CN109461712B - TO-220IR-3L lead frame convenient for plastic packaging processing - Google Patents
TO-220IR-3L lead frame convenient for plastic packaging processing Download PDFInfo
- Publication number
- CN109461712B CN109461712B CN201811313527.4A CN201811313527A CN109461712B CN 109461712 B CN109461712 B CN 109461712B CN 201811313527 A CN201811313527 A CN 201811313527A CN 109461712 B CN109461712 B CN 109461712B
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- China
- Prior art keywords
- area
- pin
- slide glass
- district
- buffer
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000011521 glass Substances 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 5
- 238000012858 packaging process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 230000003139 buffering effect Effects 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000012634 fragment Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a TO-220IR-3L lead frame convenient for plastic packaging processing, which comprises a radiating fin area, a carrying sheet area and a pin area, wherein the pin area is connected with the carrying sheet area on different planes through connecting sheets, each pin of the pin area is connected with the carrying sheet area through connecting ribs and is divided into a middle connecting rib and a bottom connecting rib, the width ratio of the middle connecting rib TO the bottom connecting rib is 0.3-0.6:1, and the carrying sheet area is a double-layer carrying sheet area; the connection part of the radiating fin area and the slide area is provided with a multi-stage buffer area. By redesigning the width of the middle connecting rib of the lead frame and correspondingly moving the middle connecting rib upwards, the problem of glue overflow from the side surface of the inner tube pin during plastic packaging is effectively avoided in the plastic packaging process, and the plastic packaging effect is improved; the structure greatly improves the chip capacity of the product by arranging the chip mounting area into a double-layer structure, and overcomes the defect that the existing lead frame can only hold a single chip.
Description
Technical Field
The invention belongs TO the technical field of semiconductor packaging, and relates TO a lead frame, in particular TO a TO-220IR-3L lead frame convenient for plastic packaging processing.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electric connection between an internal circuit lead-out end of the chip and an external lead by means of bonding materials and forming an electric loop, plays a role of a bridge connected with an external lead, and most of semiconductor integrated blocks need to use the lead frame, thus being an important basic material in the electronic information industry. The TO-220IR-3L lead frame is a common lead frame, the connecting ribs of the connecting pins are wider according TO the current structural design and processing mode, the widths of the connecting ribs in the middle and the connecting ribs at the bottom are consistent, and are generally 14.75mm, so that the problem of glue overflow on the side face of the inner pin is solved, the plastic packaging effect is reduced, the fixed point of the traditional TO-220IR-3L is unreasonable in the design, the problem of head warping and even fragments in the plastic packaging process is solved, the plastic packaging difficulty is increased, and the plastic packaging effect is reduced. The existing TO-220IR-3L lead frame can only be loaded with a single chip, limits the application range of the lead frame, and cannot meet the diversified demands of clients, so improvement is needed.
Disclosure of Invention
The invention aims to: the invention aims TO overcome the defects of the prior art and provide a TO-220IR-3L lead frame convenient for plastic packaging processing.
The technical scheme is as follows: the TO-220IR-3L lead frame convenient for plastic packaging processing comprises a radiating fin area, a carrying sheet area and a pin area, wherein the radiating fin area is positioned above the carrying sheet area, the pin area is positioned below the carrying sheet area, the pin area is connected with the carrying sheet area on different planes through connecting sheets, each pin of the pin area is connected with the carrying sheet area through connecting ribs and is divided into a middle connecting rib and a bottom connecting rib, the width ratio of the middle connecting rib TO the bottom connecting rib is 0.3-0.6:1, the carrying sheet area is a double-layer carrying sheet area, and the carrying sheet area is a first carrying sheet area and a second carrying sheet area from top TO bottom in sequence; one end of the first slide glass zone is connected with one end of the second slide glass zone through a rotating shaft; and a multistage buffer area is arranged at the joint of the radiating fin area and the slide area.
Further, the pin area comprises a first pin, a second pin and a third pin from left to right in sequence, the tops of the first pin and the third pin are provided with welding areas, the top of the second pin is connected with the slide area through a connecting sheet, and the area ratio of the welding areas at the tops of the first pin and the third pin is 1: 1.2-1.5, by enlarging the area of a welding area at one side, more aluminum wires are bonded, and meanwhile, the problem that the aluminum wires fall off can be avoided.
Further, in order to improve the plastic packaging effect, the problem that the head is askew or even fragments appear in the plastic packaging process is avoided, the junction of welding area and pin is equipped with the buffering strip groove, buffering strip groove middle part is equipped with auxiliary fixing hole.
Further, for improving the buffering effect, the multistage buffer zone includes one-level buffer strip groove and sets up in the oval buffering hole in buffer strip groove middle part, the cross-section of one-level buffer strip groove is the integrated configuration of trapezoidal lower rectangle.
Further, in order to improve the buffering effect, the cross section of the oval buffering hole comprises a front opening section and a rear opening section, and the front opening section and the rear opening section are connected through an involute horn-shaped channel.
Further, in order to improve the buffering effect, the width of the front opening section of the oval buffering hole is larger than that of the rear opening section, the tail of the front opening section is provided with a buffering shrinkage opening, and the width of the buffering shrinkage opening is smaller than that of the rear opening section.
Further, in order to improve the drainage effect, drainage channels are arranged around the slide glass region, and a drainage outlet is arranged at the tail end of each drainage channel and is lower than the drainage channels; the section of the drainage channel is of a trapezoid structure.
Further, the first slide area is provided with a central connecting part, the slide area is divided into four trapezoid slide areas around the central connecting part, and the four trapezoid slide areas are mutually communicated through the central connecting part to realize self-switching.
Further, in order to avoid the problem of glue overflow on the side face of the inner pin in the plastic packaging process, the width of the middle connecting rib is 13.06mm.
The beneficial effects are that: (1) By redesigning the width of the middle connecting rib of the lead frame and correspondingly moving the middle connecting rib upwards, the problem of glue overflow from the side surface of the inner tube pin during plastic packaging is effectively avoided in the plastic packaging process, and the plastic packaging effect is improved; (2) The chip mounting area is set to be a double-layer structure, so that the chip capacity of the product is greatly improved, and the defect that the existing lead frame can only hold a single chip is overcome; (3) The central connecting part is arranged in the slide glass region, four trapezoid slide glass regions are divided into around the central connecting part and are mutually communicated through the central connecting part, so that self-switching is realized, and the work flexibility of the lead frame is improved; (4) By arranging the drainage channels around the slide glass area, the drainage performance of the product is improved, and the use safety of the product is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a side view of the overall structure of the present invention;
FIG. 3 is a side view of a multi-stage buffer in the present configuration;
FIG. 4 is a schematic view of the structure of the first slide region in example 2;
wherein: 1. the heat sink comprises a heat radiating fin area, 11, a central connecting part, 12, a trapezoid slide area, 2, a slide area, 21, a drainage channel, 3, a pin area, 31, a first pin, 32, a second pin, 33, a third pin, 4, a connecting sheet, 5, a middle connecting rib, 6, a bottom connecting rib, 7, a primary buffer strip groove, 8, an elliptic buffer hole, 81, a front opening section, 82, a rear opening section, 83, a horn-shaped channel, 84, a buffer shrinkage opening, 9, a welding area, 91, a buffer strip groove, 92 and an auxiliary fixing hole.
Detailed Description
The technical scheme of the invention is described in detail below through the drawings, but the protection scope of the invention is not limited to the embodiments.
Example 1: the TO-220IR-3L lead frame convenient for plastic packaging processing comprises a radiating fin area 1, a carrying sheet area 2 and a pin area 3, wherein the radiating fin area 1 is positioned above the carrying sheet area 2, the pin area 3 is positioned below the carrying sheet area 2, the pin area 3 is connected with the carrying sheet area 2 on different planes through a connecting sheet 4, each pin of the pin area is connected with the carrying sheet area 2 through a connecting rib and is divided into a middle connecting rib 5 and a bottom connecting rib 6, the width ratio of the middle connecting rib 5 TO the bottom connecting rib 6 is 0.3-0.6:1, the width of the middle connecting rib 5 is 13.06mm, the carrying sheet area 2 is a double-layer carrying sheet area, and the first carrying sheet area and the second carrying sheet area are sequentially arranged from top TO bottom; one end of the first slide glass zone is connected with one end of the second slide glass zone through a rotating shaft; and a multistage buffer area is arranged at the joint of the radiating fin area 1 and the slide area 2. The multistage buffer zone comprises a first-stage buffer strip groove 7 and an elliptical buffer hole 8 arranged in the middle of the buffer strip groove, and the section of the first-stage buffer strip groove 7 is of a combined structure with an upper trapezoid and a lower rectangle; the cross section of the oblong buffer hole 8 comprises a front opening section 81 and a rear opening section 82, said front and rear opening sections 81, 82 being connected by an involute trumpet-shaped channel 83. The front opening section 81 has a width greater than the width of the rear opening section 82, and the rear section has a buffer pinch 84 at the rear end thereof, the buffer pinch 84 having a width less than the width of the rear opening section 82.
The periphery of the slide glass area 2 is provided with a drainage channel 21, the tail end of the drainage channel 21 is provided with a drainage outlet, and the drainage outlet is lower than the drainage channel; the cross section of the drainage channel 21 is in a trapezoid structure.
The pin area 3 sequentially comprises a first pin 31, a second pin 32 and a third pin 33 from left to right, the tops of the first pin 31 and the third pin 33 are provided with a welding area 9, the top of the second pin 32 is connected with the slide area 2 through a connecting sheet 4, and the area ratio of the welding area 9 at the tops of the first pin 31 and the third pin 33 is 1:1.5, by enlarging the area of a welding area at one side, more aluminum wires are bonded, and meanwhile, the problem that the aluminum wires fall off can be avoided; the junction of welding district 9 and pin is equipped with buffering bar groove 91, buffering bar groove 91 middle part is equipped with supplementary fixed orifices 92.
The lead frame is convenient for plastic packaging processing, effectively avoids the problem of glue overflow in processing, and greatly improves the chip carrying capacity due to the design of a plurality of carrying areas, and has better market prospect.
Example 2: the structure in this embodiment is basically the same as that in embodiment 1, and the difference is that in this embodiment, the first slide area is provided with a central connection portion 11, and four trapezoid slide areas 12 are divided into slide areas around the central connection portion 11 in the slide area, and the four trapezoid slide areas 12 are mutually communicated through the central connection portion 11, so as to realize self-switching.
As described above, although the present invention has been shown and described with reference to certain preferred embodiments, it is not to be construed as limiting the invention itself. Various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (2)
1. TO-220IR-3L lead frame convenient TO plastic envelope processing, including fin district, slide glass district and pin district, the fin district is located slide glass district top, and the pin district is located slide glass district below, the pin district is connected on different planes through connection piece and slide glass district, each pin in pin district is connected through the splice bar, divide into middle part splice bar and bottom splice bar, its characterized in that: the width ratio of the middle connecting ribs to the bottom connecting ribs is 0.3-0.6:1, and the slide glass region is a double-layer slide glass region, and is sequentially provided with a first slide glass region and a second slide glass region from top to bottom; one end of the first slide glass zone is connected with one end of the second slide glass zone through a rotating shaft; a multistage buffer area is arranged at the joint of the radiating fin area and the slide area;
the pin area comprises a first pin, a second pin and a third pin from left to right in sequence, wherein the tops of the first pin and the third pin are provided with welding areas, the top of the second pin is connected with the slide area through a connecting sheet, and the area ratio of the welding areas at the tops of the first pin and the third pin is 1: 1.2-1.5;
a buffer strip groove is formed in the joint of the welding area and the pin, and an auxiliary fixing hole is formed in the middle of the buffer strip groove;
the multistage buffer zone comprises a first-stage buffer strip groove and an elliptical buffer hole arranged in the middle of the buffer strip groove, and the section of the first-stage buffer strip groove is of a combined structure with an upper trapezoid and a lower rectangle;
the section of the oval buffer hole comprises a front opening section and a rear opening section, and the front opening section and the rear opening section are connected through an involute horn-shaped channel;
the width of the front opening section of the oval buffer hole is larger than that of the rear opening section, the tail of the front opening section is provided with a buffer shrinkage opening, and the width of the buffer shrinkage opening is smaller than that of the rear opening section;
the periphery of the slide glass area is provided with a drainage channel, the tail end of the drainage channel is provided with a drainage outlet, and the drainage outlet is lower than the drainage channel; the section of the drainage channel is of a trapezoid structure;
the first slide glass area is provided with a central connecting part, the slide glass area is divided into four trapezoid slide glass areas around the central connecting part, and the four trapezoid slide glass areas are mutually communicated through the central connecting part to realize self-switching.
2. The TO-220IR-3L lead frame for facilitating plastic packaging as claimed in claim 1, wherein: the width of the middle connecting rib is 13.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313527.4A CN109461712B (en) | 2018-11-06 | 2018-11-06 | TO-220IR-3L lead frame convenient for plastic packaging processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313527.4A CN109461712B (en) | 2018-11-06 | 2018-11-06 | TO-220IR-3L lead frame convenient for plastic packaging processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109461712A CN109461712A (en) | 2019-03-12 |
| CN109461712B true CN109461712B (en) | 2024-03-19 |
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ID=65609472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811313527.4A Active CN109461712B (en) | 2018-11-06 | 2018-11-06 | TO-220IR-3L lead frame convenient for plastic packaging processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109461712B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617983A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Low-power plastic packaged lead frame |
| CN103617985A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with bent heads |
| CN204257630U (en) * | 2014-11-10 | 2015-04-08 | 四川金湾电子有限责任公司 | A kind of semiconductor lead frame |
| CN107994003A (en) * | 2017-12-01 | 2018-05-04 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220EW lead frames |
| CN209561386U (en) * | 2018-11-06 | 2019-10-29 | 泰州友润电子科技股份有限公司 | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing |
-
2018
- 2018-11-06 CN CN201811313527.4A patent/CN109461712B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617983A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Low-power plastic packaged lead frame |
| CN103617985A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame with bent heads |
| CN204257630U (en) * | 2014-11-10 | 2015-04-08 | 四川金湾电子有限责任公司 | A kind of semiconductor lead frame |
| CN107994003A (en) * | 2017-12-01 | 2018-05-04 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220EW lead frames |
| CN209561386U (en) * | 2018-11-06 | 2019-10-29 | 泰州友润电子科技股份有限公司 | A kind of TO-220IR-3L lead frame convenient for plastic packaging processing |
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| Publication number | Publication date |
|---|---|
| CN109461712A (en) | 2019-03-12 |
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