CN201466961U - rectifier - Google Patents

rectifier Download PDF

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Publication number
CN201466961U
CN201466961U CN2009200464477U CN200920046447U CN201466961U CN 201466961 U CN201466961 U CN 201466961U CN 2009200464477 U CN2009200464477 U CN 2009200464477U CN 200920046447 U CN200920046447 U CN 200920046447U CN 201466961 U CN201466961 U CN 201466961U
Authority
CN
China
Prior art keywords
pin
brace
chip
packaging body
paster
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200464477U
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Chinese (zh)
Inventor
朱宁
易际宙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd
Original Assignee
CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd filed Critical CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd
Priority to CN2009200464477U priority Critical patent/CN201466961U/en
Application granted granted Critical
Publication of CN201466961U publication Critical patent/CN201466961U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8438—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/84385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Rectifiers (AREA)

Abstract

The utility model relates to a rectifier particularly, comprising a first pin, a second pin, a third pin, a first connecting piece, a second connecting piece, a first chip, a second chip and an encapsulating body, wherein the inner ends of the first pin, the second pin and the third pin, the surface of a second paster paddle (PAD) DAP, the first connecting piece, the second connecting piece, the first chip and the second chip are encapsulated in the encapsulating body, the back surface of the second paster paddle (PAD) is exposed outside of the encapsulating body, and a first bulge is arranged on one side at which the first connecting piece and the first pin are connected; a second bulge is arranged on one side at which the second connecting piece and the third pin are connected; a plurality of first grooves are arranged on one side at which the first pin and the first connecting piece are connected; and a plurality of second grooves are arranged on one side at which the third pin and the second connecting piece are connected. The rectifier in the utility model has the advantages of no pollution and high reliability.

