CN2932894Y - SMD capacitor-type electret microphone - Google Patents
SMD capacitor-type electret microphone Download PDFInfo
- Publication number
- CN2932894Y CN2932894Y CN 200620017354 CN200620017354U CN2932894Y CN 2932894 Y CN2932894 Y CN 2932894Y CN 200620017354 CN200620017354 CN 200620017354 CN 200620017354 U CN200620017354 U CN 200620017354U CN 2932894 Y CN2932894 Y CN 2932894Y
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- CN
- China
- Prior art keywords
- pcb board
- microphone
- shell
- pole plate
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model relates to a SMD condenser type electret microphone comprising a shell, a membrane, a tight film ring, a pad under the tight film ring, a back polar plate, a back polar seat, a connection ring, a first PCB plate, a second PCB plate and a screening can, wherein the membrane, the tight film ring, the pad, the back polar plate, the back polar seat, the connection ring and the first PCB plate are sequentially arranged in the shell to form an integral mounted part, and the first PCB plate is connected with the back polar plate through the connection ring; the integral mounted part is surface mounted on the one side of the surface of the second PCB plate, and the surface is provided with a FET pipe and a capacity on the outer shell; the screening can is rectangular, and covers the outer sides of the above parts. The rectangular microphone is easy to confirm direction, adjust the parts and reduce the connection failure, when the surface is mounted; the FET pipe and the capacity are arranged on a second circuit plate and on one side of the integral mounted part, so the height of the microphone is reduced.
Description
Technical field
The utility model relates to a kind of Electret Condencer Microphone, is meant a kind of SMD condenser type electret microphone especially.
Background technology
It is rounded that tradition is applied to the miniature capacitance type microphone of mobile phone, comprises capacitance type sensor, the electret that the diaphragm that can respond acoustic pressure forms, the field effect transistor of adhering to the back pole plate of electret and being used to cushion the output amplifying signal.Also include a cylindrical metal shell, its inner sealing has the zona that stretches tight, diaphragm, pad, back-pole base, backplane ring and mounts pcb board of elements such as FET, electric capacity etc.This typical electrical capacitance-type microphone has cylindrical exterior and be formed with two splicing ears in pcb board.
Simultaneously, in the process of mounted on surface, the terminal of its pcb board must correctly be connected with the terminal of Electret Condencer Microphone.Because terminal surfaces is lower than the curved surface of shell, so may produce the connection fault in the process of mounted on surface.
Because people are more and more to the requirement of mobile phone thin typeization now, therefore how to do mobile phone thinlyyer, be the problem that manufacturer pays close attention to always.Traditional microphone all is to settle above-mentioned parts in order successively, and FET manages and electric capacity all is installed on the pcb board, and because of the thickness of FET pipe and electric capacity self, reducing whole microphone products height has the lower limit that can't go beyond.
The utility model content
Technical problem to be solved in the utility model is: a kind of SMD condenser type electret microphone is provided, on the basis that guarantees the existing product electroacoustic performance, can be convenient to mount, and can reduce whole microphone products height, to adapt to the needs of electronic products such as ultra thin handset.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: a kind of SMD condenser type electret microphone, the zona that stretches tight that comprises shell, is located at diaphragm in the shell, diaphragm is tightened, be located at pad, the back pole plate that is provided with hole, the back-pole base that is supported in the back pole plate downside, connecting ring, first pcb board, second pcb board and radome below the zona that stretches tight with hole.Described diaphragm, the zona that stretches tight, pad, back pole plate, back-pole base, connecting ring, first pcb board set gradually and form whole mounted member in the described shell, and described first pcb board is electrically connected with back pole plate by connecting ring; Described whole mounted member surface mount is on second pcb board, one side surface, and this side surface of second pcb board also is provided with FET pipe and the electric capacity that is positioned at housing exterior; Described radome is rectangular, and it is covered in above-mentioned each parts outside.
Further improvement in the technical proposal is: described FET pipe is set in parallel on second pcb board with electric capacity.
Further improvement in the technical proposal is: the opposite side surface of described second pcb board is provided with stretches out and the outside terminal that is connected.
The beneficial effects of the utility model are: microphone is made rectangle, be convenient to confirm the parts direction when finished surface mounts, connect so can conveniently regulate parts, reduce the connection fault; And with FET pipe, electric capacity is arranged on the second circuit board and place a side of whole whole mounted member, and reduces the microphone products height.
Below in conjunction with accompanying drawing the utility model is described in further detail.
Description of drawings
Fig. 1 is the cutaway view of the utility model SMD condenser type electret microphone.
Fig. 2 is the exploded perspective view of the utility model SMD condenser type electret microphone.
Embodiment
Extremely shown in Figure 2 as Fig. 1, the utility model provides a kind of SMD condenser type electret microphone, comprises the zona 4 that stretches tight that the diaphragm 3, of metallic shield 1, shell 2, an annular tightens diaphragm 3, pad 5, back pole plate 6, back-pole base 7, connecting ring 8, first pcb board 9, second pcb board 10 of annular.
Described metallic shield 1 is rectangular, and it covers above-mentioned other each parts outsides, and the interference of the outer bound pair microphone of maskable makes transaudient best results.On metallic shield 1, offer a through hole 100.
