CN206003768U - A kind of DFN3810 9L lead frame - Google Patents
A kind of DFN3810 9L lead frame Download PDFInfo
- Publication number
- CN206003768U CN206003768U CN201621018649.7U CN201621018649U CN206003768U CN 206003768 U CN206003768 U CN 206003768U CN 201621018649 U CN201621018649 U CN 201621018649U CN 206003768 U CN206003768 U CN 206003768U
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- framework
- chip
- mount unit
- dfn3810
- chip mount
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- 230000002787 reinforcement Effects 0.000 claims abstract description 26
- 238000005260 corrosion Methods 0.000 claims abstract description 23
- 230000007797 corrosion Effects 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 17
- 210000003205 muscle Anatomy 0.000 claims description 16
- 230000003628 erosive effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 10
- 238000005728 strengthening Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 239000004033 plastic Substances 0.000 description 11
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
This utility model is related to a kind of semiconductor fabrication, a kind of specifically related to DFN3810 9L lead frame, framework including the rectangle for taking up chip, described framework is provided with multiple chip mount unit, described chip mount unit is adapted with the encapsulating structure of DFN3810 9L, the chip bearing portion of described chip mount unit is half corrosion structure, is provided with reinforcement between adjacent chip mount unit.Set reinforcement between adjacent chip mount unit, ensure that the bulk strength of framework, reduce and increase the gap size between chip mount unit because strengthening needing, arrange more chip mount unit, save chip layout space, improve the utilization rate of frame material, save production cost.
Description
Technical field
This utility model is related to a kind of semiconductor fabrication, particularly a kind of DFN3810-9L lead frame.
Background technology
Generally, multiple semiconductor chips are merged into use in single semiconductor package, rather than it is single
Solely use, in order to manufacture the single semiconductor package including multiple quasiconductors it is necessary to use lead frame.
The major function of lead frame is to provide the carrier of mechanical support for chip, as connection chip inside and outside conducting medium
Circuit and form pathway for electrical signals, and the heat producing when together outwards distributing chip operation with package casing, constitute radiating logical
Road, lead frame, as the chip carrier of integrated circuit, is that one kind realizes chip internal circuits exit by means of bonding gold wire
With the electrical connection of outer lead, form the key structure part of electric loop, it serves the function served as bridge connecting with outer lead,
It is required for using chi frame in the semiconductor integrated block of the overwhelming majority, be important basic material in electronics and information industry.Core
Piece packing forms are DFN3810-9L（DFN is the chip packaging unit model of miniature electric components and parts, and it is single that 9L represents that chip is installed
The chip that unit installs is provided with 9 pins, and 3810 represent that chip mount unit is rectangular configuration, its a size of long 3.8mm, width
1.0mm）When, because the pin of this chip package is more, package dimension is larger, to arrange more in identical chi frame size
Chip, improve stock utilization it is necessary to reasonably be devised to arrangement form.
Utility model content
Goal of the invention of the present utility model is：For the chip for DFN3810-9L for the packing forms, because its pin is many,
The size of one single chip encapsulation unit is big, how reasonably to be arranged, improves the problem of the utilization rate of frame material, provide one
Kind of DFN3810-9L lead frame, it sets reinforcement between adjacent chip mount unit it is ensured that the bulk strength of framework,
Reduce the gap size between chip mount unit, improve the utilization rate of frame material, save production cost.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of DFN3810-9L lead frame, including the framework of the rectangle for taking up chip, described framework is provided with many
Individual chip mount unit, described chip mount unit is adapted with the encapsulating structure of DFN3810-9L, and that is, each chip installs list
Unit is correspondingly arranged on 9 pin grooves, and the chip bearing portion of described chip mount unit is half corrosion structure, and adjacent chip is installed
It is provided with reinforcement between unit.
This lead frame arranges that on framework the encapsulating structure with DFN3810-9L is adapted, i.e. each chip mount unit
It is correspondingly arranged on 9 pin grooves, and set reinforcement between adjacent chip mount unit it is ensured that the bulk strength of framework,
Reduce and increase the gap size between chip mount unit because strengthening needing, arrange more chip mount unit, save core
Piece arrangement space, improves the utilization rate of frame material, saves production cost.
