CN101959107A - MEMS (Micro Electro Mechanical Systems) microphone - Google Patents
MEMS (Micro Electro Mechanical Systems) microphone Download PDFInfo
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- CN101959107A CN101959107A CN2010101534953A CN201010153495A CN101959107A CN 101959107 A CN101959107 A CN 101959107A CN 2010101534953 A CN2010101534953 A CN 2010101534953A CN 201010153495 A CN201010153495 A CN 201010153495A CN 101959107 A CN101959107 A CN 101959107A
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Abstract
The invention provides an MEMS (Micro Electro Mechanical Systems) microphone which comprises a base, a back plate and a vibration diaphragm, wherein the base is provided with an acoustic rear cavity; the back plate is connected with the base and is provided with an acoustic hole; and the vibration diaphragm is opposite to the back plate and is located between the back plate and the base. An acoustic front cavity is formed between the vibration diaphragm and the back plate, and an edge area of the vibration diaphragm is provided with ventilation holes. The ventilation holes form a first ventilation hole array near the center of the vibration diaphragm and a second ventilation hole array away from the center of the vibration membrane, one ventilation hole in any array is located between two adjacent ventilation holes in the other array, and the connecting lines of the central points of the three ventilation holes form a triangle. Thus, the acoustic sensitivity and the integral structure performance of the MEMS microphone are further increased.
Description
[technical field]
The present invention relates to a kind of microphone, relate in particular to a kind of MEMS microphone.
[background technology]
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, the user not only is satisfied with conversation to the requirement of mobile phone, and want high-quality communication effect can be provided, especially at present the development of mobile multimedia technology, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone, be called for short MEMS), in the correlation technique, microphone be used for discharging vibrating diaphragm internal stress, obviously effect is limited to reduce the acoustic resistance aspect, therefore is necessary to provide a kind of novel MEMS microphone.
[summary of the invention]
The technical problem that the present invention need solve has provided the MEMS microphone that a kind of Stress Release ability is strong, the damping regulating power is good.
According to the above-mentioned technical problem that needs solution, designed a kind of MEMS microphone, comprise the substrate that is provided with the acoustics back cavity, the backboard that links to each other with substrate, backboard is provided with hole, it also comprises vibrating diaphragm relative with backboard and between backboard and substrate, form the acoustics ante-chamber between this vibrating diaphragm and the backboard, the vibrating diaphragm fringe region is provided with air-vent, this air-vent is formed near the first air-vent array at vibrating diaphragm center with away from the second air-vent array at vibrating diaphragm center, and an air-vent in arbitrary array is in another array between adjacent two air-vents, the link group triangularity of the central point of these three air-vents.
Preferably, the line of the central point of described three air-vents is formed equilateral triangle.
Preferably, the line of the central point of the air-vent of arbitrary array is formed a circle.
Preferably, the circle of the circle of described arbitrary air-vent array composition and other air-vent arrays composition is a concentric circles.
Preferably, air-vent is shaped as circle or rectangle.
Beneficial effect of the present invention is: the vibrating diaphragm that is provided with two circles or the equally distributed air-vent of multi-turn concentric circles, air-vent between circle and the circle adopts the triangle dot matrix to distribute, when the vibrating diaphragm area constantly dwindles, there is good stress to reconcile and the damping regulating action, thereby can further improve the sensitivity behaviour and the unfailing performance of small size diaphragm structure.
[description of drawings]
Fig. 1 is the profile of one embodiment of the invention;
Fig. 2 is one embodiment of the invention diaphragm structure schematic diagram;
Fig. 3 is an embodiment of the invention vibrating diaphragm A portion structure for amplifying schematic diagram.
[embodiment]
The invention will be further described below in conjunction with drawings and embodiments.
As shown in Figure 1, in an embodiment provided by the invention, the MEMS microphone comprises the substrate 1 that is provided with acoustics back cavity 6, the backboard 3 that links to each other with substrate 1, backboard 3 is provided with hole 31, it also comprises vibrating diaphragm 4 relative with backboard 3 and between backboard 3 and substrate 1, forms acoustics ante-chamber 5 between this vibrating diaphragm 4 and the backboard 3.
