CN101321413B - Condenser type microphone - Google Patents
Condenser type microphone Download PDFInfo
- Publication number
- CN101321413B CN101321413B CN2008100682965A CN200810068296A CN101321413B CN 101321413 B CN101321413 B CN 101321413B CN 2008100682965 A CN2008100682965 A CN 2008100682965A CN 200810068296 A CN200810068296 A CN 200810068296A CN 101321413 B CN101321413 B CN 101321413B
- Authority
- CN
- China
- Prior art keywords
- vibrating diaphragm
- integrated circuit
- mounted integrated
- pole plate
- back pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention relates to a capacitance-type microphone, in particular to a micro electro-mechanical system (short for MEMS) microphone, comprising a back-electrode plate, a diaphragm and an integrated circuit board. A first capacitance is formed between the back-electrode plate and the diaphragm. A second capacitance is formed between the diaphragm and the integrated circuit board. The first capacitance and the second capacitance are electrically connected to the integrated circuit board through difference. The noise signal can be filtered and the sensitivity of the microphone can be improved through the difference connection of two capacitances.
Description
[technical field]
The present invention relates to Electret Condencer Microphone, relate in particular to a kind of microelectromechanical-systems microphone.
[background technology]
Development along with wireless telecommunications; Global Mobile Phone Users is more and more, and the user not only is satisfied with conversation to the requirement of mobile phone, and wants high-quality communication effect can be provided; Especially at present the development of mobile multimedia technology; The speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone), and its encapsulation volume is littler than traditional electret microphone.Yet reducing of volume causes the influence of outside electromagnetic interference to become outstanding.How to eliminate or weaken outside electromagnetic interference, become important problem.
The present invention provides a kind of new Electret Condencer Microphone of eliminating or weakening outside electromagnetic interference.
[summary of the invention]
The technical problem that the present invention will solve is to provide a kind of new Electret Condencer Microphone, and outside electromagnetic interference can eliminated or weaken to this microphone, improves sensitivity of microphone.
The present invention solves above-mentioned technical problem through such technical scheme:
A kind of Electret Condencer Microphone; Mainly comprise: back pole plate, the vibrating diaphragm that is oppositely arranged with back pole plate, the surface-mounted integrated circuit that is oppositely arranged with vibrating diaphragm; Vibrating diaphragm is between back pole plate and surface-mounted integrated circuit, and mutually insulated between the three, forms first electric capacity between vibrating diaphragm and the back pole plate; Form second electric capacity between vibrating diaphragm and the surface-mounted integrated circuit, two electric capacity are electrically connected to other circuit on the surface-mounted integrated circuit with difference form.
As a kind of improvement of the present invention, this Electret Condencer Microphone is provided with elastic coupling element in addition, and this elastic coupling element lays respectively between vibrating diaphragm and the surface-mounted integrated circuit and between vibrating diaphragm and the back pole plate, is used for vibrating diaphragm is positioned between back pole plate and the surface-mounted integrated circuit.
As another kind of improvement the of the present invention, be provided with on the back pole plate some through holes in order to transmission sound to vibrating diaphragm.
As another kind of improvement the of the present invention, surface-mounted integrated circuit is provided with conductive part and is electrically connected to external circuit.
As another kind of improvement the of the present invention, offer some sound holes on the surface-mounted integrated circuit.
Compared with prior art, the present invention has the following advantages: through the differential setting of electric capacity, filtering noise signal (being outside electromagnetic interference) is eliminated or has been weakened the harmful effect that electromagnetic interference is brought, the sensitivity that has improved microphone.
[description of drawings]
Fig. 1 is the cross-sectional schematic of Electret Condencer Microphone of the present invention.
Fig. 2 is the capacitance difference parallel circuit sketch map of Electret Condencer Microphone of the present invention.
[embodiment]
Specify concrete structure of the present invention below in conjunction with accompanying drawing.
Electret Condencer Microphone of the present invention is mainly used on the mobile phone, accepts sound and sound is converted into the signal of telecommunication.
Please join Fig. 1 and Fig. 2, Electret Condencer Microphone 10 of the present invention, the vibrating diaphragm 12 that mainly comprises surface-mounted integrated circuit 11, is oppositely arranged with surface-mounted integrated circuit 11, with the back pole plate 13 that vibrating diaphragm 12 is oppositely arranged, vibrating diaphragm 12 is between surface-mounted integrated circuit 11 and back pole plate 13.
Surface-mounted integrated circuit 11 is provided with conductive layer 111 in the face of the part of vibrating diaphragm 12.
