CN206179857U - SMB FL16 arranges lead frame - Google Patents
SMB FL16 arranges lead frame Download PDFInfo
- Publication number
- CN206179857U CN206179857U CN201621003968.0U CN201621003968U CN206179857U CN 206179857 U CN206179857 U CN 206179857U CN 201621003968 U CN201621003968 U CN 201621003968U CN 206179857 U CN206179857 U CN 206179857U
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- CN
- China
- Prior art keywords
- chip
- row
- smb
- framework
- frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a semiconductor device manufacture technique, concretely relates to SMB FL16 arranges lead frame, including the frame that is used for the rectangle of take up chip, be equipped with a plurality of install the chip units on the frame, the frame is formed by underframe frame and top frame combination, the chip -bearing portion that is used for the support that is equipped with on the underframe frame, the last chip closing cap portion that is equipped with that corresponds of top frame, after underframe frame and top frame combination, formation spatial structure's install the chip unit, install the chip unit and SMB FL encapsulation form suits. The combination forms this frame with top frame by underframe frame, and underframe frame and top frame combination back form spatial structure's install the chip unit, improve operating efficiency, does benefit to the improvement to the utilization ratio in rack mount space, improvement material utilization rate, saving manufacturing cost.
Description
Technical field
The utility model is related to a kind of semiconductor fabrication, particularly a kind of row lead frames of SMB-FL 16.
Background technology
Generally, multiple semiconductor chips are merged in single semiconductor package to use, rather than by its list
Solely use, in order to manufacture the single semiconductor package for including multiple semiconductors, it is necessary to use lead frame.
The major function of lead frame is the carrier for providing mechanical support for chip, used as connecting chip inside and outside conducting medium
Circuit and form pathway for electrical signals, and the heat produced when together outwards distributing chip operation with package casing constitutes radiating logical
Road, it is a kind of electrical connection that chip internal circuits exit and outer lead are realized by means of bonding techniques spun gold, forms electricity
The key structure part of air circuit, is required for using lead frame in the semiconductor integrated block of the overwhelming majority, is electronics and information industry
In important basic material.Chip package form is SMB-FL（SMB is the chip packaging unit model of miniature electric components and parts,
SMB-FL encapsulation after one single chip pin be 2, and encapsulate after one single chip encapsulation part be cube-shaped structure, single core
The size of piece encapsulation unit is 4.5*3.6mm）, due to SMB-FL encapsulating structures it is complex, and one single chip installation unit
Size is larger, and due to traditional chip package process technology restriction, encapsulation operation is less efficient, be in identical lead frame chi
It is very little to arrange more chips, also seem extremely difficult so that the utilization rate of material is not high.
Therefore, it is necessary to the design feature for being directed to SMB-FL lead frames is improved, to improve the profit of its lead frame
With rate, production cost is saved.
Utility model content
Goal of the invention of the present utility model is：It is complex for existing SMB-FL encapsulating structures, and one single chip peace
The size of dress unit is larger, and due to traditional chip package process technology restriction, encapsulation operation is less efficient, chip mount unit
The problem that utilization rate is not high, production cost is high to framework, there is provided a kind of row lead frames of SMB-FL 16, the framework can be improved
Operating efficiency, be conducive to improving utilization rate to framework installing space, improve stock utilization, save production cost.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of row lead frames of SMB-FL 16, including for taking up the framework of the rectangle of chip, the framework is provided with many
Individual chip mount unit, the framework is combined by bottom framework and top frame, and the bottom framework is provided with the core for supporting
Piece supporting part, is correspondingly provided with chip closure portion on the top frame, after bottom framework and top frame are combined, form stereochemical structure
Chip mount unit, the chip mount unit is adapted with SMB-FL packing forms.
The framework is combined by bottom framework and top frame, and is correspondingly arranged chip on bottom framework and top frame respectively and is held
After load portion and chip closure portion, and bottom framework and top frame combination, chip bearing portion forms stereochemical structure with chip closure portion
The chip mount unit being adapted with SMB-FL packing forms, improves operating efficiency, and the chip mount unit of stereochemical structure has
Beneficial to the utilization rate improved to framework installing space, improve stock utilization, save production cost.
As preferred version of the present utility model, a length of 252 ± 0.05mm of the framework, a width of 73 ± 0.04mm,
16 rows, 32 row chip mount units are disposed with the framework.
Used as preferred version of the present utility model, the chip mount unit 2 is classified as one group of arrangement, 2 row in same group
Chip mount unit shares a framework installation region.2 row chip mount units are arranged for one group, and in same group
2 row chip mount units share a framework installation region, can greatly save the installing space of framework so that chip mount unit
Arrangement it is more, and then improve material utilization rate.
As preferred version of the present utility model, 16 row chip bearing bars are disposed with the bottom framework, each column chip holds
Carrier strip both sides are provided with the chip bearing portion that 2 row are parallel to each other, and the chip bearing portion quantity of each column is 16.Arrange on bottom framework
16 row chip bearing bars, and set 2 row chip bearing portions in each column chip bearing bar both sides, that is, 32 row chip bearing portions are formed, often
The quantity in row chip bearing portion is 16, and so in fact two row chip bearing portions share a chip bearing bar, saves framework
Arrangement space, improves stock utilization；And the setting in 16 chip bearing portions also form and 16 row's chips are arranged on whole framework
The basis of installation unit.
As preferred version of the present utility model, under being between the 2 row chip bearing portion in same chip carrier strip
Recessed trench structure.
Used as preferred version of the present utility model, the top frame is provided with the chip capping corresponding with bottom framework of 16 row
Bar, each column chip capping bar both sides are provided with the chip closure portion that 2 row are parallel to each other, and the quantity of the chip closure portion of each column is 16
It is individual.Top frame is correspondingly arranged chip capping bar and chip closure portion with bottom framework, and formation is adapted with SMB-FL packing forms
Three-dimensional chip mount unit, improves frame material utilization rate, and realizes arranging 16 rows, 16*2=32 row chip peace on framework
Dress unit, i.e., arrange 512 chip mount units on framework.
It is raised between 2 row chip closure portions on same chip capping bar as preferred version of the present utility model
Trench structure, the groove depth of the trench structure is more than the groove depth of the trench structure of chip bearing bar, when chip bearing bar and chip are sealed
When cover fillet combination is installed, the direction of both trench structures is identical.When chip bearing bar and chip capping bar are combined, both grooves
The direction of type structure is identical, and the raised trench structure groove depth on chip capping bar is more than the recessed grooved of chip bearing bar
Structure groove depth, after both combine, forms between the chip closure portion of chip capping bar and the chip bearing portion of chip bearing bar
Certain installation gap, for chip, meets the demand of chip installation.
Used as preferred version of the present utility model, the chip bearing portion is correspondingly provided with bottom framework pole with chip mounting location
Point is raised, top frame limit is correspondingly provided with chip mounting location on the chip closure portion raised.
Used as preferred version of the present utility model, the bottom framework limit projection is arranged on the centre bit in chip bearing portion
Put, the top frame limit projection is arranged on the center of chip closure portion.
As preferred version of the present utility model, have additional on the framework of SMB-FL packaging pins position oval little
Hole.The aperture can increase tin plating area, the solderability of reinforcing element.
In sum, as a result of above-mentioned technical proposal, the beneficial effects of the utility model are：
1st, the framework is combined by bottom framework and top frame, and on bottom framework and top frame is correspondingly arranged chip respectively
After supporting part and chip closure portion, and bottom framework and top frame combination, chip bearing portion forms stereochemical structure with chip closure portion
The chip mount unit being adapted with SMB-FL packing forms, improve operating efficiency, and the chip mount unit of stereochemical structure
Be conducive to improving the utilization rate to framework installing space, improve stock utilization, save production cost；
2nd, this framework is arranged 2 row chip mount units for one group, and 2 row chip mount units in same group are common
With a framework installation region, the installing space of framework can be greatlyd save so that the arrangement of chip mount unit is more, enters
And improve the utilization rate of material；
3rd, when chip bearing bar and chip capping bar are combined, the direction of both trench structures is identical, and chip capping bar
On raised trench structure groove depth more than chip bearing bar recessed trench structure groove depth, both combine after, chip envelope
Certain installation gap is formed between the chip closure portion of cover fillet and the chip bearing portion of chip bearing bar, for chip,
Meet the demand of chip installation.
Description of the drawings
Fig. 1 is the structural representation of the row lead frames of the utility model SMB-FL 16.
Fig. 2 is the A portions enlarged drawing in Fig. 1.
Fig. 3 is the upward view of Fig. 2.
Fig. 4 is the structural representation of bottom framework in Fig. 1.
Fig. 5 is the B portions enlarged drawing in Fig. 4.
Fig. 6 is the C portions enlarged drawing in Fig. 5.
Fig. 7 is the upward view of Fig. 6.
Fig. 8 be another embodiment Fig. 5 in C portions enlarged drawing.
Fig. 9 is the upward view of Fig. 8.
Figure 10 is the structural representation of top frame.
D portions enlarged drawing in Figure 11 Figure 10.
Figure 12 is the E portions enlarged drawing in Figure 11.
Figure 13 is the upward view of Figure 12.
Mark in figure：1- frameworks, 101- bottom frameworks, 1011- chip bearings portion, 1012- chip bearing bars, 1013- underframes
Frame limit is raised, 102- top frames, 1021- chip closure portions, 1022- location holes, 1023- chips capping bar, 1024- top frames
Limit is raised, 2- chip mount units, 3- subregion locating slots.
Specific embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to the utility model.It should be appreciated that specific embodiment described herein is only to explain this
Utility model, is not used to limit the utility model.
Embodiment 1
As shown in figure 1 to figure 13, the row lead frames of SMB-FL 16 of the present embodiment include the rectangle for taking up chip
Framework 1, the framework 1 is provided with multiple chip mount units 3, the framework 1 combined by bottom framework 101 and top frame 102 and
Into the bottom framework 101 is provided with the chip bearing portion 1011 for supporting, and chip envelope is correspondingly provided with the top frame 102
Cap 1021, after bottom framework 101 and top frame 102 are combined, forms the chip mount unit 2 of stereochemical structure, the chip peace
Dress unit 2 is adapted with SMB-FL packing forms.
The framework is combined by bottom framework and top frame, and is correspondingly arranged chip on bottom framework and top frame respectively and is held
After load portion and chip closure portion, and bottom framework and top frame combination, chip bearing portion forms stereochemical structure with chip closure portion
The chip mount unit being adapted with SMB-FL packing forms, improves operating efficiency, and the chip mount unit of stereochemical structure has
Beneficial to the utilization rate improved to framework installing space, improve stock utilization, save production cost.
Specifically, in the present embodiment, a length of 252mm of the framework 1, a width of 73mm are disposed with 16 on the framework 1
Row, 32 row chip mount units 2.
More specifically design, the chip mount unit 2 is 2 to be classified as one group and be arranged, 2 row chips in same group
Installation unit 2 shares a framework installation region.2 row chip mount units are arranged for one group, and 2 row in same group
Chip mount unit shares a framework installation region, can greatly save the installing space of framework so that chip mount unit
Arrangement is more, and then improves the utilization rate of material.
Further, the design of the installation region of the shared framework of 2 row chip mount units is as follows：
16 row chip bearing bars 1012 are disposed with bottom framework 101, the both sides of each column chip bearing bar 1012 are provided with 2 row phases
Mutual parallel chip bearing portion 1011, the quantity of chip bearing portion 1011 of each column is 16.16 row chips are set on bottom framework
Carrier strip, and set 2 row chip bearing portions in each column chip bearing bar both sides, that is, 32 row chip bearing portions are formed, each column chip holds
The quantity in load portion is 16, and so in fact two row chip bearing portions share a chip bearing bar, saves frame arrangement space,
Improve stock utilization；And the setting in 16 chip bearing portions also form and 16 row's chip mount units are arranged on whole framework
Basis.
Accordingly, 16 row are provided with top frame 102 and cover bar 1023, each column chip with the corresponding chip of bottom framework 101
Capping bar 1023 both sides are provided with the chip closure portion 1021 that 2 row are parallel to each other, and the quantity of the chip closure portion 1021 of each column is 16
It is individual.Top frame is correspondingly arranged chip capping bar and chip closure portion with bottom framework, and formation is adapted with SMB-FL packing forms
Three-dimensional chip mount unit, improves frame material utilization rate, and realizes arranging 16 rows, 16*2=32 row chip peace on framework
Dress unit, i.e., arrange 512 chip mount units on framework.
As shown in Figure 10, on top frame 102, same row chip capping bar 1023 on 2 row chip closure portions 1021 it
Between be additionally provided with location hole 1022, for positioning；As shown in figure 4, on bottom framework 101, between adjacent chip bearing bar 1012
Subregion locating slot 3 is additionally provided with, the gap between adjacent chips carrier strip is formed, positioning is can be used for.
Embodiment 2
As shown in figure 1 to figure 13, the row lead frames of SMB-FL 16 according to embodiment 1, same chip carrier strip
Certain spacing is formed between the 2 row chip bearing portion 1011 on 1012, is herein recessed trench structure.
Accordingly, it is raised trench structure between 2 row chip closure portions on same chip capping bar, the trench structure
Groove width and bottom framework 101 on trench structure be adapted, meanwhile, the grooved of the groove depth of the trench structure more than chip bearing bar
The groove depth of structure, when chip bearing bar and chip capping bar combination are installed, the direction of both trench structures is identical.Chip holds
When carrier strip and chip capping bar are combined, the direction of both trench structures is identical, and the raised grooved knot on chip capping bar
Deeply more than the recessed trench structure groove depth of chip bearing bar, after both combine, chip covers the chip closure portion of bar to flute
Certain installation gap is formed and the chip bearing portion of chip bearing bar between, for chip, the need of chip installation is met
Ask.
Further, the chip bearing portion 1011 is correspondingly provided with bottom framework limit projection 1013 with chip mounting location,
Top frame limit projection 1024 is correspondingly provided with chip mounting location on the chip closure portion 1021.
Further, the bottom framework limit projection 1013 is arranged on the center in chip bearing portion 1011, the top
Framework limit projection 1024 is arranged on the center of chip closure portion 1021.
Further, oval aperture is had additional on the framework of SMB-FL packaging pins position.The aperture can increase plating
Tin area, the solderability of reinforcing element.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (9)
1. row lead frames of a kind of SMB-FL 16, including for taking up the framework of the rectangle of chip, the framework is provided with multiple
Chip mount unit, it is characterised in that the framework is combined by bottom framework and top frame, the bottom framework be provided with for
The chip bearing portion of support, is correspondingly provided with chip closure portion on the top frame, after bottom framework and top frame are combined, form vertical
The chip mount unit of body structure, the chip mount unit is adapted with SMB-FL packing forms, is disposed with the frame
16 rows, 32 row chip mount units, the chip mount unit 2 is classified as one group of arrangement, 2 row chip mount units in same group
Share a framework installation region.
2. row lead frames of SMB-FL according to claim 1 16, it is characterised in that a length of the 252 of the framework ±
0.05mm, a width of 73 ± 0.04mm.
3. row lead frames of SMB-FL according to claim 1 and 2 16, it is characterised in that be disposed with the bottom framework
16 row chip bearing bars, each column chip bearing bar both sides are provided with the chip bearing portion that 2 row are parallel to each other, the chip bearing portion of each column
Quantity is 16.
4. row lead frames of SMB-FL according to claim 3 16, it is characterised in that 2 row in same chip carrier strip
It is recessed trench structure between the chip bearing portion.
5. row lead frames of SMB-FL according to claim 4 16, it is characterised in that the top frame is provided with 16 row
Chip corresponding with bottom framework covers bar, and each column chip capping bar both sides are provided with the chip closure portion that 2 row are parallel to each other, each column
The quantity of chip closure portion is 16.
6. row lead frames of SMB-FL according to claim 5 16, it is characterised in that 2 row on same chip capping bar
It is raised trench structure between chip closure portion, the groove depth of the trench structure is more than the groove of the trench structure of chip bearing bar
Deep, when chip bearing bar and chip capping bar combination are installed, the direction of both trench structures is identical.
7. row lead frames of SMB-FL according to claim 6 16, it is characterised in that the chip bearing portion and chip
Installation site is correspondingly provided with bottom framework limit projection, and top frame pole is correspondingly provided with chip mounting location on the chip closure portion
Point is raised.
8. row lead frames of SMB-FL according to claim 7 16, it is characterised in that the bottom framework limit projection sets
The center in chip bearing portion is put, the top frame limit projection is arranged on the center of chip closure portion.
9. row lead frames of SMB-FL 16 according to one of claim 4-8, it is characterised in that draw in SMB-FL encapsulation
Oval aperture is had additional on the framework of placement of foot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621003968.0U CN206179857U (en) | 2016-08-31 | 2016-08-31 | SMB FL16 arranges lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621003968.0U CN206179857U (en) | 2016-08-31 | 2016-08-31 | SMB FL16 arranges lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206179857U true CN206179857U (en) | 2017-05-17 |
Family
ID=60240160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621003968.0U Expired - Fee Related CN206179857U (en) | 2016-08-31 | 2016-08-31 | SMB FL16 arranges lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206179857U (en) |
-
2016
- 2016-08-31 CN CN201621003968.0U patent/CN206179857U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170517 Termination date: 20180831 |