CN101959107A - MEMS (Micro Electro Mechanical Systems) microphone - Google Patents

MEMS (Micro Electro Mechanical Systems) microphone Download PDF

Info

Publication number
CN101959107A
CN101959107A CN2010101534953A CN201010153495A CN101959107A CN 101959107 A CN101959107 A CN 101959107A CN 2010101534953 A CN2010101534953 A CN 2010101534953A CN 201010153495 A CN201010153495 A CN 201010153495A CN 101959107 A CN101959107 A CN 101959107A
Authority
CN
China
Prior art keywords
air
vent
array
vibrating diaphragm
backboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010101534953A
Other languages
Chinese (zh)
Inventor
孟珍奎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Microtech Changzhou Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Microtech Changzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Microtech Changzhou Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to CN2010101534953A priority Critical patent/CN101959107A/en
Publication of CN101959107A publication Critical patent/CN101959107A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The invention provides an MEMS (Micro Electro Mechanical Systems) microphone which comprises a base, a back plate and a vibration diaphragm, wherein the base is provided with an acoustic rear cavity; the back plate is connected with the base and is provided with an acoustic hole; and the vibration diaphragm is opposite to the back plate and is located between the back plate and the base. An acoustic front cavity is formed between the vibration diaphragm and the back plate, and an edge area of the vibration diaphragm is provided with ventilation holes. The ventilation holes form a first ventilation hole array near the center of the vibration diaphragm and a second ventilation hole array away from the center of the vibration membrane, one ventilation hole in any array is located between two adjacent ventilation holes in the other array, and the connecting lines of the central points of the three ventilation holes form a triangle. Thus, the acoustic sensitivity and the integral structure performance of the MEMS microphone are further increased.

Description

The MEMS microphone
[technical field]
The present invention relates to a kind of microphone, relate in particular to a kind of MEMS microphone.
[background technology]
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, the user not only is satisfied with conversation to the requirement of mobile phone, and want high-quality communication effect can be provided, especially at present the development of mobile multimedia technology, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone, be called for short MEMS), in the correlation technique, microphone be used for discharging vibrating diaphragm internal stress, obviously effect is limited to reduce the acoustic resistance aspect, therefore is necessary to provide a kind of novel MEMS microphone.
[summary of the invention]
The technical problem that the present invention need solve has provided the MEMS microphone that a kind of Stress Release ability is strong, the damping regulating power is good.
According to the above-mentioned technical problem that needs solution, designed a kind of MEMS microphone, comprise the substrate that is provided with the acoustics back cavity, the backboard that links to each other with substrate, backboard is provided with hole, it also comprises vibrating diaphragm relative with backboard and between backboard and substrate, form the acoustics ante-chamber between this vibrating diaphragm and the backboard, the vibrating diaphragm fringe region is provided with air-vent, this air-vent is formed near the first air-vent array at vibrating diaphragm center with away from the second air-vent array at vibrating diaphragm center, and an air-vent in arbitrary array is in another array between adjacent two air-vents, the link group triangularity of the central point of these three air-vents.
Preferably, the line of the central point of described three air-vents is formed equilateral triangle.
Preferably, the line of the central point of the air-vent of arbitrary array is formed a circle.
Preferably, the circle of the circle of described arbitrary air-vent array composition and other air-vent arrays composition is a concentric circles.
Preferably, air-vent is shaped as circle or rectangle.
Beneficial effect of the present invention is: the vibrating diaphragm that is provided with two circles or the equally distributed air-vent of multi-turn concentric circles, air-vent between circle and the circle adopts the triangle dot matrix to distribute, when the vibrating diaphragm area constantly dwindles, there is good stress to reconcile and the damping regulating action, thereby can further improve the sensitivity behaviour and the unfailing performance of small size diaphragm structure.
[description of drawings]
Fig. 1 is the profile of one embodiment of the invention;
Fig. 2 is one embodiment of the invention diaphragm structure schematic diagram;
Fig. 3 is an embodiment of the invention vibrating diaphragm A portion structure for amplifying schematic diagram.
[embodiment]
The invention will be further described below in conjunction with drawings and embodiments.
As shown in Figure 1, in an embodiment provided by the invention, the MEMS microphone comprises the substrate 1 that is provided with acoustics back cavity 6, the backboard 3 that links to each other with substrate 1, backboard 3 is provided with hole 31, it also comprises vibrating diaphragm 4 relative with backboard 3 and between backboard 3 and substrate 1, forms acoustics ante-chamber 5 between this vibrating diaphragm 4 and the backboard 3.
As shown in Figure 2, be embodiment of the invention vibrating diaphragm 4 structural representations, vibrating diaphragm 4 fringe regions are provided with air-vent 2, this air-vent 2 is formed near first air-vent, 2 arrays at vibrating diaphragm 4 centers with away from second air-vent, 2 arrays at vibrating diaphragm center, and between adjacent two air-vents 2, the line of the central point of these three air-vents 2 is formed equilateral triangle to an air-vent 2 in arbitrary array in another array.The line of the central point of the air-vent 2 of arbitrary array is formed a circle, and the circle of the circle of arbitrary air-vent 2 arrays composition and other air-vents 2 arrays composition is a concentric circles; Number of arrays is more than or equal to two.
Product of the present invention is when using, and when the sound air communication was crossed hole 31 and is delivered on the vibrating diaphragm 4, ventilative 2 along with corresponding stress, the sensitivity that can effectively improve product are adjusted in the contraction or the expansion of vibrating diaphragm 4; When acoustic pressure is excessive, can play the effect that weakens acoustic pressure simultaneously.Air-vent 2 is a small sircle hole, but under the same terms, air-vent 2 also can be the hole of other shapes such as rectangular opening; Air-vent 2 improves sensitivity of microphone, helps the lifting of whole acoustical behavior simultaneously.
Above-described only is embodiments of the present invention, should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the invention design, can also make improvement, but these all belongs to protection scope of the present invention.

