CN102014332A - Capacitance MEMS (micro-electro-mechanical system) microphone - Google Patents
Capacitance MEMS (micro-electro-mechanical system) microphone Download PDFInfo
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- CN102014332A CN102014332A CN2010101483010A CN201010148301A CN102014332A CN 102014332 A CN102014332 A CN 102014332A CN 2010101483010 A CN2010101483010 A CN 2010101483010A CN 201010148301 A CN201010148301 A CN 201010148301A CN 102014332 A CN102014332 A CN 102014332A
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- vibrating diaphragm
- diaphragm unit
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Abstract
The invention relates to a capacitance MEMS (micro-electro-mechanical system) microphone applied to electronic equipment and with more sensitivity, relating to the field of minitype microphones. The capacitance MEMS microphone comprises a substrate, a back plate and a vibrating diaphragm unit, wherein the substrate is provided with a through hole; the back plate with an air guide hole is arranged on the substrate; the vibrating diaphragm unit is arranged opposite to the back plate and supported by an insulating layer; a capacitance system is formed by the vibrating diaphragm unit and the back plate; the vibrating diaphragm unit comprises an inner membrane suspended on a center position, at least four pairs of uniformly distributed crank arms connected to the insulating layer are outwards derived and extend from the inner membrane so as to reduce the constraint of the insulating layer on the peripheral edge part of the vibrating diaphragm unit, therefore the sensitivity can be effectively enhanced; and the vibrating diaphragm unit can prevent plane writhe during the vibration of the vibrating diaphragm unit to effectively release stress, therefore the stability of the performance of the capacitance MEMS microphone is further improved.
Description
[technical field]
The present invention relates to the mini microphone field, specifically refer to a kind of being applied on the electronic equipment, have electric capacity MEMS (micro-electro-mechanical system) microphone of sensitivity more.
[background technology]
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, the user not only is satisfied with conversation to the requirement of mobile phone, and want high-quality communication effect can be provided, especially at present the development of mobile multimedia technology, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is the Si semiconductor microphone, the Si semiconductor microphone is built back pole plate and vibrating diaphragm on silicon wafer, and with suitable circuit connection, utilize the chemical etching technology with smooth and simple the placing in the substrate of vibrating diaphragm, make it do free vibration completely with sound, the electric field change that forms between the vibrating diaphragm of vibration and the back pole plate promptly produces the signal of telecommunication on the circuit.Usually the MEMS microphone comprises backboard, vibrating diaphragm relative with backboard and that be connected by the support portion, backboard is provided with acoustic holes, this acoustic holes can be delivered to the sound air-flow on the vibrating diaphragm, and acoustic pressure drives the relative backboard vibration of vibrating diaphragm, forms an operatic tunes between described vibrating diaphragm and the backboard; Being respectively equipped with conductive layer on vibrating diaphragm and the backboard also can power up, but the part mutually insulated that powers up, the operatic tunes between vibrating diaphragm and the backboard is just formed the capacitor with electric capacity like this, being directly proportional between two plates of the value of electric capacity and electric capacity over against area, and the distance between two plates of electric capacity is inversely proportional to.The microphone acoustic holes position of this kind structure is over against the zone line of vibrating diaphragm, and the zone line mechanical sensitivity height of vibrating diaphragm, the edge substantially all is strapped in the substrate, because the marginal position level is low, then cause the waste of vibrating diaphragm center, reduced sensitivity of microphone; And vibrating diaphragm is connected a plurality of electrodes of conducting electrical signals needs with substrate, and requisite space is bigger, and this is a challenge to miniature day by day MEMS, will limit the application of product.
[summary of the invention]
The objective of the invention is to solve the lower deficiency of vibrating diaphragm sensitivity, and propose a kind of capacitance MEMS (micro-electro-mechanical system) microphone.
