CN203871317U - Structure of bridge rectifier - Google Patents

Structure of bridge rectifier Download PDF

Info

Publication number
CN203871317U
CN203871317U CN201420261245.5U CN201420261245U CN203871317U CN 203871317 U CN203871317 U CN 203871317U CN 201420261245 U CN201420261245 U CN 201420261245U CN 203871317 U CN203871317 U CN 203871317U
Authority
CN
China
Prior art keywords
rectification chip
paster
welded
connect
dao
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420261245.5U
Other languages
Chinese (zh)
Inventor
孙良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Galaxy Century Microelectronics Co ltd
Original Assignee
ZHANGZHOU YINHESHIJI MICRO-ELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHANGZHOU YINHESHIJI MICRO-ELECTRONIC Co Ltd filed Critical ZHANGZHOU YINHESHIJI MICRO-ELECTRONIC Co Ltd
Priority to CN201420261245.5U priority Critical patent/CN203871317U/en
Application granted granted Critical
Publication of CN203871317U publication Critical patent/CN203871317U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Synchronous Machinery (AREA)

Abstract

The utility model relates to the structure of a bridge rectifier. The structure of the bridge rectifier includes four leads, four rectification chips and a plastic package body, wherein the four leads are provided with paster base islands, and the four paster base islands and the four rectification chips are packaged in the plastic package body; the structure of the bridge rectifier also includes two connecting sheets; a positive electrode of the first rectification chip and a negative electrode of the third rectification chip are in welded connection with the first paster base island, and a negative electrode of the second rectification chip and a positive electrode of the fourth rectification chip are in welded connection with the fourth paster base island; a negative electrode of the first rectification chip and a positive electrode of the second rectification chip are in welded connection with the first connecting sheet at the same time, and the first connecting sheet is in welded connection with the third paster base island; a positive electrode of the third rectification chip and a negative electrode of the fourth rectification chip are in welded connection with the second connecting sheet at the same time, and the second connecting sheet is in welded connection with the second paster base island; and the four leads are provided with bending segments respectively which are all located outside the plastic package body. The structure of the bridge rectifier in the utility model has the advantages of high assembling efficiency, good finished product quality and the like.

Description

The structure of bridge rectifier
Technical field
The utility model is specifically related to a kind of structure of bridge rectifier, belongs to the technical field of microelectronic component.
Background technology
Existing bridge rectifier comprises four rectification chips and four lead-in wires, the back side of four rectification chips is connected with four corresponding Ji Dao of lead-in wire respectively, and the surface of four rectification chips is connected with four corresponding Ji Dao of lead-in wire by bonding wire respectively, and the diameter of bonding wire is also thinner than the diameter of hairline, this just brings certain difficulty to assembling, make production efficiency low, and the phenomenon that may occur rosin joint after bonding wire welding, or when after bonding wire welding, operating personnel's hand is taken workpiece range estimation, can break carelessly bonding wire, this all can cause rate of finished products low, and stability and poor reliability, cannot guarantee high-quality, because lead-in wire is all the section of keeping straight on, in use, during with PCB electronic circuit board plug-in mounting, not only yielding again, and can cause internal connection fracture, making product failure, reliability reduces.
Summary of the invention
The purpose of this utility model is: provide a kind of not only assembler to lead height, and the structure of the bridge rectifier of favorable quality of finished products, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution of the utility model: a kind of structure of bridge rectifier, comprise the first lead-in wire, the second lead-in wire, the 3rd lead-in wire, the 4th lead-in wire, the first rectification chip, the second rectification chip, the 3rd rectification chip, the 4th rectification chip and plastic-sealed body, described the first lead-in wire, the second lead-in wire, the 3rd lead-in wire and the 4th goes between to be had respectively and its first paster Ji Dao of one each other separately, the second paster Ji Dao, the 3rd paster Ji Dao and the 4th paster Ji Dao, described the first paster Ji Dao, the second paster Ji Dao, the 3rd paster Ji Dao, the 4th paster Ji Dao, the first rectification chip, the second rectification chip, the 3rd rectification chip and the 4th rectification chip are all encapsulated in plastic-sealed body, its innovative point is:
A, also comprise the first brace and the second brace, described the first rectification chip is between the first paster Ji Dao and the first brace, the second rectification chip is between the 4th paster Ji Dao and the first brace, the 3rd rectification chip is between the first paster Ji Dao and the second brace, and the 4th rectification chip is between the 4th paster Ji Dao and the second brace;
The negative pole anodal and the 3rd rectification chip of b, described the first rectification chip is all welded to connect with the first paster Ji Dao, and the positive pole of the negative pole of the second rectification chip and the 4th rectification chip is all welded to connect with the 4th paster Ji Dao;
The anodal of the negative pole of c, described the first rectification chip and the second rectification chip is welded to connect with the first brace simultaneously, and the first brace and the 3rd paster Ji Dao are welded to connect; The negative pole of the positive pole of the 3rd rectification chip and the 4th rectification chip is welded to connect with the second brace simultaneously, and the second brace and the second paster Ji Dao are welded to connect;
D, described the first lead-in wire, the second lead-in wire, the 3rd lead-in wire and the 4th lead-in wire have respectively and its first fold curved segment, the second bending section, the 3rd bending section and the four fold curved segment of one each other separately, and first fold curved segment, the second bending section, the 3rd bending section and four fold curved segment are all positioned at outside plastic-sealed body.
In technique scheme, described the first brace has and its first lap segment of one each other, and described the first lap segment and the 3rd paster Ji Dao are welded to connect.
In technique scheme, described the second brace has and its second lap segment of one each other, and described the second lap segment and the second paster Ji Dao are welded to connect.
In technique scheme, on described the first paster Ji Dao, there are the first boss and the second boss, the positive pole of the first rectification chip and the first boss are welded to connect, and the negative pole of the 3rd rectification chip and the second boss are welded to connect; On described the 4th paster Ji Dao, have the 3rd boss and the 4th boss, the negative pole of the second rectification chip and the 3rd boss are welded to connect, and the positive pole of the 4th rectification chip and the 4th boss are welded to connect.
In technique scheme, on described the first brace, there is the first connection boss to be connected boss with second, the negative pole of the first rectification chip and first is connected boss and is welded to connect, and the positive pole of described the second rectification chip and second is connected boss and is welded to connect; On the second brace, have the 3rd connection boss to be connected boss with the 4th, the positive pole of the 3rd rectification chip and the 3rd is connected boss and is welded to connect, and the negative pole of the 4th rectification chip and the 4th is connected boss and is welded to connect.
The good effect that the utility model has is: because the back side of described four rectification chips is connected with four corresponding paster Ji Dao of lead-in wire respectively, and wherein the surface of two rectification chips is welded to connect by the first brace respectively, the surface of two rectification chips of residue is welded to connect by the second brace respectively, rather than as being that rectification chip surface is to adopt bonding wire and corresponding paster Ji Dao to be welded to connect in prior art, therefore, greatly improved efficiency of assembling, improved production work efficiency, nor there will be rosin joint or when test to break the problem of bonding wire, guaranteed the quality of manufactured goods, again because four lead-in wires have respectively corresponding bending section, like this, in use, during with PCB electronic circuit board plug-in mounting, can effectively discharge stress, not only not yielding, nor can cause internal connection fracture, thereby guaranteed the reliability of product, thereby realized the purpose of this utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the A-A cross-sectional schematic of Fig. 1;
Fig. 3 is the B-B cross-sectional schematic of Fig. 1;
Fig. 4 is the C-C cross-sectional schematic of Fig. 1
Fig. 5 is the D-D cross-sectional schematic of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the utility model is further described, but is not limited to this.
As Fig. 1, 2, 3, 4, shown in 5, a kind of structure of bridge rectifier, comprise the first lead-in wire 1, the second lead-in wire 2, the 3rd lead-in wire 3, the 4th lead-in wire 4, the first rectification chip 5, the second rectification chip 6, the 3rd rectification chip 7, the 4th rectification chip 8 and plastic-sealed body 9, described the first lead-in wire 1, the second lead-in wire 2, the 3rd lead-in wire the 3 and the 4th lead-in wire 4 has respectively and its first paster base island 1-1 of one each other separately, the second paster base island 2-1, the 3rd paster base island 3-1 and the 4th paster base island 4-1, described the first paster base island 1-1, the second paster base island 2-1, the 3rd paster base island 3-1, the 4th paster base island 4-1, the first rectification chip 5, the second rectification chip 6, the 3rd rectification chip 7 and the 4th rectification chip 8 are all encapsulated in plastic-sealed body 9, and its:
A, also comprise the first brace 10 and the second brace 11, described the first rectification chip 5 is between the first paster base island 1-1 and the first brace 10, the second rectification chip 6 is between the 4th paster base island 4-1 and the first brace 10, the 3rd rectification chip 7 is between the first paster base island 1-1 and the second brace 11, and the 4th rectification chip 8 is between the 4th paster base island 4-1 and the second brace 11;
The negative pole anodal and the 3rd rectification chip 7 of b, described the first rectification chip 5 is all welded to connect with the first paster base island 1-1, and the positive pole of the negative pole of the second rectification chip 6 and the 4th rectification chip 8 is all welded to connect with the 4th paster base island 4-1;
The anodal of the negative pole of c, described the first rectification chip 5 and the second rectification chip 6 is welded to connect with the first brace 10 simultaneously, and the first brace 10 and the 3rd paster base island 3-1 are welded to connect; The negative pole of the positive pole of the 3rd rectification chip 7 and the 4th rectification chip 8 is welded to connect with the second brace 11 simultaneously, and the second brace 11 and the second paster base island 2-1 are welded to connect;
D, described first lead-in wire the 1, second lead-in wire the 2, the 3rd lead-in wire the 3 and the 4th lead-in wire 4 have respectively and its first fold curved segment 1-2, the second bending section 2-2, the 3rd bending section 3-2 and the four fold curved segment 4-2 of one each other separately, and first fold curved segment 1-2, the second bending section 2-2, the 3rd bending section 3-2 and four fold curved segment 4-2 are all positioned at outside plastic-sealed body 9.
As shown in Fig. 1,4, for the ease of the first brace 10 and the 3rd paster base island 3-1, be welded to connect, described the first brace 10 has and its first lap segment 10-1 of one each other, and described the first lap segment 10-1 and the 3rd paster base island 3-1 are welded to connect.
As shown in Figure 1,3, for the ease of the second brace 11 and the second paster base island 2-1, be welded to connect, described the second brace 11 has and its second lap segment 11-1 of one each other, and described the second lap segment 11-1 and the second paster base island 2-1 are welded to connect.
As shown in Fig. 2,5, for the ease of being welded to connect behind rectification chip and paster Ji Dao location, on described the first paster base island 1-1, there are the first boss 1-1-1 and the second boss 1-1-2, the positive pole of the first rectification chip 5 and the first boss 1-1-1 are welded to connect, and the negative pole of the 3rd rectification chip 7 and the second boss 1-1-2 are welded to connect; On described the 4th paster base island 4-1, have the 3rd boss 4-1-1 and the 4th boss 4-1-2, the negative pole of the second rectification chip 6 and the 3rd boss 4-1-1 are welded to connect, and the positive pole of the 4th rectification chip 8 and the 4th boss 4-1-2 are welded to connect.
As shown in Fig. 2,5, for the ease of being welded to connect behind rectification chip and brace location, on described the first brace 10, there is the first connection boss 10-2 to be connected boss 10-3 with second, the negative pole of the first rectification chip 5 is connected boss 10-2 with first and is welded to connect, and the positive pole of described the second rectification chip 6 is connected boss 10-3 with second and is welded to connect; On the second brace 11, have the 3rd connection boss 11-2 to be connected boss 11-3 with the 4th, the positive pole of the 3rd rectification chip 7 is connected boss 11-2 with the 3rd and is welded to connect, and the negative pole of the 4th rectification chip 8 is connected boss 11-3 with the 4th and is welded to connect.
The utility model has not only improved production work efficiency, nor there will be rosin joint or when test to break the problem of bonding wire, has guaranteed the quality of manufactured goods; In use, during with PCB electronic circuit board plug-in mounting, can effectively discharge stress, not only not yielding, nor can cause internal connection fracture, thus guaranteed the reliability of product.
The demonstration of the utility model lab scale effect, its effect is well-content.

Claims (5)

1. the structure of a bridge rectifier, comprise the first lead-in wire (1), the second lead-in wire (2), the 3rd lead-in wire (3), the 4th lead-in wire (4), the first rectification chip (5), the second rectification chip (6), the 3rd rectification chip (7), the 4th rectification chip (8) and plastic-sealed body (9), described the first lead-in wire (1), the second lead-in wire (2), the 3rd lead-in wire (3) and the 4th go between (4) have respectively separately and its first paster Ji Dao (1-1) of one each other, the second paster Ji Dao (2-1), the 3rd paster Ji Dao (3-1) and the 4th paster Ji Dao (4-1), described the first paster Ji Dao (1-1), the second paster Ji Dao (2-1), the 3rd paster Ji Dao (3-1), the 4th paster Ji Dao (4-1), the first rectification chip (5), the second rectification chip (6), the 3rd rectification chip (7) and the 4th rectification chip (8) are all encapsulated in plastic-sealed body (9), it is characterized in that:
A, also comprise the first brace (10) and the second brace (11), described the first rectification chip (5) is positioned between the first paster Ji Dao (1-1) and the first brace (10), the second rectification chip (6) is positioned between the 4th paster Ji Dao (4-1) and the first brace (10), the 3rd rectification chip (7) is positioned between the first paster Ji Dao (1-1) and the second brace (11), and the 4th rectification chip (8) is positioned between the 4th paster Ji Dao (4-1) and the second brace (11);
The negative pole of the positive pole of b, described the first rectification chip (5) and the 3rd rectification chip (7) is all welded to connect with the first paster Ji Dao (1-1), and the positive pole of the negative pole of the second rectification chip (6) and the 4th rectification chip (8) is all welded to connect with the 4th paster Ji Dao (4-1);
The anodal of the negative pole of c, described the first rectification chip (5) and the second rectification chip (6) is welded to connect with the first brace (10) simultaneously, and the first brace (10) is welded to connect with the 3rd paster Ji Dao (3-1); The negative pole of the positive pole of the 3rd rectification chip (7) and the 4th rectification chip (8) is welded to connect with the second brace (11) simultaneously, and the second brace (11) is welded to connect with the second paster Ji Dao (2-1);
D, described the first lead-in wire (1), the second lead-in wire (2), the 3rd lead-in wire (3) and the 4th go between (4) have respectively separately and its first fold curved segment (1-2), the second bending section (2-2), the 3rd bending section (3-2) and the four fold curved segment (4-2) of one each other, and first fold curved segment (1-2), the second bending section (2-2), the 3rd bending section (3-2) and four fold curved segment (4-2) are all positioned at outside plastic-sealed body (9).
2. the structure of bridge rectifier according to claim 1, it is characterized in that: described the first brace (10) has and its first lap segment (10-1) of one each other, and described the first lap segment (10-1) is welded to connect with the 3rd paster Ji Dao (3-1).
3. the structure of bridge rectifier according to claim 1, it is characterized in that: described the second brace (11) has and its second lap segment (11-1) of one each other, and described the second lap segment (11-1) is welded to connect with the second paster Ji Dao (2-1).
4. the structure of bridge rectifier according to claim 1, it is characterized in that: on described the first paster Ji Dao (1-1), have the first boss (1-1-1) and the second boss (1-1-2), the positive pole of the first rectification chip (5) and the first boss (1-1-1) are welded to connect, and the negative pole of the 3rd rectification chip (7) and the second boss (1-1-2) are welded to connect; On described the 4th paster Ji Dao (4-1), there are the 3rd boss (4-1-1) and the 4th boss (4-1-2), the negative pole of the second rectification chip (6) and the 3rd boss (4-1-1) are welded to connect, and the positive pole of the 4th rectification chip (8) and the 4th boss (4-1-2) are welded to connect.
5. the structure of bridge rectifier according to claim 1, it is characterized in that: on described the first brace (10), have the first connection boss (10-2) to be connected boss (10-3) with second, the negative pole of the first rectification chip (5) is connected boss (10-2) and is welded to connect with first, the positive pole of described the second rectification chip (6) is connected boss (10-3) and is welded to connect with second; On the second brace (11), there is the 3rd connection boss (11-2) to be connected boss (11-3) with the 4th, the positive pole of the 3rd rectification chip (7) is connected boss (11-2) and is welded to connect with the 3rd, the negative pole of the 4th rectification chip (8) is connected boss (11-3) and is welded to connect with the 4th.
CN201420261245.5U 2014-05-21 2014-05-21 Structure of bridge rectifier Expired - Lifetime CN203871317U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420261245.5U CN203871317U (en) 2014-05-21 2014-05-21 Structure of bridge rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420261245.5U CN203871317U (en) 2014-05-21 2014-05-21 Structure of bridge rectifier

Publications (1)

Publication Number Publication Date
CN203871317U true CN203871317U (en) 2014-10-08

Family

ID=51652242

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420261245.5U Expired - Lifetime CN203871317U (en) 2014-05-21 2014-05-21 Structure of bridge rectifier

Country Status (1)

Country Link
CN (1) CN203871317U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807302A (en) * 2015-10-08 2018-11-13 苏州固锝电子股份有限公司 Rectifying bridge type semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807302A (en) * 2015-10-08 2018-11-13 苏州固锝电子股份有限公司 Rectifying bridge type semiconductor devices

Similar Documents

Publication Publication Date Title
CN204144243U (en) A kind of structure of chip diode
CN203076135U (en) Ultrasonic atomization piece
CN203871317U (en) Structure of bridge rectifier
CN203839407U (en) Paster type diode
CN107293530B (en) High-precision high-yield rectifier device
CN202678303U (en) Lead frame
CN204885149U (en) Lead wire frame construction of rectifier bridge
CN101868123B (en) Printed circuit board and design method thereof
CN102157480A (en) Bridge rectifier
CN204029816U (en) A kind of chip diode
CN210403749U (en) Fold tile subassembly welded structure
CN204732407U (en) Kenotron
CN204391097U (en) A kind of anti-rosin joint chip diode
CN203437691U (en) Combined type bakelite plate
CN205912353U (en) Multi -level circuit board paster smelting tool for reinforcement
CN204441276U (en) For the diode component of small-signal
CN204271106U (en) For the bending welding of photovoltaic module
CN203659846U (en) Lead frame and packaging body
CN202781910U (en) Press slide
CN208819872U (en) A kind of novel high-power transistor lead frame of DIE PAD roughing in surface
CN204303486U (en) The high pressure resistant composite type polymer thermistor of a kind of patch-type
CN203553421U (en) Novel serially connectable jack
CN204289468U (en) A kind of chip diode
CN202282383U (en) Novel LED support
CN207704170U (en) A kind of LCD modules of double welding positions

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19

Patentee after: CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO.,LTD.

Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19

Patentee before: CHANGZHOU GALAXY CENTURY MICRO-ELECTRONICS Co.,Ltd.

CX01 Expiry of patent term

Granted publication date: 20141008