CN207603920U - A kind of Electret Condencer Microphone - Google Patents
A kind of Electret Condencer Microphone Download PDFInfo
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- CN207603920U CN207603920U CN201721786987.XU CN201721786987U CN207603920U CN 207603920 U CN207603920 U CN 207603920U CN 201721786987 U CN201721786987 U CN 201721786987U CN 207603920 U CN207603920 U CN 207603920U
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- integrated circuit
- capacitance
- vibrating diaphragm
- circuit plate
- noise reduction
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Abstract
The utility model discloses a kind of Electret Condencer Microphone, including back pole plate, vibrating diaphragm, integrated circuit plate, signal wire and ground wire is provided on integrated circuit plate, acoustic aperture is set on back pole plate, vibrating diaphragm is between back pole plate and integrated circuit plate, and mutually insulated;The first capacitance is formed between vibrating diaphragm and back pole plate, the second capacitance is formed between vibrating diaphragm and integrated circuit plate, the first capacitance, the second capacitance are arranged in parallel and are connect with the two poles of the earth of integrated circuit plate;Vibrating diaphragm includes the inner membrance in middle position and the annular outer membrane around inner membrance peripheral side, and derivative extends first electrode, second electrode to inner membrance outward respectively with outer membrane;Multiple noise reduction perforations are provided on integrated circuit plate, noise reduction perforation hole wall is equipped with conductive coating, and noise reduction perforation forms signal wire the filter capacitor of one shunt capacitance being equivalent between the first capacitance of access, the second capacitance and integrated circuit plate.The utility model, which can eliminate or weaken outside electromagnetic interference and reduce high frequency noise in signal transduction, to be influenced, high sensitivity.
Description
Technical field
The utility model is related to mini microphone fields, and in particular to a kind of Electret Condencer Microphone.
Background technology
With the development of wireless telecommunications, Global Mobile Phone Users are more and more, and requirement of the user to mobile phone is not
Only it is satisfied with call, and is capable of providing the communication effect of high quality, the development of especially current Technology of Mobile Multimedia moves
The speech quality of mobile phone becomes more important, and the voice pick device of the microphone of mobile phone as mobile phone designs
It is bad to directly affect speech quality.
And more and better performances the microphone of application is microphone of microelectromechanicsystem system (Micro-Electro- at present
Mechanical-System Microphone), encapsulation volume is smaller than traditional electret microphone.However, built in these
Electret Condencer Microphone can be done in terms of recording because of the noise that the high-frequency device in midget plant or component are issued
It disturbs, these noises become noise of the Electret Condencer Microphone in signal transduction in addition to signal is had been received by;Also, with body
Long-pending reduction can cause the influence of outside electromagnetic interference to become prominent.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, one kind is provided it can eliminate or weaken external electromagnetic and do
Disturbing and reduce high frequency noise in signal transduction influences, the Electret Condencer Microphone of high sensitivity.
The technical solution of the utility model is as follows:A kind of Electret Condencer Microphone is oppositely arranged including back pole plate, with back pole plate
Vibrating diaphragm, the integrated circuit plate that is oppositely arranged with vibrating diaphragm, be provided with outwardly directed signal wire in the middle part of the integrated circuit plate
And ground wire, several acoustic aperture are set sound is transmitted on vibrating diaphragm on the back pole plate, the vibrating diaphragm be located at back pole plate with
Between integrated circuit plate, and mutually insulated between three;Form the first capacitance between the vibrating diaphragm and back pole plate, the vibrating diaphragm with
Form the second capacitance between integrated circuit plate, first capacitance, the second capacitance be arranged in parallel and with the two poles of the earth of integrated circuit plate
Connection;The vibrating diaphragm is included in the inner membrance of middle position and the annular outer membrane around inner membrance peripheral side, the inner membrance and outer membrane
Derivative extends first electrode, second electrode outward respectively, and the first electrode, second electrode are connected by an elastic coupling element
It connects and is located between back pole plate and integrated circuit plate;Multiple noise reductions of integrated circuit plate are provided through on the integrated circuit plate
Perforation, the multiple noise reduction perforation are set to around signal wire and ground wire, and the noise reduction perforation hole wall is equipped with conductive coating,
The noise reduction perforation forms signal wire the one bypass electricity being equivalent between the first capacitance of access, the second capacitance and integrated circuit plate
The filter capacitor of appearance.
Further, gap is equipped between the inner membrance and outer membrane.
Further, uniformly derivative extends multiple support portions on the inner membrance peripheral side.
Further, the groove of accommodating support portion is equipped on the annular inner circumferential side of the outer membrane with respect to the position of support portion.
Further, the noise reduction perforation is round or regular polygon.
Further, the noise reduction perforation is regular hexagon.
Further, the conductive coating materials are copper.
