CN2461152Y - Packing image sensing chip with transparent piece - Google Patents
Packing image sensing chip with transparent piece Download PDFInfo
- Publication number
- CN2461152Y CN2461152Y CN 00265156 CN00265156U CN2461152Y CN 2461152 Y CN2461152 Y CN 2461152Y CN 00265156 CN00265156 CN 00265156 CN 00265156 U CN00265156 U CN 00265156U CN 2461152 Y CN2461152 Y CN 2461152Y
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- CN
- China
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- substrate
- wafer
- light transmission
- image sensing
- transmission piece
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- Expired - Fee Related
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Abstract
The utility model relates to an encapsulating image sensing wafer with a transparent piece. The utility model is proposed to provide an encapsulating semiconductor element which can be produced in a batch method, has low cost, can shorten the signal transferring distance of wafers and enhance the signal transferring quality. The encapsulating semiconductor element comprises a basal plate, a wafer, a flange frame and a transparent piece, wherein, the basal plate is composed of a plurality of metal pieces and a colloid and forms a first connection point and a second connection point, and the wafer forms electric connection with the first connection point of the basal plate by a conducting wire.
Description
The utility model belongs to packaging semiconductor, particularly a kind of encapsulation image sensing wafer of tool light transmission piece.
General image sensing wafer is in order to reach the demand of heat radiation and high leakproofness, system is with the substrate of ceramic material as bearing wafer, this substrate periphery extends on the substrate, be formed with horizontal Jiong () the shape pin of mutual conduction on the upper surface, wafer is placed on the substrate, again with the pin on lead electrical connection wafer and the substrate surface, glass with printing opacity is placed on the wafer then, to finish the encapsulation of encapsulation image sensing wafer, so, the encapsulation image sensing wafer that encapsulation can be finished is electrically connected with circuit board formation with the pin of base lower surface.
This kind during its machine-shaping, must be noted that the selection of ceramic material composition and the control of processing temperature with the substrate of ceramic material as the encapsulation image sensing wafer, if its selection or control improperly will cause base plate deformation or be full of cracks.Moreover,, can't produce in a large number, so that its production cost is quite high so that when encapsulation must single encapsulation because ceramic substrate structure can't cut.
Moreover because the pin of base lower surface system is in order to be electrically connected with circuit board, therefore, pin must have more smooth contact-making surface, just unlikelyly influences being electrically connected of substrate and circuit board.Yet horizontal Jiong () shape that known pin system forms with impact style is with as first and second surperficial pin of substrate, so it influences the transmission of image sensing wafer signal because of being difficult to obtain comparatively smooth pin.
In addition, it is longer that the formed electric signal of this horizontal Jiong () shape pin transmits distance, also influences the signal transmission of wafer to substrate.
The purpose of this utility model provides and a kind ofly produces in batches, cost is low, shorten the wafer signal transmits distance, improves the encapsulation image sensing wafer of tool light transmission piece that signal transmits the tool light transmission piece of quality.
The utility model comprises substrate, is provided with the wafer of plural weld pad, flange frame and light transmission piece; The base material that the sheet metal that substrate system is arranged by most spaces and the colloid of cemented each sheet metal constitute with first surface and second surface, each sheet metal is exposed to colloid, form be positioned at first and second surface of substrate as the signal input, go out first and second contact of end; The flange frame is fixedly arranged on the substrate first surface, and to form groove, wafer is glutinous is located at the substrate first surface, and makes wafer and each sheet metal be positioned at groove, and weld pad system forms with substrate first contact with lead and is electrically connected on the wafer; Light transmission piece is set up and is fixed on the flange frame, to cover sealing wafer, lead and first contact.
Because the utility model wafer comprises substrate, glutinous be located at wafer on the substrate, be fixedly arranged on the flange frame on the substrate and be covered in light transmission piece on the flange frame; Sheet metal that substrate system is arranged by most spaces and colloid constitute and have first and second surface that forms first and second contact, and wafer is electrically connected with the formation of substrate first contact with lead.During use, the utility model is placed on the circuit board, and be electrically connected with circuit board formation with second contact of substrate.During operation, can make light be passed to wafer by light transmission piece, the light signal that wafer receives is passed to first contact as signal input end of substrate through lead, and through second contact output as signal output end of sheet metal and substrate.Make the signal transmission media of wafer by the foil of substrate, can obtain short transmission distance, has preferable signal transmission effect, second contact of substrate, can form preferable electro-contact effect with circuit board, its substrate can be cut into single tool light transmission piece encapsulation image sensing wafer, therefore, its package speed is fast, can reduce production costs, not only can produce in batches, cost is low, and shorten the wafer signal and transmit distance, improve signal and transmit quality, thereby reach the purpose of this utility model.
Fig. 1, be the utility model structural representation cutaway view.
