CN203617288U - Lead frame with bending head - Google Patents
Lead frame with bending head Download PDFInfo
- Publication number
- CN203617288U CN203617288U CN201320701927.9U CN201320701927U CN203617288U CN 203617288 U CN203617288 U CN 203617288U CN 201320701927 U CN201320701927 U CN 201320701927U CN 203617288 U CN203617288 U CN 203617288U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- head
- bent
- loading area
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a lead frame with a bending head, which is formed by arranging a plurality of lead frame units in a single row, wherein the lead frame units are connected with each other through connecting ribs, the lead frame unit comprises a base body and lead pins, a connecting part of the base body and the lead pin is bent, the base body is divided into a chip loading area and a heat radiating piece, a connecting part of the chip loading area and the heat radiating piece is bent, the center of the heat radiating piece is provided with an elliptical hole, the chip loading area is provided with 200-250 uniformly distributed pits, and the lead frame unit is provided with a positioning hole. The head of the lead frame is bent, resistance during injection molding is reduced, and the elliptical hole is designed to elliptical, thereby ensuring the edge of the elliptical hole not to collide with a circular hole shaped core of a packaging mold to result in a phenomenon of copper exposure, and enabling the head to be completely insulated. A pit design of the chip loading area enhances the reliability of a plastic package material.
Description
Technical field
The utility model relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of lead frame.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame of head-bent, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix is divided into slide glass district and fin, bend in described slide glass district and fin junction.
As further improvement of the utility model, described fin central authorities are provided with elliptical aperture.
As further improvement of the utility model, described slide glass body is provided with 200-250 evenly distributed pit.
As further improvement of the utility model, described lead frame unit is provided with location hole.
Adopt said structure, its beneficial effect is: this lead frame head-bent, when injection moulding, reduce resistance, elliptical aperture is designed to ellipse, guarantee elliptical aperture edge not with seal mould circular hole core and collide, cause and reveal copper phenomenon, head is insulated completely, the pit in slide glass district designs, and has increased the fixing of capsulation material.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model lead frame.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-slide glass district, 5-fin, 6-elliptical aperture, 7-pit, 8-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Figure 1, a kind of lead frame of head-bent, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, the width of lead frame unit 1 is 11.405 ± 0.025mm, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 and terminal pin 3 thickness are 0.5 ± 0.015mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 2.36 ± 0.05mm, described matrix 2 is divided into slide glass district 4 and fin 5, bend in described slide glass district 4 and fin 5 junctions, make slide glass district 4 and fin 5 planes at a distance of 0.85 ± 0.03mm, described fin 5 central authorities are provided with elliptical aperture 6, the major diameter of elliptical aperture 6 is 5.5 ± 0.1mm, minor diameter is 4.3 ± 0.2mm, described slide glass body 4 is provided with 200-250 evenly distributed pit 7, pit 7 is of a size of 0.1*0.1*0.1mm, described lead frame unit 1 is provided with location hole 8, the diameter of location hole 8 is 2 ± 0.06mm.
This lead frame head-bent, when injection moulding, reduce resistance, elliptical aperture is designed to ellipse, guarantee elliptical aperture edge not with seal mould circular hole core and collide, cause and reveal copper phenomenon, head is insulated completely, the pit in slide glass district designs, and has increased the fixing of capsulation material, and this framework is total incapsulation form, material attenuation, cost-saving.
Within the similar designed lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.
Claims (4)
1. the lead frame of a head-bent, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) is divided into slide glass district (4) and fin (5), bends in described slide glass district (4) and fin (5) junction.
2. the lead frame of a kind of head-bent according to claim 1, is characterized in that: described fin (5) central authorities are provided with elliptical aperture (6).
3. the lead frame of a kind of head-bent according to claim 1, is characterized in that: described slide glass body (4) is provided with 200-250 evenly distributed pit (7).
4. the lead frame of a kind of head-bent according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320701927.9U CN203617288U (en) | 2013-11-08 | 2013-11-08 | Lead frame with bending head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320701927.9U CN203617288U (en) | 2013-11-08 | 2013-11-08 | Lead frame with bending head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617288U true CN203617288U (en) | 2014-05-28 |
Family
ID=50769914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320701927.9U Expired - Fee Related CN203617288U (en) | 2013-11-08 | 2013-11-08 | Lead frame with bending head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617288U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110476198A (en) * | 2017-03-24 | 2019-11-19 | 株式会社日本显示器 | Display device |
-
2013
- 2013-11-08 CN CN201320701927.9U patent/CN203617288U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110476198A (en) * | 2017-03-24 | 2019-11-19 | 株式会社日本显示器 | Display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203617288U (en) | Lead frame with bending head | |
| CN203850288U (en) | Plastic-sealed lead frame with separated heat radiating fins | |
| CN203277357U (en) | Leading wire frame for semiconductor | |
| CN203850280U (en) | Double-chip plastic-sealed lead frame | |
| CN103617985A (en) | Plastic package lead frame with bent heads | |
| CN103617983A (en) | Low-power plastic packaged lead frame | |
| CN203850287U (en) | Plastic-sealed lead frame in full packaging manner | |
| CN203617290U (en) | Lead frame with pits | |
| CN203617286U (en) | Lead frame with head being opened | |
| CN203850286U (en) | Plastic-sealed lead frame suitable for high-temperature environment | |
| CN203617285U (en) | Lead frame capable of radiating heat quickly | |
| CN103617984A (en) | Plastic package lead frame | |
| CN203850278U (en) | Packaging-facilitated plastic-coated lead frame | |
| CN203850284U (en) | Plastic-sealed lead frame with square tanks | |
| CN103943596A (en) | Fully packaged type lead frame | |
| CN203850279U (en) | Plastic-sealed lead frame suitable for high-power electrical appliances | |
| CN203850285U (en) | Thickened plastic-sealed lead frame | |
| CN203850276U (en) | A plastic package lead wire framework | |
| CN203850274U (en) | A thin plastic packaging lead wire framework | |
| CN103928429A (en) | Lead frame with split cooling fins | |
| CN203617287U (en) | Lead frame with sawtooth pressing marks | |
| CN203850277U (en) | A plastic package lead wire framework with bosses formed through pressing | |
| CN103617981A (en) | Plastic package lead frame with opened heads | |
| CN203850282U (en) | Plastic-sealed lead frame with material locking openings | |
| CN103617986A (en) | Plastic-packaged lead frame capable of performing heat dissipation rapidly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20141108 |
|
| EXPY | Termination of patent right or utility model |