Described shell 2 surfaces offer hole 20.
Described diaphragm 3 is installed in the inside of shell 2.
The described zona 4 that stretches tight has open top and bottom;
5 insulating effects of described pad.
Described back pole plate 6, back-pole base 7 all are installed in the shell 2, in the wherein said back pole plate 6 hole 60 are arranged, and described back-pole base 7 supports back pole plate 6.
Described connecting ring 8 is installed in the inboard of backboard seat 7 and is connected on the back pole plate 6, and it has some connection electrode (scheming not shown).
Described first pcb board 9 is rounded, and described pcb board 9 is electrically connected by connecting ring 8 with above-mentioned parts, and transmission of electric signals.First pcb board 9 is provided with terminal, and wherein a terminal links to each other with the respective electrode of connecting ring 8, and another terminal then links to each other with shell 2 outside formed another electrodes.
Be pasted with FET pipe 11 and electric capacity 12,13 by the SMT mode on one side surface of described second pcb board 10, and described FET pipe 11, electric capacity 12,13 parallel mounting.The opposite side surface of second pcb board 10 is provided with the terminal that stretches out and is connected with outside.
During assembling, at first above-mentioned diaphragm 3, the zona 4 that stretches tight, pad 5, back pole plate 6, back-pole base 7, connecting ring 8, first pcb board, 9 arranged in sequence are formed whole mounted member in described shell 2; The whole mounted member that will form then is mounted on the side surface that is provided with FET pipe 11 and electric capacity 12,13 of second pcb board 10, and the pipe of the FET on this side surface of second pcb board 10 11, electric capacity 12,13 are positioned at the outside of whole casing 2; Cover above-mentioned all parts with metallic shield 1 more at last, can shield the interference of outer bound pair microphone like this, make transaudient best results.
Consult Fig. 3 in the lump, in practical work process, it is inner and pass to diaphragm 3 to import microphone after through the sound hole 20 on the through hole 100 on the described metallic shield 1, the shell 2 into from the sound of outside; Diaphragm 3 promptly can vibrate under the acoustic pressure effect, thereby changes the gap between diaphragm 3 and the back pole plate 6, thereby changes the electrostatic capacitance between diaphragm 3 and the back pole plate 6, realizes the variation of the signal of telecommunication with sound wave.First pcb board 9 is provided with terminal, and wherein a terminal links to each other with the respective electrode of connecting ring 8, and another terminal then links to each other with outside formed another electrodes of shell 2, by terminal signal is imported FET pipe 11, and amplification is also exported to external circuit by the terminal that stretches out.
Claims (3)
1, a kind of SMD condenser type electret microphone, the zona that stretches tight that comprises shell, is located at diaphragm in the shell, diaphragm is tightened, be located at pad, the back pole plate that is provided with hole, the back-pole base that is supported in the back pole plate downside, connecting ring and first pcb board below the zona that stretches tight with hole, described diaphragm, the zona that stretches tight, pad, back pole plate, back-pole base, connecting ring, first pcb board set gradually in the described shell, form whole mounted member, and described first pcb board is electrically connected with back pole plate by connecting ring; It is characterized in that: described microphone also comprises second pcb board and radome, and described whole mounted member surface mount is on second pcb board, one side surface, and this side surface of second pcb board also is provided with FET pipe and the electric capacity that is positioned at housing exterior; Described radome is rectangular, and it is covered in above-mentioned each parts outside.
2, SMD condenser type electret microphone as claimed in claim 1 is characterized in that: described FET pipe is set in parallel on second pcb board with electric capacity.
3, SMD condenser type electret microphone as claimed in claim 1 or 2 is characterized in that: the opposite side surface of described second pcb board is provided with stretches out and the outside terminal that is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620017354 CN2932894Y (en) | 2006-08-01 | 2006-08-01 | SMD capacitor-type electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620017354 CN2932894Y (en) | 2006-08-01 | 2006-08-01 | SMD capacitor-type electret microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2932894Y true CN2932894Y (en) | 2007-08-08 |
Family
ID=38349383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620017354 Expired - Lifetime CN2932894Y (en) | 2006-08-01 | 2006-08-01 | SMD capacitor-type electret microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2932894Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101889455A (en) * | 2007-12-26 | 2010-11-17 | 美商富迪科技股份有限公司 | Microphone module with electromagnetic interference shielding means |
| CN101426170B (en) * | 2008-08-20 | 2013-01-09 | 瑞声声学科技(深圳)有限公司 | Microphone manufacturing method |
-
2006
- 2006-08-01 CN CN 200620017354 patent/CN2932894Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101889455A (en) * | 2007-12-26 | 2010-11-17 | 美商富迪科技股份有限公司 | Microphone module with electromagnetic interference shielding means |
| CN101889455B (en) * | 2007-12-26 | 2013-07-03 | 美商富迪科技股份有限公司 | Microphone module with electromagnetic interference shielding means |
| CN101426170B (en) * | 2008-08-20 | 2013-01-09 | 瑞声声学科技(深圳)有限公司 | Microphone manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070808 |
|
| EXPY | Termination of patent right or utility model |