CN204538040U - A kind of solar panels of SMT encapsulation structure - Google Patents
A kind of solar panels of SMT encapsulation structure Download PDFInfo
- Publication number
- CN204538040U CN204538040U CN201520290077.7U CN201520290077U CN204538040U CN 204538040 U CN204538040 U CN 204538040U CN 201520290077 U CN201520290077 U CN 201520290077U CN 204538040 U CN204538040 U CN 204538040U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- solar wafer
- solar
- attachment position
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 9
- 238000003475 lamination Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 229920002635 polyurethane Polymers 0.000 claims abstract description 4
- 239000004814 polyurethane Substances 0.000 claims abstract description 4
- 239000011253 protective coating Substances 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000007812 deficiency Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The utility model discloses a kind of solar panels of SMT encapsulation structure, it is characterized in that, comprise one group of solar wafer, pcb board, described pcb board one side is provided with the attachment position connecting solar wafer, attachment position is provided with the pad connecting solar wafer positive and negative electrode, and the another side of pcb board is provided with the positive and negative electrode o pads connecting load.Described solar wafer is packaged into the attachment position on pcb board by SMT paster, solar wafer upper surface lamination one deck eva film and PET matte film or direct plating one deck mono-component polyurethane protective coating.Solar wafer is connected with pcb board by the encapsulation of SMT paster, can provide product quality and the production efficiency of solar panels.
Description
Technical field
The utility model relates to solar panel technology field, particularly relates to the solar panels of a kind of solar wafer and pcb board paster encapsulating structure.
Background technology
Solar energy is a kind of green non-pollution and the inexhaustible energy, other energy relatively, solar energy for area most on the earth have existence generality, can take on the spot, and at last decade, solar energy industry becomes the emphasis of world community development.Mainly convert thereof into electric energy by solar panel at present, and then used as other purposes, as street lamp, refrigerator, electric automobile etc.The both positive and negative polarity of conventional solar wafer is distributed in the two sides of battery wafer, the mode of manual welding must be adopted for such solar wafer, the positive and negative electrode of solar wafer is drawn by wire bonds respectively on the two sides of battery wafer, then by solar wafer manual adhesive on pcb board and by wire bonds on pcb board, low and the product of such manufacture production efficiency of low quality, thus the demand of people cannot be met.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the utility model provides a kind of solar panels of SMT paster encapsulating structure.
The technical scheme that the utility model adopts is: a kind of solar panels of SMT encapsulation structure, it is characterized in that, comprise one group of solar wafer, pcb board, described pcb board one side is provided with the attachment position connecting solar wafer, attachment position is provided with the pad connecting solar wafer positive and negative electrode, and the another side of pcb board is provided with the positive and negative electrode o pads connecting load.
Described solar wafer is packaged into the attachment position on pcb board by SMT paster, solar wafer upper surface lamination one deck eva film and PET matte film, or solar wafer upper surface direct plating one deck mono-component polyurethane protective coating.
The deficiency of the solar wafer manual welding of traditional solar panels is overcome by the utility model, by SMT chip surface encapsulation technology, one group or some groups of solar wafer pasters are packaged on pcb board, not only increase product quality, and also improve production efficiency, reduce production cost.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is further described.
With reference to accompanying drawing 1, a kind of solar panels of SMT encapsulation structure, it is characterized in that, comprise one group of solar wafer 1, pcb board 2, described pcb board 2 one side is provided with the attachment position connecting solar wafer 1, attachment position is provided with the pad connecting solar wafer 1 positive and negative electrode, and the another side of pcb board 2 is provided with the positive and negative electrode o pads connecting load.
Described solar wafer 1 is packaged into the attachment position on pcb board 2 by SMT paster, solar wafer 1 upper surface lamination one deck eva film and PET matte film, or solar wafer (1) upper surface direct plating one deck mono-component polyurethane protective coating.
Above-described embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to execution mode of the present utility model.And for belong to connotation of the present utility model the apparent change of extending out or variation still belong to protection range of the present utility model.
Claims (2)
1. the solar panels of a SMT encapsulation structure, it is characterized in that: comprise one group of solar wafer (1), pcb board (2), described pcb board (2) one side is provided with the attachment position connecting solar wafer (1), attachment position is provided with the pad connecting solar wafer (1) positive and negative electrode, and the another side of pcb board (2) is provided with the positive and negative electrode o pads connecting load.
2. the solar panels of a kind of SMT encapsulation structure according to claim 1; it is characterized in that: described solar wafer (1) is packaged into the attachment position on pcb board (2) by SMT paster; solar wafer (1) upper surface lamination one deck eva film and PET matte film, or solar wafer (1) upper surface direct plating one deck mono-component polyurethane protective coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520290077.7U CN204538040U (en) | 2015-05-07 | 2015-05-07 | A kind of solar panels of SMT encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520290077.7U CN204538040U (en) | 2015-05-07 | 2015-05-07 | A kind of solar panels of SMT encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204538040U true CN204538040U (en) | 2015-08-05 |
Family
ID=53752008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520290077.7U Active CN204538040U (en) | 2015-05-07 | 2015-05-07 | A kind of solar panels of SMT encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204538040U (en) |
-
2015
- 2015-05-07 CN CN201520290077.7U patent/CN204538040U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160411 Address after: 518106 Guangdong province Shenzhen City Guangming Street South Outer Ring Road exchange Po Industrial Park 7 Building fifth layer Patentee after: Guangrui Industry Co., Ltd., Shenzhen City Address before: Buji Town, Longgang District of Shenzhen city candal garden 518100 11-401 in Guangdong Province Patentee before: Hu Jinlong |