CN101394687A - Microphone with silicon capacitor - Google Patents
Microphone with silicon capacitor Download PDFInfo
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- CN101394687A CN101394687A CNA2008101582786A CN200810158278A CN101394687A CN 101394687 A CN101394687 A CN 101394687A CN A2008101582786 A CNA2008101582786 A CN A2008101582786A CN 200810158278 A CN200810158278 A CN 200810158278A CN 101394687 A CN101394687 A CN 101394687A
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Abstract
The invention discloses a silicon condenser microphone, which comprises a casing and a circuit board. The casing and the circuit board form the protection structure of the silicon condenser microphone, a sound hole communicated with the external space of a MEMS acoustical-electrical conversion chip is formed on the protection structure, a cover including a flat part and a raised part with a hollow inner part is installed on the surface of the circuit board at the inner part of the protection structure, the periphery of the cover is hermetically combined with the surface of the circuit board, at least a breather hole is formed on the flat part, the MEMS acoustical-electrical conversion chip is installed on the flat part on the breather hole, and a breather channel communicated with the breather hole and a cavity is arranged on the combined part between the bottom surface of the cover and the surface of the circuit board. The silicon condenser microphone can effectively increase the air space (rear cavity) at the rear part of the MEMS acoustical-electrical conversion chip, and the MEMS acoustical-electrical conversion chip is installed on the flat part of the cover, therefore the height of the product is not excessively increased.
Description
Technical field
The present invention relates to a kind of microphone, especially relate to a kind of silicon capacitor microphone with novel package structure.
Background technology
In recent years, along with electronic product volumes such as mobile phone, notebook constantly reduce, performance is more and more higher, also require the volume of supporting electronic component constantly to reduce, performance and consistency improve.Under this background, also released a lot of novel products as the microphone products of one of strength member, the silicon capacitor microphone that utilizes MEMS (MEMS (micro electro mechanical system)) technology to produce is a representative products wherein.And the key technology in the silicon capacitor microphone is a package design, and it is higher to encapsulate shared cost ratio, so, a lot of patents about the silicon capacitor microphone encapsulation technology have also appearred recently.
Publication number be US20020102004 U.S. Patent Publication the microphone package patent of a kind of by name " small-sized silicon capacitor microphone and manufacture method thereof (miniature silicon condenser microphone and method forproducing same) ", silicon capacitor microphone in this patent comprises a shell, shell is provided with the sound hole that can see through sound, a wiring board is arranged, shell and wiring board are combined into a cavity, MEMS (MEMS (micro electro mechanical system)) acoustic-electro conversion chip and integrated circuit are installed on the wiring board, and MEMS acoustic-electro conversion chip and integrated circuit can be converted into the signal of telecommunication with voice signal jointly.The key technology point (shown in Fig. 6 in this patent documentation) of patent US20020102004 is: make certain depression by technologies such as corrosion on the wiring board of the position below the MEMS acoustic-electro conversion chip.The advantage of this design is: (the sound hole is arranged on the position beyond the MEMS acoustic-electro conversion chip to affact the product structure of MEMS acoustic-electro conversion chip top at voice signal, the voice signal of extraneous transmission acts on MEMS acoustic-electro conversion chip top), the air space that can increase MEMS acoustic-electro conversion chip below (is referred to as " back cavity-Back volume " usually in the industry, refer to that sound wave runs into after the MEMS acoustic-electro conversion chip, the space at MEMS acoustic-electro conversion chip rear), can make the sensitivity of silicon capacitor microphone higher, frequency response curve is better.Yet the wiring board that passes through MEMS acoustic-electro conversion chip below of this simplicity of design caves in and increases back cavity, and is very limited to the contribution that back cavity increases, also very little to the contribution that performance improves; And this design will make the thickness of wiring board increase greatly, too much increase the height of product, and cause cost to increase.
Publication number is to disclose a kind of silicon capacitor microphone equally during the PCT of W02007126179A1 applies for a patent, this patent has disclosed a kind of silicon capacitor microphone that can increase back cavity equally, a lid that has the middle part projection is installed in the circuit board, the MEMS acoustic-electro conversion chip is installed on the middle part lug boss of lid, on the lug boss of middle part and the position of MEMS acoustic-electro conversion chip correspondence is provided with air-vent, thereby the space that forms between the middle part lug boss of wiring board and lid can be used as back cavity.This design can still will make the integral thickness of product increase greatly so that the space of back cavity becomes big.
