CN103617985A - Plastic package lead frame with bent heads - Google Patents
Plastic package lead frame with bent heads Download PDFInfo
- Publication number
- CN103617985A CN103617985A CN201310550090.7A CN201310550090A CN103617985A CN 103617985 A CN103617985 A CN 103617985A CN 201310550090 A CN201310550090 A CN 201310550090A CN 103617985 A CN103617985 A CN 103617985A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- bent
- heads
- plastic package
- chip carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses a plastic package lead frame with bent heads. The plastic package lead frame with the bent heads is composed of a plurality of lead frame units in a single row. All the lead frame units are connected mutually through connecting ribs, each lead frame unit comprises a base body and terminal pins, the connecting portions of the base bodies and the corresponding terminal pins are bent, each base body is divided into a chip carrying area and a heat dissipating piece, the connecting portion of each chip carrying area and the corresponding heat dissipating piece is bent, an elliptical hole is formed in the center of each heat dissipating sheet, each chip carrying area is provided with 200-250 pocking points arranged and distributed evenly, and the each lead frame unit is provided with a locating hole. The heads of the lead frame are bent, resistance in injection molding is reduced, the elliptical holes are designed into an elliptical shape, the effect that the edges of the elliptical holes will not collide with an encapsulating mold round hole core to cause copper exposure phenomena is ensured, the heads are insulated completely, and the firmness of plastic package materials is increased due to the pocking point design of the chip carrying areas.
Description
Technical field
The present invention relates to a kind of plastic packaging lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plastic packaging lead frame.
In order to solve the problems of the technologies described above, the invention provides a kind of plastic packaging lead frame of head-bent, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix is divided into slide glass district and fin, bend in described slide glass district and fin junction.
As a further improvement on the present invention, described fin central authorities are provided with elliptical aperture.
As a further improvement on the present invention, described slide glass body is provided with 200-250 evenly distributed pit.
As a further improvement on the present invention, described lead frame unit is provided with location hole.
Adopt said structure, its beneficial effect is: this lead frame head-bent, during injection moulding, reduce resistance, elliptical aperture is designed to ellipse, guarantee elliptical aperture edge not with seal mould circular hole core and collide, cause and reveal copper phenomenon, head is insulated completely, the pit in slide glass district designs, and has increased the fixing of capsulation material.
Accompanying drawing explanation
Fig. 1 is the structural representation of plastic packaging lead frame of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin ，4-slide glass district, 5-fin, 6-elliptical aperture, 7-pit, 8-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of plastic packaging lead frame of head-bent, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, the width of lead frame unit 1 is 11.405 ± 0.025mm, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 and terminal pin 3 thickness are 0.5 ± 0.015mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 2.36 ± 0.05mm, described matrix 2 is divided into slide glass district 4 and fin 5, bend in described slide glass district 4 and fin 5 junctions, make slide glass district 4 and fin 5 planes at a distance of 0.85 ± 0.03mm, described fin 5 central authorities are provided with elliptical aperture 6, the major diameter of elliptical aperture 6 is 5.5 ± 0.1mm, minor diameter is 4.3 ± 0.2mm, described slide glass body 4 is provided with 200-250 evenly distributed pit 7, pit 7 is of a size of 0.1*0.1*0.1mm, described lead frame unit 1 is provided with location hole 8, the diameter of location hole 8 is 2 ± 0.06mm.
This lead frame head-bent, during injection moulding, reduce resistance, elliptical aperture is designed to ellipse, guarantee elliptical aperture edge not with seal mould circular hole core and collide, cause and reveal copper phenomenon, head is insulated completely, the pit in slide glass district designs, and has increased the fixing of capsulation material, and this framework is total incapsulation form, material attenuation, cost-saving.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. the plastic packaging lead frame of a head-bent, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) is divided into slide glass district (4) and fin (5), bends in described slide glass district (4) and fin (5) junction.
2. the plastic packaging lead frame of a kind of head-bent according to claim 1, is characterized in that: described fin (5) central authorities are provided with elliptical aperture (6).
3. the plastic packaging lead frame of a kind of head-bent according to claim 1, is characterized in that: described slide glass body (4) is provided with 200-250 evenly distributed pit (7).
4. the plastic packaging lead frame of a kind of head-bent according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550090.7A CN103617985A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with bent heads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550090.7A CN103617985A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with bent heads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617985A true CN103617985A (en) | 2014-03-05 |
Family
ID=50168689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310550090.7A Pending CN103617985A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with bent heads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617985A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461712A (en) * | 2018-11-06 | 2019-03-12 | 泰州友润电子科技股份有限公司 | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873966A (en) * | 2006-06-08 | 2006-12-06 | 葵和精密电子（上海）有限公司 | Improved structure of lead frame for packaging semiconductor chip |
| CN102332443A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Lead frame for plastic package semiconductor |
| CN102693952A (en) * | 2011-03-24 | 2012-09-26 | 比亚迪股份有限公司 | Packaging structure of TVS diode and method for manufacturing TVS diode |
| CN203277357U (en) * | 2013-04-16 | 2013-11-06 | 泰州东田电子有限公司 | Leading wire frame for semiconductor |
-
2013
- 2013-11-08 CN CN201310550090.7A patent/CN103617985A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873966A (en) * | 2006-06-08 | 2006-12-06 | 葵和精密电子（上海）有限公司 | Improved structure of lead frame for packaging semiconductor chip |
| CN102693952A (en) * | 2011-03-24 | 2012-09-26 | 比亚迪股份有限公司 | Packaging structure of TVS diode and method for manufacturing TVS diode |
| CN102332443A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Lead frame for plastic package semiconductor |
| CN203277357U (en) * | 2013-04-16 | 2013-11-06 | 泰州东田电子有限公司 | Leading wire frame for semiconductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461712A (en) * | 2018-11-06 | 2019-03-12 | 泰州友润电子科技股份有限公司 | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing |
| CN109461712B (en) * | 2018-11-06 | 2024-03-19 | 泰州友润电子科技股份有限公司 | TO-220IR-3L lead frame convenient for plastic packaging processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |