrounding sealing.By this double-deck pad; when there is greater impact in the external world; arrive in MEMS sheet cavity again after first passing through the cavity of the first pad and the formation of the second pad; cavity has the effect of buffer gas flow, filtration and damping; after dust enters; can be filtered by cavity, reach the object of available protecting MEMS sheet, overall MEMS curve can be improved by the size of adjusting hole and track simultaneously.The invention also discloses a kind of MEMS microphone, this MEMS microphone has described Double bottom pad, effectively avoids MEMS sheet to be subject to greater impact, strengthens the reliability of MEMS microphone.
Refer to accompanying drawing 2, a kind of structural representation of Double bottom pad disclosed in the embodiment of the present invention.The embodiment of the invention discloses a kind of Double bottom pad, the structure of this Double bottom pad specifically comprises: the first pad 13 and the second pad 14, described first pad 13 and described second pad 14 are provided with the hole track 16 and 17 of groove 18 and different size, described first pad 13 and described second pad 14 are when pasting, described groove 18 keeps different directions, edge fluid sealant or the tin cream 15 of described first pad 13 and described second pad 14 are pasted together, described first pad 13 is fixedly connected with described second pad 14, and forms the cavity of surrounding sealing.
Concrete, refer to the front schematic view of accompanying drawing 3 to 6, Fig. 3 first pad disclosed in the embodiment of the present invention; The side schematic view of Fig. 4 first pad disclosed in the embodiment of the present invention; The front schematic view of Fig. 5 second pad disclosed in the embodiment of the present invention; The side schematic view of Fig. 6 second pad disclosed in the embodiment of the present invention.
Preferably, the described groove 18 described first pad 13 and described second pad 14 arranged is the groove of any angle.
Preferably, the size of the described hole track 16 and 17 described first pad 13 and described second pad 14 arranged and track adjustable.
Preferably, described first pad 13 and described second pad 14 are metallic gasket or alloy pad or stainless steel gasket or non-metallic gasket or semi-metallic gasket.
Preferably, the center of described first pad 13 and described second pad 14 can arrange porose.
Preferably, the adjustable interval between described first pad 13 and described second pad 14.
Concrete, refer to accompanying drawing 7, the perspective view that the first pad and the second pad are pasted together disclosed in the embodiment of the present invention.The scheme of groove as shown in Fig. 3 to 7 of the first pad 13 described above and the second pad 14; in addition; in order to protection scope of the present invention expands; in the present invention, the groove of the first pad 13 and the second pad 14 also can be as shown in Figure 8; refer to accompanying drawing 8, the another kind of scheme schematic diagram of the first pad and the second pad disclosed in the embodiment of the present invention.
Refer to accompanying drawing 9, the airflow directional diagram disclosed in the embodiment of the present invention between the first pad and the second pad.Concrete; when sound press is transmitted to MEMS sheet 2 by sound hole 12; first through the hole track 17 of the first pad 13; carry out in the cavities after damping, sound press is reduced and filters, then be passed in MEMS sheet 2 cavity by the hole track 16 on the second pad 14; cavity has the effect of buffer gas flow, filtration and damping; after dust enters, can be filtered by cavity, reach the object of available protecting MEMS sheet.
Concrete, refer to accompanying drawing 10, the birds-eye perspective in the airflow direction disclosed in the embodiment of the present invention between the first pad and the second pad.Acoustic pressure is flowed by zigzag middle cavity after entering into pad 13 by R1 circular hole sound hole, has common cavity place to pad 14, and the cavity along pad 14 circulates, and in R2 circle, by R2 hole, is passed to the cavity of MEMS sheet.