Relative to the prior art, the beneficial effects of the utility model are:
1) by the differential setting of capacitance, filtering noise signal (i.e. outside electromagnetic interference) is eliminated or is reduced electromagnetism and does
The harmful effect brought is disturbed, improves the sensitivity of microphone;
2) multiple noise reduction perforations can form signal wire one and be equivalent to the first capacitance of access, the second capacitance and integrated circuit plate
Between shunt capacitance filter capacitor, effect is filtered out to the high-frequency noise in input signal, can be mixing in signal
High frequency spurs filter out, the final influence for reducing high-frequency noise to signal;
3) vibrating diaphragm is formed by being in the inner membrance of middle position and the annular outer membrane around inner membrance peripheral side, inner membrance and outer membrane point
Not derivative not outward to extend first electrode, second electrode, first electrode, second electrode are connected by an elastic coupling element and positioned
Between back pole plate and integrated circuit plate, to reduce the constraint of vibrating diaphragm week lateral edge portion, sensitivity can be effectively improved, meanwhile,
The diaphragm structure can reduce the demand to electrode, be conducive to save more spaces, measurement result is better than periphery fixed capacity formula
Microphone.
Description of the drawings
Fig. 1 is a kind of structure diagram of Electret Condencer Microphone described in the utility model embodiment;
Fig. 2 is the structure diagram of vibrating diaphragm in the utility model embodiment;
Fig. 3 is a kind of condenser network schematic diagram of Electret Condencer Microphone described in the utility model embodiment;
Fig. 4 is the distribution schematic diagram of noise reduction perforation in the utility model embodiment.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Referring to Fig. 1, a kind of Electret Condencer Microphone of the utility model embodiment, including back pole plate 1, with back pole plate 1 relatively
The vibrating diaphragm 2 of setting, the integrated circuit plate 3 being oppositely arranged with vibrating diaphragm 2, the middle part of integrated circuit plate 3 is provided with outwardly directed letter
Number line 4 and ground wire 5, setting several acoustic aperture 11 on back pole plate 1, vibrating diaphragm 2 is located at back pole plate sound is transmitted on vibrating diaphragm 2
Between 1 and integrated circuit plate 3.
As shown in Fig. 2, vibrating diaphragm 2 includes the inner membrance 21 in middle position and the annular outer membrane around 21 peripheral side of inner membrance
22, body shape is equipped with gap 23 between circular inner membrance 21 and the outer membrane 22 of annular, advantageously reduces parasitic capacitance, inner membrance
21 outward it is derivative extend first electrode 24 by an elastic coupling element 6 connection be located in back pole plate 1 and integrated circuit plate 3 it
Between, the derivative extending direction outer membrane derivative of opposite first pole 24 extends second electrode 25, and second electrode 25 passes through another bullet
Property connecting element 6 connection be located between back pole plate 1 and integrated circuit plate 3.In addition, uniformly derive on 21 peripheral side of inner membrance
Extend 3 support portions 26, the quantity in certain actual support portion 26 is not limited thereto.Opposite, the annular inner circumferential of outer membrane 22
The groove 27 of accommodating support portion 26 is equipped on side with respect to the position of support portion 26.The vibrating diaphragm of this structure can be reduced to number of electrodes
Demand, be conducive to save more spaces in favor of to increasingly miniaturization;Simultaneously also to reduce vibrating diaphragm week lateral edge portion
Constraint, sensitivity can be effectively improved.
When external voice is transmitted to by the acoustic aperture 11 of back pole plate 1 on vibrating diaphragm 2, vibrating diaphragm 2 is produced because of the effect of acoustic pressure
Raw up-down vibration, as shown in phantom in Figure 1.Back pole plate 1, vibrating diaphragm 2 on the conductive layer 31 of integrated circuit plate 3 with that can be fixed electricity
Pressure, and mutually insulated between back pole plate 1, vibrating diaphragm 2 and integrated circuit plate 3, in this way, after respectively powering up, back pole plate 1 is with shaking
The first capacitance C1 (referring to Fig. 3) is formed between film 2, the second electricity is formed between vibrating diaphragm 2 and the conductive layer 31 of integrated circuit plate 3
Hold C2 (referring to Fig. 3), and be arranged in parallel between two capacitances, the capacitance connection after being arranged in parallel to the two of integrated circuit plate 3
Pole.When vibrating diaphragm 2 generates vibration, the conductive layer 31 of the distance between vibrating diaphragm 2 and back pole plate 1 and vibrating diaphragm 2 and integrated circuit plate 3
Distance change simultaneously, and the conductive layer of the variation of the distance between vibrating diaphragm 2 and back pole plate 1 and vibrating diaphragm 2 and integrated circuit plate 3
The variation of 31 distance is opposite, that is, another reduces during an increase, and the variation of distance leads to the first capacitance C1 and the second capacitance
The value of C2 changes, the variation of the value of the capacitance after parallel connection so that electric current is generated in entire circuit, and this electric current is collected
It is received into circuit board 3, voice signal is then converted into electric signal.Pass through the signal wire 4 and external electrical on integrated circuit plate 3 again
Road connects, and the electric signal transmission converted the sound into is gone out.
External electromagnetic interference is also electricity in form, and the electric current that outside electromagnetic interference generates acts on the first capacitance C1 simultaneously
On the second capacitance C2, since difference acts on, which is cancelled or is retrieved.
