CN204885149U - Lead wire frame construction of rectifier bridge - Google Patents
Lead wire frame construction of rectifier bridge Download PDFInfo
- Publication number
- CN204885149U CN204885149U CN201520562769.2U CN201520562769U CN204885149U CN 204885149 U CN204885149 U CN 204885149U CN 201520562769 U CN201520562769 U CN 201520562769U CN 204885149 U CN204885149 U CN 204885149U
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- time
- lead
- paster
- dao
- connecting rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model relates to a lead wire frame construction of rectifier bridge, including the last frame and the underframe of mutually supporting and using, go up the frame and include the connecting rod, and go up and have a plurality of units that go between on of separately arranging on the connecting rod, on go between the unit and have and firstly go between on going up lead wire and second, the underframe includes connecting rod down, there are down a plurality of lower lead wire units of separately arranging on the connecting rod, and go between down that have the first to go between to the unit and the second goes between, first lead wire is including each other first paster ji dao and first pin as an organic whole, second lead wire is including each other second paster ji dao and second pin as an organic whole, its innovation point lies in: the recess that has many parallel arrangement on the second paster ji dao of second lead wire, the root of second pin just leans on its second paster ji daochu to have the through -hole. The utility model discloses unnecessary welding is glued or soldering paste emergence aversion in the time of can effectively preventing the chip because of the welding.
Description
Technical field
The utility model relates to a kind of lead frame, is specifically related to a kind of lead frame structure of rectifier bridge.
Background technology
The lead frame of existing rectifier bridge comprises the upper frame and underframe that are used in conjunction with each other, second time paster Ji Dao of second time lead-in wire on described underframe is smooth shape, like this, second time paster Ji Dao is by soldering paste and chip bonding process, soldering paste is because spreading along second time paster Ji Dao to surrounding after high temperature melting, even also can overflow on pin, pollute pin; Meanwhile, chip also along with the direction skew of soldering paste flowing, therefore, can affect product fine rate and reduce the reliability of product.
Summary of the invention
The purpose of this utility model is: provide a kind of chip that can effectively prevent to be shifted because of unnecessary weldering glue during welding or soldering paste, improve the lead frame structure of the rectifier bridge of product reliability, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution of the utility model is: a kind of lead frame structure of rectifier bridge, comprises the upper frame and underframe that are used in conjunction with each other; Described upper frame comprises upper connecting rod, and upper connecting rod has multiple upper lead wire unit arranged apart, and described upper lead wire unit to have on first on lead-in wire and second and goes between; Described underframe comprises lower connecting rod, described lower connecting rod there is multiple lower lead wire unit arranged apart, and lower lead wire unit has first time lead-in wire and second time lead-in wire, described first time lead-in wire comprises first time paster Ji Dao and first time pin of one each other, and described second time lead-in wire comprises second time paster Ji Dao and second time pin of one each other; Its innovative point is:
The groove that second time paster Ji Dao of a, described second time lead-in wire has many to be arranged in parallel;
The root of b, described second time pin and have through hole by its second time paster Ji Daochu.
In technique scheme, the root of described second time pin and have the second bending section by its second time paster Ji Daochu, and through hole is located on the second bending section.
In technique scheme, described second time paster Ji Dao is provided with gap, and gap is positioned at the side of second time pin.
In technique scheme, go between on described first, on second lead-in wire and first time lead-in wire first time paster Ji Dao on be respectively equipped with chip positioning boss, the root of described first time pin and have the first bending section by its first time paster Ji Daochu.
In technique scheme, described through hole is manhole or kidney ellipsoid through hole.
In technique scheme, the upper connecting rod of described upper frame and the lower connecting rod of underframe have multiple technology hole respectively, and multiple technology hole is circular technology hole and/or kidney ellipsoid technology hole.
The good effect that the utility model has is: after adopting lead frame of the present utility model, the groove that second time paster Ji Dao due to described second time lead-in wire has many to be arranged in parallel, therefore, chip is in welding process, after fusing, unnecessary weldering glue or soldering paste can flow in groove, with the phenomenon preventing chip from displacement occurring; Due to described second time pin root and have through hole by its second time paster Ji Daochu, after fusing, unnecessary weldering glue or soldering paste can flow in through hole along second time pin, prevent too much weldering glue or soldering paste from overflowing on pin, the phenomenon of the pin reliability that would not make a difference, meanwhile, weldering glue moderate on second time paster Ji Dao or solder paste amounts can be ensured again, thus improve product fine rate, and the quality level such as reliability, achieve the purpose of this utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the enlarged diagram of the utility model underframe;
Fig. 3 is first time lead-in wire left view in Fig. 2;
Fig. 4 is the A-A cross-sectional schematic in Fig. 2.
Embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the utility model is further described, but is not limited thereto.
As shown in Figure 1,2,3, 4, a kind of lead frame structure of rectifier bridge, comprises the upper frame 1 and underframe 2 that are used in conjunction with each other; Described upper frame 1 comprises upper connecting rod 1-1, and upper connecting rod 1-1 has multiple upper lead wire unit 3 arranged apart, and described upper lead wire unit 3 has 3-2 that the 3-1 and second that to go between on first goes between; Described underframe 2 comprises lower connecting rod 2-1, described lower connecting rod 2-1 there is multiple lower lead wire unit 4 arranged apart, and lower lead wire unit 4 has 4-1 and the second time lead-in wire 4-2 that go between for first time, described first time lead-in wire 4-1 comprises first time paster base island 4-1-1 and first time pin 4-1-2 of one each other, and described second time lead-in wire 4-2 comprises second time paster base island 4-2-1 and second time pin 4-2-2 of one each other;
The groove 4-2-3 that second time paster base island 4-2-1 of a, described second time lead-in wire 4-2 has many to be arranged in parallel;
The root of b, described second time pin 4-2-2 and have through hole 4-2-4 by its 4-2-1 place, second time paster base island.
As shown in Fig. 1,2,4, in order to make the utility model structure more reasonable, make chip and lead frame in welding process, soldering paste after fusing or weldering glue can not overflow on lower pin, the root of described second time pin 4-2-2 and have the second bending section 4-2-5 by its 4-2-1 place, second time paster base island, and through hole 4-2-4 is located on the second bending section 4-2-5.
As shown in Fig. 1,2,4, in order to strengthen the adhesion between the insulating cement shell of product and lead-in wire, described second time paster base island 4-2-1 is provided with gap 4-2-6, and gap 4-2-6 is positioned at the side of second time pin 4-2-2.
As shown in Figure 1, equipped for the ease of positioning chip, go between on described first 3-1, second goes between 3-2 and first time lead-in wire 4-1 first time paster base island 4-1-1 on be respectively equipped with chip positioning boss 5, the root of described first time pin 4-1-2 and have the first bending section 4-1-3 by its 4-1-1 place, first time paster base island.
Through hole 4-2-4 described in the utility model is manhole or kidney ellipsoid through hole.
As shown in Figure 1, for the ease of upper frame and underframe are equipped with tool locating respectively, the upper connecting rod 1-1 of described the upper frame 1 and lower connecting rod 2-1 of underframe 2 has multiple technology hole 6 respectively, and multiple technology hole 6 is circular technology hole and/or kidney ellipsoid technology hole.
When the utility model uses, four rectification chips are placed on respectively the 3-1 that to go between on first, on the chip positioning boss 5 gone between on second on first time paster base island 4-1-1 of 3-2 and first time lead-in wire 4-1, and be welded to connect by soldering paste or weldering glue, then the paster Ji Dao of the 3-1 that goes between on first is corresponding with first time paster base island 4-1-1 of first time 4-1 that goes between, go between on second 3-2 with paster Ji Dao corresponding with second time paster base island 4-2-1 of second time 4-2 that goes between, and be welded to connect by soldering paste or weldering glue, like this, after fusing, unnecessary weldering glue or soldering paste can flow into groove and flow in through hole along second time pin, there is the phenomenon of displacement to prevent chip and prevent too much weldering glue or soldering paste from overflowing on pin, prevent the phenomenon affecting pin reliability, simultaneously, weldering glue moderate on the second paster Ji Dao or solder paste amounts can be ensured again, thus improve product fine rate, and the quality level such as reliability.
The utility model lab scale effect shows, and its effect is well-content.
Claims (6)
1. a lead frame structure for rectifier bridge, comprises the upper frame (1) and underframe (2) that are used in conjunction with each other; Described upper frame (1) comprises upper connecting rod (1-1), and upper connecting rod (1-1) has multiple upper lead wire unit (3) arranged apart, and described upper lead wire unit (3) has to go between on (3-1) and second on first and goes between (3-2); Described underframe (2) comprises lower connecting rod (2-1), described lower connecting rod (2-1) there is multiple lower lead wire unit (4) arranged apart, and lower lead wire unit (4) has first time lead-in wire (4-1) and second time lead-in wire (4-2), described first time lead-in wire (4-1) comprises first time paster Ji Dao (4-1-1) and first time pin (4-1-2) of one each other, and described second time lead-in wire (4-2) comprises second time paster Ji Dao (4-2-1) and second time pin (4-2-2) of one each other; It is characterized in that:
The groove (4-2-3) that second time paster Ji Dao (4-2-1) of a, described second time lead-in wire (4-2) has many to be arranged in parallel;
The root of b, described second time pin (4-2-2) and have through hole (4-2-4) by its second time paster Ji Dao (4-2-1) place.
2. the lead frame structure of rectifier bridge according to claim 1, it is characterized in that: the root of described second time pin (4-2-2) and have the second bending section (4-2-5) by its second time paster Ji Dao (4-2-1) place, and through hole (4-2-4) is located on the second bending section (4-2-5).
3. the lead frame structure of rectifier bridge according to claim 1 and 2, is characterized in that: described second time paster Ji Dao (4-2-1) is provided with gap (4-2-6), and gap (4-2-6) is positioned at the side of second time pin (4-2-2).
4. the lead frame structure of rectifier bridge according to claim 1, it is characterized in that: first time paster Ji Dao (4-1-1) of go between on described first lead-in wire (3-2) and first time lead-in wire (4-1) on (3-1), second is respectively equipped with chip positioning boss (5), the root of described first time pin (4-1-2) and lean on its first time paster Ji Dao (4-1-1) place to have the first bending section (4-1-3).
5. the lead frame structure of rectifier bridge according to claim 1 and 2, is characterized in that: described through hole (4-2-4) is manhole or kidney ellipsoid through hole.
6. the lead frame structure of rectifier bridge according to claim 1 and 2, it is characterized in that: the upper connecting rod (1-1) of described upper frame (1) and the lower connecting rod (2-1) of underframe (2) have multiple technology hole (6) respectively, and multiple technology hole (6) is circular technology hole and/or kidney ellipsoid technology hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520562769.2U CN204885149U (en) | 2015-07-30 | 2015-07-30 | Lead wire frame construction of rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520562769.2U CN204885149U (en) | 2015-07-30 | 2015-07-30 | Lead wire frame construction of rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885149U true CN204885149U (en) | 2015-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520562769.2U Active CN204885149U (en) | 2015-07-30 | 2015-07-30 | Lead wire frame construction of rectifier bridge |
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| CN (1) | CN204885149U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571342A (en) * | 2016-08-15 | 2017-04-19 | 林茂昌 | Combined-type rectifying component and manufacturing method thereof |
| CN108493179A (en) * | 2018-02-06 | 2018-09-04 | 昆山市品能精密电子有限公司 | The firm integrated circuit supporting structure of chip adhesive and its manufacturing method |
-
2015
- 2015-07-30 CN CN201520562769.2U patent/CN204885149U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571342A (en) * | 2016-08-15 | 2017-04-19 | 林茂昌 | Combined-type rectifying component and manufacturing method thereof |
| CN106571342B (en) * | 2016-08-15 | 2020-01-17 | 林茂昌 | Combined rectifying element and preparation method thereof |
| CN108493179A (en) * | 2018-02-06 | 2018-09-04 | 昆山市品能精密电子有限公司 | The firm integrated circuit supporting structure of chip adhesive and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: Changzhou Galaxy century microelectronics Limited by Share Ltd Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee before: Changzhou Galaxy Century Micro-Electronics Co., Ltd. |