A kind of Double bottom pad disclosed in the embodiment of the present invention, this Double bottom pad comprises: the first pad and the second pad, first pad and the second pad are provided with the hole track of groove and different size, first pad and the second pad are when pasting, groove keeps different directions, the edge fluid sealant of the first pad and the second pad or tin cream are pasted together, and the first pad is fixedly connected with the second pad, and form the cavity of surrounding sealing.By this double-deck pad; when there is greater impact in the external world; arrive in MEMS sheet cavity again after first passing through the cavity of the first pad and the formation of the second pad; cavity has the effect of buffer gas flow, filtration and damping; after dust enters; can be filtered by cavity, reach the object of available protecting MEMS sheet, overall MEMS curve can be improved by the size of adjusting hole and track simultaneously.
On a kind of disclosed in the invention described above embodiment basis of double-deck pad, the embodiment of the invention also discloses a kind of MEMS microphone, refer to accompanying drawing 11, a kind of structural representation of MEMS microphone disclosed in the embodiment of the present invention, this MEMS microphone specifically comprises: terminal block 1, MEMS sheet 2, MEMS sheet packaging plastic 3, MEMS diaphragm 4, gold thread 5, ASIC plate 6, ASIC plate fixing glue 7, ASIC plate packaging plastic 8, shell 9, fluid sealant or tin cream 10, the annular seal space 11 that shell 9 and terminal block 1 are formed and sound hole 12, also comprise the Double bottom pad described in claim 1-6 any one, described Double bottom pad comprises: the first pad 13 and the second pad 14, wherein, MEMS sheet 2 bonds on terminal block 1 by MEMS sheet packaging plastic 3, ASIC plate 6 bonds on terminal block 1 by ASIC fixing glue 7, ASIC plate 6 is fixedly encapsulated on terminal block 1 by ASIC plate packaging plastic 8, MEMS sheet 2 and ASIC plate 6 link together by gold thread 5, and ASIC plate 6 is connected with terminal block 1 by another root gold thread 5, signal to be delivered on terminal block 1 and to export, described first pad 13 is pasted onto on described terminal block 1 by packaging plastic 19, described second pad 14 is pasted with described MEMS sheet 2 is fixing by described MEMS sheet packaging plastic 3.When acoustic pressure enters into microphone inside by sound control 12, what first pass through is cavity, serves cushioning effect.
A kind of MEMS microphone disclosed by the invention; this MEMS microphone has described Double bottom pad; when there is greater impact in the external world; arrive in MEMS sheet cavity again after first passing through the cavity of the first pad and the formation of the second pad; cavity has the effect of buffer gas flow, filtration and damping; after dust enters; can be filtered by cavity; reach the object of available protecting MEMS sheet; overall MEMS curve can be improved by the size of adjusting hole and track simultaneously; effectively avoid MEMS sheet to be subject to greater impact, strengthen the reliability of MEMS microphone.
In sum: the invention discloses a kind of Double bottom pad and a kind of MEMS microphone, this Double bottom pad comprises: the first pad and the second pad, first pad and the second pad are provided with the hole track of groove and different size, first pad and the second pad are when pasting, groove keeps different directions, the edge fluid sealant of the first pad and the second pad or tin cream are pasted together, and the first pad is fixedly connected with the second pad, and form the cavity of surrounding sealing.By this double-deck pad; when there is greater impact in the external world; arrive in MEMS sheet cavity again after first passing through the cavity of the first pad and the formation of the second pad; cavity has the effect of buffer gas flow, filtration and damping; after dust enters; can be filtered by cavity, reach the object of available protecting MEMS sheet, overall MEMS curve can be improved by the size of adjusting hole and track simultaneously.The invention also discloses a kind of MEMS microphone, this MEMS microphone has described Double bottom pad, effectively avoids MEMS sheet to be subject to greater impact, strengthens the reliability of MEMS microphone.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a Double bottom pad, it is characterized in that, comprise: the first pad (13) and the second pad (14), described first pad (13) has the first hole track (17), described second pad (14) has the second hole track (16); The varying in size of described first hole track (17) and described second hole track (16), mutually not interlock; The medial surface of described first pad (13) and described second pad (14) has groove (18); Described first pad (13) and described second pad (14) are when pasting, described groove (18) keeps different directions, edge fluid sealant or the tin cream (15) of described first pad (13) and described second pad (14) are pasted together, described first pad (13) is fixedly connected with described second pad (14), and forms the cavity of surrounding sealing.
