CN103313160B

CN103313160B - Thin type electric microphone module for microcomputer

Info

Publication number: CN103313160B
Application number: CN201210069744.XA
Authority: CN
Inventors: 黄朝敬; 吕如梅; 陈弘仁; 邱冠勋
Original assignee: Merry Electronics Shenzhen Co ltd
Current assignee: Merry Electronics Shenzhen Co ltd
Priority date: 2012-03-16
Filing date: 2012-03-16
Publication date: 2017-11-21
Anticipated expiration: 2032-03-16
Also published as: CN103313160A

Abstract

The invention discloses a kind of thin type electric microphone module for microcomputer, the thin type electric microphone module for microcomputer includes a first circuit board, a mems chip, a specific applying chip, an and second circuit board, wherein, the first circuit board has spaced one first groove and one second groove, and has one first signal layer and one first ground plane；The mems chip is located in the first groove of the first circuit board；The second circuit board is covered on the first circuit board, and with a sound hole, one second signal layer, and one second ground plane；The specific applying chip is arranged at the second circuit board, and towards the second groove of the first circuit board.Thin type electric microphone module for microcomputer of the present invention utilizes the design of the two panels circuit board of fitting up and down, then the ground path for inside of arranging in pairs or groups realizes electromagnetic shielding, can reach the purpose for reducing packaging height and reducing encapsulation volume.

Description

Thin type electric microphone module for microcomputer

Technical field

The invention belongs to micro-electro-mechanical microphone technical field, especially it is a kind of reduce packaging height thin type it is micro electronmechanical Microphone module.

Background technology

Fig. 1 is existing electric microphone module for microcomputer 10, consists predominantly of a circuit board 11, a mems chip 12, one Specific applying chip 13, and a metal cover 14, wherein, mems chip 12 is respectively arranged on circuit with specific applying chip 13 On plate 11, and make to be electrically connected between the two by a wire 15, metal cover 14 is covered on circuit board 11 and and circuit A chamber 16 is formed between plate 11, to accommodate mems chip 12 and specific applying chip 13, and utilizes the metal material of itself Matter provides effectiveness.

But in this existing design, the chamber 16 formed between metal cover 14 and circuit board 11 must have enough Volume, the height of routing could be retained so that metal cover 14 must be maintained at certain height, herein under the premise of, to Sizable difficulty certainly will be had by reducing the height of metal cover 14.

The content of the invention

It is a primary object of the present invention to provide a kind of thin type electric microphone module for microcomputer, packaging height can be reduced and subtracted Few encapsulation volume.

To achieve the above object, thin type electric microphone module for microcomputer of the present invention include a first circuit board, One mems chip, a specific applying chip, and a second circuit board, wherein, the first circuit board has spaced One first groove and one second groove, and there is one first signal layer and one first ground plane；The mems chip is located in this In first groove of first circuit board；The second circuit board is covered on the first circuit board, and with a sound hole, one second signal Layer, and one second ground plane；The specific applying chip is arranged at the second circuit board, and towards the second of the first circuit board Groove, in addition, the sound hole of the second circuit board corresponds to the mems chip, the second signal layer is electrically connected with first circuit board The first signal layer, the mems chip, and the specific applying chip, second ground plane is electrically connected with first circuit board First ground plane and between first ground plane around formed an earth shield structure, for providing the function of electromagnetic shielding. Thin type electric microphone module for microcomputer of the present invention utilizes the design of the two panels circuit board of fitting up and down, then internal connect of arranging in pairs or groups Ground circuit realizes electromagnetic shielding, can reach the purpose for reducing packaging height and reducing encapsulation volume.

Brief description of the drawings

Fig. 1 is the cross-sectional view of existing electric microphone module for microcomputer.

Fig. 2 is the schematic diagram of fabrication technology of the embodiment of the present invention.

Fig. 3 is the cross-sectional view of the embodiment of the present invention.

Primary clustering and symbol description

20	Micro-electro-mechanical microphone	30	First circuit board
				31	First groove	32	Second groove
33	First signal layer	34	First ground plane
				40	Mems chip	50	Specific applying chip
60	Second circuit board	61	Sound hole
				62	Second signal layer	63	Second ground plane
66	Wire	70	Conducting resinl
				80	Earth shield structure

Embodiment

Where describing the structure of the present invention, feature and effect in detail, with reference to specific embodiment and accompanying drawing do into One step describes in detail.

Fig. 3 show the thin type electric microphone module for microcomputer 20 that the present embodiment is provided, and includes a first circuit board 30th, a mems chip 40, a specific applying chip 50 (Application-specific integrated circuit, ), and a second circuit board 60 ASIC.

First circuit board 30 is recessed from its top surface spaced one first groove 31 and one second groove 32, and in interior Portion is embedded with one first signal layer 33 and one first ground plane 34.

Mems chip 40 is located in the first groove 31 of first circuit board 30 and is attached at the bottom wall of the first groove 31.

Second circuit board 60 is covered on the top surface of first circuit board 30 and is sticked with its bottom surface for specific applying chip 50, this When specific applying chip 50 be placed in the second groove 32 of first circuit board 30.Second circuit board 60 have a sound hole 61, One second signal layer 62, and one second ground plane 63, wherein, sound hole 61 corresponds to mems chip 40；Second signal layer 62 It is electrically connected respectively by between a conducting resinl 70 and the first signal layer 33 and mems chip 40 of first circuit board 30, It is electrically connected in addition by between a wire 66 and specific applying chip 50；Second ground plane 63 by a conducting resinl 70 with First ground plane 34 is electrically connected so that the second ground plane 63 of second circuit board 60 and the first ground connection of first circuit board Around an earth shield structure 80 is formed between layer 34, reach effectiveness.

During fabrication, as shown in Fig. 2 the top surface of the first circuit board 30 prior to having completed wiring and buried regions is to be machined Mode forms the first groove 31 and one second groove 32, and mems chip 40 then is attached at into the first recessed of first circuit board 30 In groove 31；In addition, specific applying chip 50 is attached at the bottom surface of the same second circuit board 60 for completing wiring and buried regions, and the Wire 66 is set between the second signal layer 62 and specific applying chip 50 of two circuit boards 60 and completes to be electrically connected with, then the Two circuit boards 60 run through sender 61, and second circuit board 60 finally is attached at into first circuit board 30 by conducting resinl 70 again, made Complete to electrically conduct between second ground plane 63 of second circuit board 60 and the first ground plane 34 of first circuit board 30, so i.e. Complete the manufacture of the thin type electric microphone module for microcomputer 20 of the present invention.

When in use, mems chip 40 can receive the sound in the external world via the sound hole 61 of second circuit board 60, and will Received acoustic pressure is converted to capacitance variations, and then specific applying chip 50 can pass through the second signal layer of second circuit board 60 62 detect this capacitance variations, and the result detected is converted into electric signal, then by this electric signal via second circuit board 60 First signal layer 33 of the second signal layer 62 and first circuit board 30 and transmit to relevant treatment component, such as processor or amplification Device.

Summary understands that thin type electric microphone module for microcomputer 20 of the present invention utilizes the two panels electricity being bonded up and down The design of road plate 20,60, and the space of routing need not be reserved, the design of ground plane 34,63 for inside of arranging in pairs or groups again in addition plays electricity The effect of magnetic screen, it is thus possible to actually reach the purpose for reducing packaging height and reducing encapsulation volume.

Illustrative is the foregoing is only, is not restricted person.It is any without departing from spirit and scope of the present invention, it is right Its equivalent modifications carried out or change, it is intended to be limited solely by the protection domain of this patent.

Claims

1. a kind of thin type electric microphone module for microcomputer, it is characterized in that, include：

One first circuit board, there is spaced one first groove and one second groove, and there is one first signal layer and one First ground plane；

One mems chip, it is located in the first groove of the first circuit board；

One second circuit board, the first circuit board is covered on, and with a sound hole, one second signal layer, and one second ground connection Layer；And

One specific applying chip, it is arranged on the second circuit board, and toward in the second groove of the first circuit board；

Wherein, the sound hole of the second circuit board corresponds to the mems chip, and the second signal layer is electrically connected with first electricity The first signal floor, the mems chip and specific applying chip of road plate, second ground plane are electrically connected with first electricity First ground plane of road plate and with first ground plane around forming an earth shield structure；

Formed between first signal layer of the first circuit board and the second signal layer of the second circuit board by a conducting resinl It is electrically connected with.

2. thin type electric microphone module for microcomputer as claimed in claim 1, it is characterized in that：The mems chip is attached at this The bottom wall of first groove of first circuit board.

3. thin type electric microphone module for microcomputer as claimed in claim 1, it is characterized in that：The specific applying chip is led with one Second signal layer of line and the second circuit board is electrically connected.

4. such as thin type electric microphone module for microcomputer as claimed in claim 1, it is characterized in that：The first of the first circuit board It is electrically connected between ground plane and the second ground plane of the second circuit board by a conducting resinl.

5. such as thin type electric microphone module for microcomputer as claimed in claim 1, it is characterized in that：The mems chip with this It is electrically connected between second signal layer of two circuit boards by a conducting resinl.