Claims (5)

1. MEMS microphone, comprise the substrate that is provided with the acoustics back cavity, the backboard that links to each other with substrate, backboard is provided with hole, it also comprises vibrating diaphragm relative with backboard and between backboard and substrate, form the acoustics ante-chamber between this vibrating diaphragm and the backboard, it is characterized in that: the vibrating diaphragm fringe region is provided with air-vent, this air-vent is formed near the first air-vent array at vibrating diaphragm center with away from the second air-vent array at vibrating diaphragm center, and an air-vent in arbitrary array is in another array between adjacent two air-vents, the link group triangularity of the central point of these three air-vents.
2. MEMS microphone according to claim 1 is characterized in that: the line of the central point of described three air-vents is formed equilateral triangle.
3. MEMS microphone according to claim 1 is characterized in that: the line of the central point of the air-vent of arbitrary array is formed a circle.
4. MEMS microphone according to claim 3 is characterized in that: the circle that the circle that described arbitrary air-vent array is formed and other air-vent arrays are formed is a concentric circles.
5. MEMS microphone according to claim 1 is characterized in that: air-vent be shaped as circle or rectangle.
CN2010101534953A 2010-04-19 2010-04-19 MEMS (Micro Electro Mechanical Systems) microphone Pending CN101959107A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010101534953A CN101959107A (en) 2010-04-19 2010-04-19 MEMS (Micro Electro Mechanical Systems) microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101534953A CN101959107A (en) 2010-04-19 2010-04-19 MEMS (Micro Electro Mechanical Systems) microphone

Publications (1)

Publication Number Publication Date
CN101959107A true CN101959107A (en) 2011-01-26

Family

ID=43486157

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101534953A Pending CN101959107A (en) 2010-04-19 2010-04-19 MEMS (Micro Electro Mechanical Systems) microphone

Country Status (1)

Country Link
CN (1) CN101959107A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102984632A (en) * 2011-09-02 2013-03-20 Nxp股份有限公司 Acoustic transducers with perforated membranes
CN103338427A (en) * 2013-07-18 2013-10-02 山东共达电声股份有限公司 MEMS (micro-electromechanical systems) chip and MEMS microphone
CN104066040A (en) * 2013-03-19 2014-09-24 财团法人工业技术研究院 Pressure sensor and method for manufacturing the same
CN105246012A (en) * 2014-05-30 2016-01-13 无锡华润上华半导体有限公司 Mems microphone
CN107226450A (en) * 2016-03-24 2017-10-03 中芯国际集成电路制造(上海)有限公司 A kind of MEMS and preparation method thereof, electronic installation
CN109151689A (en) * 2017-06-27 2019-01-04 中芯国际集成电路制造(上海)有限公司 microphone and its manufacturing method
CN109195075A (en) * 2018-11-29 2019-01-11 华景科技无锡有限公司 A kind of microphone diaphragm and microphone
CN110267184A (en) * 2019-06-29 2019-09-20 瑞声科技(南京)有限公司 MEMS microphone
CN110366090A (en) * 2018-04-11 2019-10-22 中芯国际集成电路制造(上海)有限公司 MEMS device and preparation method thereof
CN110602617A (en) * 2019-09-05 2019-12-20 南京师范大学 Laser MEMS microphone
WO2022062001A1 (en) * 2020-09-25 2022-03-31 瑞声声学科技(深圳)有限公司 Bone conduction microphone and mobile terminal
CN115002633A (en) * 2022-08-02 2022-09-02 苏州敏芯微电子技术股份有限公司 Microphone assembly and electronic equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1823551A (en) * 2003-07-17 2006-08-23 星电株式会社 Sound detection mechanism
CN201210744Y (en) * 2008-03-27 2009-03-18 歌尔声学股份有限公司 Miniature capacitor type microphone
CN101394687A (en) * 2008-10-28 2009-03-25 歌尔声学股份有限公司 Microphone with silicon capacitor
CN101406069A (en) * 2006-03-29 2009-04-08 雅马哈株式会社 Condenser microphone
US20090310810A1 (en) * 2008-06-12 2009-12-17 Fortemedia, Inc. Mems microphone package with rf insensitive mems microphone chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1823551A (en) * 2003-07-17 2006-08-23 星电株式会社 Sound detection mechanism
CN101406069A (en) * 2006-03-29 2009-04-08 雅马哈株式会社 Condenser microphone
CN201210744Y (en) * 2008-03-27 2009-03-18 歌尔声学股份有限公司 Miniature capacitor type microphone
US20090310810A1 (en) * 2008-06-12 2009-12-17 Fortemedia, Inc. Mems microphone package with rf insensitive mems microphone chip
CN101394687A (en) * 2008-10-28 2009-03-25 歌尔声学股份有限公司 Microphone with silicon capacitor