Description

A kind of rectifier
Technical field
The utility model relates to a kind of rectifying device, is specifically related to a kind of semiconductor rectifier.
Background technology
Along with development of electronic technology, the demand of semiconductor rectifier progressively increases, adopt brace that chip is connected with pin in the conventional semiconductor rectifier mostly, generally be manually brace to be linked to each other with pin by certain requirement during making, because when pin and brace weld by weld tabs, after melting, weld tabs can overflow along pin, thereby the weld tabs that pin can be overflowed pollutes, make product when test, not reach standard, and the weld that is encapsulated in the packaging body can occur welding inhomogeneous, make reliability low, reduced competitiveness of product.
Summary of the invention
The purpose of this utility model provides a kind of not only pollution-free, and the high rectifier of reliability.
In order to achieve the above object, the technical solution of the utility model is: a kind of rectifier, comprise first pin, second pin, the 3rd pin, first brace, second brace, first chip, second chip and packaging body, the inner of described first pin is connected with an end of first brace; The inner of described the 3rd pin is connected with an end of second brace; Be connected with first chip between the second paster Ji Dao of described second pin and the other end of first brace; Be connected with second chip between the second paster Ji Dao of described second pin and the other end of second brace; Surface, first brace, second brace, first chip, second chip inner and the second paster Ji Dao of the inner of the inner of described first pin, second pin, the 3rd pin all are encapsulated in the packaging body, the back side of the second paster Ji Dao exposes outside packaging body, and a side that links to each other with first pin of described first brace has first projection; A side that links to each other with the 3rd pin of described second brace has second projection; A side that links to each other with first brace of described first pin has several first grooves; A side that links to each other with second brace of described the 3rd pin has several first grooves.
The close packaging body edge that is positioned at packaging body that the close packaging body edge that is positioned at packaging body of described first pin has some second grooves, second pin has some first grooves, and the close packaging body edge that is positioned at packaging body of the 3rd pin has some second grooves.
The surface of the second paster Ji Dao of described second pin has rough annular knurl, and the back side is smooth flat.
Described second pin has on the fin that is connected as a single entity and the fin and has through hole, and described fin exposes outside packaging body, and fin stretch out direction and second pin to stretch out direction opposite.
Described first pin and the 3rd pin are the T matrix, and the upper right corner of the T matrix of first pin has chamfering, and the upper left corner of the T matrix of the 3rd pin has chamfering.
Described first pin is connected by weld tabs with first brace; Described the 3rd pin is connected by weld tabs with second brace.
Described first brace all is connected with first chip by weld tabs with the second paster Ji Dao; Described second brace all is connected with second chip by weld tabs with the second paster Ji Dao.
The good effect that the utility model had is: because a side that links to each other with first pin of described first brace has first projection, a side that links to each other with the 3rd pin of described second brace has second projection, a side that links to each other with first brace of described first pin has several first grooves, a side that links to each other with second brace of the 3rd pin has several first grooves, thereby when welding, increased projection and groove adsorptivity to weld tabs, the weld tabs that has overcome after melting overflows and has polluted the shortcoming of pin along pin, make product when test, reach standard, and the weld welding that is encapsulated in package interior is more even, make the reliability height, improved competitiveness of product, during use, directly pin is installed on the electronic circuit board.
Description of drawings
Fig. 1 is the structural representation that the utility model paster bridge rectifier is cut plastic body open;
Fig. 2 is along the cutaway view of A-A direction among Fig. 1;
Fig. 3 is along the cutaway view of B-B direction among Fig. 1;
Fig. 4 is the structural representation of pin among Fig. 1;
Fig. 5 is along the cutaway view of C-C direction among Fig. 4;
Fig. 6 be among Fig. 4 first pin along D to structural representation;
Fig. 7 be among Fig. 4 the 3rd pin along E to structural representation;
Fig. 8 is the structural representation of first brace among Fig. 1;
Fig. 9 is the left view of Fig. 8;
Figure 10 is the structural representation of second brace among Fig. 1;
Figure 11 is the right view of Figure 10.
Embodiment
Below in conjunction with the embodiment that accompanying drawing provides, the utility model is described in further detail.
Shown in Fig. 1,2,3,4,5,6,7,8,9,10,11, a kind of rectifier, comprise first pin 1, second pin 2, the 3rd pin 3, first brace 4, second brace 5, first chip 6, second chip 7 and packaging body 8, the inner of described first pin 1 is connected with an end of first brace 4; The inner of described the 3rd pin 3 is connected with an end of second brace 5; Be connected with first chip 6 between the second paster base island 2-1 of described second pin 2 and the other end of first brace 4; Be connected with second chip 7 between the second paster base island 2-1 of described second pin 2 and the other end of second brace 5; Surface, first brace 4, second brace 5, first chip 6, second chip 7 inner and the second paster base island 2-1 of the inner of the inner of described first pin 1, second pin 2, the 3rd pin 3 all are encapsulated in the packaging body 8, the back side of the second paster base island 2-1 exposes outside packaging body 8, and a side that links to each other with first pin 1 of described first brace 4 has the first protruding 4-1; A side that links to each other with the 3rd pin 3 of described second brace 5 has the second protruding 5-1; A side that links to each other with first brace 4 of described first pin 1 has several first grooves 1-1, and a side that links to each other with second brace 5 of described the 3rd pin 3 has several first grooves 3-1.The opposite side of described first brace 4 and second brace 5 all has pit.
Shown in Fig. 1,2,3,4,5,6,7, for the weld tabs after better avoiding melting overflows along pin, close packaging body 8 edges that are positioned at packaging body 8 that close packaging body 8 edges that are positioned at packaging body 8 of described first pin 1 have some second groove 1-2, second pin 2 have some first groove 2-4, and close packaging body 8 edges that are positioned at packaging body 8 of the 3rd pin 3 have some second groove 3-2.
Shown in Fig. 1,2,3,4,5, the welding of the paster Ji Dao of chip and pin for convenience, prevent the adsorptivity that chip moves and strengthens weld tabs and paster Ji Dao, the surface of the second paster base island 2-1 of described second pin 2 has rough annular knurl 2-1-1, and the back side is smooth flat.
Shown in Fig. 1,2,3,4,5, for the ease of chip cooling, described second pin 2 has on the fin 2-2 that is connected as a single entity and the fin 2-2 and has through hole 2-3, described fin 2-2 exposes outside packaging body 8, and fin 2-2 stretch out direction and second pin 2 to stretch out direction opposite.
Shown in Fig. 1,4,6,7, be connected with corresponding pin for the ease of brace, described first pin 1 and the 3rd pin 3 are the T matrix, and the upper right corner of the T matrix of first pin 1 has chamfering, and the upper left corner of the T matrix of the 3rd pin 3 has chamfering.
Shown in Fig. 1,2,3, in order to simplify production process, the weld tabs 9 that passes through of described first pin 1 and first brace 4 is connected; Described the 3rd pin 3 is connected by weld tabs 9 with second brace 5.Described first brace 4 all is connected with first chip 6 by weld tabs 9 with the second paster base island 2-1; Described second brace 5 all is connected with second chip 7 by weld tabs 9 with the second paster base island 2-1.

Claims (7)

1. rectifier, comprise first pin (1), second pin (2), the 3rd pin (3), first brace (4), second brace (5), first chip (6), second chip (7) and packaging body (8), the inner of described first pin (1) is connected with an end of first brace (4); The inner of described the 3rd pin (3) is connected with an end of second brace (5); Be connected with first chip (6) between the second paster Ji Dao (2-1) of described second pin (2) and the other end of first brace (4); Be connected with second chip (7) between the second paster Ji Dao (2-1) of described second pin (2) and the other end of second brace (5); Surface, first brace (4), second brace (5), first chip (6), second chip (7) inner and the second paster Ji Dao (2-1) of the inner of the inner of described first pin (1), second pin (2), the 3rd pin (3) all are encapsulated in the packaging body (8), the back side of the second paster Ji Dao (2-1) exposes outside packaging body (8), it is characterized in that:
A side that links to each other with first pin (1) of a, described first brace (4) has first projection (4-1);
A side that links to each other with the 3rd pin (3) of b, described second brace (5) has second projection (5-1);
A side that links to each other with first brace (4) of c, described first pin (1) has several first grooves (1-1);
A side that links to each other with second brace (5) of d, described the 3rd pin (3) has several first grooves (3-1).
2. rectifier according to claim 1, it is characterized in that: close packaging body (8) edge that is positioned at packaging body (8) that close packaging body (8) edge that is positioned at packaging body (8) of described first pin (1) has some second grooves (1-2), second pin (2) has some first grooves (2-4), and close packaging body (8) edge that is positioned at packaging body (8) of the 3rd pin (3) has some second grooves (3-2).
3. rectifier according to claim 1 is characterized in that: the surface of the second paster Ji Dao (2-1) of described second pin (2) has rough annular knurl (2-1-1), and the back side is smooth flat.
4. rectifier according to claim 1, it is characterized in that: described second pin (2) has on the fin (2-2) that is connected as a single entity and the fin (2-2) and has through hole (2-3), described fin (2-2) exposes outside packaging body (8), and fin (2-2) stretch out direction and second pin (2) to stretch out direction opposite.
5. rectifier according to claim 1 is characterized in that: described first pin (1) and the 3rd pin (3) are the T matrix, and the upper right corner of the T matrix of first pin (1) has chamfering, and the upper left corner of the T matrix of the 3rd pin (3) has chamfering.
6. rectifier according to claim 1 is characterized in that: described first pin (1) is connected by weld tabs (9) with first brace (4); Described the 3rd pin (3) is connected by weld tabs (9) with second brace (5).
7. rectifier according to claim 1 is characterized in that: described first brace (4) all is connected with first chip (6) by weld tabs (9) with the second paster Ji Dao (2-1); Described second brace (5) all is connected with second chip (7) by weld tabs (9) with the second paster Ji Dao (2-1).
CN2009200464477U 2009-06-10 2009-06-10 rectifier Expired - Fee Related CN201466961U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200464477U CN201466961U (en) 2009-06-10 2009-06-10 rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200464477U CN201466961U (en) 2009-06-10 2009-06-10 rectifier

Publications (1)

Publication Number Publication Date
CN201466961U true CN201466961U (en) 2010-05-12

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ID=42394308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200464477U Expired - Fee Related CN201466961U (en) 2009-06-10 2009-06-10 rectifier

Country Status (1)

Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104617073A (en) * 2015-01-19 2015-05-13 苏州固锝电子股份有限公司 Diode device for small signals
JP2018517302A (en) * 2015-06-10 2018-06-28 ヴィシェイ ジェネラル セミコンダクター，エルエルシーＶｉｓｈａｙ Ｇｅｎｅｒａｌ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ，Ｌｌｃ Lead frame with conductive clip for attaching semiconductor die while reducing clip shift

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104617073A (en) * 2015-01-19 2015-05-13 苏州固锝电子股份有限公司 Diode device for small signals
JP2018517302A (en) * 2015-06-10 2018-06-28 ヴィシェイ ジェネラル セミコンダクター，エルエルシーＶｉｓｈａｙ Ｇｅｎｅｒａｌ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ，Ｌｌｃ Lead frame with conductive clip for attaching semiconductor die while reducing clip shift
EP3308396A4 (en) * 2015-06-10 2019-02-06 Vishay General Semiconductor LLC Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100512

Termination date: 20160610