CN207021259U - A kind of encapsulating lead of integrated circuit - Google Patents
A kind of encapsulating lead of integrated circuit Download PDFInfo
- Publication number
- CN207021259U CN207021259U CN201720851109.5U CN201720851109U CN207021259U CN 207021259 U CN207021259 U CN 207021259U CN 201720851109 U CN201720851109 U CN 201720851109U CN 207021259 U CN207021259 U CN 207021259U
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- lead
- edge
- dao
- integrated circuit
- groove
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of encapsulating lead of integrated circuit, including multiple package lead units；Each package lead unit includes Ji Dao（11）With multiple interior pins（14）；Ji Dao is square Ji Dao, and the edge of square Ji Dao upper surface is provided with the edge V-groove for waterproof（12）；Edge V-groove is 4, and 4 edge V-grooves connect the V-type proof mechanism of water to form rectangle.The packaging lead frame structure of the integrated circuit is compact, and reliability is high.
Description
Technical field
It the utility model is related to a kind of encapsulating lead of integrated circuit.
Background technology
Chip carrier of the lead frame as integrated circuit is one kind by means of bonding material（Spun gold, aluminium wire, copper wire）It is real
The electrical connection of existing chip internal circuits exit and outer lead, the key structure part of electric loop is formed, it is served and outside
The function served as bridge of portion's wire connection, while radiating also is provided for integrated circuit, it is required in most semiconductor integrated blocks
It is basic material important in electronics and information industry using lead frame.
SOP（Small Outline Package）It is small outline packages, and ESOP（Exposed Small Outline
Package）It is exposed small outline packages, i.e. radiating fin exposed outside.The encapsulation is a kind of relatively common packing forms, market scope
Extensively, mainly for the application environment for having high cooling requirements, can by exposed fin, by product work caused by heat pass
Export is gone.
ESOP has the particular advantages of good heat dissipation, so the function of the product is more compared with common product function, and function more one
Aspect is that chip functions are more；On the other hand it is that number of chips is more, the most frequently used mode is to match somebody with somebody one by a main control chip
MOS chips realize it is multi-functional, that is, multi-chip realize it is multi-functional.
Realize that multi-chip is pasted, it is necessary to which different types of glue is pasted for the angle of function, and different glue are meaned
The differences such as different resin systems or proportioning components, with two kinds of glue so on a carrier, it may appear that glue volatile matter
Cross contamination, or resin overflow and interfered with each other, and layering, which occur, in final products influences reliability.
The encapsulating lead of existing integrated circuit, its package lead unit is as shown in figure 1, due to no splashproof machine
Structure, it is impossible to control interfering for a variety of glue, easily had undesirable effect to encapsulating structure.
Therefore, it is necessary to design a kind of encapsulating lead of new integrated circuit.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of encapsulating lead of integrated circuit, the integrated electricity
The packaging lead frame structure on road is compact, and reliability is high.
The technical solution of utility model is as follows：
A kind of encapsulating lead of integrated circuit, including multiple package lead units；
Each package lead unit includes Ji Dao and multiple interior pins；
Ji Dao is square Ji Dao, and the edge of square Ji Dao upper surface is provided with the edge V-groove for waterproof（12）；Side
It it is 4 along V-groove, 4 edge V-grooves connect the V-type proof mechanism of water to form rectangle.
Ji Dao upper surfaces are additionally provided with longitudinal central V-groove, and central V-groove connects with edge V-groove so that central V-type
Groove connects to form horizontal stroke " day " font proof mechanism of water with 4 edge V-grooves.
Probably referring to day word across the meaning come in horizontal " day " font, referring to accompanying drawing 2.
Each package lead unit has eight interior pins.
Interior pin is provided with lock hole.
Encapsulating lead includes 256 package lead units, and 256 package lead units are arranged in matrix-style.
Connecting rod is used for linker Dao Yuji islands external frame.
V-type capillary groove also is provided with interior pin.
Beneficial effect：
The encapsulating lead of integrated circuit of the present utility model, has the characteristics that：
With central V-groove and edge V-groove, and it is interconnected.
Lock hole, the effect of similar pin, makes interior pin firmly be locked in plastic-sealed body, and it is anti-dilatory to improve outer pin
Ability；
The edge of carrier and middle increase V-type capillary groove, can isolate two chips of left and right, main to isolate two chips not
Same glue, when there is glue diffusion or pollution, capillary groove can play a part of isolation；
Matrix arrangement has 256 encapsulation units on lead frame body, and lead frame is generally 140 at present, increase
After wall scroll quantity, production efficiency and stock utilization can be improved.
The utility model solves to influence caused by glue resin overflows, while make modeling by changing the form of frame structure
Combined more closely between envelope material and lead frame, prevent layering from improving product reliability.
Brief description of the drawings
Fig. 1 is existing package lead cellular construction schematic diagram；
Fig. 2 is package lead cellular construction schematic diagram of the present utility model；
Fig. 3 is A-A cross section views in Fig. 2；
Fig. 4 is the encapsulating lead general structure schematic diagram of integrated circuit.
Label declaration：1 ~ 8 is pin numbering, 11- Ji Dao, 12- edges V-groove, 13- centers V-groove, pin in 14-,
15- connecting rods, 16- lock holes.
Embodiment
The utility model is described in further details below with reference to the drawings and specific embodiments：
Embodiment 1：Such as Fig. 2-4, a kind of encapsulating lead of integrated circuit, including multiple package lead units；
Each package lead unit includes base island 11 and multiple interior pins 14；
Ji Dao is square Ji Dao, and the edge of square Ji Dao upper surface is provided with the edge V-groove 12 for waterproof；Edge
V-groove is 4, and 4 edge V-grooves connect the V-type proof mechanism of water to form rectangle.
Ji Dao upper surfaces are additionally provided with longitudinal central V-groove 13, and central V-groove connects with edge V-groove so that central V
Type groove connects to form horizontal stroke " day " font proof mechanism of water with 4 edge V-grooves.
Probably referring to day word across the meaning come in horizontal " day " font, referring to accompanying drawing 2.
Each package lead unit has eight interior pins.
Interior pin is provided with lock hole 16.
Encapsulating lead includes 256 package lead units, and 256 package lead units are arranged in matrix-style.
This patent on interior pin mainly by increasing lock hole；Carrier（Also known as Ji Dao）Edge and middle increase V-type
Capillary groove；Matrix arrangement has 256 encapsulation units on lead frame body.
The utility model lead frame, include 238 ± 0.102mm of length of lead frame, 70 ± 0.061mm of width；It is single
Bar lead frame is provided with 256 encapsulation units, and all encapsulation units arrange in the column matrix formula of 8 row 32.
Encapsulation unit in the utility model lead frame, including carrier, interior pin and the silver-plated ring group of carrier surface into
Frame-type structure.In the structure, carrier front is provided with V-type capillary groove along edge and centre；Carrier both sides are provided with multiple interior pins,
Pin is provided with lock hole and V row capillary grooves in each；The other both sides of carrier are respectively provided with a connecting rod 15, and connecting rod is used for
Connect carrier and outside framework；Lead frame surface carries out roughening treatment, increases the adhesion of lead frame and plastic packaging material.Base
Chip bonding pad on island is interconnected with interior pin by bonding line.
Claims (5)
1. a kind of encapsulating lead of integrated circuit, it is characterised in that including multiple package lead units；
Each package lead unit includes Ji Dao（11）With multiple interior pins（14）；
Ji Dao is square Ji Dao, and the edge of square Ji Dao upper surface is provided with the edge V-groove for waterproof（12）；Edge V
Type groove is 4, and 4 edge V-grooves connect the V-type proof mechanism of water to form rectangle.
2. the encapsulating lead of integrated circuit according to claim 1, it is characterised in that Ji Dao upper surfaces are additionally provided with vertical
To central V-groove（13）, central V-groove connects with edge V-groove so that central V-groove connects shape with 4 edge V-grooves
Into horizontal stroke " day " font proof mechanism of water.
3. the encapsulating lead of integrated circuit according to claim 1, it is characterised in that each package lead unit
With eight interior pins.
4. the encapsulating lead of integrated circuit according to claim 1, it is characterised in that interior pin is provided with lock hole
（15）.
5. the encapsulating lead of the integrated circuit according to claim any one of 1-4, it is characterised in that package leadframe
Frame includes 256 package lead units, and 256 package lead units are arranged in matrix-style.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720851109.5U CN207021259U (en) | 2017-07-13 | 2017-07-13 | A kind of encapsulating lead of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720851109.5U CN207021259U (en) | 2017-07-13 | 2017-07-13 | A kind of encapsulating lead of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207021259U true CN207021259U (en) | 2018-02-16 |
Family
ID=61484198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720851109.5U Active CN207021259U (en) | 2017-07-13 | 2017-07-13 | A kind of encapsulating lead of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207021259U (en) |
-
2017
- 2017-07-13 CN CN201720851109.5U patent/CN207021259U/en active Active
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