As the preferred technical solution of the present embodiment, as Figure 1 and Figure 4, it is provided through integrating on integrated circuit plate 3
Multiple noise reduction perforations 32 of circuit board 3, the multiple noise reduction perforation 32 are set to around signal wire and ground wire.In this implementation
In example, the noise reduction perforation 32 is six, is round or regular polygon.In order to shorten spacing and reduced bore, can adopt
With regular hexagon, the aperture center of such shape is approximate with round perforation to Edge Distance, and spacing is more shorter than round perforation between hole.
In the present embodiment, for the ease of processing, the noise reduction perforation 32 is using round.
Multiple noise reduction perforations 32 on integrated circuit plate 3 can generate signal wire 4 certain inductance capacitance, these noise reductions pass through
The inductance capacitance that hole 32 generates is equivalent to the shunt capacitance between the first capacitance C1 of access, the second capacitance C2 and integrated circuit plate 3
Filter capacitor C3 (referring to Fig. 3).Since filter capacitor C3 filters out effect to the high-frequency noise in input signal, it is possible to
The high frequency spurs mixed in signal are filtered out, so as to reduce influence of the high-frequency noise to signal.It, can be in order to increase capacity effect
Noise reduction perforation is shaped to just polygon by the quantity of appropriate increase noise reduction perforation 32, the aperture for reducing noise reduction perforation 32
Shape.32 hole wall of noise reduction perforation has conducting wire coating (non-label).The conductive coating can be silver or copper.In the present embodiment,
Using copper.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all in this practicality
All any modification, equivalent and improvement made within novel spirit and principle etc., should be included in the guarantor of the utility model
Within the scope of shield.
Claims (7)
1. a kind of Electret Condencer Microphone, the vibrating diaphragm being oppositely arranged including back pole plate, with back pole plate are integrated with what vibrating diaphragm was oppositely arranged
Circuit board is provided with outwardly directed signal wire and ground wire in the middle part of the integrated circuit plate, it is characterised in that:The backplane
Several acoustic aperture are set on plate sound is transmitted on vibrating diaphragm, the vibrating diaphragm between back pole plate and integrated circuit plate, and
Mutually insulated between three;The first capacitance, shape between the vibrating diaphragm and integrated circuit plate are formed between the vibrating diaphragm and back pole plate
Into the second capacitance, first capacitance, the second capacitance are arranged in parallel and are connect with the two poles of the earth of integrated circuit plate;The vibrating diaphragm includes
Inner membrance in middle position and the annular outer membrane around inner membrance peripheral side, the inner membrance with outer membrane extend outward respectively by derivative
First electrode, second electrode, the first electrode, second electrode are located in back pole plate and collection by elastic coupling element connection
Into between circuit board;Multiple noise reduction perforations of integrated circuit plate, the multiple noise reduction are provided through on the integrated circuit plate
Perforation is set to around signal wire and ground wire, and the noise reduction perforation hole wall is equipped with conductive coating, and the noise reduction perforation is to letter
Number line forms the filter capacitor of a shunt capacitance being equivalent between the first capacitance of access, the second capacitance and integrated circuit plate.
2. a kind of Electret Condencer Microphone according to claim 1, it is characterised in that:Between being equipped between the inner membrance and outer membrane
Gap.
3. a kind of Electret Condencer Microphone according to claim 1, it is characterised in that:Uniformly derive on the inner membrance peripheral side
Extend multiple support portions.
4. a kind of Electret Condencer Microphone according to claim 3, it is characterised in that:Phase on the annular inner circumferential side of the outer membrane
The groove of accommodating support portion is equipped with to the position of support portion.
5. a kind of Electret Condencer Microphone according to claim 1, it is characterised in that:The noise reduction perforation is round or just more
Side shape.
6. a kind of Electret Condencer Microphone according to claim 5, it is characterised in that:The noise reduction perforation is regular hexagon.
7. a kind of Electret Condencer Microphone according to claim 1, it is characterised in that:The conductive coating materials are copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721786987.XU CN207603920U (en) | 2017-12-19 | 2017-12-19 | A kind of Electret Condencer Microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721786987.XU CN207603920U (en) | 2017-12-19 | 2017-12-19 | A kind of Electret Condencer Microphone |
Publications (1)
Publication Number | Publication Date |
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CN207603920U true CN207603920U (en) | 2018-07-10 |
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ID=62767483
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CN201721786987.XU Active CN207603920U (en) | 2017-12-19 | 2017-12-19 | A kind of Electret Condencer Microphone |
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CN (1) | CN207603920U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024040648A1 (en) * | 2022-08-25 | 2024-02-29 | 瑞声声学科技(深圳)有限公司 | Microphone chip and microphone |
-
2017
- 2017-12-19 CN CN201721786987.XU patent/CN207603920U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024040648A1 (en) * | 2022-08-25 | 2024-02-29 | 瑞声声学科技(深圳)有限公司 | Microphone chip and microphone |
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