CN107806574A - A kind of LED illumination light source - Google Patents
A kind of LED illumination light source Download PDFInfo
- Publication number
- CN107806574A CN107806574A CN201711143880.8A CN201711143880A CN107806574A CN 107806574 A CN107806574 A CN 107806574A CN 201711143880 A CN201711143880 A CN 201711143880A CN 107806574 A CN107806574 A CN 107806574A
- Authority
- CN
- China
- Prior art keywords
- electrode
- ceramic matrix
- metal film
- wire
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005286 illumination Methods 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 38
- 239000011159 matrix material Substances 0.000 claims abstract description 36
- 238000003780 insertion Methods 0.000 claims abstract description 5
- 230000037431 insertion Effects 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229940050561 matrix product Drugs 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED illumination light source.It includes metal base,Circuit board and ceramic matrix,Metal base is provided with chamber groove,Circuit board is embedded at the bottom of chamber groove,The upper surface of ceramic matrix is fixed with multiple LED chips and metal film electrode for alternateing interval connection,The upper surface of ceramic matrix is provided with multiple outstanding protuberances,Groove is formed between two neighboring protuberance,LED chip is arranged in groove,Metal film electrode is arranged on protuberance,Ceramic matrix is provided with the passage of two insertions,Electrode cable is formed in passage,The upper end of two strip electrode wires electrically connects with outermost metal film electrode respectively,The lower end of one strip electrode wire is located at the center of lower surface,Circuit board is provided with electrode contacts and the electrode around electrode contacts touches ring,The bottom of ceramic matrix is threadedly coupled with chamber groove,And two the lower end of strip electrode wire touch ring with electrode contacts and electrode respectively and electrically connect.The present invention can improve heat dispersion and convenient maintenance.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of LED illumination light source.
Background technology
With the continuous improvement of LED (Light Emitting Diode, light emitting diode) light efficiency, led in general illumination
Domain, start to show the trend that traditional luminescent device is substituted using LED.But LED light source would generally produce very at work
Big heat, these heats need to distribute in time, otherwise will influence whether the normal work of LED light source and using the longevity
Life.
Existing LED light source includes circuit board and the LED chip being arranged on circuit board.Led however, circuit board mainly rises
Electro ultrafiltration, it is limited that it does not have a heat-sinking capability substantially, when heat aggregation is excessive caused by LED chip, easily causes LED chip
Damage, moreover, further, once LED chip is damaged, can not repair substantially, can only the new LED light source of integral replacing.
The content of the invention
The present invention solves the technical problem of provide a kind of LED illumination light source, it is possible to increase heat dispersion and conveniently
Maintenance.
In order to solve the above technical problems, one aspect of the present invention is：A kind of LED illumination light source is provided, wrapped
Metal base, circuit board and ceramic matrix are included, the metal base is provided with chamber groove, and the circuit board is embedded at the bottom of the chamber groove
Portion, the upper surface of the ceramic matrix are fixed with multiple LED chips and multiple metal film electrodes, the LED chip and metal
Membrane electrode alternates interval setting, the P electrode and N electrode of each LED chip metallic film with its both sides respectively
Electrode electrically connects, and the upper surface of the ceramic matrix is provided with multiple outstanding protuberances, shape between two neighboring protuberance
Into groove, the LED chip is arranged in the groove, and the metal film electrode is arranged on the protuberance, the pottery
Porcelain basal body is provided with the first passage and second channel of insertion, and silver paste is perfused with the first passage and second channel and forms first
Electrode cable and second electrode wire, the upper end of the first electrode wire and second electrode wire respectively with the leftmost side and most right
The metal film electrode electrical connection of side, the lower end of the first electrode wire is located at the center of the ceramic matrix lower surface, institute
State circuit board provided with electrode contacts and around the electrode contacts electrode touch ring, the bottom of the ceramic matrix with it is described
Chamber groove is threadedly coupled, and the lower end of the first electrode wire electrically connects with the electrode contacts, the second electrode wire
Ring is touched with the electrode and is electrically connected in lower end.
Preferably, the both sides of the metal film electrode are welded with metallic conduction post, P electrode or the N electricity of the LED chip
Electrically connected between pole and the metallic conduction post by wire.
Preferably, it is attached with epoxy resin layer between the ceramic matrix and the metal film electrode.
Preferably, the surface of the protuberance is completely covered in the metal film electrode.
The beneficial effects of the invention are as follows：The situation of prior art is different from, the present invention is by the upper surface of ceramic matrix
Provided with multiple outstanding protuberances, groove is formed between two neighboring protuberance so that the surface radiating face of ceramic matrix
Product increase, can accelerate to radiate, and on metal base set chamber groove, set on ceramic matrix insertion first passage and
Perfusion silver paste forms first electrode wire and second electrode wire in second channel, first passage and second channel, on circuit board
Ring is touched provided with electrode contacts and around the electrode of electrode contacts, the bottom of ceramic matrix is threadedly coupled with chamber groove, and the first electricity
The lower end of polar conductor electrically connects with electrode contacts, and lower end and the electrode of second electrode wire touch ring and electrically connected, so, even if LED
Wafer damage, it is only necessary to which LED chip is changed in maintenance, without changing circuit board, in this way, so as to carry
High heat dispersion and convenient maintenance.
Brief description of the drawings
Fig. 1 is the structural representation of LED illumination light source provided in an embodiment of the present invention.
Fig. 2 is the decomposition texture schematic diagram of LED illumination light source provided in an embodiment of the present invention.
Fig. 3 is the schematic top plan view of the circuit board of the LED illumination light source shown in Fig. 2.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Refering to Fig. 1 to Fig. 3, the LED illumination light source of the embodiment of the present invention includes metal base 10, circuit board 20 and ceramic base
Body 30.Metal base 10 is provided with chamber groove 11, and circuit board 20 is embedded at the bottom of chamber groove 11.
The upper surface of ceramic matrix 30 is fixed with multiple LED chips 40 and multiple metal film electrodes 50, LED chip 40 with
Metal film electrode 50 alternates interval setting, the P electrode and N electrode of each LED chip 40 metal with its both sides respectively
Membrane electrode 50 electrically connects.Wherein, multiple LED chips 40 and multiple metal film electrodes 50 can be arranged with uniform intervals in in-line
Row, thus achieve the series connection of each LED chip 40 and metal film electrode 50.
The upper surface of ceramic matrix 30 is provided with multiple outstanding protuberances 31, is formed between two neighboring protuberance 31
Groove 32, LED chip 40 are arranged in groove 32, and metal film electrode 50 is arranged on protuberance 31.Preferably, metallic film
The surface of protuberance 31 is completely covered in electrode 50.So, the cross sectional shape of ceramic matrix 30 just forms the shape of class square waveform, because
The class square wave-shaped configuration that this ceramic matrix 30 has increases the surface area of ceramic matrix 30 on limited light source occupied area,
Be advantageous to ceramic matrix 30 heat Quick diffusing caused by LED chip 40 is gone out.Also, further, metal film electrode
50 are positioned relatively close to apart from LED chip 40, and LED chip 40 is generally electrically connected to metal film electrode 50 by wire,
Therefore, the LED illumination light source of the present embodiment can use shorter wire to complete LED chip 40 and the electricity of metal film electrode 50
Connection, because the length of wire is short, had both reduced the complexity of welding, and had also increased the reliability of welding.
Ceramic matrix 30 is provided with the first passage 301 and second channel 302 of insertion, first passage 301 and second channel 302
Inside it is perfused with silver paste formation first electrode wire 311 and second electrode wire 312, first electrode wire 311 and second electrode is led
Metal film electrode 50 of the upper end of line 312 respectively with the leftmost side and the rightmost side electrically connects, the lower end position of first electrode wire 311
In the center of the lower surface of ceramic matrix 30, circuit board 20 is provided with electrode contacts 21 and the electrode around electrode contacts 21 touches ring
22, the bottom of ceramic matrix 30 is threadedly coupled with chamber groove 11, and the lower end of first electrode wire 311 is electrically connected with electrode contacts 21
Connect, lower end and the electrode of second electrode wire 312 touch ring 22 and electrically connected.Wherein, the bottom of ceramic matrix 30 and the screw thread of chamber groove 11
After connection, lower surface and the circuit board 20 of ceramic matrix 30 will be in close contact so that first electrode wire 311 and second electrode are led
The lower end of line 312 can touch ring 22 with electrode contacts 21 and electrode and keep being reliably connected.
Because ceramic matrix 30 is threadedly coupled with chamber groove 11, therefore, ceramic matrix 30 can take out out of chamber groove 11, this
Sample, even if LED chip is damaged, without circuit board is changed, repaired so as to convenient.
In the present embodiment, the both sides of metal film electrode 50 are welded with metallic conduction post 51, the P electrode of LED chip 40
Or electrically connected between N electrode and metallic conduction post 51 by wire.The wire electrically connected with metal film electrode 50 only needs to weld
It is connected in metallic conduction post 51, the electrical connection with metal film electrode 50 is realized by metallic conduction post 51.Metallic conduction post 51
The thickness of wire welding position can be increased, reduce the difficulty of wire welding, increase soldering reliability.
In the present embodiment, epoxy resin layer 60 is attached between ceramic matrix 30 and metal film electrode 50.Due to pottery
Adhesive force between ceramic material and metal material is poor, and the adhesive force between epoxide resin material and ceramic material is fine, because
This, metal film electrode 50 can be firmly bonded on ceramic matrix 30 by epoxy resin layer 60.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (4)
1. a kind of LED illumination light source, it is characterised in that including metal base, circuit board and ceramic matrix, the metal base is set
Have a chamber groove, the circuit board is embedded at the bottom of the chamber groove, the upper surface of the ceramic matrix be fixed with multiple LED chips and
Multiple metal film electrodes, the LED chip alternate interval setting, the P of each LED chip with metal film electrode
Electrode and N electrode electrically connect with the metal film electrode of its both sides respectively, and the upper surface of the ceramic matrix is provided with multiple outside
Prominent protuberance, groove is formed between two neighboring protuberance, the LED chip is arranged in the groove, the metal
Membrane electrode is arranged on the protuberance, first passage and second channel of the ceramic matrix provided with insertion, and described first
Silver paste is perfused with passage and second channel and forms first electrode wire and second electrode wire, the first electrode wire and the
Metal film electrode of the upper end of two electrode cables respectively with the leftmost side and the rightmost side electrically connects, under the first electrode wire
Positioned at the center of the ceramic matrix lower surface, the circuit board is provided with electrode contacts and around the electrode contacts at end
Electrode touches ring, and the bottom of the ceramic matrix is threadedly coupled with the chamber groove, and the lower end of the first electrode wire with it is described
Electrode contacts electrically connect, and lower end and the electrode of the second electrode wire touch ring and electrically connected.
2. LED illumination light source according to claim 1, it is characterised in that the both sides of the metal film electrode are welded with
Metallic conduction post, electrically connected between the P electrode or N electrode and the metallic conduction post of the LED chip by wire.
3. LED illumination light source according to claim 1, it is characterised in that the ceramic matrix and metallic film electricity
Epoxy resin layer is attached between pole.
4. LED illumination light source according to claim 1, it is characterised in that the metal film electrode is completely covered described
The surface of protuberance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711143880.8A CN107806574A (en) | 2017-11-17 | 2017-11-17 | A kind of LED illumination light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711143880.8A CN107806574A (en) | 2017-11-17 | 2017-11-17 | A kind of LED illumination light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107806574A true CN107806574A (en) | 2018-03-16 |
Family
ID=61590482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711143880.8A Withdrawn CN107806574A (en) | 2017-11-17 | 2017-11-17 | A kind of LED illumination light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107806574A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524374A (en) * | 2018-12-13 | 2019-03-26 | 麦科勒（滁州）新材料科技有限公司 | A kind of LED light module |
| WO2020052078A1 (en) * | 2018-09-12 | 2020-03-19 | 上海三思电子工程有限公司 | Led illumination device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200965890Y (en) * | 2006-11-02 | 2007-10-24 | 聚鼎科技股份有限公司 | LED element and its device |
| CN201868429U (en) * | 2010-11-29 | 2011-06-15 | 苏州君耀光电有限公司 | Embedded-type encapsulating structure of luminous diode |
| CN105321937A (en) * | 2014-06-25 | 2016-02-10 | 常州欧密格光电科技有限公司 | Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element |
| CN207740742U (en) * | 2017-11-17 | 2018-08-17 | 夏烬楚 | A kind of LED illumination light source |
-
2017
- 2017-11-17 CN CN201711143880.8A patent/CN107806574A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200965890Y (en) * | 2006-11-02 | 2007-10-24 | 聚鼎科技股份有限公司 | LED element and its device |
| CN201868429U (en) * | 2010-11-29 | 2011-06-15 | 苏州君耀光电有限公司 | Embedded-type encapsulating structure of luminous diode |
| CN105321937A (en) * | 2014-06-25 | 2016-02-10 | 常州欧密格光电科技有限公司 | Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element |
| CN207740742U (en) * | 2017-11-17 | 2018-08-17 | 夏烬楚 | A kind of LED illumination light source |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020052078A1 (en) * | 2018-09-12 | 2020-03-19 | 上海三思电子工程有限公司 | Led illumination device |
| CN109524374A (en) * | 2018-12-13 | 2019-03-26 | 麦科勒（滁州）新材料科技有限公司 | A kind of LED light module |
| CN109524374B (en) * | 2018-12-13 | 2024-03-12 | 麦科勒（滁州）新材料科技有限公司 | LED light-emitting module |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180316 |
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| WW01 | Invention patent application withdrawn after publication |