Summary of the invention
Technical problem to be solved by this invention provides a kind of exceeding increases the product height, but can significantly increase the silicon capacitor microphone of cavity space behind the MEMS acoustic-electro conversion chip.
For solving the problems of the technologies described above, technical scheme of the present invention is: silicon capacitor microphone, comprise shell and wiring board, described shell and described wiring board constitute the protection structure of silicon capacitor microphone, described protection inside configuration is equipped with the MEMS acoustic-electro conversion chip, described protection structure is provided with the sound hole that is communicated with described MEMS acoustic-electro conversion chip space outerpace, and: the lid that comprises a par and a lug boss is installed on the PCB surface of described protection inside configuration, the periphery of described lid and the airtight combination of described PCB surface, described lug boss inner space forms a cavity, described par is provided with at least one air-vent, on the described par of described air-vent top described MEMS acoustic-electro conversion chip is installed, the joint portion of described lid bottom surface and described PCB surface is provided with the gas-permeable channels that is communicated with described air-vent and described cavity; By this design, can effectively increase the air space (back cavity) at MEMS acoustic-electro conversion chip rear, and the MEMS acoustic-electro conversion chip is installed on the par of lid, do not increase the height of product too much.
The improvement of the technical program is: the groove of described gas-permeable channels for being provided with on described wiring board; The spatial communication air-vent of MEMS acoustic-electro conversion chip below, air-vent is communicated to the cavity of lug boss and PCB surface formation by the groove that is provided with on the wiring board, this wiring board does not need to be provided with the too much number of plies, generally can use wiring board and another layer of one deck hollow out not to have the wiring board of hollow out to be combined together to form, design comparatively simple.
The improvement of the technical program is: the groove of described gas-permeable channels for being provided with on described lid par; The spatial communication air-vent of MEMS acoustic-electro conversion chip below, air-vent is communicated to the cavity that lug boss and PCB surface form by the groove that is provided with on the lid par, and this wiring board can be the plane, designs comparatively simple.
The improvement of the technical program is: be provided with the ring seal layer between described lid and the described PCB surface, made by described ring seal layer to form the slit between described lid and the described PCB surface, thereby form described gas-permeable channels; Applied lid of this design and wiring board do not need to be provided with groove, only need ring seal layer formation certain height and seal well just can be effective.
The improvement of the technical program is: the par of described lid and lug boss are one; This lid can be avoided too much installation procedure as integrative-structure.
Improvement of the technical scheme is: the edge of described lug boss is provided with horizontal-extending portion, and described horizontal-extending portion and described PCB surface combine; Contact area is bigger between the lid edge of this design and the wiring board, and sealing property is better.
The improvement of the technical program is: separate with lug boss the par of described lid, and described lug boss annular closed bonds or is welded on and forms described cavity on the described par, and the par of described cavity correspondence is provided with air-vent; This lid is made more or less freely as a minute body structure.
Improvement of the technical scheme is: be provided with two air-vents on the par of described lid at least, described lug boss is installed on one of them air-vent at least.
Further improvement in the technical proposal is: the edge of described par down bending sticks on the described PCB surface, and the centre of described par and described PCB surface form described horizontal gas-permeable channels.
The further improvement of technique scheme is: be provided with the support salient point between the centre of described par and the described PCB surface.
The improvement of the technical program is: described lid is a metal lid; Lid can be by multiple material, but the ductility of metal material (for example aluminium) is better, and the part of making complicated shape under less size is more or less freely, with low cost, and for example plastic material or ceramic material also can be used for other.
The improvement of the technical program is: described air-vent is a plurality of micro-holes; This air-vent that is made of a plurality of micro-holes can be avoided impurity such as dust, the particle contact MEMS acoustic-electro conversion chip in the back cavity effectively, causes various bad.
For the air seal that guarantees lid periphery and PCB surface is good, lid and PCB surface can adopt viscose to combine, and also can adopt other materials such as scolding tin to combine; Shell can be that integrally formed or a plurality of parts are combined in integrally formed for metal or resin material making; The sound hole can be arranged on shell or the wiring board, but the position with the lid correspondence can not be set in the circuit board, otherwise product will not have the effect that increases back cavity, accepts the external sound signal from the below of MEMS acoustic-electro conversion chip and become; Board substrate can be resin or other materials.