Fig. 2, be the utility model encapsulation schematic sectional view (row are established sheet metal).
Fig. 3, be the utility model board structure schematic isometric.
Fig. 4, be the utility model encapsulation schematic sectional view (setting firmly the flange frame).
Below in conjunction with accompanying drawing the utility model is further elaborated.
As shown in Figure 1, the utility model comprises substrate 10, wafer 12, flange frame 30 and light transmission piece 14.
Wafer 12 is provided with plural weld pad 34.
During use, the encapsulation image sensing wafer of the utility model tool light transmission piece is placed on the circuit board, and form with circuit board with second contact 28 that is positioned at substrate 10 second surfaces 22 and to be electrically connected.During operation, can make light be passed to wafer 12 by light transmission piece 14, the light signal that wafer 12 receives is passed to first contact 26 as signal input end that is positioned at substrate 10 first surfaces 20 through its weld pad 34 and lead 15, and through sheet metal 16 and be positioned at second contact 28 outputs of substrate 10 second surfaces 22 as signal output end.
As mentioned above, the utlity model has following advantage:
1, transmits media by the foil 16 of substrate 10 as the signal of wafer 12, when with wafer 12 Signal when being passed to circuit board, can obtain short transmission distance, thereby have better signal transmission effect Really.
2, expose second contact 28 that is positioned at substrate 10 second surfaces 22 that colloid 18 sheet metals 16 form, Can form better electro-contact effect with circuit board.
3, substrate 10 is the colloid 18 that sets firmly the plastic cement material of most sheet metals 16, can be cut into single tool light transmission piece encapsulation image sensing wafer, and therefore, its package speed is fast, can reduce production costs.
4, the substrate 10 that constitutes for the colloid 18 of the plastic cement material that sets firmly most sheet metals 16, its cost of material is low than ceramic material, and packaging cost is greatly reduced.
Claims (5)
1, a kind of encapsulation image sensing wafer of tool light transmission piece, it comprises substrate and is fixedly arranged on the wafer that substrate is provided with plural weld pad; It is characterized in that setting firmly on the described substrate flange frame with the groove that forms ccontaining wafer and set up and be fixed on the flange frame to cover the light transmission piece of sealing wafer; The base material that the sheet metal that substrate system is arranged by most spaces and the colloid of cemented each sheet metal constitute with first surface and second surface, each sheet metal is exposed to colloid, form be positioned at first and second surface of substrate as the signal input, go out first and second contact of end; Weld pad forms with first contact that is positioned at the substrate first surface with lead and is electrically connected on the wafer.
2, the encapsulation image sensing wafer of tool light transmission piece according to claim 1, the colloid that it is characterized in that described formation substrate is for to be made by plastic cement materials such as epoxidation plastic cement mixture (Epoxy Mold Compound), BT, FR4, FR5 or PPE.
3, the encapsulation image sensing wafer of tool light transmission piece according to claim 1, the sheet metal that it is characterized in that described formation substrate is smooth sheet metal.
4, the encapsulation image sensing wafer of tool light transmission piece according to claim 1 is characterized in that described wafer is electrically connected with first contact formation of substrate as signal input end with the lead that routing (wire bond) mode forms with weld pad system on it.
5, the encapsulation image sensing wafer of tool light transmission piece according to claim 1 is characterized in that described light transmission piece is a light transmission glass plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00265156 CN2461152Y (en) | 2000-12-11 | 2000-12-11 | Packing image sensing chip with transparent piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00265156 CN2461152Y (en) | 2000-12-11 | 2000-12-11 | Packing image sensing chip with transparent piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2461152Y true CN2461152Y (en) | 2001-11-21 |
Family
ID=33619594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00265156 Expired - Fee Related CN2461152Y (en) | 2000-12-11 | 2000-12-11 | Packing image sensing chip with transparent piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2461152Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100582836C (en) * | 2004-11-06 | 2010-01-20 | 鸿富锦精密工业（深圳）有限公司 | Digital camera lens module |
| CN101924081A (en) * | 2009-06-15 | 2010-12-22 | 鸿富锦精密工业（深圳）有限公司 | Image sensor package and image sensor module |
| CN102889477A (en) * | 2011-07-20 | 2013-01-23 | 黄裕仁 | LED (Light Emitting Diode) lamp bulb |
-
2000
- 2000-12-11 CN CN 00265156 patent/CN2461152Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100582836C (en) * | 2004-11-06 | 2010-01-20 | 鸿富锦精密工业（深圳）有限公司 | Digital camera lens module |
| CN101924081A (en) * | 2009-06-15 | 2010-12-22 | 鸿富锦精密工业（深圳）有限公司 | Image sensor package and image sensor module |
| CN102889477A (en) * | 2011-07-20 | 2013-01-23 | 黄裕仁 | LED (Light Emitting Diode) lamp bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |