CN105578370A - Electret microphone - Google Patents
Electret microphone Download PDFInfo
- Publication number
- CN105578370A CN105578370A CN201610146179.0A CN201610146179A CN105578370A CN 105578370 A CN105578370 A CN 105578370A CN 201610146179 A CN201610146179 A CN 201610146179A CN 105578370 A CN105578370 A CN 105578370A
- Authority
- CN
- China
- Prior art keywords
- electret microphone
- shell
- contact pin
- printed substrate
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Abstract
The invention relates to an electret microphone. The electret microphone comprises a shell, a diaphragm, an insulation gasket, a back polar plate and a copper ring, wherein the diaphragm, the insulation gasket, the back polar plate and the copper ring are sequentially arranged in the shell from bottom to top; a plastic ring and a printed circuit board are also arranged in the shell, wherein the plastic ring is used for fixing the back polar plate and the copper ring and insulated with the shell; the printed circuit board is arranged on a loop; the printed circuit board comprises a contact pin guide hole and a through hole; the contact pin guide hole is used for conducting a double-surface cathode copper foil; and the through hole is used for conducting two surfaces of the cathode of the printed circuit board. The electret microphone disclosed by the invention is not liable to be influenced by an external environment while being welded; the steady sensitivity can be kept; influence of the welding temperature on the electret microphone is improved; the sound recording quality of the electret microphone is improved; the electret microphone cannot be damaged while being welded; the flat frequency response curve of the whole electret microphone is ensured; and bad effects of a contact pin are avoided.
Description
[technical field]
The present invention relates to microphone field, particularly relate to a kind of electret microphone
[background technology]
At present, electret microphone is generally divided into pin type and wire type.Its interior fittings non-high-temperature resistant material, and contact pin type needs client to weld, when welding with flatiron when deployed, sensitivity easily changes.What contact pin adopted in addition is first perforate on a printed-wiring board, then pin riveting is entered, support greatly in riveting pin process by the place that pin contacts with printed wire plate hole is flattened, with make pin can with printed substrate rigid contact, because of electret microphone printed substrate too partially thin (general 0.27-0.35mm), by gold-plated in printed substrate riveting pin hole and around copper is thin breaks when this process easily causes riveting pin, such negative pole riveting pin and printed substrate exposed face and grounding shell have can not the risk of conducting or loose contact (because of printed substrate exposed face negative pole and shell conducting, form the ground in loop), noise phenomenon can be produced in communication process.
Chinese invention (publication number: CN102075841A, publication date: on May 25th, 2011), disclose a kind of electret microphone, the diaphragm unit comprising shell and set gradually in the enclosure, insulation spacer, backplane assembly, dielectric chamber and circuit board assemblies, backplane assembly and circuit board assemblies are electrically connected, shell comprises drain pan and top shell, drain pan and top shell are socketed to form one for accommodating diaphragm unit, insulation spacer, backplane assembly, the host cavity of dielectric chamber and circuit board assemblies, circuit board assemblies is arranged near top shell, the top shell surface parallel with diaphragm unit is a plane.The top shell of this technical scheme electret microphone is directly made by mould, and the evenness at its top is far above the shell edge after traditional crimping, thus difficulty when reducing electret microphone SMT, improve the production qualification rate of product; In addition, this technical scheme adopts in dielectric chamber corresponding area between the electric-conductor that is electrically connected backplane assembly and circuit board assemblies with shell to reduce, thus parasitic capacitance is reduced, and noise reduction, improves quality.It is to be noted this technical scheme impact on sensitivity in unresolved electret microphone welding process.
[summary of the invention]
For above-mentioned defect, the invention provides a kind of electret microphone.
A kind of electret microphone, the diaphragm, insulation spacer, back pole plate and the copper ring that comprise shell and set gradually from the bottom up in described shell, also comprise in this shell back pole plate and copper ring fixed and with the moulding ring and be arranged on the printed circuit board (PCB) on loop of casing insulation, described printed substrate comprises contact pin guide hole and via hole, contact pin guide hole is used for two-sided negative copper foil conducting, and described via hole is by the two sides conducting of printed substrate negative pole.
Insulation spacer is lined with between described vibrating diaphragm and loop.
Described vibrating diaphragm, insulation spacer, back pole plate and mould ring and all adopt the material of resistance to more than 320 DEG C to make.
Described printed substrate comprises contact pin guide hole and via hole, and contact pin guide hole is used for two-sided negative copper foil conducting, and described via hole is by the two sides conducting of printed substrate negative pole.
Described vibrating diaphragm comprises metallic object and electret vibration film, and metallic object is fixed on outer casing bottom.
The invention has the beneficial effects as follows:
1. be not subject to external environment influence, can stable sensitivity be kept;
2. improve the impact of welding temperature on electret microphone;
3. improve the recording tonequality of electret microphone;
4. can not be impaired when welding, ensure that the frequency response curve of electret microphone entirety is smooth;
5. avoid the harmful effect of contact pin.
[accompanying drawing explanation]
Fig. 1 is the structure schematic front view of electret microphone of the present invention;
Fig. 2 is shell mechanism schematic diagram;
Fig. 3 is vibrating diaphragm structural representation;
Fig. 4 is insulation spacer structural representation;
Fig. 5 is back pole plate structure schematic front view;
Fig. 6 is copper ring structural representation;
Fig. 7 is for moulding ring structure schematic diagram;
Fig. 8 is printed circuit board structure schematic front view;
Fig. 9 is printed circuit board structure schematic top plan view.
[embodiment]
Below in conjunction with 1-9 figure, electret microphone technical scheme of the present invention is described in detail:
Figure 1 shows that electret microphone of the present invention, the vibrating diaphragm 6 comprising shell 7 and set gradually from the bottom up in described shell, insulation spacer 5, back pole plate 4 and copper ring 3, also comprise in this shell back pole plate and copper ring fixed and with the printed circuit board (PCB) 1 moulded ring 2 and be arranged on loop of casing insulation, described printed substrate comprises contact pin guide hole and via hole, contact pin guide hole is used for two-sided negative copper foil conducting, and described via hole is by the two sides conducting of printed substrate negative pole.Vibrating diaphragm 6 comprises metallic object 61 and electret vibration film 62, and metallic object 61 is fixed on bottom shell 7; It is middle with back pole plate 4 that insulation spacer is arranged on vibrating diaphragm 6, and copper ring 3 is positioned at back pole plate assembly 4 top, and back pole plate and copper ring are fixed together by moulding ring 2, and printed substrate 1 is positioned at copper ring top.
In the present embodiment, the current potential of polarization is stored on the electret film 41 of back pole plate 4, because back pole plate 4 is on vibrating diaphragm 6, insulation spacer 5, completely inner at electret microphone, be not subject to external environment influence, can stable sensitivity be kept.
The current potential of polarization is stored on back pole plate 4, be not stored on the vibrating diaphragm 6 that is close to shell 7, when welding with flatiron, because thermally sensitive vibrating diaphragm 6 does not store electric charge, but be stored on the electret film 41 of back pole plate 4 in electret microphone, improve the impact of welding temperature on electret microphone.
Vibrating diaphragm 6 does not need to store electric charge, and selecting can resistant to elevated temperatures PPS material, very frivolous, improves the recording tonequality of electret microphone.
Insulation spacer 5 and mould that ring 2 all adopts can resistant to elevated temperatures material, can not be impaired when welding, the frequency response curve of guarantee electret microphone entirety is smooth.
Printed substrate 1 is except contact pin guide hole is by except two-sided negative copper foil conducting, via hole 11 is increased by the two sides conducting of printed substrate negative pole in other position, split even if printed substrate pin holes is inserted when riveting contact pin like this, cause the two-sided not conducting of printed substrate, also the via hole 11 increased by other position, by the two sides conducting of printed substrate negative pole, avoids contact pin harmful effect.
As shown in Figure 9, two holes of printed substrate 11, two metal needles are inserted by the two sides conducting of printed substrate by riveting, because of electret microphone printed substrate too partially thin (general 0.27-0.35mm), when riveting pin easily by gold-plated in printed substrate riveting pin hole and around copper is thin breaks, such negative pole riveting pin and printed substrate exposed face and grounding shell have can not the risk of conducting or loose contact (because of printed substrate exposed face negative pole and shell conducting, form the ground in loop), noise phenomenon can be produced in communication process, increase by the negative pole via hole of 12 on a printed-wiring board for this reason, split even if printed substrate pin holes is inserted when riveting contact pin like this, cause the two-sided not conducting of printed substrate, also the via hole increased by other position is by the two sides conducting of printed substrate negative pole, avoid contact pin harmful effect.
After high-temperature soldering, change of sensitivity is within 1dB, meanwhile, negative pole riveting pin not by riveting pin process influence, still can with printed substrate exposed face and grounding shell good contact, improve product quality and stopped product quality risk.
Above embodiment is the preferred embodiments of the present invention; the invention is not restricted to above-described embodiment; for those of ordinary skills; the any apparent change that the basis not deviating from the technology of the present invention principle is done, all belongs to the protection range of design of the present invention and claims.
Claims (5)
1. an electret microphone, the vibrating diaphragm assembly comprising shell and set gradually from the bottom up in described shell, insulation spacer, backplane assembly and copper ring, it is characterized in that: also comprise in this shell back pole plate and copper ring fixed and with the moulding ring and be arranged on the printed circuit board (PCB) on loop of casing insulation, described printed substrate comprises contact pin guide hole and via hole, contact pin guide hole is used for two-sided negative copper foil conducting, and described via hole is by the two sides conducting of printed substrate negative pole.
2. electret microphone according to claim 1, is characterized in that: be lined with insulation spacer between described vibrating diaphragm and loop.
3. electret microphone according to claim 1, is characterized in that: described vibrating diaphragm, insulation spacer, back pole plate and mould ring and all adopt the material of resistance to more than 320 DEG C to make.
4. electret microphone according to claim 1, is characterized in that: described printed substrate comprises contact pin guide hole and via hole, and contact pin guide hole is used for two-sided negative copper foil conducting, and described via hole is by the two sides conducting of printed substrate negative pole.
5. electret microphone according to claim 1, is characterized in that: described vibrating diaphragm comprises metallic object and electret vibration film, and metallic object is fixed on outer casing bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610146179.0A CN105578370A (en) | 2016-03-15 | 2016-03-15 | Electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610146179.0A CN105578370A (en) | 2016-03-15 | 2016-03-15 | Electret microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105578370A true CN105578370A (en) | 2016-05-11 |
Family
ID=55887945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610146179.0A Pending CN105578370A (en) | 2016-03-15 | 2016-03-15 | Electret microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578370A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156564A (en) * | 2018-02-28 | 2018-06-12 | 深圳捷力泰科技开发有限公司 | Electret microphone |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1933679A (en) * | 2006-09-30 | 2007-03-21 | 潍坊共达电讯有限公司 | Waterpoof and dampproof electret capacitance microphone |
| CN200956411Y (en) * | 2006-10-19 | 2007-10-03 | 深圳创维－Rgb电子有限公司 | Two-sided PCB earthing device for flat screen television |
| US20080056523A1 (en) * | 2006-09-05 | 2008-03-06 | Chung Dam Song | Electret condenser microphone |
| CN201312382Y (en) * | 2008-12-16 | 2009-09-16 | 潍坊新港电子有限公司 | One-way electret microphone |
| CN102075841A (en) * | 2011-03-03 | 2011-05-25 | 深圳市豪恩声学股份有限公司 | Electret microphone |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN205048241U (en) * | 2015-07-24 | 2016-02-24 | 惠州伟志电子有限公司 | Adopt two via hole FPC's backlight |
| CN205491153U (en) * | 2016-03-15 | 2016-08-17 | 深圳捷力泰科技开发有限公司 | Electret microphone |
-
2016
- 2016-03-15 CN CN201610146179.0A patent/CN105578370A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080056523A1 (en) * | 2006-09-05 | 2008-03-06 | Chung Dam Song | Electret condenser microphone |
| CN1933679A (en) * | 2006-09-30 | 2007-03-21 | 潍坊共达电讯有限公司 | Waterpoof and dampproof electret capacitance microphone |
| CN200956411Y (en) * | 2006-10-19 | 2007-10-03 | 深圳创维－Rgb电子有限公司 | Two-sided PCB earthing device for flat screen television |
| CN201312382Y (en) * | 2008-12-16 | 2009-09-16 | 潍坊新港电子有限公司 | One-way electret microphone |
| CN102075841A (en) * | 2011-03-03 | 2011-05-25 | 深圳市豪恩声学股份有限公司 | Electret microphone |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN205048241U (en) * | 2015-07-24 | 2016-02-24 | 惠州伟志电子有限公司 | Adopt two via hole FPC's backlight |
| CN205491153U (en) * | 2016-03-15 | 2016-08-17 | 深圳捷力泰科技开发有限公司 | Electret microphone |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156564A (en) * | 2018-02-28 | 2018-06-12 | 深圳捷力泰科技开发有限公司 | Electret microphone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100673849B1 (en) | Condenser microphone for inserting in mainboard and potable communication device including the same | |
| EP2632171B1 (en) | Loudspeaker housing and mobile terminal device | |
| US8023670B2 (en) | Stray capacitance reduced condenser microphone | |
| JP2011019085A (en) | Condenser microphone | |
| US20060188112A1 (en) | Condenser microphone and method for manufacturing the same | |
| WO2022166912A1 (en) | Electronic device, and method for preparing elastic grounding assembly | |
| WO2009005211A1 (en) | Diaphragm with air groove and condenser microphone using the same | |
| US10805707B2 (en) | Systems and methods for unconstrained battery spring tab assemblies for in-ear headphone | |
| CN105578370A (en) | Electret microphone | |
| KR200389794Y1 (en) | Microphone assembly | |
| JP2012049798A (en) | Capacitor microphone unit and capacitor microphone | |
| CN1706218B (en) | A condenser microphone mountable on main PCB | |
| CN102075841B (en) | Electret microphone | |
| CN205491153U (en) | Electret microphone | |
| CN204046803U (en) | Minitype acoustic generator | |
| US11115745B2 (en) | Systems and methods for antenna and ground plane mounting schemes for in-ear headphone | |
| KR20070031524A (en) | Electret Condenser Microphone For Surface Mounting And Main Board Including The Same | |
| KR100758515B1 (en) | Electret Condenser Microphone And Assembling Method Thereof | |
| CN212278465U (en) | Bone conduction microphone | |
| CN201094162Y (en) | Condenser microphone | |
| KR20040079776A (en) | Electret condenser microphone | |
| CN207939733U (en) | Back-polar type electret microphone | |
| US11223894B2 (en) | Horn for an integrated frequency division circuit | |
| KR100758513B1 (en) | Electret Condenser Microphone And Assembling Method Thereof | |
| KR20060100843A (en) | Electret condenser microphone assembly for smd |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160511 |
|
| RJ01 | Rejection of invention patent application after publication |