2. Double bottom pad according to claim 1, is characterized in that, the groove that described first pad (13) and the upper described groove (18) arranged of described second pad (14) are any angle.
3. Double bottom pad according to claim 1, is characterized in that, the size in described first pad (13) and upper described hole track (16) and (17) arranged of described second pad (14) and track adjustable.
4. Double bottom pad according to claim 1, is characterized in that, described first pad (13) and described second pad (14) are metallic gasket or alloy pad or stainless steel gasket or non-metallic gasket or semi-metallic gasket.
5. Double bottom pad according to claim 1, is characterized in that, the center of described first pad (13) and described second pad (14) can arrange porose.
6. Double bottom pad according to claim 1, is characterized in that, the adjustable interval between described first pad (13) and described second pad (14).
7. a MEMS microphone, comprise: terminal block (1), MEMS sheet (2), MEMS sheet packaging plastic (3), MEMS diaphragm (4), gold thread (5), ASIC plate (6), ASIC plate fixing glue (7), ASIC plate packaging plastic (8), shell (9), fluid sealant or tin cream (10), the annular seal space (11) that shell (9) and terminal block (1) are formed and sound hole (12), it is characterized in that, also comprise the Double bottom pad described in claim 1-6 any one, described Double bottom pad comprises: the first pad (13) and the second pad (14), wherein,
Described first pad (13) is pasted onto on described terminal block (1) by packaging plastic (19), and described second pad (14) is pasted by described MEMS sheet packaging plastic (3) and described MEMS sheet (2) are fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310162352.2A CN103281660B (en) | 2013-05-06 | 2013-05-06 | A kind of Double bottom pad and a kind of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310162352.2A CN103281660B (en) | 2013-05-06 | 2013-05-06 | A kind of Double bottom pad and a kind of MEMS microphone |
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| Publication Number | Publication Date |
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| CN103281660A CN103281660A (en) | 2013-09-04 |
| CN103281660B true CN103281660B (en) | 2015-11-18 |
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| CN201310162352.2A Active CN103281660B (en) | 2013-05-06 | 2013-05-06 | A kind of Double bottom pad and a kind of MEMS microphone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10239748B2 (en) | 2013-10-16 | 2019-03-26 | Stmicroelectronics S.R.L. | Microelectromechanical device with protection for bonding |
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| CN201854425U (en) * | 2010-07-25 | 2011-06-01 | 歌尔声学股份有限公司 | Silicon microphone |
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| CN102932722A (en) * | 2012-11-08 | 2013-02-13 | 山东共达电声股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN203289643U (en) * | 2013-05-06 | 2013-11-13 | 山东共达电声股份有限公司 | Double-bottom gasket and MEMS microphone |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7382048B2 (en) * | 2003-02-28 | 2008-06-03 | Knowles Electronics, Llc | Acoustic transducer module |
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|---|---|---|---|---|
| CN201160322Y (en) * | 2008-02-29 | 2008-12-03 | 瑞声声学科技(深圳)有限公司 | Dustproof microphone |
| CN201854425U (en) * | 2010-07-25 | 2011-06-01 | 歌尔声学股份有限公司 | Silicon microphone |
| CN102256198A (en) * | 2011-05-27 | 2011-11-23 | 歌尔声学股份有限公司 | Silicon microphone |
| CN102291661A (en) * | 2011-07-19 | 2011-12-21 | 恩平市海天电子科技有限公司 | Anti-electromagnetic-interference capacitor microphone |
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| CN203289643U (en) * | 2013-05-06 | 2013-11-13 | 山东共达电声股份有限公司 | Double-bottom gasket and MEMS microphone |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10239748B2 (en) | 2013-10-16 | 2019-03-26 | Stmicroelectronics S.R.L. | Microelectromechanical device with protection for bonding |
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| CN103281660A (en) | 2013-09-04 |
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