CN102075841B - Electret microphone - Google Patents
Electret microphone Download PDFInfo
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- CN102075841B CN102075841B CN201110051131.9A CN201110051131A CN102075841B CN 102075841 B CN102075841 B CN 102075841B CN 201110051131 A CN201110051131 A CN 201110051131A CN 102075841 B CN102075841 B CN 102075841B
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- drain pan
- shell
- top shell
- tone
- circuit board
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Abstract
The invention relates to an electret microphone. The electret microphone comprises a shell and a membrane component, an insulating gasket, a back electret component, an insulating cavity and a circuit board component which are arranged in the shell in sequence, wherein the back electret component is electrically connected with the circuit board component; and the shell comprises a bottom shell and a top shell, the bottom shell and the top shell are sleeved to form an accommodating cavity for accommodating the membrane component, the insulating gasket, the back electret component, the insulating cavity and the circuit board component, the circuit board component is arranged close to the top shell, and the surface, parallel to the membrane component, of the top shell, is a plane. The top shell of the electret microphone is directly manufactured by a mold, and the smoothness of the top part is much higher than that of shell edges curled by the traditional method, so that the SMT difficulty of the electret microphone is lowered, and the qualification rate of products is improved.
Description
[technical field]
The present invention relates to microphone field, relate in particular to a kind of electret microphone.
[background technology]
In portable communications field, most of circular crimping or the square bead designs of adopting of traditional electret microphone.But the surface smoothness of circular crimping or square crimping electret microphone product is not high, be unfavorable for large-scale SMT (Surface Mounted Technology, surface mounting technology) produce, and after SMT, the qualification rate of product is low, and performance is relatively poor.
[summary of the invention]
Based on this, be necessary the electret microphone that provides a kind of surface smoothness higher.
A kind of electret microphone, comprise shell and the diaphragm unit setting gradually in the enclosure, insulation spacer, backplane assembly, insulation cavity and circuit board assemblies, backplane assembly and circuit board assemblies are electrically connected, shell comprises drain pan and top shell, drain pan and top shell are socketed to form one for accommodating the host cavity of diaphragm unit, insulation spacer, backplane assembly, insulation cavity and circuit board assemblies, circuit board assemblies is near top shell setting, and the top shell surface parallel with diaphragm unit is a plane.
Preferably, the drain pan extension that drain pan comprises square bottom and vertically extends to form along bottom margin; The top shell extension that top shell comprises square top and vertically extends to form along top, the top of top shell offers the opening for exposing circuit board assemblies; The internal diameter adaptation of the external diameter adaptation of the internal diameter of top shell extension and drain pan extension or the external diameter of top shell extension and drain pan extension.
Preferably, circuit board assemblies comprises wiring board, is located at wiring board near multiple conducting boss of opening one side and is located at impedance transformer and the capacitance resistance element of wiring board opposite side.
Preferably, the bottom of drain pan offers tone-entering hole.
Preferably, the bottom lock of drain pan, wiring board offers tone-entering hole, and tone-entering hole runs through in multiple conducting boss, and tone-entering hole is communicated with the cavity that insulation cavity and backplane assembly and wiring board form.
Preferably, the bottom lock of drain pan, wiring board offers tone-entering hole, and tone-entering hole runs through in multiple conducting boss, and insulation cavity offers the through hole that runs through the cavity that insulate at tone-entering hole place, and tone-entering hole and through hole are communicated with the cavity of drain pan and diaphragm unit formation.
Preferably, between diaphragm unit and the bottom of drain pan, be provided with gasket ring.
Preferably, also comprise the seal that is located at the gap between top shell and drain pan.
Preferably, diaphragm unit comprises and the conduction zona of outer casing bottom close contact and be located at the vibrating diaphragm between conduction zona and insulation spacer.
Preferably, backplane assembly comprises and offers the back pole plate of at least one backplane tone-entering hole and be located at the electret film on back pole plate, and electret film is arranged on the side near diaphragm unit on back pole plate.
The top shell of above-mentioned electret microphone is directly made by mould, and the shell edge of the evenness at its top after far above traditional crimping, thereby the difficulty while having reduced electret microphone SMT improve the production qualification rate of product; In addition, adopt two-layer shell structure, in performance, between the electric-conductor that is electrically connected backplane assembly and circuit board assemblies in insulation cavity and shell, corresponding area reduces, and parasitic capacitance is reduced, reducing noise.
This electret microphone during fabrication, easy to process, and efficiency is high, can carry out large-scale production; Production technology regulates easy, easily management and control; Top shell downforce is adjustable, can not damage inner structure; Equipment is simple, can reduce the input of production equipment.
[accompanying drawing explanation]
Fig. 1 is the schematic perspective view of the electret microphone of embodiment 1;
Fig. 2 be in Fig. 1 electret microphone along the cutaway view of I-I line;
Fig. 3 is the schematic perspective view of the electret microphone of embodiment 2;
Fig. 4 be in Fig. 3 electret microphone along the cutaway view of II-II line;
Fig. 5 is the cutaway view of the electret microphone of embodiment 3.
[embodiment]
Mainly in conjunction with the drawings and the specific embodiments electret microphone is described in further detail below.
Embodiment 1
As depicted in figs. 1 and 2, the electret microphone 100 of the present embodiment comprises shell 110 and sets gradually in shell 110 diaphragm unit 120, insulation spacer 130, backplane assembly 140, insulation cavity 150, circuit board assemblies 160, electric-conductor 170 and seal 180.Between backplane assembly 140 and circuit board assemblies 160, by electric-conductor 170, be electrically connected.
Shell 110 comprises drain pan 112 and top shell 116.Top shell 116 is socketed with this drain pan 112, and to form a host cavity for accommodating diaphragm unit 120, insulation spacer 130, backplane assembly 140, insulation cavity 150 and circuit board assemblies 160, wherein circuit board assemblies 160 arranges near top shell 116.The top 117 of top shell 116, also the surface parallel with diaphragm unit 120 is a planar structure.
The drain pan extension 114 that drain pan 112 comprises square bottom 113 and extends to form along bottom 113 edge-perpendicular.The top shell extension 118 that top shell 116 comprises square top 117 and extends to form along top 117 edge-perpendicular.Top shell 112 and drain pan 116 are all roughly the untight rectangular housing of a side.Wherein, the middle part at the top 117 of top shell 116 offers the opening 119 that exposes circuit board assemblies 160 for part.The internal diameter of the top shell extension 118 of the present embodiment and the external diameter adaptation of drain pan extension 114, thus drain pan 112 can be nested in top shell 116.In other embodiments, the external diameter of top shell extension 118 can also with the internal diameter adaptation of drain pan extension 114, thereby top shell 116 can be nested in drain pan 112.
Gap between drain pan 112 and top shell 116 adopts seal 180 to seal, and seal 180 can be rubber ring, rubber blanket or glue etc.
The middle part of the bottom 113 of the drain pan 112 of the present embodiment offers tone-entering hole 115.Preferably, shell 110 is also provided with in the position of tone-entering hole 115 for preventing that dust from entering the structures such as the dustcloth of electret microphone 100 or Air Filter.
The diaphragm unit 120 of the present embodiment comprises and the conduction zona 122 of bottom 113 close contacts of drain pan 112 and be located at the vibrating diaphragm 124 between conduction zona 122 and insulation spacer 130.Vibrating diaphragm 124 is provided with metallic diaphragm (not shown) near a side of resonant cavity 190.Preferably, conduction zona 122 is metal material, and vibrating diaphragm 124 is macromolecule membrane, and as PPS (polyphenylene sulfide) film etc., metallic diaphragm can be conventional nickel metal layer.
Between backplane assembly 140 and circuit board assemblies 160, by electric-conductor 170, be electrically connected.The electric-conductor 170 of the present embodiment is copper post, in other preferred embodiments, electric-conductor 170 can also be the structures such as conductive pin, electroconductive elastic sheet, power spring or conduction connection ring, and further the less metal or alloy of the conductivity such as preferably copper parasitic capacitance good, that produce with shell 110 is made.
External sound signal enters in shell 110 by the tone-entering hole 115 of offering on shell 110, the vibrating diaphragm 124 that causes the diaphragm unit 120 being contained in shell 110 vibrates, further cause the variation of capacity plate antenna between vibrating diaphragm 124 and backplane assembly 140, produce alternating voltage signal, complete the conversion of acoustoelectric signal; By electric-conductor 170, the signal of telecommunication is passed to circuit board assemblies 160 again, through impedance variation, transmit signals to conducting boss 164.
The top shell 116 of the electret microphone 100 of the present embodiment is directly made by mould, and the shell edge of the evenness at its top 117 after far above traditional crimping, thereby the difficulty while having reduced electret microphone 100SMT improve the production qualification rate of product.In addition, adopt two-layer shell structure, in performance, between the electric-conductor 170 of insulation cavity 150 interior electric connection backplane assembly 140 and circuit board assemblies 160 and shell 110, corresponding area reduces, and parasitic capacitance is reduced, reducing noise.
Further, electret microphone 100 during fabrication, easy to process, and efficiency is high, can carry out large-scale production; Production technology regulates easy, easily management and control; Top shell 116 downforce are adjustable, can not damage inner structure; Equipment is simple, can reduce the input of production equipment.
Embodiment 2
As shown in Figure 3 and Figure 4, the electret microphone 200 of the present embodiment comprises shell 210 and sets gradually in shell 210 diaphragm unit 220, insulation spacer 230, backplane assembly 240, insulation cavity 250, circuit board assemblies 260, electric-conductor 270 and seal 280.Between backplane assembly 240 and circuit board assemblies 260, by electric-conductor 270, be electrically connected.
Shell 210 structure similar embodiment 1, comprise drain pan 212 and top shell 216.Wherein, the drain pan extension 214 that drain pan 212 comprises square bottom 213 and extends to form along bottom 213 edge-perpendicular.The top shell extension 218 that top shell 216 comprises square top 217 and extends to form along top 217 edge-perpendicular.The top 217 of top shell 216, also the surface parallel with diaphragm unit 220 is a planar structure.The middle part at the top 217 of top shell 216 offers the opening 219 that exposes circuit board assemblies 260 for part.The internal diameter of the top shell extension 218 of the present embodiment and the external diameter adaptation of drain pan extension 214, thus drain pan 212 can be nested in top shell 216.Gap between drain pan 212 and top shell 216 adopts seal 280 to seal.
Diaphragm unit 220 comprises the conduction zona 222 with bottom 213 close contacts of drain pan 212, and is located at the vibrating diaphragm 224 between conduction zona 222 and insulation spacer 230.Vibrating diaphragm 224 is provided with metallic diaphragm (not shown) near a side of resonant cavity 290.
The bottom 213 of the drain pan 212 of the present embodiment is sealed.Wiring board 262 offers tone-entering hole 265, and tone-entering hole 265 runs through in multiple conducting boss 264.Tone-entering hole 265 is communicated with the cavity 252 that insulation cavity 250 and backplane assembly 240 and wiring board 262 form.
Accordingly, electret microphone 200 is provided with gasket ring 215 between diaphragm unit 220 and bottom 213, thereby drain pan 212 coordinates gasket ring 215 and diaphragm unit 220 to form resonant cavity 290.Gasket ring 215 shapes of the present embodiment coordinate the thickness of conduction zona 222 to reach the dimensional requirement of resonant cavity 290 with conduction zona 222 adaptations, the thickness of gasket ring 215.In addition, in a preferred embodiment, gasket ring 215 can also be one-body molded with drain pan 212, also in the bottom 213 of drain pan 212, offers and conduct electricity the structures such as the groove of zona 222 adaptations or opening.
Embodiment 3
As shown in Figure 5, the electret microphone 300 of the present embodiment comprises shell 310 and sets gradually in shell 310 diaphragm unit 320, insulation spacer 330, backplane assembly 340, insulation cavity 350, circuit board assemblies 360, electric-conductor 370 and seal 380.Between backplane assembly 340 and circuit board assemblies 360, by electric-conductor 370, be electrically connected.
Shell 310 structure similar embodiment 1, comprise drain pan 312 and top shell 316.Wherein, drain pan 312 comprises square bottom 313, and the drain pan extension 314 extending to form along bottom 313 edge-perpendicular.Top shell 316 comprises square top 317, and the top shell extension 318 extending to form along top 317 edge-perpendicular.The top 317 of top shell 316, also the surface parallel with diaphragm unit 320 is a planar structure.The middle part at the top 317 of top shell 316 offers the opening 319 that exposes circuit board assemblies 360 for part.The internal diameter of the top shell extension 318 of the present embodiment and the external diameter adaptation of drain pan extension 314, thus drain pan 312 can be nested in top shell 316.Gap between drain pan 212 and top shell 216 adopts seal 280 to seal.
Diaphragm unit 320 comprises the conduction zona 322 with bottom 313 close contacts of drain pan 312, and is located at the vibrating diaphragm 324 between conduction zona 322 and insulation spacer 330.Vibrating diaphragm 224 is provided with metallic diaphragm (not shown) near a side of resonant cavity 290.
The bottom 313 of the drain pan 312 of the present embodiment is sealed.Wiring board 362 offers tone-entering hole 365, and tone-entering hole 365 runs through in multiple conducting boss 364.Insulation cavity 350 offers the through hole 352 that runs through the cavity 350 that insulate at tone-entering hole 365 places.Tone-entering hole 365 and through hole 352 are communicated with the cavity that drain pan 312 and diaphragm unit 320 form.
Accordingly, electret microphone 300 is provided with gasket ring 315 between diaphragm unit 320 and the bottom 313 of drain pan 312, so that tone-entering hole 365 and through hole 352 are communicated with the cavity that drain pan 312 and diaphragm unit 320 form.
The tone-entering hole that is appreciated that electret microphone is not limited to above-mentioned set-up mode, also can be located at a side of the drain pan of shell.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (5)
1. an electret microphone, the diaphragm unit that comprises shell and set gradually in described shell, insulation spacer, backplane assembly, insulation cavity and circuit board assemblies, between described backplane assembly and described circuit board assemblies, by electric-conductor, be electrically connected, described electric-conductor is copper post, it is characterized in that, described shell comprises drain pan and top shell, described drain pan and described top shell are socketed to form one for accommodating described diaphragm unit, insulation spacer, backplane assembly, the host cavity of insulation cavity and circuit board assemblies, described circuit board assemblies is near described top shell setting, the described top shell surface parallel with described diaphragm unit is a plane,
The drain pan extension that described drain pan comprises square bottom and vertically extends to form along described bottom margin; The top shell extension that described top shell comprises square top and vertically extends to form along described top, the top of described top shell offers the opening for exposing described circuit board assemblies; External diameter adaptation or the external diameter of described top shell extension and the internal diameter adaptation of described drain pan extension of the internal diameter of described top shell extension and described drain pan extension;
Described circuit board assemblies comprises wiring board, be located at described wiring board near multiple conducting boss of described opening one side and be located at impedance transformer and the capacitance resistance element of described wiring board opposite side;
Also comprise the seal that is located at the gap between described top shell and described drain pan;
Described diaphragm unit comprises and the conduction zona of described outer casing bottom close contact and be located at the vibrating diaphragm between described conduction zona and described insulation spacer;
Described backplane assembly comprises and offers the back pole plate of at least one backplane tone-entering hole and be located at the electret film on described back pole plate, and described electret film is arranged on the side near described diaphragm unit on described back pole plate;
Wherein, described backplane assembly is placed in the inside of described insulation cavity.
2. electret microphone as claimed in claim 1, is characterized in that, the bottom of described drain pan offers tone-entering hole.
3. electret microphone as claimed in claim 1, it is characterized in that, the bottom lock of described drain pan, described wiring board offers tone-entering hole, described tone-entering hole runs through in described multiple conducting boss, and described tone-entering hole is communicated with the cavity that described insulation cavity and described backplane assembly and wiring board form.
4. electret microphone as claimed in claim 1, it is characterized in that, the bottom lock of described drain pan, described wiring board offers tone-entering hole, described tone-entering hole runs through in described multiple conducting boss, described insulation cavity offers at described tone-entering hole place the through hole that runs through described insulation cavity, and described tone-entering hole and described through hole are communicated with the cavity of described drain pan and the formation of described diaphragm unit.
5. the electret microphone as described in claim 3 or 4, is characterized in that, between described diaphragm unit and the bottom of described drain pan, is provided with gasket ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110051131.9A CN102075841B (en) | 2011-03-03 | 2011-03-03 | Electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110051131.9A CN102075841B (en) | 2011-03-03 | 2011-03-03 | Electret microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102075841A CN102075841A (en) | 2011-05-25 |
| CN102075841B true CN102075841B (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110051131.9A Active CN102075841B (en) | 2011-03-03 | 2011-03-03 | Electret microphone |
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| Country | Link |
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| CN (1) | CN102075841B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102333272A (en) * | 2011-08-18 | 2012-01-25 | 东莞泉声电子有限公司 | Simple and compact electret microphone |
| CN102655617B (en) * | 2012-05-24 | 2015-09-30 | 歌尔声学股份有限公司 | Microphone and assembly method thereof |
| CN103747402B (en) * | 2014-01-06 | 2017-06-20 | 歌尔股份有限公司 | Microphone and its assemble method |
| CN105578370A (en) * | 2016-03-15 | 2016-05-11 | 深圳捷力泰科技开发有限公司 | Electret microphone |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200962670Y (en) * | 2006-07-13 | 2007-10-17 | 东莞泉声电子有限公司 | Square structure electret capacitance speaker |
| CN201491263U (en) * | 2009-07-17 | 2010-05-26 | 瑞声声学科技(常州)有限公司 | Electret microphone |
| CN101835077A (en) * | 2010-05-28 | 2010-09-15 | 深圳市豪恩声学股份有限公司 | Electret condenser microphone and manufacturing method thereof |
-
2011
- 2011-03-03 CN CN201110051131.9A patent/CN102075841B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200962670Y (en) * | 2006-07-13 | 2007-10-17 | 东莞泉声电子有限公司 | Square structure electret capacitance speaker |
| CN201491263U (en) * | 2009-07-17 | 2010-05-26 | 瑞声声学科技(常州)有限公司 | Electret microphone |
| CN101835077A (en) * | 2010-05-28 | 2010-09-15 | 深圳市豪恩声学股份有限公司 | Electret condenser microphone and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN102075841A (en) | 2011-05-25 |
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