For vibrating diaphragm 12 being positioned between surface-mounted integrated circuit 11 and the back pole plate 13, respectively between back pole plate 13 and the vibrating diaphragm 12 and between vibrating diaphragm 12 and the surface-mounted integrated circuit 11 elastic coupling element 14 being set.
When the through hole 131 of external voice through back pole plate 13 is delivered to 12 last times of vibrating diaphragm, vibrating diaphragm 12 produces up-down vibration because of the effect of acoustic pressure, shown in dotted line among Fig. 1.Can add fixedly voltage on the conductive layer 111 of back pole plate 13, vibrating diaphragm 12 and surface-mounted integrated circuit 11; And mutually insulated between the conductive layer 111 of back pole plate 13, vibrating diaphragm 12 and surface-mounted integrated circuit 11; Like this; After powering up separately, just formed first capacitor C 1 (ginseng Fig. 2) between back pole plate 13 and the vibrating diaphragm 12, form second capacitor C 2 (ginseng Fig. 2) between the conductive layer 111 of vibrating diaphragm 12 and surface-mounted integrated circuit 11; And parallel connection is provided with between two electric capacity, and the electric capacity after parallel connection is provided with is connected to other circuit part of surface-mounted integrated circuit 11.When vibrating diaphragm 12 produces vibration; Distance between vibrating diaphragm 12 and the back pole plate 13 and vibrating diaphragm 12 change with the distance of the conductive layer 111 of surface-mounted integrated circuit 11 simultaneously, and the variable in distance between vibrating diaphragm 12 and the back pole plate 13 is opposite with the variation of the distance of the conductive layer 111 of surface-mounted integrated circuit 11 with vibrating diaphragm 12, promptly; Another reduces during an increase; The variation of distance causes the value of first capacitor C 1 and second capacitor C 2 to change, and the variation of value of the electric capacity after the parallel connection makes to produce electric current in the entire circuit; And this electric current is integrated circuit board and accepts, so microphone 10 converts voice signal to the signal of telecommunication.Conductive part 112 is set on the surface-mounted integrated circuit 11, and in order to be connected with external circuit, the signal of telecommunication that sound is converted transfers out.
Outside electromagnetic interference also is electricity in form, and the electric current that outside electromagnetic interference produces acts on capacitor C 1 and the C2 simultaneously, because the difference effect, this electromagnetic interference is cancelled or is weakened.
In addition, on surface-mounted integrated circuit 11, also can offer sound hole 113, so that sound is delivered on the vibrating diaphragm 12 from surface-mounted integrated circuit 11 sides.
The above is merely preferred embodiments of the present invention; Protection scope of the present invention is not exceeded with above-mentioned execution mode; As long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (5)
1. Electret Condencer Microphone; Mainly comprise: back pole plate, the vibrating diaphragm that is oppositely arranged with back pole plate, with the surface-mounted integrated circuit that vibrating diaphragm is oppositely arranged, it is characterized in that: vibrating diaphragm is between back pole plate and surface-mounted integrated circuit, and mutually insulated between the three; Form first electric capacity between vibrating diaphragm and the back pole plate; Form second electric capacity between vibrating diaphragm and the surface-mounted integrated circuit, two electric capacity are electrically connected to other circuit on the surface-mounted integrated circuit with difference form, and the parallel connection of two electric capacity is provided with; Electric capacity after parallel connection is provided with is connected to other circuit of surface-mounted integrated circuit; When vibrating diaphragm produced vibration, the distance of the conductive layer of distance between vibrating diaphragm and the back pole plate and vibrating diaphragm and surface-mounted integrated circuit changed simultaneously, and the variation of the distance of the conductive layer of the variable in distance between vibrating diaphragm and the back pole plate and vibrating diaphragm and surface-mounted integrated circuit is opposite.
2. Electret Condencer Microphone as claimed in claim 1; It is characterized in that: this Electret Condencer Microphone is provided with elastic coupling element in addition; This elastic coupling element lays respectively between vibrating diaphragm and the surface-mounted integrated circuit and between vibrating diaphragm and the back pole plate, is used for vibrating diaphragm is positioned between back pole plate and the surface-mounted integrated circuit.
3. Electret Condencer Microphone as claimed in claim 1 is characterized in that: be provided with on the back pole plate some through holes in order to transmission sound to vibrating diaphragm.
4. Electret Condencer Microphone as claimed in claim 1, it is characterized in that: surface-mounted integrated circuit is provided with conductive part and is electrically connected to external circuit.
5. like claim 1 or 3 described Electret Condencer Microphones, it is characterized in that: offer some sound holes on the surface-mounted integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100682965A CN101321413B (en) | 2008-07-04 | 2008-07-04 | Condenser type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100682965A CN101321413B (en) | 2008-07-04 | 2008-07-04 | Condenser type microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101321413A CN101321413A (en) | 2008-12-10 |
| CN101321413B true CN101321413B (en) | 2012-03-28 |
Family
ID=40181162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100682965A Expired - Fee Related CN101321413B (en) | 2008-07-04 | 2008-07-04 | Condenser type microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101321413B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2502427B1 (en) * | 2009-11-16 | 2016-05-11 | InvenSense, Inc. | Microphone with backplate having specially shaped through-holes |
| US8860154B2 (en) * | 2011-03-11 | 2014-10-14 | Goertek Inc. | CMOS compatible silicon differential condenser microphone and method for manufacturing the same |
| CN102932718B (en) * | 2012-11-13 | 2015-09-30 | 山东共达电声股份有限公司 | A kind of electret microphone picking up differential signal |
| CN105246013B (en) * | 2014-07-11 | 2019-10-15 | 晶镁电子股份有限公司 | Microphone apparatus |
| CN106658248B (en) * | 2017-01-06 | 2019-01-18 | 北京博实联创科技有限公司 | The Electret Condencer Microphone and electronic equipment of double directing property and non-directive exchange function |
| CN107666645B (en) * | 2017-08-14 | 2020-02-18 | 苏州敏芯微电子技术股份有限公司 | Differential capacitor microphone with double diaphragms |
| CN113784264A (en) * | 2020-06-09 | 2021-12-10 | 通用微(深圳)科技有限公司 | Silicon-based microphone device and electronic equipment |
| CN113784266A (en) * | 2020-06-09 | 2021-12-10 | 通用微(深圳)科技有限公司 | Silicon-based microphone device and electronic equipment |
| CN113949979A (en) * | 2020-07-17 | 2022-01-18 | 通用微(深圳)科技有限公司 | Sound collection device, sound processing device and method, device and storage medium |
| CN118433619A (en) * | 2024-07-04 | 2024-08-02 | 深圳市晶扬电子有限公司 | Acoustic structure, airflow sensor and micro-electromechanical system microphone chip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665350A (en) * | 2004-03-05 | 2005-09-07 | 西门子测听技术有限责任公司 | Method and apparatus for matching phase of audiphone directional microphone |
| CN1838839A (en) * | 2006-04-07 | 2006-09-27 | 清华大学 | Loudspeaker simple tone detecting method |
-
2008
- 2008-07-04 CN CN2008100682965A patent/CN101321413B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665350A (en) * | 2004-03-05 | 2005-09-07 | 西门子测听技术有限责任公司 | Method and apparatus for matching phase of audiphone directional microphone |
| CN1838839A (en) * | 2006-04-07 | 2006-09-27 | 清华大学 | Loudspeaker simple tone detecting method |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2005-136628A 2005.05.26 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101321413A (en) | 2008-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101321413B (en) | Condenser type microphone | |
| CN201438743U (en) | microphone | |
| CN101588529A (en) | Silica-based condenser microphone and production method thereof | |
| CN104902415A (en) | Differential capacitive MEMS (Micro-Electro-Mechanical System) microphone | |
| CN103402160A (en) | MEMS (micro electro mechanical system) microphone and work control method of MEMS microphone | |
| US20150189443A1 (en) | Silicon Condenser Microphone | |
| CN104378724A (en) | MEMS silicon microphone without large back acoustic cavity | |
| CN105050013B (en) | A kind of operation control method of MEMS microphone and the MEMS microphone | |
| CN201226591Y (en) | Capacitance type microphone | |
| CN201528409U (en) | Micro-electro-mechanical microphone | |
| CN101835080B (en) | Silicon-based microphone | |
| CN111787474A (en) | MEMS acoustic sensor | |
| CN202587368U (en) | Micro machine system microphone | |
| CN101646120A (en) | Capacitance microphone | |
| CN201226594Y (en) | Silicon-based capacitance microphone | |
| CN101959109A (en) | Micro-electro-mechanical-system microphone | |
| CN201491261U (en) | capacitance microphone | |
| CN205320289U (en) | Capacitive microphone | |
| CN201118978Y (en) | Electret microphone | |
| CN101651919A (en) | Silicon capacitance microphone | |
| CN207603920U (en) | A kind of Electret Condencer Microphone | |
| CN101651918A (en) | Capacitance type microphone | |
| CN201967086U (en) | Microphone | |
| CN207625800U (en) | Microphone | |
| US20230171551A1 (en) | Silicon-Based Microphone Device And Electronic Device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Patent of Ruisheng acoustic technology (Shenzhen) Co.,Ltd. The person in charge Document name: payment instructions |
|
| DD01 | Delivery of document by public notice | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20210704 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |