CN109461712A - A kind of TO-220IR-3L lead frame convenient for plastic packaging processing - Google Patents
A kind of TO-220IR-3L lead frame convenient for plastic packaging processing Download PDFInfo
- Publication number
- CN109461712A CN109461712A CN201811313527.4A CN201811313527A CN109461712A CN 109461712 A CN109461712 A CN 109461712A CN 201811313527 A CN201811313527 A CN 201811313527A CN 109461712 A CN109461712 A CN 109461712A
- Authority
- CN
- China
- Prior art keywords
- area
- slide glass
- pin
- plastic packaging
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000011521 glass Substances 0.000 claims abstract description 63
- 239000000872 buffer Substances 0.000 claims abstract description 17
- 230000003139 buffering effect Effects 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 11
- 230000008602 contraction Effects 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 206010044074 Torticollis Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 208000018197 inherited torticollis Diseases 0.000 description 2
- 210000003205 muscle Anatomy 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention discloses a kind of TO-220IR-3L lead frame convenient for plastic packaging processing, including heat sink area, slide glass area and pin area, pin area is connected in Different Plane by connection sheet and slide glass area, each pin of pin area is connected by dowel, it is divided into middle part dowel and bottom dowel, the width ratio of middle part dowel and bottom dowel is 0.3~0.6:1, and slide glass area is double-deck slide glass area；The junction in heat sink area and slide glass area is equipped with multi-buffer area.By redesigning the width of dowel in the middle part of lead frame, middle part dowel is accordingly moved up, from internal pin side excessive glue when effectively avoiding the problem that plastic packaging during plastic packaging, improves plastic packaging effect；For this structure by setting double-layer structure for chip installation area, the chip for substantially increasing the product holds carrying capacity, overcomes existing lead frame and is only capable of holding the defect for carrying monolithic.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, are related to a kind of lead frame, and in particular to one kind adds convenient for plastic packaging
The TO-220IR-3L lead frame of work.
Background technique
Chip carrier of the lead frame as integrated circuit is that one kind is drawn by means of bonding material realization chip internal circuits
The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead
It acts on, requires to be basic material important in electronics and information industry using lead frame in most semiconductor integrated blocks
Material.TO-220IR-3L type lead frame is a kind of common lead frame, according to current structure design and processing method, even
The dowel for connecing pin is wider, the equivalent width of middle part dowel and bottom dowel, generally 14.75mm, is commonly present interior draw
Foot side excessive glue problem reduces plastic packaging effect, and fixed point is unreasonable in the design by existing TO-220IR-3L, in plastic packaging process
In cannot good fixation, occur torticollis even fragment the problem of, increase plastic packaging difficulty, reduce plastic packaging effect.Existing TO-
220IR-3L type lead frame is only capable of loading one single chip, has limited to its scope of application, has been unable to satisfy the diversified demand of client,
Therefore it needs to improve.
Summary of the invention
Goal of the invention: present invention aims in view of the deficiencies of the prior art, provide a kind of TO- convenient for plastic packaging processing
220IR-3L lead frame.
Technical solution: a kind of TO-220IR-3L lead frame convenient for plastic packaging processing of the present invention, including cooling fin
Area, slide glass area and pin area, heat sink area are located above slide glass area, and pin area is located at below slide glass area, and the pin area passes through
Connection sheet and slide glass area are connected in Different Plane, and each pin of the pin area is connected by dowel, are divided into middle part connection
The width ratio of muscle and bottom dowel, the middle part dowel and bottom dowel is 0.3~0.6:1, and the slide glass area is
The double-deck slide glass area is from top to bottom followed successively by the first slide glass area and the second slide glass area；First slide glass area and the second slide glass area
One end is connected by shaft；The junction in the heat sink area and slide glass area is equipped with multi-buffer area.
Further, the pin area successively includes the first pin, second pin and third pin from left to right, and described the
It is equipped with welding section at the top of one pin and third pin, is connect by connection sheet with slide glass area at the top of second pin, described first draws
Welding section area ratio at the top of foot and third pin is 1:1.2~1.5, by expanding the area of side welding section, realizes key
The problem of closing more aluminum steels, while can falling off to avoid aluminum steel.
Further, to improve plastic packaging effect, avoid the problem that occurring torticollis even fragment, the weldering during plastic packaging
The junction for meeting area and pin is equipped with buffering bar groove, is equipped in the middle part of the buffering bar groove and hole is auxiliarily fixed.
Further, to improve buffering effect, the multi-buffer area includes first-level buffer bar groove and is set to buffer bar
Ellipse buffering hole in the middle part of slot, the section of the first-level buffer bar groove is in the composite structure of rectangle under upper trapezoid.
It further, is to improve buffering effect, the section in ellipse buffering hole includes open front section and after-opening section,
The open front section is connected with after-opening section by the horn-like channel of involute.
Further, to improve buffering effect, the width of the open front section in ellipse buffering hole is greater than after-opening section
Width, open front segment trailer has buffering contraction mouth, and the width of the buffering contraction mouth is less than the width of after-opening section.
Further, to improve drainage effect, the surrounding in the slide glass area has drainage channel, and the end of drainage channel is set
There is discharge outlet, discharge outlet is lower than drainage channel；The trapezoidal structure in the section of the drainage channel.
Further, first slide glass area is equipped with central connecting part, divides in slide glass area around the central connecting part
For four trapezoidal slide glass areas, the trapezoidal slide glass area of described four is interconnected by central connecting part, realizes own switching.
Further, to avoid the problem that internal pin side excessive glue during plastic packaging, the width of the middle part dowel is
13.06mm。
The utility model has the advantages that (1) accordingly moves up middle part dowel by the width of dowel in the middle part of redesign lead frame,
From internal pin side excessive glue when effectively avoiding the problem that plastic packaging during plastic packaging, plastic packaging effect is improved；(2) this structure pass through by
Chip installation area is set as double-layer structure, and the chip for substantially increasing the product holds carrying capacity, overcomes existing lead frame only
The defect for carrying monolithic can be held；(3) by setting central connecting part in slide glass area, four trapezoidal slide glasses are divided into around central connecting part
Area, four trapezoidal slide glass areas are interconnected by central connecting part, realize that own switching, the work for improving lead frame are flexible
Degree；(4) by slide glass area surrounding be arranged drainage channel, improve the drainage performance of product, improve product using safe
Property.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is overall structure side view of the invention；
Fig. 3 is the structural side view in multi-buffer area in this structure；
Fig. 4 is the structural schematic diagram in the first slide glass area in embodiment 2；
Wherein: 1, heat sink area, 11, central connecting part, 12, trapezoidal slide glass area, 2, slide glass area, 21, have a drainage channel, 3,
Pin area, the 31, first pin, 32, second pin, 33, third pin, 4, connection sheet, 5, middle part dowel, 6, bottom connection
Muscle, 7, first-level buffer bar groove, 8, ellipse buffering hole, 81, open front section, 82, after-opening section, 83, horn-like channel, 84, slow
Rush contraction mouth, 9, welding section, 91, buffering bar groove, 92, hole is auxiliarily fixed.
Specific embodiment
Technical solution of the present invention is described in detail below by attached drawing, but protection scope of the present invention is not limited to
The embodiment.
Embodiment 1: a kind of TO-220IR-3L lead frame convenient for plastic packaging processing, including heat sink area 1,2 and of slide glass area
Pin area 3, heat sink area 1 are located at 2 top of slide glass area, and pin area 3 is located at 2 lower section of slide glass area, and the pin area 3 passes through connection sheet
4 are connected in Different Plane with slide glass area 2, and each pin of the pin area is connected by dowel, are divided into middle part 5 He of dowel
The width ratio of bottom dowel 6, the middle part dowel 5 and bottom dowel 6 is 0.3~0.6:1, middle part dowel 5
Width is 13.06mm, and the slide glass area 2 is double-deck slide glass area, is from top to bottom followed successively by the first slide glass area and the second slide glass area；Institute
The first slide glass area is stated to connect with the one end in the second slide glass area by shaft；The heat sink area 1 and the junction in slide glass area 2 are equipped with
Multi-buffer area.Multi-buffer area includes first-level buffer bar groove 7 and the ellipse buffering hole 8 being set in the middle part of buffering bar groove, institute
The section of first-level buffer bar groove 7 is stated in the composite structure of rectangle under upper trapezoid；The section in ellipse buffering hole 8 includes open front section
81 and after-opening section 82, the open front section 81 and after-opening section 82 are connected by the horn-like channel 83 of involute.Open front section
81 width is greater than the width of after-opening section 82, and open front segment trailer has buffering contraction mouth 84, the width of the buffering contraction mouth 84
Degree is less than the width of after-opening section 82.
The surrounding in slide glass area 2 has drainage channel 21, and the end of drainage channel 21 is equipped with discharge outlet, and discharge outlet is lower than draining
Channel；The trapezoidal structure in section of the drainage channel 21.
Pin area 3 successively includes the first pin 31, second pin 32 and third pin 33, first pin from left to right
31 and third pin 33 at the top of be equipped with welding section 9, connect by connection sheet 4 with slide glass area 2 at the top of second pin 32, described first
9 area ratio of welding section at 33 top of pin 31 and third pin is 1:1.5, by expanding the area of side welding section, is realized
The problem of being bonded more aluminum steels, while can falling off to avoid aluminum steel；Welding section 9 and the junction of pin are equipped with buffering bar groove
91, it is equipped in the middle part of the buffering bar groove 91 and hole 92 is auxiliarily fixed.
The lead frame convenient for plastic packaging processing, effectively avoid processing in excessive glue problem, the design in multiple slide glass areas, significantly
It improves chip and carries capacity, there are preferable market prospects.
Embodiment 2: in the present embodiment structure with it is essentially identical in embodiment 1, it is different to be carried in this present embodiment first
Section is equipped with central connecting part 11, surrounds the central connecting part 11 in slide glass area and is divided into four trapezoidal slide glass areas 12, described
Four trapezoidal slide glass areas 12 be interconnected by central connecting part 11, realize own switching.
As described above, must not be explained although the present invention has been indicated and described referring to specific preferred embodiment
For the limitation to invention itself.It without prejudice to the spirit and scope of the invention as defined in the appended claims, can be right
Various changes can be made in the form and details for it.
Claims (9)
1. a kind of TO-220IR-3L lead frame convenient for plastic packaging processing, including heat sink area, slide glass area and pin area, heat dissipation
Section is located above slide glass area, and pin area is located at below slide glass area, and the pin area is connected to not by connection sheet and slide glass area
On coplanar, each pin of the pin area is connected by dowel, is divided into middle part dowel and bottom dowel, feature exist
In: the width ratio of the middle part dowel and bottom dowel is 0.3~0.6:1, and the slide glass area is double-deck slide glass area, by
The first slide glass area and the second slide glass area are followed successively by under；The one end in first slide glass area and the second slide glass area is connected by shaft
It connects；The junction in the heat sink area and slide glass area is equipped with multi-buffer area.
2. according to claim 1 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the pin
Area successively includes the first pin, second pin and third pin from left to right, is equipped at the top of first pin and third pin
Welding section, second pin top are connect by connection sheet with slide glass area, the welding section at the top of first pin and third pin
Area ratio is 1:1.2~1.5.
3. according to claim 2 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the welding
Area and the junction of pin are equipped with buffering bar groove, are equipped in the middle part of the buffering bar groove and hole is auxiliarily fixed.
4. according to claim 1 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the multistage
Buffer area includes first-level buffer bar groove and the ellipse buffering hole being set in the middle part of buffering bar groove, and the first-level buffer bar groove is cut
Face is in the composite structure of rectangle under upper trapezoid.
5. according to claim 4 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the ellipse
The section in shape buffering hole includes open front section and after-opening section, and the open front section and after-opening section are horn-like logical by involute
Road connection.
6. according to claim 5 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the ellipse
The width that shape buffers the open front section in hole is greater than the width of after-opening section, and open front segment trailer has buffering contraction mouth, the buffering
The width of contraction mouth is less than the width of after-opening section.
7. according to claim 1 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the slide glass
The surrounding in area has drainage channel, and the end of drainage channel is equipped with discharge outlet, and discharge outlet is lower than drainage channel；The drainage channel
The trapezoidal structure in section.
8. according to claim 1 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: described first
Slide glass area is equipped with central connecting part, and the central connecting part is surrounded in slide glass area and is divided into four trapezoidal slide glass areas, and described four
A trapezoidal slide glass area is interconnected by central connecting part, realizes own switching.
9. according to claim 1 convenient for the TO-220IR-3L lead frame of plastic packaging processing, it is characterised in that: the middle part
The width of dowel is 13.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313527.4A CN109461712B (en) | 2018-11-06 | 2018-11-06 | TO-220IR-3L lead frame convenient for plastic packaging processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313527.4A CN109461712B (en) | 2018-11-06 | 2018-11-06 | TO-220IR-3L lead frame convenient for plastic packaging processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109461712A true CN109461712A (en) | 2019-03-12 |
| CN109461712B CN109461712B (en) | 2024-03-19 |
Family
ID=65609472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811313527.4A Active CN109461712B (en) | 2018-11-06 | 2018-11-06 | TO-220IR-3L lead frame convenient for plastic packaging processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109461712B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617983A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Low-power plastic packaged lead frame |
| CN103617985A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with bent heads |
| CN204257630U (en) * | 2014-11-10 | 2015-04-08 | 四川金湾电子有限责任公司 | A kind of semiconductor lead frame |
| CN107994003A (en) * | 2017-12-01 | 2018-05-04 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220EW lead frames |
| CN209561386U (en) * | 2018-11-06 | 2019-10-29 | 泰州友润电子科技股份有限公司 | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing |
-
2018
- 2018-11-06 CN CN201811313527.4A patent/CN109461712B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617983A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Low-power plastic packaged lead frame |
| CN103617985A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with bent heads |
| CN204257630U (en) * | 2014-11-10 | 2015-04-08 | 四川金湾电子有限责任公司 | A kind of semiconductor lead frame |
| CN107994003A (en) * | 2017-12-01 | 2018-05-04 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220EW lead frames |
| CN209561386U (en) * | 2018-11-06 | 2019-10-29 | 泰州友润电子科技股份有限公司 | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109461712B (en) | 2024-03-19 |
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