As preferred version of the present utility model, described reinforcement is the non-corrosion part of framework, and described reinforcement is length
Strip structure, it is parallel with the side of chip mount unit.Chip mount unit is the structure of half corrosion, and reinforcement is framework
Not erodable section, by the structural strengthening of framework itself, you can reduces manufacturing process and material cost, can play again and framework is added
Pretend use；And reinforcement is arranged to the structure parallel with the side of chip mount unit, reduce taking up room, favorably of reinforcement
In many arrangement chip mount unit.
As preferred version of the present utility model, the long side of described chip mount unit and the minor face of framework are arranged in parallel.
As preferred version of the present utility model, described lengths of frame is 250 ± 0.1mm, and width is 70 ± 0.05mm,
14 rows, 176 row chip mount unit are disposed with framework.The long side of chip mount unit and the minor face of framework are arranged in parallel
Afterwards, in conjunction with one single chip installation unit size be 3.8*1.0mm, 14 rows, 176 row chip mount unit institutes are arranged on framework
Take size be：Long：176*1.0=176mm, wide：14*3.8=53.2mm, long and wide size is respectively less than the length and width chi of framework
Very little, 2464 chip mount unit thus can be arranged on framework, and be also reserved with frame and the chip installation of framework
Gap size between unit, meets actual production demand.
As preferred version of the present utility model, described framework is additionally provided with the 3 row subregion grooves parallel with its minor face, 3
Arrange described subregion groove and framework is divided into 4 regions being used for chip installation unit.Framework arranges subregion groove, by frame
Frame is divided into 4 regions for chip installation unit, is easy to installation and the segmentation positioning of chip mount unit.
As preferred version of the present utility model, it is additionally provided with multiple cuttings between the frame of framework and chip mounting area
Location division, the side of described cutting location division is arranged to the position alignd with the line of cut of chip mount unit.Frame in framework
The cutting location division of setting, for cutter positioning during diced chip installation unit, is easy to chip and chip mounting area between
Cutting, beneficial to improve operating efficiency.
As preferred version of the present utility model, described cutting location division includes the cutting positioning running through the rectangle of framework
Groove and be arranged on interval trough between cutting locating slot, the side of described cutting locating slot and the cutting edge of chip mount unit
Line aligns.Alignd with chip mount unit upper line of cut setting in the side of cutting locating slot, be easy to separately diced chip when
The positioning of blade and be aligned are it is ensured that chip quality after cutting.
As preferred version of the present utility model, in described interval trough, it is additionally provided with half corrosion muscle.
As preferred version of the present utility model, half corrosion muscle in the horizontal interval trough of framework is put down with the long side of framework
OK, half corrosion muscle in the vertical interval trough of framework is parallel with framework minor face.Half corrosion muscle of setting, plastic packaging in interval trough
After make both be connected in one piece, after frame cuts away, when tearing frame from plastic packaging film, the sky that half corrosion muscle stays in interval trough
Between region can make that plastic packaging material and frame combine more firm.
In sum, due to employing technique scheme, the beneficial effects of the utility model are：
1st, this lead frame arranges that on framework the encapsulating structure with DFN3810-9L is adapted, and in adjacent chip peace
Set reinforcement between dress unit it is ensured that the bulk strength of framework, reduce and increase between chip mount unit because strengthening needing
Gap size, arrange more chip mount unit, save chip layout space, improve the utilization rate of frame material, saving
Production cost；
2nd, chip mount unit is the structure of half corrosion, and reinforcement is the not erodable section of framework, by framework itself
Structural strengthening, you can reduce manufacturing process and material cost, the booster action to framework can be played again；And reinforcement is arranged to
The structure parallel with the side of chip mount unit, reduces taking up room of reinforcement, is conducive to arranging chip mount unit more；
3rd, after the minor face on the long side of chip mount unit and framework being arranged in parallel, in conjunction with the chi of one single chip installation unit
Very little for 3.8*1.0mm, framework is arranged the size shared by 14 rows, 176 row chip mount unit is：Long：176*1.0=
176mm, wide：14*3.8=53.2mm, long and wide size is respectively less than the length and width size of framework, thus can on framework cloth
Put 2464 chip mount unit, and be also reserved with the gap size between the frame of framework and chip mount unit, meet
Actual production demand；
4th, the half corrosion muscle arranging in interval trough, on framework during chip mount unit entirety plastic packaging, can increase plastic packaging
Body and the combination effect of framework, strengthen the protection to chip product；Both are made to be connected in one piece after plastic packaging, after frame cuts away, from
When tearing frame on plastic packaging film, the area of space that half corrosion muscle stays in interval trough can make plastic packaging material and frame combine more
Jail.
