CN207719202U - Thin-film LED cascaded structure - Google Patents
Thin-film LED cascaded structure Download PDFInfo
- Publication number
- CN207719202U CN207719202U CN201721831527.4U CN201721831527U CN207719202U CN 207719202 U CN207719202 U CN 207719202U CN 201721831527 U CN201721831527 U CN 201721831527U CN 207719202 U CN207719202 U CN 207719202U
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- China
- Prior art keywords
- thin
- film
- film led
- prefabricated substrate
- cascaded structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010409 thin film Substances 0.000 title claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 241000218202 Coptis Species 0.000 claims abstract description 13
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000004744 fabric Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of thin-film LED cascaded structures, including：Including：Two thin-film LEDs, Prefabricated substrate and gold thread, wherein in two thin-film LEDs, include the thin-film LED of thin-film LED and a n-electrode upward of a p-electrode upward；Two thin-film LED electrodes directed downwardly are respectively welded on Prefabricated substrate, and electrode upward is connected by way of welding gold thread, completes being connected in series with for thin-film LED.In this way, during being connected in series with, without being connected by way of routing between thin-film LED, reliability is improved while greatly reducing cost.
Description
Technical field
The utility model is related to technical field of semiconductors more particularly to a kind of thin-film LED cascaded structures.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of can to convert electrical energy into visible light
Solid state semiconductor devices, principle of luminosity are electroluminescence, i.e., after PN is tied and added forward current, free electron and hole
It is compound and luminous, to which electric energy is directly converted into luminous energy.
Light emitting diode (LED) chip with vertical structure refers to heteropleural of two distribution of electrodes in epitaxial wafer, with patterned electrodes and whole p-types
Limiting layer is as second electrode so that electric current almost all flows vertically through LED epitaxial layers, the electric current of few lateral flow.With this,
Light emitting diode (LED) chip with vertical structure 1 is when connecting, generally use Fig. 1 and method shown in Fig. 2, by the P electrode of two vertical chips with
N electrode is connected by way of beating gold thread 2；And in order to by lower electrode（P-electrode）It draws to facilitate routing, it is also necessary in substrate
Upper design circuit and reserved 3 position of pad.
Utility model content
The purpose of this utility model is to provide a kind of thin-film LED cascaded structure, efficiently solves existing vertical structure
Cost is higher during chip-in series, the not high technical problem of reliability.
The technical scheme that the utility model is provided is as follows：
A kind of thin-film LED cascaded structure, including：Two thin-film LEDs, Prefabricated substrate and gold thread, wherein
In described two thin-film LEDs, including p-electrode thin-film LED upward and a n-electrode are upward
Thin-film LED；
Two thin-film LED electrodes directed downwardly are respectively welded on Prefabricated substrate, and electrode upward is by welding gold thread
Mode connect, complete being connected in series with for thin-film LED.
It is further preferred that include the connection circuit of two thin-film LED electrodes of connection on the Prefabricated substrate, two
A thin-film LED electrode directed downwardly is respectively welded at the both ends of connection circuit, realizes the series connection of two thin-film LEDs.
It is further preferred that the Prefabricated substrate is electrically-conductive backing plate, described two thin-film LED electrodes directed downwardly point
It is not welded on Prefabricated substrate, realizes the series connection of two thin-film LEDs.
It is further preferred that the Prefabricated substrate is the rigid substrates of arbitrary shape.
It is further preferred that the Prefabricated substrate includes two pieces of rigid substrates in predetermined angle, two vertical structures
Chip is respectively welded on one piece of rigid substrates.
It is further preferred that the Prefabricated substrate is flexible base board.
Opposite polarity thin-film LED is used in the present invention, is welded on same Prefabricated substrate, is realized
Being connected in series between thin-film LED, in this way, during being connected in series with, without by another between thin-film LED
The mode of outer routing connects, and reliability is improved while greatly reducing cost；In addition, without in order to by electrode draw and
Circuit and pad are designed on Prefabricated substrate, and the space of Prefabricated substrate has been saved while having saved cost, chip may be implemented and exist
Greater density is integrated on Prefabricated substrate；Finally, the multi-angle of cascaded structure can be realized by the angle of adjusting Prefabricated substrate
It shines.
Description of the drawings
Below by a manner of clearly understandable, preferred embodiment is described with reference to the drawings, characteristic, skill to the cascaded structure
Art feature, advantage and its realization method are further described.
Fig. 1 is that thin-film LED is connected in series with structure positive structure schematic in the prior art；
Fig. 2 is that thin-film LED is connected in series with texture edge structural schematic diagram in the prior art；
Fig. 3 is that thin-film LED is connected in series with positive structure schematic in a kind of example of structure in the utility model；
Fig. 4 is that thin-film LED is connected in series with side structure signal in structure example as shown in Figure 3 in the utility model
Figure；
Fig. 5 is that thin-film LED is connected in series with side structure schematic diagram in another example of structure in the utility model；
Fig. 6 is that thin-film LED is connected in series with side structure schematic diagram in another example of structure in the utility model.
Reference numeral：
1- light emitting diode (LED) chip with vertical structure, 2- gold threads, 3- pads, 4- Prefabricated substrates.
Specific implementation mode
The substantive content of the utility model is further illustrated with example below in conjunction with the accompanying drawings, but the content of the utility model is simultaneously
It is without being limited thereto.
The utility model provides a kind of thin-film LED cascaded structure, includes in the cascaded structure specifically：Two
Thin-film LED, Prefabricated substrate and gold thread, wherein in two thin-film LEDs, including a p-electrode upward vertical
The thin-film LED of fabric chip and a n-electrode upward；Two thin-film LED electrodes directed downwardly are respectively welded at prefabricated
On substrate, electrode upward is connected by way of welding gold thread, completes being connected in series with for thin-film LED.