As shown in Figure 2, be embodiment of the invention vibrating diaphragm 4 structural representations, vibrating diaphragm 4 fringe regions are provided with air-vent 2, this air-vent 2 is formed near first air-vent, 2 arrays at vibrating diaphragm 4 centers with away from second air-vent, 2 arrays at vibrating diaphragm center, and between adjacent two air-vents 2, the line of the central point of these three air-vents 2 is formed equilateral triangle to an air-vent 2 in arbitrary array in another array.The line of the central point of the air-vent 2 of arbitrary array is formed a circle, and the circle of the circle of arbitrary air-vent 2 arrays composition and other air-vents 2 arrays composition is a concentric circles; Number of arrays is more than or equal to two.
Product of the present invention is when using, and when the sound air communication was crossed hole 31 and is delivered on the vibrating diaphragm 4, ventilative 2 along with corresponding stress, the sensitivity that can effectively improve product are adjusted in the contraction or the expansion of vibrating diaphragm 4; When acoustic pressure is excessive, can play the effect that weakens acoustic pressure simultaneously.Air-vent 2 is a small sircle hole, but under the same terms, air-vent 2 also can be the hole of other shapes such as rectangular opening; Air-vent 2 improves sensitivity of microphone, helps the lifting of whole acoustical behavior simultaneously.
Above-described only is embodiments of the present invention, should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the invention design, can also make improvement, but these all belongs to protection scope of the present invention.
Claims (5)
1. MEMS microphone, comprise the substrate that is provided with the acoustics back cavity, the backboard that links to each other with substrate, backboard is provided with hole, it also comprises vibrating diaphragm relative with backboard and between backboard and substrate, form the acoustics ante-chamber between this vibrating diaphragm and the backboard, it is characterized in that: the vibrating diaphragm fringe region is provided with air-vent, this air-vent is formed near the first air-vent array at vibrating diaphragm center with away from the second air-vent array at vibrating diaphragm center, and an air-vent in arbitrary array is in another array between adjacent two air-vents, the link group triangularity of the central point of these three air-vents.
2. MEMS microphone according to claim 1 is characterized in that: the line of the central point of described three air-vents is formed equilateral triangle.
3. MEMS microphone according to claim 1 is characterized in that: the line of the central point of the air-vent of arbitrary array is formed a circle.
4. MEMS microphone according to claim 3 is characterized in that: the circle that the circle that described arbitrary air-vent array is formed and other air-vent arrays are formed is a concentric circles.
5. MEMS microphone according to claim 1 is characterized in that: air-vent be shaped as circle or rectangle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010101534953A CN101959107A (en) | 2010-04-19 | 2010-04-19 | MEMS (Micro Electro Mechanical Systems) microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010101534953A CN101959107A (en) | 2010-04-19 | 2010-04-19 | MEMS (Micro Electro Mechanical Systems) microphone |
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CN101959107A true CN101959107A (en) | 2011-01-26 |
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CN2010101534953A Pending CN101959107A (en) | 2010-04-19 | 2010-04-19 | MEMS (Micro Electro Mechanical Systems) microphone |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102984632A (en) * | 2011-09-02 | 2013-03-20 | Nxp股份有限公司 | Acoustic transducers with perforated membranes |
CN103338427A (en) * | 2013-07-18 | 2013-10-02 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical systems) chip and MEMS microphone |
CN104066040A (en) * | 2013-03-19 | 2014-09-24 | 财团法人工业技术研究院 | Pressure sensor and method for manufacturing the same |
CN105246012A (en) * | 2014-05-30 | 2016-01-13 | 无锡华润上华半导体有限公司 | Mems microphone |
CN107226450A (en) * | 2016-03-24 | 2017-10-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of MEMS and preparation method thereof, electronic installation |
CN109151689A (en) * | 2017-06-27 | 2019-01-04 | 中芯国际集成电路制造(上海)有限公司 | microphone and its manufacturing method |
CN109195075A (en) * | 2018-11-29 | 2019-01-11 | 华景科技无锡有限公司 | A kind of microphone diaphragm and microphone |
CN110267184A (en) * | 2019-06-29 | 2019-09-20 | 瑞声科技(南京)有限公司 | MEMS microphone |
CN110366090A (en) * | 2018-04-11 | 2019-10-22 | 中芯国际集成电路制造(上海)有限公司 | MEMS device and preparation method thereof |
CN110602617A (en) * | 2019-09-05 | 2019-12-20 | 南京师范大学 | Laser MEMS microphone |
WO2022062001A1 (en) * | 2020-09-25 | 2022-03-31 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone and mobile terminal |
CN115002633A (en) * | 2022-08-02 | 2022-09-02 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
Citations (5)
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CN1823551A (en) * | 2003-07-17 | 2006-08-23 | 星电株式会社 | Sound detection mechanism |
CN201210744Y (en) * | 2008-03-27 | 2009-03-18 | 歌尔声学股份有限公司 | Miniature capacitor type microphone |
CN101394687A (en) * | 2008-10-28 | 2009-03-25 | 歌尔声学股份有限公司 | Microphone with silicon capacitor |
CN101406069A (en) * | 2006-03-29 | 2009-04-08 | 雅马哈株式会社 | Condenser microphone |
US20090310810A1 (en) * | 2008-06-12 | 2009-12-17 | Fortemedia, Inc. | Mems microphone package with rf insensitive mems microphone chip |
-
2010
- 2010-04-19 CN CN2010101534953A patent/CN101959107A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1823551A (en) * | 2003-07-17 | 2006-08-23 | 星电株式会社 | Sound detection mechanism |
CN101406069A (en) * | 2006-03-29 | 2009-04-08 | 雅马哈株式会社 | Condenser microphone |
CN201210744Y (en) * | 2008-03-27 | 2009-03-18 | 歌尔声学股份有限公司 | Miniature capacitor type microphone |
US20090310810A1 (en) * | 2008-06-12 | 2009-12-17 | Fortemedia, Inc. | Mems microphone package with rf insensitive mems microphone chip |
CN101394687A (en) * | 2008-10-28 | 2009-03-25 | 歌尔声学股份有限公司 | Microphone with silicon capacitor |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102984632A (en) * | 2011-09-02 | 2013-03-20 | Nxp股份有限公司 | Acoustic transducers with perforated membranes |
CN104066040A (en) * | 2013-03-19 | 2014-09-24 | 财团法人工业技术研究院 | Pressure sensor and method for manufacturing the same |
CN103338427A (en) * | 2013-07-18 | 2013-10-02 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical systems) chip and MEMS microphone |
CN105246012A (en) * | 2014-05-30 | 2016-01-13 | 无锡华润上华半导体有限公司 | Mems microphone |
CN107226450A (en) * | 2016-03-24 | 2017-10-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of MEMS and preparation method thereof, electronic installation |
CN109151689A (en) * | 2017-06-27 | 2019-01-04 | 中芯国际集成电路制造(上海)有限公司 | microphone and its manufacturing method |
CN110366090A (en) * | 2018-04-11 | 2019-10-22 | 中芯国际集成电路制造(上海)有限公司 | MEMS device and preparation method thereof |
CN110366090B (en) * | 2018-04-11 | 2021-02-23 | 中芯国际集成电路制造(上海)有限公司 | MEMS device and preparation method thereof |
CN109195075A (en) * | 2018-11-29 | 2019-01-11 | 华景科技无锡有限公司 | A kind of microphone diaphragm and microphone |
CN109195075B (en) * | 2018-11-29 | 2024-04-12 | 华景科技无锡有限公司 | Microphone vibrating diaphragm and microphone |
CN110267184A (en) * | 2019-06-29 | 2019-09-20 | 瑞声科技(南京)有限公司 | MEMS microphone |
CN110602617A (en) * | 2019-09-05 | 2019-12-20 | 南京师范大学 | Laser MEMS microphone |
WO2022062001A1 (en) * | 2020-09-25 | 2022-03-31 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone and mobile terminal |
CN115002633A (en) * | 2022-08-02 | 2022-09-02 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
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