CN203617286U - Lead frame with head being opened - Google Patents
Lead frame with head being opened Download PDFInfo
- Publication number
- CN203617286U CN203617286U CN201320701812.XU CN201320701812U CN203617286U CN 203617286 U CN203617286 U CN 203617286U CN 201320701812 U CN201320701812 U CN 201320701812U CN 203617286 U CN203617286 U CN 203617286U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- lead
- base body
- head
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a lead frame with the head being opened, which is formed by arranging a plurality of lead frame units in a single row, wherein the lead frame units are connected with each other through connecting ribs, the lead frame unit comprises a base body and lead pins, a connecting part of the base body and the lead pin is bent, the head of the base body is provided with an arc-shaped gap, the radius of the arc-shaped gap is 2.5+/-0.5mm, the lead pin is provided with a bonding area, the bonding area is connected with the base body, the base body is provided with a left chip loading area and a right chip loading area, and the lead frame unit is provided with a positioning hole. The lead frame disclosed by the utility model is of a complete package mode, provided with two chip loading areas, the bonding areas of the lead pins at both sides are connected with the base body, a grounding wire is not required at both sides, the middle part is provided with a plurality of driving wires, and the same lead is shared, thereby saving the space of a circuit board, and saving the production cost. The head is designed to be the gap mode, thereby reducing resistance during injection molding, and preventing the wire from being broken by vibrations.
Description
Technical field
The utility model relates to a kind of lead frame.
Background technology
lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of lead frame.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame of head opening, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix head is provided with arc notch, and the radius of arc notch is 2.5 ± 0.05mm.
As further improvement of the utility model, described terminal pin is provided with bonding region, and bonding region is connected with matrix.
As further improvement of the utility model, described matrix is provided with slide glass district, and slide glass is divided into two of left and right.
As further improvement of the utility model, described lead frame unit is provided with location hole.
Adopt said structure, its beneficial effect is: this framework is total incapsulation form, is divided into Liang Pian slide glass district, and the bonding region of both sides terminal pin is connected with matrix, without earth connection in both sides, many drive wires are beaten in centre, jointly use same lead-in wire, save the space of wiring board, save production cost, head design becomes breach form, and the resistance while reducing injection moulding, prevents from shaking fracture of wire.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model lead frame.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-arc notch, 5-bonding region, 6-slide glass district, 7-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Figure 1, a kind of lead frame of head opening, by 1 single composition of multiple lead frames unit, lead frame unit 1 width is 11.405 ± 0.025mm, between each lead frame unit 1, interconnect by dowel, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 1 and terminal pin 3 thickness are 0.6 ± 0.015mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 1.8 ± 0.05mm, described matrix 2 heads are provided with arc notch 4, the radius of arc notch 4 is 2.5 ± 0.05mm, described terminal pin 3 is provided with bonding region 5, bonding region 5 is connected with matrix 2, described matrix 2 is provided with slide glass district 6, slide glass district 6 is divided into two of left and right, described lead frame unit 1 is provided with location hole 7, location hole 7 diameters are 2.0 ± 0.05mm.
This framework is total incapsulation form, be divided into Liang Pian slide glass district, the bonding region of both sides terminal pin is connected with matrix, and without earth connection, in both sides, many drive wires are beaten in centre, same lead-in wire of common use, the space of saving wiring board, saves production cost, and head design becomes breach form, resistance while reducing injection moulding, prevents from shaking fracture of wire.
Within the similar designed lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.
Claims (4)
1. the lead frame of a head opening, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) head is provided with arc notch (4), and the radius of arc notch (4) is 2.5 ± 0.05mm.
2. the lead frame of a kind of head opening according to claim 1, is characterized in that: described terminal pin (3) is provided with bonding region (5), and bonding region (5) are connected with matrix (2).
3. the lead frame of a kind of opening according to claim 1, is characterized in that: described matrix (2) is provided with slide glass district (6), and slide glass district (6) are divided into two of left and right.
4. the lead frame of a kind of head opening according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320701812.XU CN203617286U (en) | 2013-11-08 | 2013-11-08 | Lead frame with head being opened |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320701812.XU CN203617286U (en) | 2013-11-08 | 2013-11-08 | Lead frame with head being opened |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617286U true CN203617286U (en) | 2014-05-28 |
Family
ID=50769912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320701812.XU Expired - Fee Related CN203617286U (en) | 2013-11-08 | 2013-11-08 | Lead frame with head being opened |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617286U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617981A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with opened heads |
| CN104952755A (en) * | 2015-06-10 | 2015-09-30 | 江苏杰进微电子科技有限公司 | Integrated circuit chip feeding device |
-
2013
- 2013-11-08 CN CN201320701812.XU patent/CN203617286U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617981A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with opened heads |
| CN104952755A (en) * | 2015-06-10 | 2015-09-30 | 江苏杰进微电子科技有限公司 | Integrated circuit chip feeding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20141108 |
|
| EXPY | Termination of patent right or utility model |