In one embodiment, on Prefabricated substrate include connection two thin-film LED electrodes connection circuit, two
A thin-film LED electrode directed downwardly is respectively welded at the both ends of connection circuit, realizes the series connection of two thin-film LEDs.
In this embodiment, in order to realize being connected in series with for thin-film LED, connection circuit welding is arranged in prefabricated base in advance
On plate.Certainly, in order to realize multigroup thin-film LED cascaded structure, multiple companies are set on same Prefabricated substrate according to demand
Circuit is connect, is arranged as desired between connection circuit.
In another embodiment, Prefabricated substrate is electrically-conductive backing plate, and two thin-film LED electrodes directed downwardly weld respectively
It is connected on Prefabricated substrate, realizes the series connection of two thin-film LEDs.Here Prefabricated substrate can be the rigidity of arbitrary structures
Substrate, or the flexible base board of arbitrary structures sets according to actual demand, is not specifically limited.In addition, to Prefabricated substrate
Concrete structure do not limit equally, arbitrary adjusting can be carried out to the demand of light emitting angle according in practical application, it is e.g., prefabricated
It is in predetermined angle that substrate, which includes two pieces,（It such as 45 °, 90 °, is adjusted according to light emitting angle）Rigid substrates, two vertical structures
Chip is respectively welded on one piece of rigid substrates.
In one example, as shown in Figure 3 and Figure 4, two opposite polarity thin-film LEDs 1 are welded on prefabricated base successively
On plate 4, the electrode of chip side upward is connected by gold thread 2, realizes being connected in series with for two thin-film LEDs.
In another example, as shown in figure 5, Prefabricated substrate 4 is in 90 ° of settings, two opposite polarity thin-film LEDs 1
It welds successively in two directions, the electrode of chip side upward is connected by gold thread 2, realizes the string of two thin-film LEDs
Connection connection.
In another example, as shown in fig. 6, two opposite polarity thin-film LEDs 1 are welded on the two of Prefabricated substrate 4
The electrode of side, chip side upward is connected by gold thread 2, realizes being connected in series with for two thin-film LEDs.
It should be noted that above-described embodiment can be freely combined as needed.The above is only the utility model
Preferred embodiment, it is noted that for those skilled in the art, do not departing from the utility model principle
Under the premise of, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the scope of protection of the utility model.
Claims (6)
1. a kind of thin-film LED cascaded structure, which is characterized in that the cascaded structure includes：Two vertical structure cores
Piece, Prefabricated substrate and gold thread, wherein
In described two thin-film LEDs, including p-electrode thin-film LED upward and a n-electrode upward vertical
Fabric chip；
Two thin-film LED electrodes directed downwardly are respectively welded on Prefabricated substrate, and electrode upward passes through the side for welding gold thread
Formula connects, and completes being connected in series with for thin-film LED.
2. thin-film LED cascaded structure as described in claim 1, which is characterized in that include connection on the Prefabricated substrate
The connection circuit of two thin-film LED electrodes, two thin-film LED electrodes directed downwardly are respectively welded at connection circuit
The series connection of two thin-film LEDs is realized at both ends.
3. thin-film LED cascaded structure as described in claim 1, which is characterized in that the Prefabricated substrate is conductive base
Plate, described two thin-film LED electrodes directed downwardly are respectively welded on Prefabricated substrate, two thin-film LEDs of realization
Series connection.
4. the thin-film LED cascaded structure as described in claim 1-3 any one, which is characterized in that the Prefabricated substrate
For the rigid substrates of arbitrary shape.
5. thin-film LED cascaded structure as claimed in claim 4, which is characterized in that the Prefabricated substrate includes two pieces
In the rigid substrates of predetermined angle, two thin-film LEDs are respectively welded on one piece of rigid substrates.
6. the thin-film LED cascaded structure as described in claim 1-3 any one, which is characterized in that the Prefabricated substrate
For flexible base board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721831527.4U CN207719202U (en) | 2017-12-25 | 2017-12-25 | Thin-film LED cascaded structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721831527.4U CN207719202U (en) | 2017-12-25 | 2017-12-25 | Thin-film LED cascaded structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719202U true CN207719202U (en) | 2018-08-10 |
Family
ID=63049671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721831527.4U Active CN207719202U (en) | 2017-12-25 | 2017-12-25 | Thin-film LED cascaded structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719202U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122899A (en) * | 2017-12-25 | 2018-06-05 | 南昌易美光电科技有限公司 | Thin-film LED cascaded structure and series connection method |
-
2017
- 2017-12-25 CN CN201721831527.4U patent/CN207719202U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122899A (en) * | 2017-12-25 | 2018-06-05 | 南昌易美光电科技有限公司 | Thin-film LED cascaded structure and series connection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Vertical structure chip series structure Effective date of registration: 20220421 Granted publication date: 20180810 Pledgee: China Merchants Bank Limited by Share Ltd. Nanchang branch Pledgor: NANCHANG YIMEI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2022980004612 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230505 Granted publication date: 20180810 Pledgee: China Merchants Bank Limited by Share Ltd. Nanchang branch Pledgor: NANCHANG YIMEI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2022980004612 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Vertical structure chip series structure Effective date of registration: 20230518 Granted publication date: 20180810 Pledgee: China Merchants Bank Limited by Share Ltd. Nanchang branch Pledgor: NANCHANG YIMEI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2023980041102 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180810 Pledgee: China Merchants Bank Limited by Share Ltd. Nanchang branch Pledgor: NANCHANG YIMEI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2023980041102 |