CN205264693U

CN205264693U - High density IDF type SOT23 -6 frame construction that goes between

Info

Publication number: CN205264693U
Application number: CN201521008909.8U
Authority: CN
Inventors: 刘兴波; 宋波; 石艳
Original assignee: Guangdong Style Science And Technology Ltd
Current assignee: Guangdong Style Science And Technology Ltd
Priority date: 2015-12-08
Filing date: 2015-12-08
Publication date: 2016-05-25
Anticipated expiration: 2025-12-08

Abstract

The utility model aims at providing a promote the packaging efficiency and practice thrift manufacturing cost's high density IDF type SOT23 -6 frame construction that goes between when improving material utilization rate. Including block base board, lead frame unit and the runner of moulding plastics, be equipped with the lead frame unit on the base plate, be equipped with the runner of moulding plastics between the lead frame unit. The utility model discloses plastic envelope material utilization ratio is higher, the lead frame unit that unit area arranged is more, and production efficiency improves greatly to greatly reduced manufacturing cost, be applicable to and use in the chip package field.

Description

A kind of high density IDF type SOT23-6 lead frame structure

Technical field

The utility model relates to integrated antenna package technical field, and particularly a kind of integrated antenna package lead frame structure is specifically related to a kind of high density IDF type SOT23-6 package lead mount structure.

Background technology

When integrated antenna package, must use lead frame structure, existing 8 row SOT23-6 package lead mount structures, because the technology before being subject to is limit, on a slice SOT23-6 package lead mount structure, can encapsulate at most 288 products, 1 product of the each each injection moulding in injection molding channel both sides, seal 8 at most by every mould and calculate, the IC quantity that every like this mould can encapsulate is at most 2304, and its production efficiency still has room for promotion. Because chip package has been tending towards meagre profit, therefore how to improve packaging efficiency, the cost-saving problem that enterprise must pay attention to that encapsulates that become. Existing 8 row SOT23-6 package lead mount structures can not satisfy the demands, and are badly in need of improving.

Summary of the invention

The purpose of this utility model is to overcome prior art chips encapsulating structure to exist the low and technical problem of waste material of efficiency, provides a kind of improving the high density IDF type SOT23-6 multi-row lead frame frame that promotes packaging efficiency and save production cost in stock utilization.

For achieving the above object, the utility model adopts following technical scheme：

A kind of high density IDF type SOT23-6 lead frame structure, comprises substrate, lead frame unit, and described substrate is provided with lead frame unit, and described lead frame is provided with injection molding channel between unit.

Further, described lead frame unit is matrix form by 27 rows 60 row and is distributed on described substrate.

Further, in the Y direction of described substrate, intersected with each other the staggering of pin of two neighbouring lead frame unit, form IDF structure.

Further, the X-direction on described substrate, arranges an injection molding channel every 4 row lead frame unit at its symmetrical centre place, and 15 injection molding channels are set altogether, 2 products of the each each injection moulding in injection molding channel both sides.

The beneficial effects of the utility model are: adopt IDF structure, lead frame utilization rate is higher; Still less, plastic packaging material utilization rate is higher for injection molding channel; The lead frame unit that unit are is arranged is more, and production efficiency improves greatly, thereby greatly reduces production cost, thereby technique effect is obvious. Below in conjunction with accompanying drawing, the utility model will be further described.

Brief description of the drawings

Fig. 1 is the overall structure schematic diagram of high density IDF type SOT23-6 lead frame described in the utility model.

Fig. 2 is the partial enlarged drawing of high density IDF type SOT23-6 lead frame described in Fig. 1.

Fig. 3 is the detailed schematic of lead frame unit group in partial enlarged drawing A part described in Fig. 2.

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.

The design of high density IDF type SOT23-6 lead frame structure, the main arrangement problems that will solve exactly between many row's circuit, should reduce as far as possible circuit and disperse the effective area waste causing, thereby save encapsulating material, the reliability while considering again whole piece circuit package. High density IDF type SOT23-6 package lead mount structure described in the utility model as depicted in figs. 1 and 2, comprises the substrate 1 of a rectangle, and is arranged in the some lead frames unit 2 on substrate 1. And clearly visible by Fig. 1, every 27 of lead frame unit 2 is row, and every 4 classify one group as, totally 15 groups, every group arranges an injection molding channel 3 at its symmetrical centre place. In order to make the clear in structure of accompanying drawing visible, Fig. 2 has adopted ellipse. Fig. 3 is the detailed schematic of every group of lead frame unit 2 in Fig. 2.

As shown in Figure 1, high density IDF type SOT23-6 lead frame described in the utility model, comprises that a block length is the rectangular substrate 1 that 300.00 ± 0.102mm, width are 100.00 ± 0.051mm; Substrate 1 is provided with 1620 lead frame unit 2, and the IDF matrix type structure that 27 row 60 are listed as is lined up in all lead frame unit 2; All lead frame unit 2 are lined up 27 row, are lined up 60 row along the length direction of substrate 1 along the width of substrate 1; From first row lead frame unit 2, along the Y direction of substrate 1, intersected with each other the staggering of pin of two neighbouring lead frame unit, form so-called IDF structure; Along the X-direction of substrate 1, every 4 row lead frame unit, just at its symmetrical centre place, an injection molding channel is set, 15 runners are set altogether, runner the right and left is 2 products of each injection moulding once, until all unit of runner both sides are all filled up by plastic packaging material.

The design's IDF type lead frame contrasts with the 8 at present common size lead frames of arranging, as shown in table 1:

Table 1 the utility model lead frame contrasts with 8 at present common row lead frame sizes

Project	Overall length (mm)	Beam overall (mm)	Only/bar	Average area (mm²/ only)
					The utility model lead frame	300.00	100.00	1620	18.51
8 common row lead frames	228.2868	50.8	288	40.26

As can be seen from Table 1, compared with existing 8 row's SOT23-6 package lead mount structures, the lead frame described in the design, lead frame unit 2 quantity on every have increased by 462.5%, and average every lead frame cellar area reduces 54.02%, has saved raw material.

The lead frame unit 2 of the design's a SOT23-6 package lead mount structure amounts to 1620, can fill 1620 circuit. Can calculate by 8 SOT23-6 package lead mount structures of output with every mould, can packaged battery way reach 12960.

The production efficiency contrast of the utility model lead frame and common 8 row lead frames is as shown in table 2. As can be seen from Table 2, compare the SOT23-6 package lead mount structure of existing 8 row's structures, while adopting the design's lead frame, production efficiency can improve 462.5%, thereby greatly reduce cost of labor, with the consumption that enters also can effectively reduce power consumption and resin, thereby technique effect is obvious.

Table 2 the utility model lead frame and existing 8 row lead frame production efficiency contrasts

Project	Only/bar	Only/mould
			The design's lead frame	1620	12960
Existing 8 row lead frames	288	2304

Novel unique, the advantages of simple of lead frame structure that the utility model provides, the output number of every mould significantly increases, and utilization rate of raw materials also has remarkable increase, and for the packaging cost that reduces product, the competitiveness of improving product has very large help.

Claims

1. a high density IDF type SOT23-6 lead frame structure, comprises substrate, lead frame unit, it is characterized in that: described substrate is provided with lead frame unit, and described lead frame is provided with injection molding channel between unit.

2. a kind of high density IDF type SOT23-6 lead frame structure according to claim 1, is characterized in that: described lead frame unit is matrix form by 27 row's 60 row and is distributed on described substrate.

3. a kind of high density IDF type SOT23-6 lead frame structure according to claim 1, is characterized in that: in the Y direction of described substrate, intersected with each other the staggering of pin of two neighbouring lead frame unit, form IDF structure.

4. a kind of high density IDF type SOT23-6 lead frame structure according to claim 1, it is characterized in that: the X-direction on described substrate, at its symmetrical centre place, an injection molding channel is set every 4 row lead frame unit, 15 injection molding channels are set altogether, 2 products of the each each injection moulding in injection molding channel both sides.