CN204732407U - Kenotron - Google Patents

Kenotron Download PDF

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Publication number
CN204732407U
CN204732407U CN201520409459.7U CN201520409459U CN204732407U CN 204732407 U CN204732407 U CN 204732407U CN 201520409459 U CN201520409459 U CN 201520409459U CN 204732407 U CN204732407 U CN 204732407U
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CN
China
Prior art keywords
rectification chip
lead
wire
welded
boss
Prior art date
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Active
Application number
CN201520409459.7U
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Chinese (zh)
Inventor
纪领艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd
Original Assignee
CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd
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Publication date
Application filed by CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd filed Critical CHANGZHOU GALAXY ELECTRIC APPLIANCE Co Ltd
Priority to CN201520409459.7U priority Critical patent/CN204732407U/en
Application granted granted Critical
Publication of CN204732407U publication Critical patent/CN204732407U/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

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  • Rectifiers (AREA)

Abstract

Disclosed in the utility model is a kind of kenotron, comprise the first lead-in wire and the second lead-in wire, described first lead-in wire has the first boss, second lead-in wire has the second boss, its innovative point is: also comprise four rectification chips between the boss being located at two lead-in wires, and protect glue-line and plastic-sealed body; Described four rectification chips are connected in series successively; Described protection glue-line is coated in the periphery of four rectification chips; The boss of described two lead-in wires, four rectification chips and protection glue-line are all encapsulated in plastic-sealed body.The utility model not only takes up room little, integrated form, and is suitable for high-voltage rectifying.

Description

Kenotron
Technical field
The utility model relates to a kind of kenotron, belongs to electronic semiconductor components technical field.
Background technology
At present, existing rectifier diode is arranged on electronic circuit board by its lead-in wire, plays rectified action.And the rectifier diode of this structure comprises a diode chip for backlight unit, its reverse cut-ff voltage is 1250V ~ 1500V, to realize rectification in high-tension line, multiple rectifier diode series connection is so just needed to use, like this, not only take up room large, and use also inconvenient, in addition, production cost is also high.
Summary of the invention
The purpose of this utility model is: provide one not only to take up room little, integrated form, and be suitable for the kenotron of high-voltage rectifying, to overcome the deficiency of prior art.
In order to achieve the above object, the technical solution of the utility model is: a kind of kenotron, comprises the first lead-in wire and the second lead-in wire, and described first lead-in wire has the first boss, and the second lead-in wire has the second boss; Its innovative point is:
A, also comprise the first boss of being located at the first lead-in wire and the second lead-in wire the second boss between the first rectification chip, the second rectification chip, the 3rd rectification chip and the 4th rectification chip, and protection glue-line and plastic-sealed body;
The one side of b, described first rectification chip is welded to connect by the first boss being welded to connect layer and first and going between, the another side of the first rectification chip is welded to connect by the one side being welded to connect layer and the second rectification chip, the another side of the second rectification chip is welded to connect by the one side being welded to connect layer and the 3rd rectification chip, the another side of described 3rd rectification chip is welded to connect by the one side being welded to connect layer and the 4th rectification chip, and the another side of the 4th rectification chip is welded to connect by the second boss being welded to connect layer and second and going between;
C, described first rectification chip, the second rectification chip, the 3rd rectification chip and the 4th rectification chip are connected in series successively;
D, described protection glue-line are coated in the periphery of the first rectification chip, the second rectification chip, the 3rd rectification chip and the 4th rectification chip;
First boss of e, described first lead-in wire, the second boss of the second lead-in wire, the first rectification chip, the second rectification chip, the 3rd rectification chip and the 4th rectification chip and protection glue-line are all encapsulated in plastic-sealed body.
In technique scheme, it is first protruding that described first lead-in wire also has with its one each other, and it is second protruding that the second lead-in wire also has with its one each other.
In technique scheme, described protection glue-line is polyimides glue.
In technique scheme, described in be welded to connect layer be weld tabs or for soldering paste.
Technique effect of the present utility model is: because kenotron of the present utility model includes four rectification chips be connected in series, and four rectification chips are located between the first boss of the first lead-in wire and the second boss of the second lead-in wire, its operating voltage is the operating voltage sum of four rectification chips, to realize rectification in high-tension line, so just only need a kenotron of the present utility model to be used in circuit, and need not again with multiple rear use of rectifier diode series connection formed containing single diode chip for backlight unit, the reverse cut-ff voltage of kenotron of the present utility model can reach 5000V ~ 6000V, simultaneously, also have take up room little, and use advantages such as also facilitating, in addition, also reduce use cost, achieve the purpose of this utility model.
Accompanying drawing explanation
fig. 1 is the structural representation of a kind of embodiment of the utility model.
Embodiment
Below in conjunction with the description of embodiment, the utility model is further described, but is not limited to this.
As shown in Figure 1, a kind of kenotron, comprise the first lead-in wire 1 and the second lead-in wire 2, described first lead-in wire 1 has the first boss 1-1, and the second lead-in wire 2 has the second boss 2-1;
A, also comprise the first boss 1-1 of being located at the first lead-in wire 1 and second lead-in wire 2 the second boss 2-1 between the first rectification chip 3, second rectification chip 4, the 3rd rectification chip 5 and the 4th rectification chip 6, and protection glue-line 7 and plastic-sealed body 8;
The one side of b, described first rectification chip 3 by be welded to connect layer and first go between 1 the first boss 1-1 be welded to connect, the another side of the first rectification chip 3 is welded to connect by the one side being welded to connect layer and the second rectification chip 4, the another side of the second rectification chip 4 is welded to connect by the one side being welded to connect layer and the 3rd rectification chip 5, the another side of described 3rd rectification chip 5 is welded to connect by the one side being welded to connect layer and the 4th rectification chip 6, the another side of the 4th rectification chip 6 by be welded to connect layer and second go between 2 the second boss 2-1 be welded to connect;
C, described first rectification chip 3, second rectification chip 4, the 3rd rectification chip 5 and the 4th rectification chip 6 are connected in series successively;
D, described protection glue-line 7 are coated in the periphery of the first rectification chip 3, second rectification chip 4, the 3rd rectification chip 5 and the 4th rectification chip 6;
First boss 1-1 of e, described first lead-in wire 1, the second boss 2-1 of the second lead-in wire 2, the first rectification chip 3, second rectification chip 4, the 3rd rectification chip 5 and the 4th rectification chip 6 and protection glue-line 7 are all encapsulated in plastic-sealed body 8.
As shown in Figure 1, in order to improve further lead-in wire and plastic-sealed body between adhesion, described first lead-in wire 1 also have with its each other one the first protruding 1-2, second lead-in wire 2 also have with its each other one the second protruding 2-2.
Protection glue-line 7 described in the utility model is polyimides glue.
The layer that is welded to connect described in the utility model is weld tabs or for soldering paste.
When the utility model uses, the first lead-in wire 1 and the second lead-in wire 2 are welded on electronic circuit board, and its operating voltage is the operating voltage sum of four rectification chips.
The utility model lab scale effect shows, and adopt kenotron of the present utility model, not only take up room little, integrated form, and is suitable for high-voltage rectifying.

Claims (4)

1. a kenotron, comprises the first lead-in wire (1) and the second lead-in wire (2), and described first lead-in wire (1) has the first boss (1-1), and the second lead-in wire (2) has the second boss (2-1); It is characterized in that:
A, also comprise the first boss (1-1) of being located at the first lead-in wire (1) and the second lead-in wire (2) the second boss (2-1) between the first rectification chip (3), the second rectification chip (4), the 3rd rectification chip (5) and the 4th rectification chip (6), and protect glue-line (7) and plastic-sealed body (8);
B, the one side of described first rectification chip (3) is welded to connect by being welded to connect go between first boss (1-1) of (1) of layer and first, the another side of the first rectification chip (3) is welded to connect by the one side being welded to connect layer and the second rectification chip (4), the another side of the second rectification chip (4) is welded to connect by the one side being welded to connect layer and the 3rd rectification chip (5), the another side of described 3rd rectification chip (5) is welded to connect by the one side being welded to connect layer and the 4th rectification chip (6), the another side of the 4th rectification chip (6) is welded to connect by being welded to connect go between second boss (2-1) of (2) of layer and second,
C, described first rectification chip (3), the second rectification chip (4), the 3rd rectification chip (5) and the 4th rectification chip (6) are connected in series successively;
D, described protection glue-line (7) are coated in the periphery of the first rectification chip (3), the second rectification chip (4), the 3rd rectification chip (5) and the 4th rectification chip (6);
First boss (1-1) of e, described first lead-in wire (1), second boss (2-1) of the second lead-in wire (2), the first rectification chip (3), the second rectification chip (4), the 3rd rectification chip (5) and the 4th rectification chip (6) and protection glue-line (7) are all encapsulated in plastic-sealed body (8).
2. kenotron according to claim 1, is characterized in that: described first lead-in wire (1) also have with its each other one the first projection (1-2), second lead-in wire (2) also have with its each other one the second projection (2-2).
3. kenotron according to claim 1, is characterized in that: described protection glue-line (7) is polyimides glue.
4. kenotron according to claim 1, is characterized in that: described in be welded to connect layer be weld tabs or for soldering paste.
CN201520409459.7U 2015-06-15 2015-06-15 Kenotron Active CN204732407U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520409459.7U CN204732407U (en) 2015-06-15 2015-06-15 Kenotron

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520409459.7U CN204732407U (en) 2015-06-15 2015-06-15 Kenotron

Publications (1)

Publication Number Publication Date
CN204732407U true CN204732407U (en) 2015-10-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520409459.7U Active CN204732407U (en) 2015-06-15 2015-06-15 Kenotron

Country Status (1)

Country Link
CN (1) CN204732407U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109244043A (en) * 2018-08-01 2019-01-18 上海艾续电子科技有限公司 New automobile igniter high-voltage diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109244043A (en) * 2018-08-01 2019-01-18 上海艾续电子科技有限公司 New automobile igniter high-voltage diode

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