CN201682614U - Electret condenser microphone - Google Patents
Electret condenser microphone Download PDFInfo
- Publication number
- CN201682614U CN201682614U CN2010202082319U CN201020208231U CN201682614U CN 201682614 U CN201682614 U CN 201682614U CN 2010202082319 U CN2010202082319 U CN 2010202082319U CN 201020208231 U CN201020208231 U CN 201020208231U CN 201682614 U CN201682614 U CN 201682614U
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- Prior art keywords
- circuit board
- assembly
- capacitor microphone
- electret capacitor
- component
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model is applicable to the field of microphones, and provides an electret condenser microphone, which comprises a housing, and a diaphragm component, a gasket, a back electret component and a circuit board component arranged and encapsulated inside the housing in sequence, wherein a cavity ring is further arranged between the back electret component and the circuit board component, and comprises an insulating cavity body and a conductor component penetrating into the insulating cavity body and electrically connected with the back electret component and the circuit board component. By virtue of the insulating cavity body and the conductor component penetrating into the insulating cavity body and electrically connected with the back electret component and the circuit board component, the electret condenser microphone replaces the traditional copper ring, spring plate or combined structure of a spring and a cavity body, so that the volume of the inner cavity is increased, the number of parasitic capacitors is decreased, the product performance is ensured, the technical processes are simplified, the processing and assembling costs are lowered, the sensitivity can be effectively improved, and the application range is wide.
Description
Technical field
The utility model belongs to the microphone field, relates in particular to a kind of electret capacitor microphone.
Background technology
At present, electret capacitor microphone has obtained development at full speed, common electret capacitor microphone in the prior art, come electrical interconnection board component and backplane assembly owing to adopt the combining structure of copper ring, shell fragment or spring and cavity, taken the space of inner chamber greatly, increased parasitic capacitance, and technological process is miscellaneous, processing and assembly cost are bigger, can not get using widely.
The utility model content
The purpose of the utility model embodiment is to provide a kind of electret capacitor microphone, be intended to solve electret capacitor microphone common in the prior art, come electrical interconnection board component and backplane assembly owing to adopt the combining structure of copper ring, shell fragment or spring and cavity, taken the space of inner chamber greatly, increased parasitic capacitance, and production process is miscellaneous, and processing and assembly cost are bigger, the problem that can not get using widely.
The utility model embodiment realizes like this, a kind of electret capacitor microphone, comprise shell and place and be encapsulated in diaphragm unit, pad, backplane assembly and the circuit board assemblies of enclosure successively, also be equipped with the chamber ring between described backplane assembly and the circuit board assemblies, described chamber ring comprises the insulation cavity and runs through the conductor assembly that described insulation inside cavity is used to be electrically connected described backplane assembly and circuit board assemblies.
Described conductor assembly is specially plain conductor or heavy plating.
Described insulation cavity is specially plastic chamber.
The upper and lower surface of described insulation cavity is respectively arranged with the sheet metal that is electrically connected with described conductor assembly.
Also be provided with damper assembly between described backplane assembly and the chamber ring, described circuit board assemblies offers sound hole.
Described damper assembly comprises:
Place the metallic gasket on the described backplane assembly and place metal gasket ring on the described metallic gasket;
Described metal gasket ring is provided with the metal gasket annular distance.
Described backplane assembly comprises the back-pole base of back pole plate and ccontaining described back pole plate and described damper assembly.
Described metallic gasket substitutes with wire netting.
Described circuit board assemblies comprises circuit board and is arranged on output and electronic component on the described circuit board, and described circuit board lower surface is provided with and is used for the metal gate polar circle that is electrically connected with described conductor assembly.
The bottom of described shell is provided with balancing slit.
The utility model embodiment compared with prior art, beneficial effect is: by the insulation cavity and run through the combining structure that conductor assembly that described insulation inside cavity is used to be electrically connected described backplane assembly and circuit board assemblies replaces traditional copper ring, shell fragment or spring and cavity, increased the volume of inner chamber, reduced parasitic capacitance, guarantee the performance of product, and simplified technological process, reduced processing and assembly cost, and can effectively promote sensitivity, but extensive use.
Description of drawings
Fig. 1 is the cross-sectional view of the electret capacitor microphone of the utility model embodiment one;
Fig. 2 is the decomposition texture schematic diagram of the electret capacitor microphone of the utility model embodiment one;
Fig. 3 is the sectional structure chart that the chamber of the electret capacitor microphone of the utility model embodiment is encircled;
Fig. 4 is the cross-sectional view of the electret capacitor microphone of the utility model embodiment two;
Fig. 5 is the decomposition texture schematic diagram of the electret capacitor microphone of the utility model embodiment two;
Fig. 6 is the flow chart of the manufacture method of the electret capacitor microphone that provides of the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Among the utility model embodiment, by the insulation cavity and run through the combining structure that conductor assembly that described insulation inside cavity is used to be electrically connected described backplane assembly and circuit board assemblies replaces traditional copper ring, shell fragment or spring and cavity, increased the volume of inner chamber, reduced parasitic capacitance, guarantee the performance of product, and simplified technological process, reduced processing and assembly cost, and can effectively promote sensitivity, but extensive use.
Embodiment one
See also Fig. 1 to Fig. 3, the electret capacitor microphone of the utility model embodiment one comprises:
In embodiment of the present utility model, the insulation cavity of being made by insulating material 141 is specially the plastic chamber of being made by plastic material; Described conductor assembly 142 is specially plain conductor or heavy plating.
Described plain conductor can be specially copper conductor, and described heavy plating can be specially heavy copper facing.
In embodiment of the present utility model, the upper and lower surface of described insulation cavity 141 is respectively arranged with the sheet metal 143 that is electrically connected with described conductor assembly 142.In actual applications, the quantity of conductor assembly 142 and sheet metal 143 can be provided with as required.
In embodiment of the present utility model, described chamber ring 14 is by being arranged between back pole plate 13 and the circuit board assemblies 30, play dual parts to support and be electrically connected, the sheet metal 143 that 14 upper surfaces are encircled in the chamber is electrically connected with the metal gate polar circle of circuit board 31, and the sheet metal 143 that 14 lower surfaces are encircled in the chamber is electrically connected with backplane assembly 13.
As preferred version, the conductor assembly 142 and the sheet metal 143 of chamber ring 14 are copper material, thereby have excellent conducting performance, and insulation cavity 141 is the FR4 material.
In embodiment of the present utility model, described pad 12 is made of plastics.
In embodiment of the present utility model, described shell 20 is specially the metal shell of the tubular of an end opening, the bottom of shell 20 offers more than one sound hole 40 and more than one balancing slit 21, and shell 20 tops also are provided with the crimping 25 that is used for closed and fixed circuit board assemblies 30.
In embodiment of the present utility model, be stained with dustcloth 50 at the bottom outer surface of metal shell 20, be used to prevent that dust from entering electret capacitor microphone inside.
In embodiment of the present utility model, described circuit board assemblies 30 comprises circuit board 31 and is arranged on electronic component such as the field effect transistor 32 as impedance transformation element on the described circuit board 31, electric capacity 33 and is arranged on output 34 on the circuit board 31, and the lower surface of circuit board 31 also is provided with and is used for the metal gate polar circle that is electrically connected with described conductor assembly.Can also be provided with sound hole 41 on the circuit board assemblies 30.Shell 20 and circuit board assemblies 30 can adopt same as the prior art or similar structure and principle, repeat no more herein.
In embodiment of the present utility model, diaphragm unit 11, pad 12, backplane assembly 13 all can adopt same as the prior art or similar structure and principle.For example, diaphragm unit 11 is made up of metal zona 111 and the macromolecule membrane 112 that is arranged on these metal zona 111 upper surfaces.This metal zona 111 closely contacts with the bottom of described metal shell 20.These macromolecule membrane 112 preferred PPS films that adopt, its one side with respect to metal shell 20 bottoms is coated with layer of metal nickel.Described backplane assembly 13 comprises the back pole plate 131 that offers an above backplane sound hole 132, and this back pole plate 131 is coated with the electret fep film with respect to the one side of diaphragm unit 11.This back pole plate 131 is handled through polarization process, has the electrostatic charge of certain electric weight.Pad 12 between diaphragm unit 11 and backplane assembly 13, thereby make diaphragm unit 11 and back pole plate 13 constitute a capacity plate antenna.
In embodiment of the present utility model, the outside of described back pole plate 131 also is set with back-pole base 133, and described back-pole base 133 is specially an annulus, is made by electrically non-conductive material, is used for back pole plate 131 and metal shell 20 are separated.
Below the operation principle of the electret capacitor microphone of embodiment one is carried out simple declaration:
Act on diaphragm unit 11 behind the sound hole 40 of extraneous acoustical signal by shell 20 and make its vibrations, thereby cause the capacitance variations of the capacity plate antenna that diaphragm unit 11 and back pole plate 13 constitute, produces an alternating voltage signal, finish acoustic-electric conversion.This voltage signal is passed to circuit board assemblies 30 through chamber ring 14, through impedance conversion, is passed to output 34.
Embodiment two
See also Fig. 4 and Fig. 5, the electret capacitor microphone of the utility model embodiment two is a directional microphone, compares with embodiment one, and difference only is, also is provided with damper assembly 60 between described backplane assembly 13 and the chamber ring 14;
In embodiment of the present utility model, described circuit board assemblies 30 offers sound hole 41.
In embodiment of the present utility model, described damper assembly 60 comprises:
Place the metallic gasket 61 on the described backplane assembly 13 and place metal gasket ring 62 on the described metallic gasket;
Described metal gasket ring 62 is provided with metal gasket annular distance 621.
Offer the metal gasket film perforations in the middle of the metallic gasket 61, described metal gasket film perforation, backplane hole 132 and metal gasket annular distance 621 form a slit and constitute the air gap damping, the acoustical signal that the sound hole 40 from circuit board assemblies 30 of being used to decay enters.So just there is phase difference in the acoustical signal that arrives diaphragm units 11 from the sound hole 40 of the sound hole 40 of shell 20 and circuit board assemblies 30 respectively, thereby obtains stronger directive property.
Place the metallic gasket 61 on the described backplane assembly 13 and place metal gasket ring 62 on the described metallic gasket because damper assembly comprises, thereby compare than traditional damper assembly, not yielding, high conformity.
In embodiment of the present utility model, described backplane assembly 13 comprises the back-pole base 133 of back pole plate 131 and ccontaining described back pole plate 131 and described damper assembly 60.
Described back-pole base 133 is an annulus, is made by electrically non-conductive material, is used for back pole plate 131, metallic gasket 61, gasket ring 62 are separated with metal shell 20.
In embodiment of the present utility model, described metallic gasket 61 can also adopt wire netting to substitute.
In embodiment of the present utility model, described wire netting specifically can adopt the steel mesh that offers a plurality of holes.
Seeing also Fig. 6 the utility model embodiment also provides a kind of manufacture method of electret capacitor microphone, said method comprising the steps of:
S601: in the insulation cavity, run through conductor assembly, make the chamber ring;
S602: successively diaphragm unit, pad, backplane assembly, chamber ring and circuit board assemblies are placed and encapsulated in the enclosure.
In embodiment of the present utility model, described conductor assembly is electrically connected described backplane assembly and circuit board assemblies.
In embodiment of the present utility model, described S601 runs through conductor assembly in the insulation cavity, and the step of making the chamber ring is specially:
In the insulation cavity, drill through the hole,, make the chamber ring at logical inner hole deposition plating.
In embodiment of the present utility model, described S601 runs through conductor assembly in the insulation cavity, and the step of making the chamber ring can also be specially:
In the insulation cavity, drill through the hole, in through hole, insert plain conductor, make the chamber ring.
Electret capacitor microphone of the present utility model and preparation method thereof, by the insulation cavity and run through the combining structure that conductor assembly that described insulation inside cavity is used to be electrically connected described backplane assembly and circuit board assemblies replaces traditional copper ring, shell fragment or spring and cavity, increased the volume of inner chamber, reduced parasitic capacitance, guarantee the performance of product, and simplified technological process, reduced processing and assembly cost, and can effectively promote sensitivity, but extensive use.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. electret capacitor microphone, comprise shell and place and be encapsulated in diaphragm unit, pad, backplane assembly and the circuit board assemblies of enclosure successively, it is characterized in that, also be equipped with the chamber ring between described backplane assembly and the circuit board assemblies, described chamber ring comprises the insulation cavity and runs through the conductor assembly that described insulation inside cavity is used to be electrically connected described backplane assembly and circuit board assemblies.
2. electret capacitor microphone as claimed in claim 1 is characterized in that, described conductor assembly is specially plain conductor or heavy plating.
3. electret capacitor microphone as claimed in claim 1 is characterized in that, described insulation cavity is specially plastic chamber.
4. electret capacitor microphone as claimed in claim 1 is characterized in that the upper and lower surface of described insulation cavity is respectively arranged with the sheet metal that is electrically connected with described conductor assembly.
5. as each described electret capacitor microphone in the claim 1 to 4, it is characterized in that also be provided with damper assembly between described backplane assembly and the chamber ring, described circuit board assemblies offers sound hole.
6. electret capacitor microphone as claimed in claim 5 is characterized in that, described damper assembly comprises:
Place the metallic gasket on the described backplane assembly and place metal gasket ring on the described metallic gasket;
Described metal gasket ring is provided with the metal gasket annular distance.
7. electret capacitor microphone as claimed in claim 5 is characterized in that described backplane assembly comprises the back-pole base of back pole plate and ccontaining described back pole plate and described damper assembly.
8. electret capacitor microphone as claimed in claim 6 is characterized in that, described metallic gasket substitutes with wire netting.
9. electret capacitor microphone as claimed in claim 1, it is characterized in that, described circuit board assemblies comprises circuit board and is arranged on output and electronic component on the described circuit board, and described circuit board lower surface is provided with and is used for the metal gate polar circle that is electrically connected with described conductor assembly.
10. electret capacitor microphone as claimed in claim 1 is characterized in that the bottom of described shell is provided with balancing slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202082319U CN201682614U (en) | 2010-05-28 | 2010-05-28 | Electret condenser microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202082319U CN201682614U (en) | 2010-05-28 | 2010-05-28 | Electret condenser microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201682614U true CN201682614U (en) | 2010-12-22 |
Family
ID=43347647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202082319U Expired - Fee Related CN201682614U (en) | 2010-05-28 | 2010-05-28 | Electret condenser microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201682614U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835077A (en) * | 2010-05-28 | 2010-09-15 | 深圳市豪恩声学股份有限公司 | Electret condenser microphone and manufacturing method thereof |
| CN102014324A (en) * | 2010-12-28 | 2011-04-13 | 深圳市豪恩声学股份有限公司 | Microphone |
| CN108156564A (en) * | 2018-02-28 | 2018-06-12 | 深圳捷力泰科技开发有限公司 | Electret microphone |
-
2010
- 2010-05-28 CN CN2010202082319U patent/CN201682614U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835077A (en) * | 2010-05-28 | 2010-09-15 | 深圳市豪恩声学股份有限公司 | Electret condenser microphone and manufacturing method thereof |
| CN102014324A (en) * | 2010-12-28 | 2011-04-13 | 深圳市豪恩声学股份有限公司 | Microphone |
| CN102014324B (en) * | 2010-12-28 | 2013-06-05 | 深圳市豪恩声学股份有限公司 | Microphone |
| CN108156564A (en) * | 2018-02-28 | 2018-06-12 | 深圳捷力泰科技开发有限公司 | Electret microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20140528 |