CN201403199Y - MEMS capacitance microphone - Google Patents

MEMS capacitance microphone Download PDF

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Publication number
CN201403199Y
CN201403199Y CN2009201359336U CN200920135933U CN201403199Y CN 201403199 Y CN201403199 Y CN 201403199Y CN 2009201359336 U CN2009201359336 U CN 2009201359336U CN 200920135933 U CN200920135933 U CN 200920135933U CN 201403199 Y CN201403199 Y CN 201403199Y
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CN
China
Prior art keywords
vibrating diaphragm
mems
hole
mems capacitance
capacitance microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009201359336U
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Chinese (zh)
Inventor
张睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Changzhou Co Ltd
AAC Technologies Pte Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Acoustic Technologies Changzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Acoustic Technologies Changzhou Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to CN2009201359336U priority Critical patent/CN201403199Y/en
Application granted granted Critical
Publication of CN201403199Y publication Critical patent/CN201403199Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model provides an MEMS capacitance microphone which comprises a base, a backboard parallel to the base and a diaphragm which is opposite to the backboard for forming the capacitance effect, wherein the diaphragm consists of a fixing portion and a vibration portion connected with the fixing portion, a hole is arranged on the center of the diaphragm, at least two grooves are arranged toward the direction of the fixing portion of the diaphragm from the hole, and the grooves are communicated with the hole. The MEMS capacitance microphone has excellent sensitivity.

Description

The MEMS capacitance microphone
Technical field
The utility model relates to a kind of MEMS microphone, relates in particular to a kind of MEMS microphone that is applied on the portable consumer electronic products such as mobile phone.
Background technology
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, the user not only is satisfied with conversation to the requirement of mobile phone, and want high-quality communication effect can be provided, especially at present the development of mobile multimedia technology, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone is called for short MEMS), and its encapsulation volume is littler than traditional electret microphone.
In the MEMS microphone related to the present invention, vibrating diaphragm be shaped as circle.This MEMS microphone diaphragm profit stress is beaten, and sensitivity is low.
The utility model content
The MEMS capacitance microphone that provides a kind of sensitivity good is provided the technical problems to be solved in the utility model.
For solving the problems of the technologies described above, the technical scheme that the utility model provides is:
A kind of MEMS capacitance microphone, comprise substrate, be parallel to the backboard of substrate, the relative vibrating diaphragm that forms capacity effect with backboard, described vibrating diaphragm comprises fixed part and the vibration section that is connected with fixed part, be provided with porose at the center of described vibrating diaphragm, fixed part direction from from this hole to vibrating diaphragm is provided with at least two grooves, and described groove communicates with described hole.
Preferably, described groove is about the center symmetry of vibrating diaphragm
Preferably, the number of described groove is more than or equal to 3.
Preferably, not penetrate vibrating diaphragm and its degree of depth be half of described vibrating diaphragm thickness for described hole and described groove.
Preferably, described hole and described groove connect described vibrating diaphragm.
Preferably, described groove extends to the fixed part of described vibrating diaphragm.
Preferably, described vibrating diaphragm is circular.
Preferably, described vibrating diaphragm is a rectangle.
Preferably, described vibrating diaphragm is oval.
The beneficial effects of the utility model are: owing to be provided with porose at the center of described vibrating diaphragm, fixed part direction from from this hole to vibrating diaphragm is provided with at least two grooves, groove communicates with the hole, so groove is divided into several portions with vibrating diaphragm, the several portions of vibrating diaphragm only is subjected to folk prescription to constraint, forming residual stress obtains effectively to discharge the sensitivity that has improved vibrating diaphragm like this.。
Description of drawings
Fig. 1 is the cutaway view that the utility model provides the MEMS capacitance microphone of an embodiment;
Fig. 2 is the plane graph of the MEMS capacitance microphone vibrating diaphragm of an embodiment providing of the utility model.
Embodiment
The utility model is described in further detail below in conjunction with drawings and embodiments.
The MEMS microphone 1 that the utility model provides is mainly used on the mobile phone, accepts sound and sound is converted into the signal of telecommunication.The invention that the utility model provides is by the effect that vibrating diaphragm fan sheet reaches the low frequency characteristic that improves microphone is set on vibrating diaphragm.
Referring to Fig. 1, the MEMS microphone 1 that the utility model provides comprises substrate 10, places the backboard 12 in the substrate 10, the supporting layer 11 that is connected with backboard 12, vibrating diaphragms 13 relative with backboard 12 and that link to each other by supporting layer 11, this vibrating diaphragm 13 comprises fixed part 131 that links to each other with supporting layer 11 and the vibration section 132 that links to each other with fixed part 131, backboard 12 is provided with back plate aperture 121, leaves air-gap 15 between backboard 12 and the vibrating diaphragm 13.In the embodiment that the utility model provides, the fixed part 131 and the vibration section 132 of vibrating diaphragm 13 are integrated.
Certainly, vibrating diaphragm 13 is not limited to the mode shown in Fig. 1 with the position relation of backboard 12.Also can be that vibrating diaphragm 13 is between backboard 12 and substrate 10; Equally, the supporting layer among Fig. 1 neither be necessary.As long as it is just passable that vibrating diaphragm 13 and backboard 12 can form capacitor.
In an embodiment provided by the invention, referring to Fig. 2, offer porosely 14 at the center of vibrating diaphragm 13, this hole 14 is provided with 6 grooves 15 to fixed part 131 directions of vibrating diaphragm 13 certainly, groove 15 communicate with hole 14 and groove 15 about the center symmetry of vibrating diaphragm 13, promptly about hole 14 symmetries.That is to say that groove 15 is with vibrating diaphragm 13 five equilibriums.
In embodiment provided by the invention, vibrating diaphragm 13 is circular, but in fact, vibrating diaphragm 13 is not limited to circle, also can be rectangle or triangle, ellipse etc.
The number of groove 15 is minimum to be 2, and groove 15 is about the center symmetry of vibrating diaphragm 13.
Hole 14 and groove 15 can be through hole and groove, promptly connect whole vibrating diaphragm 13, also can not connect whole vibrating diaphragm 13.The thickness of hole 14 and groove 15 and highly can be half of vibrating diaphragm 13 thickness also can be 1/3 etc. of vibrating diaphragm 13 thickness.
Groove 15 can extend to the fixed part 131 of vibrating diaphragm 13, also can extend to the vibration section 132 of vibrating diaphragm 13.
Above-described only is execution mode of the present utility model; should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the utility model creation design; can also make improvement, but these all belong to protection range of the present utility model.

Claims (9)

1, a kind of MEMS capacitance microphone, comprise substrate, be parallel to the backboard of substrate, the relative vibrating diaphragm that forms capacity effect with backboard, described vibrating diaphragm comprises fixed part and the vibration section that is connected with fixed part, it is characterized in that: be provided with porose at the center of described vibrating diaphragm, fixed part direction from from this hole to vibrating diaphragm is provided with at least two grooves, and described groove communicates with described hole.
2, MEMS capacitance microphone according to claim 1 is characterized in that: described groove is about the center symmetry of vibrating diaphragm
3, MEMS capacitance microphone according to claim 1 is characterized in that: the number of described groove is more than or equal to 3.
4, MEMS capacitance microphone according to claim 1 is characterized in that: it is half of described vibrating diaphragm thickness that described hole and described groove do not penetrate vibrating diaphragm and its degree of depth.
5, MEMS capacitance microphone according to claim 1 is characterized in that: described hole and described groove connect described vibrating diaphragm.
6, according to claim 1 or 2 or 3 or 4 or 5 described MEMS capacitance microphones, it is characterized in that: described groove extends to the fixed part of described vibrating diaphragm.
7, MEMS capacitance microphone according to claim 1 is characterized in that: described vibrating diaphragm is for circular.
8, MEMS capacitance microphone according to claim 1 is characterized in that: described vibrating diaphragm is a rectangle.
9, MEMS microphone according to claim 1 is characterized in that: described vibrating diaphragm is for oval.
CN2009201359336U 2009-03-27 2009-03-27 MEMS capacitance microphone Expired - Lifetime CN201403199Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201359336U CN201403199Y (en) 2009-03-27 2009-03-27 MEMS capacitance microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201359336U CN201403199Y (en) 2009-03-27 2009-03-27 MEMS capacitance microphone

Publications (1)

Publication Number Publication Date
CN201403199Y true CN201403199Y (en) 2010-02-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201359336U Expired - Lifetime CN201403199Y (en) 2009-03-27 2009-03-27 MEMS capacitance microphone

Country Status (1)

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CN (1) CN201403199Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102014332A (en) * 2010-04-12 2011-04-13 瑞声声学科技(深圳)有限公司 Capacitance MEMS (micro-electro-mechanical system) microphone
TWI448164B (en) * 2010-05-14 2014-08-01 Nat Univ Tsing Hua Micro electromechanical condenser microphones
CN104602173A (en) * 2013-10-30 2015-05-06 北京卓锐微技术有限公司 Silicon capacitor microphone and method for manufacturing same
EP2605545B1 (en) * 2011-02-23 2016-11-09 OMRON Corporation, a corporation of Japan Acoustic sensor and microphone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102014332A (en) * 2010-04-12 2011-04-13 瑞声声学科技(深圳)有限公司 Capacitance MEMS (micro-electro-mechanical system) microphone
TWI448164B (en) * 2010-05-14 2014-08-01 Nat Univ Tsing Hua Micro electromechanical condenser microphones
EP2605545B1 (en) * 2011-02-23 2016-11-09 OMRON Corporation, a corporation of Japan Acoustic sensor and microphone
CN104602173A (en) * 2013-10-30 2015-05-06 北京卓锐微技术有限公司 Silicon capacitor microphone and method for manufacturing same

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20170525

Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8

Co-patentee after: AAC Acoustic Technologies (Changzhou) Co., Ltd.

Patentee after: AAC Technologies (Singapore) Co., Ltd.

Address before: Wujin Nanxiashu town Jiangsu city Changzhou province 213167

Co-patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd.

Patentee before: AAC Acoustic Technologies (Changzhou) Co., Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20100210

CX01 Expiry of patent term