CN202425207U - Packaging structure for tri-axial sensor - Google Patents
Packaging structure for tri-axial sensor Download PDFInfo
- Publication number
- CN202425207U CN202425207U CN2011205393545U CN201120539354U CN202425207U CN 202425207 U CN202425207 U CN 202425207U CN 2011205393545 U CN2011205393545 U CN 2011205393545U CN 201120539354 U CN201120539354 U CN 201120539354U CN 202425207 U CN202425207 U CN 202425207U
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- sensor chip
- printed circuit
- circuit board
- pcb
- axial sensor
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Abstract
The utility model relates to a packaging structure for a tri-axial sensor, which comprises a printed circuit board, an X-axial sensor chip, a Y-axial sensor chip, a Z-axial sensor chip, wherein the X-axial sensor chip and the Y-axial sensor chip are arranged on the printed circuit board and electrically connected with the printed circuit board. The Z-axial sensor chip is vertically arranged on the printed circuit board and is connected with the printed circuit board in a bonding manner. The novel packaging structure is used for packaging the tri-axial sensor by means of bumping technology and wire bonding technology, and is low in manufacturing cost and high in yield.
Description
Technical field
The utility model relates to a kind of encapsulating structure of transducer, especially, and a kind of encapsulating structure of three-axis sensor.
Background technology
Along with the expansion day by day of consumer electronics function, application of sensor is progressively popularized, and has become the standard configuration of some electronic products gradually.And along with the continually developing and integrated requirement of transducer utilization, single shaft and two axle sensors no longer can be satisfied the demand, and the three-axis sensor that integrated level is higher also emerges.
Three-axis sensor usually need be assembled sensor chip in Z-direction in order to obtain reliable and stable Z axis signal, but this is a critical technological point at present, and product cost, yield and reliability all face very big challenge, is difficult to produce in batches.And attempt becoming assembling Z axle sensor chip on 90 ° of directions with X, Y axle sensor chip through the mode of upside-down mounting (Flip chip) or paster (SMT), for now, on technology, be difficult to realize that yield and reliability also can't guarantee.This also just causes existing three-axis sensor manufacturing cost high, is unfavorable for large-scale production and popularizes.
Therefore, necessary a kind of encapsulating structure of novel three-axis sensor that provides overcomes defective of the prior art.
The utility model content
The utility model technical problem to be solved is that the manufacturing cost of existing three-axis sensor is high, yield is low.The utility model provides a kind of encapsulating structure of three-axis sensor, and it adopts bump process to combine bonding technology, has improved the encapsulation finished product yield of three-axis sensor, and then has reduced the manufacturing cost of product, helps the extensive manufacturing of three-axis sensor and popularizes.
In order to solve the problems of the technologies described above; The technical scheme that the utility model proposed is: a kind of encapsulating structure of three-axis sensor; It comprises printed circuit board (PCB), the X, the Y axle sensor chip that are arranged on the said printed circuit board (PCB) and electrically connect with printed circuit board (PCB), and Z axle sensor chip; Said Z axle sensor chip vertically is arranged on the printed circuit board (PCB), and Z axle sensor chip is connected with the printed circuit board (PCB) bonding.
Further, in different execution modes, wherein Z axle sensor chip is provided with salient point, and Z axle sensor chip is connected with the printed circuit board (PCB) bonding through said salient point.
Further, in different execution modes, wherein the end points that is connected with the printed circuit board (PCB) bonding of Z axle sensor chip is the side of salient point on Z axle sensor chip.
Further, in different execution modes, wherein printed circuit board (PCB) is provided with the pad that bonding connects usefulness.
Compared with prior art; The beneficial effect of the utility model is: the utility model is to adopt bump process to combine bonding technology to carry out the resulting encapsulating structure of encapsulation of three-axis sensor; It is a kind of encapsulating structure of novel three-axis sensor; And can guarantee the reliability and the yield of encapsulating structure, reduce the manufacturing cost of three-axis sensor, the large-scale production that helps three-axis sensor reaches to be popularized.
Description of drawings
The encapsulating structure sketch map of the three-axis sensor that Fig. 1 relates to for the utility model.
Embodiment
Specify the embodiment of the utility model below in conjunction with accompanying drawing.
In the execution mode of the three-axis sensor package structure that a utility model relates to; See also shown in Figure 1; Wherein a kind of three-axis sensor package structure; It comprises printed circuit board (PCB) (pcb board) 10, X, Y axle sensor chip (not shown) and Z axle sensor chip 20, and wherein X, Y axle sensor chip level are installed on the pcb board 10 and with pcb board 10 and electrically connect; Z axle sensor chip 20 vertically is installed on the pcb board 10, i.e. vertical setting between Z axle sensor chip 20 and X, the Y axle sensor chip.
Z axle sensor chip 20 is provided with salient point 22, and pcb board 10 is provided with pad 12, be connected through bonding wire 30 bondings between salient point 22 and the pad 12, thereby Z axle sensor chip 20 is realized being connected with the bonding of pcb board 10.In this execution mode, the end points that Z axle sensor chip 20 is connected with pcb board 10 bondings is the sidepiece at salient point 22.In other embodiments, the end points that is connected with pcb board 10 bondings of Z axle sensor chip 20 also can be other position at salient point 22, for example top.
The utility model is to adopt bump process to combine bonding technology to carry out the resulting encapsulating structure of encapsulation of three-axis sensor; It is a kind of encapsulating structure of novel three-axis sensor; And can guarantee the reliability and the yield of encapsulating structure; Reduced the manufacturing cost of three-axis sensor, the large-scale production that helps three-axis sensor reaches to be popularized.
The above is merely the preferred embodiments of the utility model; The protection range of the utility model does not exceed with above-mentioned execution mode; As long as the equivalence that those of ordinary skills are done according to the utility model disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (4)
1. the encapsulating structure of a three-axis sensor; It comprises printed circuit board (PCB); The X, the Y axle sensor chip that are arranged on the said printed circuit board (PCB) and electrically connect with printed circuit board (PCB); And Z axle sensor chip, it is characterized in that: said Z axle sensor chip vertically is arranged on the printed circuit board (PCB), and Z axle sensor chip is connected with the printed circuit board (PCB) bonding.
2. the encapsulating structure of three-axis sensor according to claim 1, it is characterized in that: said Z axle sensor chip is provided with salient point, and Z axle sensor chip is connected with the printed circuit board (PCB) bonding through said salient point.
3. the encapsulating structure of three-axis sensor according to claim 2, it is characterized in that: the end points that said Z axle sensor chip is connected with the printed circuit board (PCB) bonding is the side of salient point on Z axle sensor chip.
4. the encapsulating structure of three-axis sensor according to claim 1 is characterized in that: said printed circuit board (PCB) is provided with the pad that bonding connects usefulness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205393545U CN202425207U (en) | 2011-12-21 | 2011-12-21 | Packaging structure for tri-axial sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205393545U CN202425207U (en) | 2011-12-21 | 2011-12-21 | Packaging structure for tri-axial sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425207U true CN202425207U (en) | 2012-09-05 |
Family
ID=46749926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205393545U Expired - Lifetime CN202425207U (en) | 2011-12-21 | 2011-12-21 | Packaging structure for tri-axial sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425207U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179787A (en) * | 2011-12-21 | 2013-06-26 | 美新半导体（无锡）有限公司 | Structure and method for packaging three-axis sensor |
| CN108347830A (en) * | 2018-02-10 | 2018-07-31 | 赵晓月 | A kind of auxiliary device and method for CPU secondary encapsulations |
-
2011
- 2011-12-21 CN CN2011205393545U patent/CN202425207U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179787A (en) * | 2011-12-21 | 2013-06-26 | 美新半导体（无锡）有限公司 | Structure and method for packaging three-axis sensor |
| CN103179787B (en) * | 2011-12-21 | 2016-02-24 | 美新半导体（无锡）有限公司 | The encapsulating structure of three-axis sensor and method for packing thereof |
| CN108347830A (en) * | 2018-02-10 | 2018-07-31 | 赵晓月 | A kind of auxiliary device and method for CPU secondary encapsulations |
| CN108347830B (en) * | 2018-02-10 | 2019-09-10 | 周伟冬 | A kind of auxiliary device and method for CPU secondary encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
| CX01 | Expiry of patent term |