In order to achieve the above object, technical scheme of the present invention is as follows:
A kind of capacitance MEMS (micro-electro-mechanical system) microphone, comprise that the substrate, the substrate that are provided with through hole are provided with the backboard that has gas port, the relative vibrating diaphragm unit that is provided with backboard, the vibrating diaphragm unit is by an insulation layer supports, described vibrating diaphragm unit and backboard constitute capacitor system, wherein the vibrating diaphragm unit comprises and is positioned at the inner membrance that middle position suspends, and described inner membrance is outwards derived and extended at least four pairs and evenly distribute and be connected cranking arm on the insulating barrier.
Crank arm and comprise that mutually discrete first cranks arm and second crank arm for described every pair, described first crank arm relative with second bearing of trend of deriving of cranking arm.
Described first crank arm with second crank arm symmetrical along vibrating diaphragm unit center line.
Described first cranks arm and second cranks arm and comprise respectively from the derive folding beam that extends into arc, described folding beam of inner membrance and derive to insulating barrier and extend support end.
Described crank arm symmetrical along the center line of vibrating diaphragm unit.
Described first crank arm and second crank arm and described inner membrance between be provided with first gap.
Be provided with second gap between described the cranking arm.
Capacitance MEMS (micro-electro-mechanical system) microphone of the present invention, comprise that the substrate, the substrate that are provided with through hole are provided with the backboard that has gas port, the relative vibrating diaphragm unit that is provided with backboard, the vibrating diaphragm unit is by an insulation layer supports, described vibrating diaphragm unit and backboard constitute capacitor system, wherein the vibrating diaphragm unit comprises and is positioned at the inner membrance that middle position suspends, described inner membrance is outwards derived and is extended at least four pairs and evenly distribute and be connected cranking arm on the insulating barrier, to reduce the constraint of insulating barrier, can effectively improve sensitivity to vibrating diaphragm unit week lateral edge portion; While vibrating diaphragm of the present invention unit, the plane twisting in the time of can preventing vibrating diaphragm unit chatter effectively discharges stress, thereby further improves the stability of microphone property.
[description of drawings]
Fig. 1 is a perspective view of the present invention;
Fig. 2 is a MEMS microphone cross-sectional view of the present invention;
Fig. 3 is a vibrating diaphragm cellular construction schematic diagram of the present invention.
[embodiment]
Below in conjunction with accompanying drawing, capacitance MEMS (micro-electro-mechanical system) microphone of the present invention is elaborated.
Capacitance MEMS (micro-electro-mechanical system) microphone of the present invention is mainly used on the mobile phone, accepts sound and sound is converted into the signal of telecommunication, and the present invention reaches the effect that improves Electret Condencer Microphone sensitivity by changing diaphragm structure.
As shown in Figure 1, be preferred embodiment of the present invention, capacitance MEMS (micro-electro-mechanical system) microphone comprises substrate 10, the insulating barrier 20 that links to each other with substrate 10 and the vibrating diaphragm unit 30 that is positioned at this supporting layer; Join shown in Figure 2, the substrate 10 of silicon materials offers a through hole of balance acoustic pressure, through hole top is backboard 40, offer the acoustic holes (not label) of conduction sound and balance acoustic pressure on the backboard 40, what backboard 40 tops were relative is vibrating diaphragm unit 30, in order to form capacitance structure with vibrating diaphragm unit 30, backboard 40 requires to have good electrical conductivity, forms with the silicon etching process; The very little gap of relative separately formation with backboard 40, vibrating diaphragm unit 30 constitutes electric field.In the time of in working order, deformation takes place in vibrating diaphragm unit 30 under the effect of acoustic pressure, the capacitance of electric field changes between vibrating diaphragm unit 30 and the backboard 40, and the capacitance variations value reflects the size of acoustic pressure, because deformation can not take place in backboard 40, so the size of vibrating diaphragm unit 30 deformation directly influences capacitance.Capacitance is to calculate like this: being directly proportional over against area between capacitance and vibrating diaphragm unit 30 and the backboard 40, and the distance between vibrating diaphragm unit 30 and the backboard 40 is inversely proportional to, i.e. C=k ε
0ε
rS/d, k are constant, ε
0Be constant, ε
rBe constant.After Electret Condencer Microphone is made, ε
0ε
rValue also just fixing, S be between two electroplaxs of electric capacity over against area, d is two distances between the electroplax, so the sensitivity of vibrating diaphragm unit 30 is most important.
Vibrating diaphragm of the present invention unit 30 comprises and is positioned at the inner membrance 31 that middle position suspends, described inner membrance 31 is outwards derived and is extended four pairs and evenly distribute to be connected and crank arm 32 on the insulating barrier 20, to reduce the constraint of 20 pairs of vibrating diaphragm unit 30 all lateral edge portion of insulating barrier, can effectively improve sensitivity; Simultaneously vibrating diaphragm of the present invention unit 30 the above every pair crank arm and be provided with second gap 33 between 31, the plane twisting in the time of can preventing vibrating diaphragm unit 30 chatters effectively discharges stress.Certainly, 31 the quantity of cranking arm of the present invention is not limited to four, can adjust according to actual needs.When 31 the quantity of cranking arm is even number, described crank arm 31 symmetrical along the center line of vibrating diaphragm unit 30.
Vibrating diaphragm 30 structures of capacitance MEMS (micro-electro-mechanical system) microphone of the present invention are seen shown in Figure 3, vibrating diaphragm unit 30 comprises and is positioned at the inner membrance 31 that middle position suspends in the present embodiment, described inner membrance 31 is outwards derived and is extended four pairs and evenly distribute to be connected and crank arm 32 on the insulating barrier, described cranking arm 32 comprises mutually discrete first 32A and second 32B that cranks arm that cranks arm, described first the crank arm bearing of trend of deriving of 32B of 32A and second of cranking arm is relative, and global shape is identical, and so described first 32A and second 32B that cranks arm that cranks arm is symmetrical along vibrating diaphragm unit 30 center lines.Described first 32A and second 32B that cranks arm that cranks arm comprises respectively from derive folding beam 321A, the 321B, described folding beam 321A, the 321B that extend into arc of inner membrance 30 and derives to insulating barrier 20 and extend support end 322A, 322B.Because first 32A and second 32B that cranks arm that cranks arm is discrete, so first 32A and second that cranks arm cranks arm and is provided with the first total gap 323 between 32B and the described inner membrance.Can effectively improve sensitivity; Plane twisting when vibrating diaphragm of the present invention unit 30 structures can prevent vibrating diaphragm unit 30 chatters simultaneously effectively discharges stress, thereby further improves the stability of microphone property.
The above only is a better embodiment of the present invention; protection scope of the present invention is not exceeded with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (7)
1. capacitance MEMS (micro-electro-mechanical system) microphone, comprise that the substrate, the substrate that are provided with through hole are provided with the backboard that has gas port, the relative vibrating diaphragm unit that is provided with backboard, the vibrating diaphragm unit is by an insulation layer supports, described vibrating diaphragm unit and backboard constitute capacitor system, it is characterized in that: the vibrating diaphragm unit comprises and is positioned at the inner membrance that middle position suspends, and described inner membrance is outwards derived and extended at least four pairs and evenly distribute and be connected cranking arm on the insulating barrier.
2. capacitance MEMS (micro-electro-mechanical system) microphone according to claim 1 is characterized in that: crank arm and comprise that mutually discrete first cranks arm and second crank arm for described every pair, described first crank arm relative with second bearing of trend of deriving of cranking arm.
3. capacitance MEMS (micro-electro-mechanical system) microphone according to claim 2 is characterized in that: described first crank arm with second crank arm symmetrical along vibrating diaphragm unit center line.
4. according to claim 2 or 3 described capacitance MEMS (micro-electro-mechanical system) microphones, it is characterized in that: described first cranks arm and second cranks arm and comprise respectively from the derive folding beam that extends into arc, described folding beam of inner membrance and derive to insulating barrier and extend support end.
5. capacitance MEMS (micro-electro-mechanical system) microphone according to claim 1 is characterized in that: described crank arm symmetrical along the center line of vibrating diaphragm unit.
6. capacitance MEMS (micro-electro-mechanical system) microphone according to claim 4 is characterized in that: described first crank arm and second crank arm and described inner membrance between be provided with first gap.
7. capacitance MEMS (micro-electro-mechanical system) microphone according to claim 1 is characterized in that: be provided with second gap between described the cranking arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101483010A CN102014332A (en) | 2010-04-12 | 2010-04-12 | Capacitance MEMS (micro-electro-mechanical system) microphone |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101483010A CN102014332A (en) | 2010-04-12 | 2010-04-12 | Capacitance MEMS (micro-electro-mechanical system) microphone |
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| CN102014332A true CN102014332A (en) | 2011-04-13 |
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| CN2010101483010A Pending CN102014332A (en) | 2010-04-12 | 2010-04-12 | Capacitance MEMS (micro-electro-mechanical system) microphone |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195075A (en) * | 2018-11-29 | 2019-01-11 | 华景科技无锡有限公司 | A kind of microphone diaphragm and microphone |
| CN110775937A (en) * | 2019-12-31 | 2020-02-11 | 共达电声股份有限公司 | MEMS diaphragm and MEMS sensor chip |
| CN113891224A (en) * | 2021-10-29 | 2022-01-04 | 安徽奥飞声学科技有限公司 | MEMS structure and manufacturing method thereof |
| WO2023202417A1 (en) * | 2022-04-20 | 2023-10-26 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101098569A (en) * | 2006-06-28 | 2008-01-02 | 潍坊歌尔电子有限公司 | Semiconductor microphone chip |
| CN101453683A (en) * | 2008-12-26 | 2009-06-10 | 瑞声声学科技(深圳)有限公司 | Silicon capacitor type microphone |
| US20090202089A1 (en) * | 2007-06-06 | 2009-08-13 | Analog Devices, Inc. | Microphone with Reduced Parasitic Capacitance |
| CN101568055A (en) * | 2009-04-03 | 2009-10-28 | 瑞声声学科技(深圳)有限公司 | Silicone base capacitance microphone |
| CN201403199Y (en) * | 2009-03-27 | 2010-02-10 | 瑞声声学科技(常州)有限公司 | MEMS capacitance microphone |
-
2010
- 2010-04-12 CN CN2010101483010A patent/CN102014332A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101098569A (en) * | 2006-06-28 | 2008-01-02 | 潍坊歌尔电子有限公司 | Semiconductor microphone chip |
| US20090202089A1 (en) * | 2007-06-06 | 2009-08-13 | Analog Devices, Inc. | Microphone with Reduced Parasitic Capacitance |
| CN101453683A (en) * | 2008-12-26 | 2009-06-10 | 瑞声声学科技(深圳)有限公司 | Silicon capacitor type microphone |
| CN201403199Y (en) * | 2009-03-27 | 2010-02-10 | 瑞声声学科技(常州)有限公司 | MEMS capacitance microphone |
| CN101568055A (en) * | 2009-04-03 | 2009-10-28 | 瑞声声学科技(深圳)有限公司 | Silicone base capacitance microphone |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195075A (en) * | 2018-11-29 | 2019-01-11 | 华景科技无锡有限公司 | A kind of microphone diaphragm and microphone |
| CN109195075B (en) * | 2018-11-29 | 2024-04-12 | 华景科技无锡有限公司 | Microphone vibrating diaphragm and microphone |
| CN110775937A (en) * | 2019-12-31 | 2020-02-11 | 共达电声股份有限公司 | MEMS diaphragm and MEMS sensor chip |
| CN110775937B (en) * | 2019-12-31 | 2020-05-08 | 共达电声股份有限公司 | MEMS diaphragm and MEMS sensor chip |
| CN113891224A (en) * | 2021-10-29 | 2022-01-04 | 安徽奥飞声学科技有限公司 | MEMS structure and manufacturing method thereof |
| CN113891224B (en) * | 2021-10-29 | 2024-03-26 | 安徽奥飞声学科技有限公司 | MEMS structure and manufacturing method thereof |
| WO2023202417A1 (en) * | 2022-04-20 | 2023-10-26 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic device |
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Application publication date: 20110413 |