Generally speaking, an integrated circuit (IC) chip that is used for conversion of signals also can be installed on the wiring board inner surface of silicon capacitor microphone, the wiring board outer surface is provided with and is used for a plurality of pads that circuit connects, design has circuit communication between MEMS acoustic-electro conversion chip, conversion of signals chip and the pad, the design of the design of this type of technology and MEMS acoustic-electro conversion chip itself does not influence purport of the present invention, and belonged to known technology, do not done detailed description.
Owing to adopted technique scheme, silicon capacitor microphone, comprise shell and wiring board, described shell and described wiring board constitute the protection structure of silicon capacitor microphone, described protection inside configuration is equipped with the MEMS acoustic-electro conversion chip, described protection structure is provided with the sound hole that is communicated with described MEMS acoustic-electro conversion chip space outerpace, and: the lid that comprises a par and a lug boss is installed on the PCB surface of described protection inside configuration, the periphery of described lid and the airtight combination of described PCB surface, described lug boss inner space forms a cavity, described par is provided with at least one air-vent, on the described par of described air-vent top described MEMS acoustic-electro conversion chip is installed, the joint portion of described lid bottom surface and described PCB surface is provided with the gas-permeable channels that is communicated with described air-vent and described cavity; The invention has the beneficial effects as follows: by this design, can effectively increase the air space (back cavity) at MEMS acoustic-electro conversion chip rear, and the MEMS acoustic-electro conversion chip is installed on the par of lid, do not increase the height of product too much.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention one;
Fig. 2 is the perspective exploded view of the embodiment of the invention one;
Fig. 3 is a kind of improvement structural representation of the embodiment of the invention one;
Fig. 4 is that the another kind of the embodiment of the invention one improves structural representation;
Fig. 5 is another improvement structural representation of the embodiment of the invention one;
Fig. 6 is the structural representation of the embodiment of the invention two;
Fig. 7 is the upward view of lid in the embodiment of the invention two;
Fig. 8 is the structural representation of the embodiment of the invention three;
Fig. 9 is the perspective exploded view of the embodiment of the invention three;
Figure 10 is the structural representation of the embodiment of the invention four;
Figure 11 is the upward view of lid in the embodiment of the invention four;
Figure 12 is a kind of improvement structural representation of the embodiment of the invention four;
Figure 13 is a kind of improvement structure upward view of lid in the embodiment of the invention four;
Figure 14 is the structural representation of the embodiment of the invention five;
Figure 15 is the perspective exploded view of the embodiment of the invention five.
Embodiment
Embodiment one: as shown in Figure 1 and Figure 2, silicon capacitor microphone comprises that the metal shell 1 of a square groove shape, shell 1 are provided with the sound hole 11 that is used to receive voice signal; The square wiring board 2 that resin material is made as base material; Shell 1 and wiring board 2 bond together, and become a protection structure; Wiring board 2 surfaces of protection inside configuration are gone up to paste a metal lid 3 that comprises a par 32 and a lug boss 31 are installed; the periphery of lid 3 and wiring board 2 surperficial airtight combinations; lug boss 31 and wiring board 2 surfaces form a cavity 34; par 32 is concordant with wiring board 2 surfaces; par 32 is provided with an air-vent 33; air-vent 33 tops are equipped with a MEMS acoustic-electro conversion chip 4; the position, joint portion of wiring board 2 surfaces and par 32 is provided with a horizontal gas-permeable channels 21 that can be communicated with air-vent 33 and cavity 34, and horizontal gas-permeable channels 21 can realize by the elongated recess that a level is set on wiring board 2 surfaces.The silicon capacitor microphone of this structure, MEMS acoustic-electro conversion chip 4 utilizes that viscose is airtight to be bonded on the par 32, space 41 under the MEMS acoustic-electro conversion chip 4 and air-vent 33 are communicated with, air-vent 33 and horizontal gas-permeable channels 21 are communicated with, horizontal gas-permeable channels 21 and cavity 34 are communicated with, and the space of this connection is airtight.Thereby, space 41 under the MEMS acoustic-electro conversion chip 4, air-vent 33, horizontal gas-permeable channels 21 and cavity 34 all become the back cavity (Back volume) of MEMS acoustic-electro conversion chip 4, wherein the space 41 under the MEMS acoustic-electro conversion chip 4 is for forming naturally, air-vent 33 and horizontal gas-permeable channels 21 mainly play the effect of air communication, and cavity 34 is the key factor that back cavity (Back volume) increases.By this design, can effectively increase the air space (back cavity) at MEMS acoustic-electro conversion chip rear, and the MEMS acoustic-electro conversion chip is installed on the par of lid, does not increase the height of product too much, can solve the defective that exists in the existing patent of background technology effectively.
On the implementation case basis, can also do certain changes and improvements.
As shown in Figure 3, the edge of lid 3 lug bosses 31 is provided with the edge part 35 of level, horizontal edge portion 35 is in the same place with wiring board 2 surface combination by the confining bed 5 of an annular with par 32, and confining bed 5 can be the mucigel or the soldering-tin layer of an annular.This design can be so that the bond area on lid 3 and wiring board 2 surfaces increases, and the layout of confining bed 5 is more or less freely, thereby can be so that the bonding seal is good between lid 3 and wiring board 2 surfaces.
As shown in Figure 4 22 be silicon capacitor microphone sound the hole, the sound hole 22 that silicon capacitor microphone is used to receive the external sound signal is arranged on wiring board 2, this design indicates another structure of silicon capacitor microphone, be referred to as the product of " Bottom " type in the general industry.
As shown in Figure 5, shell 1 and wiring board 2 all are the wiring board material by multi-layer resinous base material, shell 1 comprises the top board 12 and a square frame shape sidewall 13 on a plane, wiring board 2 is to be made by the two layers of resin base material, comprise by the wiring board 24 on the wiring board 23 of part hollow out and plane, after wiring board 23 and wiring board 24 combinations, the openwork part of wiring board 23 has formed horizontal gas-permeable channels 21.Air-vent 33 is made of a plurality of tiny air-vents, and this structure can prevent that the impurity in the back cavity is attached on the MEMS acoustic-electro conversion chip 4, causes various bad phenomenon.
Embodiment two: shown in Fig. 6,7, the main distinction of the implementation case and case study on implementation one is, horizontal gas-permeable channels is arranged on the par 32 of lid 3, groove 36 as shown in Fig. 6,7, groove 36 is arranged on the par 32 of lid 3 and the binding site of wiring board 2, and can be communicated with air-vent 33 and cavity 34.This design only needs the wiring board 2 on plane, does not need complicated wiring board design.
Embodiment three: as Fig. 8, shown in Figure 9, the main distinction of the implementation case and case study on implementation one is, separate with lug boss 31 par 32 of lid 3, lug boss 31 is metal caps 31 of a square groove shape, and par 32 is planar metal sheet 32 that have two air- vents 33 and 37, MEMS acoustic-electro conversion chip 4 is installed on the sheet metal 32 of air-vent 33 tops, metal cap 31 is installed in and forms cavity 34 on the sheet metal 32 of air-vent 37 tops, and the air seal is good each other.In the silicon capacitor microphone of this structure, the space 41 under the MEMS acoustic-electro conversion chip 4, air-vent 33, horizontal gas-permeable channels 21, air-vent 37 and cavity 34 connect mutually, have formed the back cavity of MEMS acoustic-electro conversion chip 4.In this structure, the lid 3 of application utilizes two parts bonding or solder bond together, and its manufacture craft is comparatively simple, does not need to make the lid of complicated shape.
Embodiment four: as Figure 10, shown in Figure 11, the implementation case is made certain improvement in conjunction with case study on implementation two and case study on implementation three.Separate with lug boss 31 par 32 of lid 3, lug boss 31 is metal caps 31 of a square groove shape, and par 32 is planar metal sheet 32 that have two air- vents 33 and 37, and the faying face of sheet metal 32 and wiring board 2 is provided with groove 36, groove 36 can be communicated with air- vent 33 and 37 as horizontal gas-permeable channels, and wiring board 2 is planes, MEMS acoustic-electro conversion chip 4 is installed on the sheet metal 32 of air-vent 33 tops, metal cap 31 is installed in and forms cavity 34 on the sheet metal 32 of air-vent 37 tops, and the air seal is good each other.In the silicon capacitor microphone of this structure, the space 41 under the MEMS acoustic-electro conversion chip 4, air-vent 33, horizontal gas-permeable channels 36, air-vent 37 and cavity 34 connect mutually, have formed the back cavity of MEMS acoustic-electro conversion chip 4.This design only needs the wiring board 2 on plane, does not need complicated wiring board design.
On the implementation case basis, can also do certain changes and improvements.
Shown in Figure 12 and 13, groove 36 areas on the faying face of sheet metal 32 and wiring board 2 are bigger, the edge of sheet metal 32 is bent and be bonded on wiring board 2 surfaces towards a lateral bending, the similar flat plate of shape, for the centre that guarantees sheet metal 32 being installed by metal cap 31 and the 4 back generation vibrations of MEMS acoustic-electro conversion chip, can between the centre of sheet metal 32 and wiring board 2, be provided with and support salient point 38, salient point 38 can be one or more, can be arranged on the sheet metal 32 or salient point on the wiring board 2 or independently.
Embodiment five: as Figure 14, shown in Figure 15, the implementation case is the improvement of carrying out on the basis of case study on implementation shown in Figure 3, the edge of lid 3 lug bosses 31 is provided with the edge part 35 of level, horizontal edge portion 35 and par 32 are by airtight the combining of confining bed 5 and wiring board 2 surfaces of an annular, and, the height of confining bed 5 suitably increases, make the enough ventilation spaces of reservation between wiring board 2 and the lid 3, this design can no longer be provided with the horizontal gas-permeable channels on wiring board 2 surfaces, confining bed 5 can use cohesiveness and seal glue class material preferably, also can use soldering tin material to make.
Claims (12)
1. silicon capacitor microphone; comprise shell and wiring board; described shell and described wiring board constitute the protection structure of silicon capacitor microphone; described protection inside configuration is equipped with the MEMS acoustic-electro conversion chip; described protection structure is provided with the sound hole that is communicated with described MEMS acoustic-electro conversion chip space outerpace; it is characterized in that: the lid that comprises a par and a lug boss is installed on the PCB surface of described protection inside configuration; the periphery of described lid and the airtight combination of described PCB surface; described lug boss inner space forms a cavity; described par is provided with at least one air-vent; on the described par of described air-vent top described MEMS acoustic-electro conversion chip is installed, the joint portion of described lid bottom surface and described PCB surface is provided with the gas-permeable channels that is communicated with described air-vent and described cavity.
2. silicon capacitor microphone as claimed in claim 1 is characterized in that: the groove of described gas-permeable channels for being provided with on described wiring board.
3. silicon capacitor microphone as claimed in claim 1 is characterized in that: the groove of described gas-permeable channels for being provided with on described lid par.
4. silicon capacitor microphone as claimed in claim 1, it is characterized in that: be provided with the ring seal layer between described lid and the described PCB surface, make by described ring seal layer to form the slit between described lid and the described PCB surface, thereby form described gas-permeable channels.
5. silicon capacitor microphone as claimed in claim 1 is characterized in that: the par of described lid and lug boss are one.
6. silicon capacitor microphone as claimed in claim 5 is characterized in that: the edge of described lug boss is provided with horizontal-extending portion, and described horizontal-extending portion and described PCB surface combine.
7. silicon capacitor microphone as claimed in claim 1, it is characterized in that: separate with lug boss the par of described lid, described lug boss annular closed bonds or is welded on and forms described cavity on the described par, and the par of described cavity correspondence is provided with air-vent.
8. silicon capacitor microphone as claimed in claim 7 is characterized in that: be provided with two air-vents on the par of described lid at least, described lug boss is installed on one of them air-vent at least.
9. silicon capacitor microphone as claimed in claim 8 is characterized in that: the edge of described par down bending sticks on the described PCB surface, and the centre of described par and described PCB surface form described horizontal gas-permeable channels.
10. silicon capacitor microphone as claimed in claim 9 is characterized in that: be provided with the support salient point between the centre of described par and the described PCB surface.
11. as the described silicon capacitor microphone of the arbitrary claim of claim 1-10, it is characterized in that: described lid is a metal lid.
12. as the described silicon capacitor microphone of the arbitrary claim of claim 1-10, it is characterized in that: described air-vent is a plurality of micro-holes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101582786A CN101394687A (en) | 2008-10-28 | 2008-10-28 | Microphone with silicon capacitor |
| PCT/CN2009/073551 WO2010048833A1 (en) | 2008-10-28 | 2009-08-27 | Silicon capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101582786A CN101394687A (en) | 2008-10-28 | 2008-10-28 | Microphone with silicon capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101394687A true CN101394687A (en) | 2009-03-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101582786A Pending CN101394687A (en) | 2008-10-28 | 2008-10-28 | Microphone with silicon capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101394687A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010048833A1 (en) * | 2008-10-28 | 2010-05-06 | 歌尔声学股份有限公司 | Silicon capacitor microphone |
| CN101959107A (en) * | 2010-04-19 | 2011-01-26 | 瑞声声学科技(深圳)有限公司 | MEMS (Micro Electro Mechanical Systems) microphone |
| WO2011103720A1 (en) * | 2010-02-26 | 2011-09-01 | Ubotic Intellectual Property Co., Ltd. | Semiconductor package for mems device and method of manufacturing the same |
| CN102726065A (en) * | 2010-12-30 | 2012-10-10 | 歌尔声学股份有限公司 | A MEMS microphone and method for packaging the same |
| CN101568055B (en) * | 2009-04-03 | 2012-10-10 | 瑞声声学科技(深圳)有限公司 | Silicone base capacitance microphone |
| CN103125019A (en) * | 2010-04-30 | 2013-05-29 | 优博创新科技产权有限公司 | Semiconductor package configured to electrically couple to printed circuit board and method of providing the same |
| US8853564B2 (en) | 2010-04-30 | 2014-10-07 | Ubotic Intellectual Property Co. Ltd. | Air cavity package configured to electrically couple to a printed circuit board and method of providing same |
| CN104301850A (en) * | 2014-11-11 | 2015-01-21 | 山东共达电声股份有限公司 | Silicon microphone |
| WO2017012122A1 (en) * | 2015-07-23 | 2017-01-26 | 华为技术有限公司 | Silicon microphone device and electronic apparatus using same |
| CN110526199A (en) * | 2019-09-10 | 2019-12-03 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
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2008
- 2008-10-28 CN CNA2008101582786A patent/CN101394687A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2010048833A1 (en) * | 2008-10-28 | 2010-05-06 | 歌尔声学股份有限公司 | Silicon capacitor microphone |
| CN101568055B (en) * | 2009-04-03 | 2012-10-10 | 瑞声声学科技(深圳)有限公司 | Silicone base capacitance microphone |
| WO2011103720A1 (en) * | 2010-02-26 | 2011-09-01 | Ubotic Intellectual Property Co., Ltd. | Semiconductor package for mems device and method of manufacturing the same |
| CN102859688B (en) * | 2010-02-26 | 2015-05-27 | 优博创新科技产权有限公司 | Semiconductor package for mems device and method of manufacturing the same |
| CN102859688A (en) * | 2010-02-26 | 2013-01-02 | 优博创新科技产权有限公司 | Semiconductor package for mems device and method of manufacturing the same |
| US8809974B2 (en) | 2010-02-26 | 2014-08-19 | Ubotic Intellectual Property Company Limited | Semiconductor package for MEMS device and method of manufacturing same |
| KR101443477B1 (en) * | 2010-02-26 | 2014-09-22 | 유보틱 인텔릭츄얼 프라퍼티 컴퍼니 리미티드 | Semiconductor package for mems device and method of manufacturing the same |
| CN101959107A (en) * | 2010-04-19 | 2011-01-26 | 瑞声声学科技(深圳)有限公司 | MEMS (Micro Electro Mechanical Systems) microphone |
| US8853564B2 (en) | 2010-04-30 | 2014-10-07 | Ubotic Intellectual Property Co. Ltd. | Air cavity package configured to electrically couple to a printed circuit board and method of providing same |
| CN103125019A (en) * | 2010-04-30 | 2013-05-29 | 优博创新科技产权有限公司 | Semiconductor package configured to electrically couple to printed circuit board and method of providing the same |
| US8742569B2 (en) | 2010-04-30 | 2014-06-03 | Ubotic Intellectual Property Co. Ltd. | Semiconductor package configured to electrically couple to a printed circuit board and method of providing same |
| CN102726065B (en) * | 2010-12-30 | 2014-06-04 | 歌尔声学股份有限公司 | A MEMS microphone and method for packaging the same |
| CN102726065A (en) * | 2010-12-30 | 2012-10-10 | 歌尔声学股份有限公司 | A MEMS microphone and method for packaging the same |
| CN104301850A (en) * | 2014-11-11 | 2015-01-21 | 山东共达电声股份有限公司 | Silicon microphone |
| WO2017012122A1 (en) * | 2015-07-23 | 2017-01-26 | 华为技术有限公司 | Silicon microphone device and electronic apparatus using same |
| CN107211224A (en) * | 2015-07-23 | 2017-09-26 | 华为技术有限公司 | Silicon microphone device and use its electronic equipment |
| CN110526199A (en) * | 2019-09-10 | 2019-12-03 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
| CN110526199B (en) * | 2019-09-10 | 2024-08-06 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and packaging method thereof |
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Application publication date: 20090325 |