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102984632A (en) * 2011-09-02 2013-03-20 Nxp股份有限公司 Acoustic transducers with perforated membranes
CN104066040A (en) * 2013-03-19 2014-09-24 财团法人工业技术研究院 Pressure sensor and method for manufacturing the same
CN103338427A (en) * 2013-07-18 2013-10-02 山东共达电声股份有限公司 MEMS (micro-electromechanical systems) chip and MEMS microphone
CN105246012A (en) * 2014-05-30 2016-01-13 无锡华润上华半导体有限公司 Mems microphone
CN107226450A (en) * 2016-03-24 2017-10-03 中芯国际集成电路制造(上海)有限公司 A kind of MEMS and preparation method thereof, electronic installation
CN109151689A (en) * 2017-06-27 2019-01-04 中芯国际集成电路制造(上海)有限公司 microphone and its manufacturing method
CN110366090A (en) * 2018-04-11 2019-10-22 中芯国际集成电路制造(上海)有限公司 MEMS device and preparation method thereof
CN110366090B (en) * 2018-04-11 2021-02-23 中芯国际集成电路制造(上海)有限公司 MEMS device and preparation method thereof
CN109195075A (en) * 2018-11-29 2019-01-11 华景科技无锡有限公司 A kind of microphone diaphragm and microphone
CN109195075B (en) * 2018-11-29 2024-04-12 华景科技无锡有限公司 Microphone vibrating diaphragm and microphone
CN110267184A (en) * 2019-06-29 2019-09-20 瑞声科技(南京)有限公司 MEMS microphone
CN110602617A (en) * 2019-09-05 2019-12-20 南京师范大学 Laser MEMS microphone
WO2022062001A1 (en) * 2020-09-25 2022-03-31 瑞声声学科技(深圳)有限公司 Bone conduction microphone and mobile terminal
CN115002633A (en) * 2022-08-02 2022-09-02 苏州敏芯微电子技术股份有限公司 Microphone assembly and electronic equipment

Similar Documents

Publication Publication Date Title
CN101959107A (en) MEMS (Micro Electro Mechanical Systems) microphone
AU2007326143B2 (en) Face plate, vibration speaker having face plate, and portable terminal including the same
CN101568057A (en) Capacitance microphone
CN102164325A (en) Miniature microphone
CN107666645A (en) Differential capacitance type microphone with double diaphragm
WO2008120436A3 (en) Voice conference apparatus providing microphone directivity to reduce acoustic coupling
CN101835078A (en) Silicon microphone and manufacturing method thereof
CN201467442U (en) Capacitor microphone
CN201426176Y (en) Silicon capacitance microphone
CN101883306B (en) Diaphragm and capacitance microphone comprising diaphragm
CN101835080B (en) Silicon-based microphone
WO2008066303A1 (en) Vibration speaker and portable terminal including the same
CN206100369U (en) Earphone microphone and be equipped with earphone of this microphone
CN202889627U (en) Loudspeaker-box-type cell phone physical microphone
CN202178856U (en) Microphone
CN201355867Y (en) Silicon-based condenser microphone
CN105828260A (en) User terminal
CN201114743Y (en) Vibration speaker
CN112689229B (en) Silicon-based microphone and manufacturing method thereof
CN201608873U (en) Electroacoustic sounder
CN201270156Y (en) MP3 player
CN101572849B (en) Silica-based microphone
CN209330393U (en) A kind of ultra-wideband sounding device
CN201690596U (en) Silicon-based microphone
CN201345734Y (en) Silica-based microphone

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110126

WD01 Invention patent application deemed withdrawn after publication