CN201226591Y - Capacitance type microphone - Google Patents
Capacitance type microphone Download PDFInfo
- Publication number
- CN201226591Y CN201226591Y CNU2008200953021U CN200820095302U CN201226591Y CN 201226591 Y CN201226591 Y CN 201226591Y CN U2008200953021 U CNU2008200953021 U CN U2008200953021U CN 200820095302 U CN200820095302 U CN 200820095302U CN 201226591 Y CN201226591 Y CN 201226591Y
- Authority
- CN
- China
- Prior art keywords
- backboard
- microphone
- vibrating diaphragm
- sound
- electret condencer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model relates to a condenser microphone, in particular to a microphone of a Micro-Electro-Mechanical-System (hereinafter referred to as MEMS); the microphone comprises a backboard and a vibrating diaphragm arranged to the opposite of the backboard, wherein, the backboard is provided with a sound hole through which the sound can be transmitted to the vibrating diaphragm to lead the vibrating diaphragm to vibrate. The condenser microphone is also provided with a dustproof part integrated with or separated from the backboard; the dustproof part is provided with a plurality of fine holes which are communicated with the sound hole.
Description
[technical field]
The utility model relates to Electret Condencer Microphone, relates in particular to a kind of microelectromechanical-systems microphone.
[background technology]
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, the user not only is satisfied with conversation to the requirement of mobile phone, and want high-quality communication effect can be provided, especially at present the development of mobile multimedia technology, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone is called for short MEMS), and its encapsulation volume is littler than traditional electret microphone.Yet the inner components and parts of MEMS microphone as dust, can influence its acoustical behavior if be subjected to external contamination, such as desensitization, even the dust inner components and parts that can wear and tear.
As shown in Figure 1, be a kind of microphone cross-sectional schematic relevant with the utility model.This microphone 10 comprises backboard 11, vibrating diaphragm 12 relative with backboard 11 and that be connected by support portion 121, vibrating diaphragm 12 is backboard 11 up-down vibration relatively, backboard 11 is provided with hole 111 in addition, and this hole 111 can be delivered to the sound air-flow on the vibrating diaphragm 12 and cause vibrating diaphragm 12 vibrations.
Yet this hole 111 is included with dust easily, and dust is fallen on the vibrating diaphragm 12, can cause the vibration performance change, influences microphone property.
But the utility model then provides a kind of new dustproof Electret Condencer Microphone.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of new Electret Condencer Microphone, and this microphone can stop dust to enter.
The utility model solves above-mentioned technical problem by such technical scheme:
A kind of Electret Condencer Microphone, mainly comprise: backboard and the vibrating diaphragm that is oppositely arranged with backboard, backboard is provided with the sound hole that the sound air-flow can be delivered to vibrating diaphragm, this Electret Condencer Microphone is provided with dustproof portion in addition, and this dustproof portion partially filled sound hole also is provided with and some the connection also with sound hole gas can stops dust granule to advance the pore of tone-entering hole.
Compared with prior art, the utlity model has following advantage: dustproof portion is set in the position in backboard sound hole, and dustproof portion is provided with the pore that is communicated with the sound hole, these pores allow air draught to pass through, but stop entering of dust.
[description of drawings]
Fig. 1 is the microphone cross-sectional schematic relevant with the utility model.
Fig. 2 is the cross-sectional schematic of the utility model Electret Condencer Microphone.
[embodiment]
Describe concrete structure of the present utility model in detail below in conjunction with accompanying drawing.
The utility model Electret Condencer Microphone is mainly used on the mobile phone, accepts sound and sound is converted into the signal of telecommunication.
Please join Fig. 2, Electret Condencer Microphone 20, the vibrating diaphragm 22 that mainly comprises backboard 21, is oppositely arranged with backboard 21, vibrating diaphragm 22 is connected on the backboard 21 by the support portion 221 with vibrating diaphragm one or split, being respectively equipped with conductive layer on vibrating diaphragm 22 and the backboard 21 also can power up, but the part mutually insulated that powers up, like this, vibrating diaphragm 22 has just been formed the capacitor with electric capacity with backboard 21.
Because form capacitor between vibrating diaphragm 22 and the backboard 21, when vibrating diaphragm 22 vibrations, distance between the two changes, and causes capacitance to change, and the variation that electric capacity takes place has then produced electric current, thereby converts tones into the signal of telecommunication.
For stopping most of dust granule, pore 213 diameters are set between 0.02～0.08mm.
The above only is a better embodiment of the present utility model; protection range of the present utility model does not exceed with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (3)
1. Electret Condencer Microphone, mainly comprise: backboard and the vibrating diaphragm that is oppositely arranged with backboard, backboard is provided with the sound hole that the sound air-flow can be delivered to vibrating diaphragm, it is characterized in that: this Electret Condencer Microphone is provided with dustproof portion in addition, and this dustproof portion partially filled sound hole also is provided with and some the connection also with sound hole gas can stops dust granule to advance the pore of tone-entering hole.
2. Electret Condencer Microphone as claimed in claim 1 is characterized in that: pore diameter is 0.02mm～0.08mm.
3. claim 1 or 2 described Electret Condencer Microphones, it is characterized in that: dustproof portion is the part of backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200953021U CN201226591Y (en) | 2008-07-04 | 2008-07-04 | Capacitance type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200953021U CN201226591Y (en) | 2008-07-04 | 2008-07-04 | Capacitance type microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201226591Y true CN201226591Y (en) | 2009-04-22 |
Family
ID=40599494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200953021U Expired - Lifetime CN201226591Y (en) | 2008-07-04 | 2008-07-04 | Capacitance type microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201226591Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185099A (en) * | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
| CN104768112A (en) * | 2014-01-03 | 2015-07-08 | 钰太芯微电子科技（上海）有限公司 | Novel microphone structure |
| CN104780474A (en) * | 2014-01-14 | 2015-07-15 | 钰太芯微电子科技（上海）有限公司 | A dustproof microphone |
| CN104854880A (en) * | 2012-08-10 | 2015-08-19 | 美商楼氏电子有限公司 | Microphone assembly with barrier to prevent contaminant infiltration |
| WO2018103208A1 (en) * | 2016-12-05 | 2018-06-14 | 歌尔股份有限公司 | Mems microphone chip, and mems microphone |
-
2008
- 2008-07-04 CN CNU2008200953021U patent/CN201226591Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104854880A (en) * | 2012-08-10 | 2015-08-19 | 美商楼氏电子有限公司 | Microphone assembly with barrier to prevent contaminant infiltration |
| CN110312176A (en) * | 2012-08-10 | 2019-10-08 | 美商楼氏电子有限公司 | Microphone assembly |
| CN104854880B (en) * | 2012-08-10 | 2020-03-20 | 美商楼氏电子有限公司 | Microphone assembly |
| CN104185099A (en) * | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
| CN104768112A (en) * | 2014-01-03 | 2015-07-08 | 钰太芯微电子科技（上海）有限公司 | Novel microphone structure |
| CN104780474A (en) * | 2014-01-14 | 2015-07-15 | 钰太芯微电子科技（上海）有限公司 | A dustproof microphone |
| WO2018103208A1 (en) * | 2016-12-05 | 2018-06-14 | 歌尔股份有限公司 | Mems microphone chip, and mems microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090422 |