Brief description
Fig. 1 is the structural representation of this utility model DFN3810 lead frame.
Fig. 2 is the structural representation of a chip installation area in Fig. 1.
Fig. 3 is A portion enlarged drawing in Fig. 2.
Fig. 4 is B portion enlarged drawing in Fig. 3.
In figure labelling：1- framework, 101- subregion groove, 2- chip mount unit, 201- chip bearing portion, 202- pin groove,
3- cuts location division, 301- interval trough, and 302- partly corrodes muscle, and 303- cuts locating slot, 4- reinforcement.
Specific embodiment
Below in conjunction with the accompanying drawings, this utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to this utility model.It should be appreciated that specific embodiment described herein is only in order to explain this
Utility model, is not used to limit this utility model.
Embodiment 1
As shown in Figures 1 to 4, the DFN3810-9L lead frame of the present embodiment, including the rectangle for taking up chip
Framework 1, described framework 1 is provided with multiple chip mount unit 2, the encapsulation knot of described chip mount unit 2 and DFN3810-9L
Structure is adapted, and that is, each chip mount unit 2 is correspondingly arranged on 9 pin grooves 202, and the chip of described chip mount unit 2 holds
Load portion 201 is half corrosion structure, is provided with reinforcement 4 between adjacent chip mount unit 2.
This lead frame arranges that on framework the encapsulating structure with DFN3810-9L is adapted, i.e. each chip mount unit
It is correspondingly arranged on 9 pin grooves, and set reinforcement between adjacent chip mount unit it is ensured that the bulk strength of framework,
Reduce and increase the gap size between chip mount unit because strengthening needing, arrange more chip mount unit, save core
Piece arrangement space, improves the utilization rate of frame material, saves production cost.
Further, described reinforcement 4 is the non-corrosion part of framework 1, and the reinforcement 4 of the present embodiment is tied for strip
Structure, it is parallel with the sideline of chip mount unit 2.Chip mount unit is the structure of half corrosion, and reinforcement is for framework not
Erodable section, by the structural strengthening of framework itself, you can reduces manufacturing process and material cost, can play the reinforcement to framework again
Effect；And reinforcement is arranged to the structure parallel with the side of chip mount unit, reduce taking up room of reinforcement, be conducive to
Many arrangement chip mount unit.
Further, the long side of the chip mount unit 2 of the present embodiment and the minor face of framework 1 are arranged in parallel.
Specifically, the length of described framework 1 is 250 ± 0.1mm, and width is 70 ± 0.05mm, is disposed with 14 on framework 1
Row, 176 row chip mount unit.After the minor face on the long side of chip mount unit and framework is arranged in parallel, in conjunction with one single chip
The size of installation unit is 3.8*1.0mm, arranges that the size shared by 14 rows, 176 row chip mount unit is on framework：
Long：176*1.0=176mm, wide：14*3.8=53.2mm, long and wide size is respectively less than the length and width size of framework, thus permissible
2464 chip mount unit are arranged on framework, and is also reserved with the gap between the frame of framework and chip mount unit
Size, meets actual production demand.
In the present embodiment, as shown in figure 1, the 3 row subregion grooves 101,3 parallel with its minor face are additionally provided with described framework 1
Arrange described subregion groove 101 and framework 1 is divided into 4 regions being used for chip installation unit 2.Subregion is arranged on framework
Groove, framework is divided into 4 regions being used for chip installation unit, and installation and the segmentation of being easy to chip mount unit are fixed
Position.
Embodiment 2
As shown in Figures 1 to 4, the lead frame according to embodiment 1, the present embodiment is in the frame of framework 1 and chip
It is additionally provided with multiple cutting location divisions 3, the side of described cutting location division 3 is arranged to and chip mount unit 2 between installation region
The position of line of cut alignment.The cutting location division of setting between the frame of framework and chip mounting area, for diced chip
Cutter positioning during installation unit, is easy to the cutting of chip, beneficial to raising operating efficiency.
Further, described cutting location division 3 includes running through the cutting locating slot 303 of the rectangle of framework and is arranged on
Interval trough 301 between cutting locating slot 303, the side of described cutting locating slot 303 and the cutting sideline pair of chip mount unit 2
Together.Alignd with chip mount unit upper line of cut setting in the side of cutting locating slot, be easy to separately diced chip when blade
Positioning and be aligned it is ensured that cutting after chip quality.
Specifically, described interval trough 301 is the rectangular channel parallel with chip mount unit 2, also sets in described interval trough 301
There is half corrosion muscle 302.
Further, half corrosion muscle 302 in the horizontal interval trough of framework 301 is parallel with the long side of framework 1, in framework
Half corrosion muscle 302 in vertical interval trough 301 is parallel with framework 1 minor face.Half corrosion muscle of setting in interval trough, after plastic packaging
Both are made to be connected in one piece, after frame cuts away, when tearing frame from plastic packaging film, the space that half corrosion muscle stays in interval trough
It is more firm that region can make that plastic packaging material and frame combine.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all this
Any modification, equivalent and improvement made within the spirit of utility model and principle etc., should be included in this utility model
Protection domain within.
Claims (9)
1. a kind of DFN3810-9L lead frame, including the framework of the rectangle for taking up chip, described framework is provided with multiple
Chip mount unit it is characterised in that the encapsulating structure of described chip mount unit and DFN3810-9L is adapted, described chip
The chip bearing portion of installation unit is half corrosion structure, is provided with reinforcement between adjacent chip mount unit.
2. DFN3810-9L lead frame according to claim 1 is it is characterised in that described reinforcement is the not rotten of framework
Erosion part, described reinforcement is string configuration, and it is parallel with the side of chip mount unit.
3. DFN3810-9L lead frame according to claim 1 is it is characterised in that the long side of described chip mount unit
It is arranged in parallel with the minor face of framework.
4. DFN3810-9L lead frame according to claim 3 it is characterised in that described lengths of frame be 250 ±
0.1mm, width is 70 ± 0.05mm, is disposed with 14 rows, 176 row chip mount unit on framework.
5. DFN3810-9L lead frame according to claim 1 is it is characterised in that be additionally provided with and it on described framework
3 parallel row subregion grooves of minor face, framework is divided into 4 regions being used for chip installation unit by the 3 described subregion grooves of row.
6. the DFN3810-9L lead frame according to one of claim 1-5 is it is characterised in that in the frame of framework and core
It is additionally provided with multiple cutting location divisions, the side of described cutting location division is arranged on and the cutting of chip mount unit between piece installation region
The position of secant alignment.
7. DFN3810-9L lead frame according to claim 6 is it is characterised in that described cutting location division includes running through
The rectangle of framework cutting locating slot and be arranged on cutting locating slot between interval trough, the side of described cutting locating slot with
The cutting sideline alignment of chip mount unit.
8. DFN3810-9L lead frame according to claim 7 is it is characterised in that be additionally provided with half corruption in described interval trough
Erosion muscle.
9. DFN3810-9L lead frame according to claim 8 is it is characterised in that in the horizontal interval trough of framework
Half corrosion muscle is parallel with the long side of framework, and half corrosion muscle in the vertical interval trough of framework is parallel with framework minor face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621018649.7U CN206003768U (en) | 2016-08-31 | 2016-08-31 | A kind of DFN3810 9L lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621018649.7U CN206003768U (en) | 2016-08-31 | 2016-08-31 | A kind of DFN3810 9L lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206003768U true CN206003768U (en) | 2017-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621018649.7U Expired - Fee Related CN206003768U (en) | 2016-08-31 | 2016-08-31 | A kind of DFN3810 9L lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206003768U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113964064A (en) * | 2021-10-25 | 2022-01-21 | 天水华洋电子科技股份有限公司 | Etching equipment for producing integrated circuit lead frame |
-
2016
- 2016-08-31 CN CN201621018649.7U patent/CN206003768U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113964064A (en) * | 2021-10-25 | 2022-01-21 | 天水华洋电子科技股份有限公司 | Etching equipment for producing integrated circuit lead frame |
| CN113964064B (en) * | 2021-10-25 | 2022-05-03 | 天水华洋电子科技股份有限公司 | Etching equipment for producing integrated circuit lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170308 Termination date: 20180831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |